HEAT DISSIPATION DEVICE

Abstract

A heat dissipation device used to dissipate heat generated by a memory, includes a first cooling fin for being attached to a first side of the memory, a second cooling fin for being attached to a second side of the memory opposite to the first side. There is also a clamp to sandwich the combined assembly of the first cooling fin, the memory, and the second cooling fin. Further included are two fasteners respectively pivotably mounted to the first and second cooling fins, and latched to the clamp to make the first and second cooling fins tightly resist against the first and second sides of the memory respectively.

Description

BACKGROUND

1. Technical Field

The present disclosure relates to a heat dissipation device.

2. Description of Related Art

With the continuing development of electronic technology, memories generate more heat during operation than previously. The heat should be dissipated as quickly as possible. In some cases, two metallic cooling fins are added to opposite sides of each memory to dissipate heat therefrom. However, this method makes maintenance difficult as it is inconvenient to disassemble the cooling fins.

BRIEF DESCRIPTION OF THE DRAWINGS

Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, all the views are schematic, and like reference numerals designate corresponding parts throughout the several views.

FIG. 1 is an exploded, isometric view of an exemplary embodiment of a heat dissipation device.

FIG. 2 is similar to FIG. 1, but viewed from another perspective.

FIG. 3 is an assembled view of the heat dissipation device of FIG. 1.

FIG. 4 shows a using state of the heat dissipation device of FIG. 3.

FIG. 5 shows another using state of the heat dissipation device of FIG. 3.

DETAILED DESCRIPTION

The present disclosure, including the accompanying drawings, is illustrated by way of examples and not by way of limitation. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.

Referring to FIGS. 1 and 2, an exemplary embodiment of a heat dissipation device used to dissipate heat of a memory 100 (shown in FIGS. 4 and 5), includes a clamp 10, two fasteners 20, a first cooling fin 30, and a second cooling fin 40.

The clamp 10 is substantially U-shaped, and includes a substantially rectangular top plate 12 and two lateral plates 14 extending down from opposite sides of the top plate 12. The top plate 12 is convex in cross section, forming a shallow trough along the length thereof. A top of each lateral plate 14 forms an arc-shaped connection portion 16 connected to the corresponding side of the top plate 12, which is convenient to deform the lateral plates 14 relative to the top plate 12. Two substantially L-shaped latches 140 substantially perpendicularly extend from opposite ends of a bottom of an outer surface of each lateral plate 14. Each latch 140 and the corresponding lateral plate 14 bound a slot 142 along a length of the lateral plate 14.

Each fastener 20 is made of elastic material, and includes a substantially U-shaped main body 22 and two pivot pins 224 substantially perpendicularly extending from opposite distal ends of the main body 22. The main body 22 includes a long resisting pole 220 and two connection poles 222 substantially perpendicularly extending up from opposite ends of the resisting pole 220. Each pivot pin 224 substantially extends from a distal end of a corresponding connection pole 222 opposite to the resisting pole 220, away from the other connection pole 222.

The first cooling fin 30 is substantially rectangular. Two first pivot tabs 32 substantially perpendicularly extend from opposite ends of a top side of the first cooling fin 30, facing the second cooling fin 40. A pivot pin 320 extends from an inner end of each pivot tab 32, along a length of the first cooling fin 30 and toward the other pivot tab 32. Two blocks 34 extend from an outer surface of the first cooling fin 30, away from the second cooling fin 40. Each block 34 defines a pivot hole 340 extending along the length of the first cooling fin 30.

The second cooling fin 40 is substantially rectangular. Two second pivot tabs 42 substantially perpendicularly extend from opposite ends of a top side of the second cooling fin 40, facing the first cooling fin 30. Each second pivot tab 42 defines a pivot hole 420 in an outer end of the second pivot tap 42, along a length of the second cooling fin 40 and opposite to the other second pivot tab 42. Two blocks 44 extend from an outer surface of the second cooling fin 40, away from the first cooling fin 30. Each block 44 defines a pivot hole 440 extending along the length of the second cooling fin 40.

Referring to FIGS. 3 to 5, in use, the first cooling fin 30 is attached to the second cooling fin 40, with the pivot pins 320 of the first cooling fin 30 rotatably engaged in the corresponding pivot holes 420 of the second cooling fin 40, thereby pivotably mounting the first cooling fin 30 to the second cooling fin 40. The memory 100 is positioned between the first cooling fin 30 and the second cooling fin 40, with opposite lateral surfaces of the memory 100 resisting against inner lateral surfaces of the first cooling fin 30 and the second cooling fin 40. The lateral plates 14 of the clamp 10 are deformed away from each other by operating the connection portions 16. The combined assembly of the first and second cooling fins 30 and 40 and the memory 100 is positioned between the lateral plates 14, with the top plate 12 of the clamp 10 resisting against the first and second pivot tabs 320 and 420. The connection portions 16 are released, and thus the lateral plates 14 are restored to resist against the first and second cooling fins 30 and 40. Therefore, the combined assembly of the first and second cooling fins 30 and 40 and the memory 100 are firmly clamped by the clamp 10. The pivot pins 224 of one of the fastener 20 correspondingly engage in the pivot holes 340 of the first cooling fin 30, and the pivot pins 224 of the other fastener 20 correspondingly engage in the pivot holes 440 of the second cooling fin 40. Thereby, the fasteners 20 are rotatably mounted to the first and second cooling fins 30 and 40, respectively. The resisting poles 220 of the fasteners 20 resist against the latches 140 of the lateral plates 14, by rotating the fasteners 20 to make the resisting poles 220 latched in the slots 142 of the latches 14, which makes the clamp 10 clamp the first and second fins 30 and 40 to tightly contact the memory 100.

