Heat dissipation module

Information

  • Patent Grant
  • D1026838
  • Patent Number
    D1,026,838
  • Date Filed
    Tuesday, April 26, 2022
    2 years ago
  • Date Issued
    Tuesday, May 14, 2024
    6 months ago
  • Inventors
    • Lin; Chun-Hung
  • Original Assignees
  • Examiners
    • Rivas; April
    Agents
    • Shih; Chun-Ming
    • HDLS IPR SERVICES
Abstract
Description


FIG. 1 is a perspective view of a heat dissipation module showing my new design;



FIG. 2 is a front view thereof;



FIG. 3 is a rear view thereof;



FIG. 4 is a left side view thereof;



FIG. 5 is a right side view thereof;



FIG. 6 is a top view thereof;



FIG. 7 is a bottom view thereof; and,



FIG. 8 is a reference view showing the heat dissipation module.


The broken lines in the drawings illustrate pod ions of the heat dissipation module that form no part of the claimed design.


Claims
  • The ornamental design for a heat dissipation module, as shown and described.
US Referenced Citations (16)
Number Name Date Kind
D567771 Wu Apr 2008 S
D715750 Mira Oct 2014 S
D722574 Mira Feb 2015 S
D954005 Inagaki Jun 2022 S
D971862 Inagaki Dec 2022 S
20160219756 Sun Jul 2016 A1
20170307299 Huang Oct 2017 A1
20190128617 Mira May 2019 A1
20190170446 He Jun 2019 A1
20200393201 Watanabe Dec 2020 A1
20210018272 Inagaki Jan 2021 A1
20230213288 Wang Jul 2023 A1
20230337398 Lin Oct 2023 A1
20230349644 Lin Nov 2023 A1
20230354552 Lin Nov 2023 A1
20230358482 Liu Nov 2023 A1
Foreign Referenced Citations (3)
Number Date Country
218244170 Jan 2023 CN
116952033 Oct 2023 CN
116997131 Nov 2023 CN
Non-Patent Literature Citations (1)
Entry
Intechopen, “Heat Pipe and Phase Change Heat Transfer Technologies for Electronics Cooling”, Fig. 16, Published Jun. 15, 2016. (https://www.intechopen.com/chapters/50699) (Year: 2016).