The disclosure of Japanese Patent Application No. 2017-165421 filed on Aug. 30, 2017 including the specification, drawings and abstract is incorporated herein by reference in its entirety.
The disclosure relates to a heat dissipation sheet that is suitable for dissipating heat generated from, for example, an electronic component generating heat to the outside and a method for manufacturing a heat dissipation sheet.
Electronic components that generate heat on their own, such as a central processing unit (CPU), are likely to operate improperly when the temperature increases excessively. In order to avoid such improper operation, an appropriate cooling device is used together with an electronic component. Examples of the cooling device as described above include the heat dissipation sheet described in Japanese Unexamined Patent Application Publication No. 2001-291810 (JP 2001-291810 A), the heat transport device described in Japanese Unexamined Patent Application Publication No. 2011-086753 (JP 2011-086753 A), and furthermore, the heat dissipation device described in Japanese Unexamined Patent Application Publication No. 2006-253601 (JP 2006-253601 A).
The heat dissipation sheet described in JP 2001-291810 A is configured of a thermally conductive adhesive layer including a matrix resin and a thermally conductive filler and an expanded sheet that supports the thermally conductive adhesive layer and is stretched in one direction. The heat transport device described in JP 2011-086753 A is configured of a working fluid enclosed in a housing, an expanded sheet that is provided in the housing and forms a flow path of the working fluid, and a capillary structure. The heat dissipation device described in JP 2006-253601 A includes a support frame formed of a flexible metal sheet material having a thermal conductive property and tubular rhombic fins formed of the same sheet material, a plurality of rhombic fins is disposed in a row in the support frame by coupling crests of the rhombic fins, and one crest of one rhombic fin in a central portion is bonded to the support frame.
In both of the heat dissipation sheet described in JP 2001-291810 A and the heat transport device described in JP 2011-086753 A, the expanded sheet has a function as a structural member for postural maintenance and the like and a function as a thermally conductive path that maintains a heat transfer property or a heat dissipation property. As described in JP 2001-291810 A and JP 2011-086753 A, in the related art, an expanded sheet 10 that is used for the above-described heat dissipation sheet and the like is formed by providing a plurality of incisions 2 in multiple rows in a zigzag shape at intervals of a width L in a thin plate-like metal sheet 1 and stretching (expanding) the metal sheet 1 in a direction orthogonal to the direction of the incisions 2 as illustrated in
The expanded sheet 10 in the above-described form is a sheet obtained by stretching the thin plate-like metal sheet 1, and, as illustrated in a sectional view of
Meanwhile, as illustrated in
Therefore, in the heat dissipation sheet 20 of the form of the related art, it is not possible to avoid functioning as a thermally conductive path that becomes different between a portion in which the coupling portion 4 is located and a portion in which the strand portion 5 is located in the expanded sheet 10. As a result, inevitably, the formation of a thermally conductive path using the expanded sheet 10 that is the heat dissipation member becomes insufficient from the viewpoint of the entire heat dissipation sheet 20, and it is needed to increase the proportion of the expanded sheet 10 that is the heat dissipation member in the heat dissipation sheet 20 in order to make the heat dissipation member highly thermally conductive. What has been described above means a decrease in the ratio of the resin material, which, inevitably, sacrifices the flexibility of the heat dissipation sheet 20.
The heat dissipation device described in JP 2006-253601 A has a configuration in which the tubular rhombic fins are provided in the rectangular support frame and has an advantage in which a number of thermally conductive paths with an equal length are formed between a top plate and a bottom plate that are heat dissipation surfaces or heat receiving surfaces using the rhombic fins. However, there is a disadvantage that the rectangular support frame is deficient in flexibility and sufficient flexibility cannot be obtained, particularly, in a depth direction. Therefore, it is difficult to satisfy both a high thermal conductive property and flexibility needed for heat dissipation sheets.
Aspects of the present disclosure provide a heat dissipation sheet capable of maintaining a higher thermal conductive property while holding needed flexibility and a method for manufacturing a heat dissipation sheet.
A first aspect of the disclosure relates to a heat dissipation sheet including a resin material and a heat dissipation member that is made of a material with a higher thermal conductivity than the resin material and has a predetermined thickness. The heat dissipation member is a bent product of a thin plate and has a plurality of elongated protrusion bands and a plurality of elongated recess bands that are alternately arranged in parallel with one another. Top surfaces of the respective protrusion bands are flush with each other, and are located in a first horizontal surface. Bottom surfaces of the respective recess bands are flush with each other, and are located in a second horizontal surface that is parallel to the first horizontal surface. A first slit including a first width that is narrower than a width of the top surface is provided between the top surfaces of the adjacent protrusion bands. A second slit including a second width that is narrower than a width of the bottom surface and is parallel to the first slit is provided between the bottom surfaces of the adjacent recess bands. Portions of the heat dissipation member other than both the top surfaces of the respective protrusion bands and the bottom surfaces of the respective recess bands are buried in the resin material.