In disassembly, the resisting poles 220 of the fasteners 20 are deformed away from the slots 142 of the lateral plates 14. The connection portions 16 of the lateral plates 14 are deformed to move the lateral plates 14 away from each other. Therefore, the clamp 10 is readily to be removed, and then the first and second cooling fins 30 and 40 can be easily disassembled from the memory 100.

In this embodiment, the curvature of the top plate 12 makes the top plate 12 easily deformed and can guide the lateral plates 14 deformed along predetermined direction when the lateral plates 14 are deformed away from each other.

It is to be understood, however, that even though numerous characteristics and advantages of the embodiments have been set forth in the foregoing description, together with details of the structure and function of the embodiments, the present disclosure is illustrative only, and changes may be made in details, especially in matters of shape, size, and arrangement of parts within the principles of the embodiments to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims

1. A heat dissipation device used to dissipate heat generated by a memory, the heat dissipation device comprising: a first cooling fin for being attached to a first side of the memory;a second cooling fin for being attached to a second side of the memory opposite to the first side;a clamp to sandwich the combined assembly of the first cooling fin, the memory, and the second cooling fin; andtwo fasteners for being respectively and pivotably mounted to the first and second cooling fins, and latched to the clamp, to make the first and second cooling fins tightly resisting against the first and second sides of the memory respectively.

2. The heat dissipation device of claim 1, wherein the clamp comprises a substantially rectangular top plate and two lateral plates extending down from opposite sides of the top plate, the first and second cooling fins are to be tightly clamped by the lateral plates.

3. The heat dissipation device of claim 2, wherein the top plate is convex in cross section, forming a shallow trough along the length thereof.

4. The heat dissipation device of claim 2, wherein a top of each of the lateral plates forms an arc-shaped connection portion connected to the corresponding side of the top plate.

5. The heat dissipation device of claim 2, wherein two latches extend from opposite ends of an outer surface of each of the lateral plates, a top surface of each of the latches defines a slot along a length of the lateral plate, each of the fasteners is to be latched in the slots of the corresponding lateral plate.

6. The heat dissipation device of claim 5, wherein outer surfaces of the first and second cooling fins each form two blocks, each of the blocks defines a pivot hole, distal ends of the fasteners are pivotably engaged in the pivot holes of the first and second cooling fins.

7. The heat dissipation device of claim 6, wherein each of the fasteners comprises a substantially U-shaped main body and two pivot pins extending from opposite distal ends of the main body, the main body comprises a resisting pole firmly latched in the slots of the corresponding lateral plate, and two connection poles substantially perpendicularly extending up from opposite ends of the resisting pole, the pivot pins substantially extend from distal ends of the connection poles away from each other, to engage in the corresponding pivot holes of a corresponding one of the first and second cooling fins.

8. The heat dissipation device of claim 1, wherein the second cooling fins is pivotably mounted to the first cooling fin.

9. The heat dissipation device of claim 8, wherein two first pivot tabs substantially perpendicularly extend from a top side of the first cooling fin, facing the second cooling fin, each of the first pivot tabs comprises a pivot pin extending toward the other first pivot tab, and two second pivot tabs substantially perpendicularly extend from a top side of the second cooling fin, facing the first cooling fin, each of the second pivot tabs defines a pivot hole opposite to the other second pivot tab, the pivot pins are pivotably engaged in the corresponding pivot holes.

10. A heat dissipation device used to dissipate heat generated by memory, the heat dissipation device comprising: a first cooling fin for being attached to a first side of the memory;a second cooling fin for being attached to a second side of the memory opposite to the first side; andan elastic clamp comprising two opposite lateral plates to respectively and tightly contact the first and second cooling fins to sandwich the combined assembly of the first cooling fin, the memory, and the second cooling fin.

11. The heat dissipation device of claim 10, wherein the clamp further comprises a top plate connected between tops of the lateral plates.

12. The heat dissipation device of claim 11, wherein the top plate is convex in cross section, forming a shallow trough along the length thereof.

13. The heat dissipation device of claim 11, wherein a top of each lateral plate forms an arc-shaped connection portion connected to the corresponding side of the top plate.

14. The heat dissipation device of claim 10, wherein the first connection fin is pivotably connected to the second connection pin.

15. The heat dissipation device of claim 14, wherein a top side of the first connection fin is pivotably connected to a top side of the second connection fin.

16. The heat dissipation device of claim 15, wherein two first pivot tabs substantially perpendicularly extend from the top side of the first cooling fin toward the second cooling fin, a pivot pin extends from each first pivot tab; two second pivot tabs substantially perpendicularly extend from the top side of the second cooling fin toward the first cooling fin, each second pivot tab defines a pivot hole to pivotably receive a corresponding pivot pin of the first cooling fin.