The broken lines in the drawings illustrate pod ions of the heat dissipation module that form no part of the claimed design.
The broken lines in the drawings illustrate pod ions of the heat dissipation module that form no part of the claimed design.
Number | Name | Date | Kind |
---|---|---|---|
D567771 | Wu | Apr 2008 | S |
D715750 | Mira | Oct 2014 | S |
D722574 | Mira | Feb 2015 | S |
D954005 | Inagaki | Jun 2022 | S |
D971862 | Inagaki | Dec 2022 | S |
20160219756 | Sun | Jul 2016 | A1 |
20170307299 | Huang | Oct 2017 | A1 |
20190128617 | Mira | May 2019 | A1 |
20190170446 | He | Jun 2019 | A1 |
20200393201 | Watanabe | Dec 2020 | A1 |
20210018272 | Inagaki | Jan 2021 | A1 |
20230213288 | Wang | Jul 2023 | A1 |
20230337398 | Lin | Oct 2023 | A1 |
20230349644 | Lin | Nov 2023 | A1 |
20230354552 | Lin | Nov 2023 | A1 |
20230358482 | Liu | Nov 2023 | A1 |
Number | Date | Country |
---|---|---|
218244170 | Jan 2023 | CN |
116952033 | Oct 2023 | CN |
116997131 | Nov 2023 | CN |
Entry |
---|
Intechopen, “Heat Pipe and Phase Change Heat Transfer Technologies for Electronics Cooling”, Fig. 16, Published Jun. 15, 2016. (https://www.intechopen.com/chapters/50699) (Year: 2016). |