In the heat dissipation sheet according to the first aspect, a plurality of third slits may be provided from the top surfaces of the protrusion bands to the bottom surfaces of the recess bands or from the bottom surfaces of the recess bands to the top surfaces of the protrusion bands in a direction orthogonal to the first slits and the second slits.
In the heat dissipation sheet according to the first aspect, insulating layers may be provided on front and rear surfaces of the heat dissipation sheet. In addition, in the heat dissipation sheet, the heat dissipation member may have insulating films on front and rear surfaces of the heat dissipation member.
In the heat dissipation sheet according to the first aspect, the heat dissipation member may be made of a single material or a complex material with a thermal conductivity of 10 W/m·K or more.
In the heat dissipation sheet according to the first aspect, the resin material may be made of any one or more of a silicone resin, an epoxy resin, a urethane resin, a polyamide resin, a polyphenylene sulfide resin, and a polyimide resin.
A second aspect of the disclosure relates to a method for manufacturing a heat dissipation sheet including a resin material and a heat dissipation member that is made of a material with a higher thermal conductivity than the resin material and has a predetermined thickness. The method includes bending a thin plate so that elongated protrusion bands having a top surface that is a flat surface and elongated recess bands having a bottom surface that is a flat surface are alternately formed, compressing the bent thin plate in a direction orthogonal to the formed protrusion bands and recess bands so that a first gap between the top surfaces of the adjacent protrusion bands and a second gap between the bottom surfaces of the adjacent recess bands become narrower than those before the thin plate is compressed; and burying the compressed thin plate in a molten resin material in a state in which the flat surfaces that are the top surfaces of the protrusion bands and the flat surfaces that are the bottom surfaces of the recess bands are left unburied and curing the resin.
The method for manufacturing a heat dissipation sheet according to the second aspect may further include forming slit rows each of which includes third slits arranged in a longitudinal direction of the third slit through non-slit portions with a predetermined length such that the silt rows are arranged parallel to one another in the thin plate at intervals in a direction orthogonal to the third slit. The thin plate in which the slit rows are formed may be bent.
With the aspect of the present disclosure, a heat dissipation sheet having higher flexibility and having a higher thermal conductive property without sacrificing the flexibility is provided (in the present specification, “being located in the first horizontal surface” also means “being substantially located in the first horizontal surface”).
Features, advantages, and technical and industrial significance of exemplary embodiments of the disclosure will be described below with reference to the accompanying drawings, in which like numerals denote like elements, and wherein:
A first embodiment of a heat dissipation sheet according to the present disclosure will be described with reference to the drawings.
Heat Dissipation Member
First, an example of a heat dissipation member that is used in the heat dissipation sheet of an embodiment will be described together with a manufacturing step thereof.
A material of the heat dissipation member is not particularly limited, and examples thereof include metal, ceramic, and graphite. Examples of the metal include copper, aluminum, gold, silver, nickel, and zinc. Examples of the ceramic include alumina, silica, boron nitride, zinc oxide, and magnesium oxide. When ceramic is used, it is desirable to mold the ceramic in a state of a green sheet that is yet to be fired from the viewpoint of ease of molding. A single material or a complex material of the heat dissipation member with a thermal conductivity of 10 W/m·K or more is desirable. As the material, a 10 μm to 500 μm-thick thin plate-like raw sheet 50 is desirably used.
First, mountain fold locations and valley fold locations are set in the raw sheet 50 that is a rectangular thin plate as illustrated in
The raw sheet 50 is bent along the mountain fold lines p and the valley fold lines q.
In the raw sheet 50 bent in the above-described form, a raw sheet portion between the mountain fold line p and the valley fold line q is present as a side surface in the vertical direction (the Z axis direction), is tolerant of a compressive force in the vertical direction (the Z axis direction), and is capable of easily following bending in a direction along an X axis (bending in a Kx direction in the drawing). However, when the bending angle α is 90 degree, as illustrated in
When bending is carried out under the above-described conditions, as illustrated in
The thickness of the heat dissipation member 100, that is, a distance b1 between the first horizontal surface H1 and the second horizontal surface H2 in the Z axis direction is b1<b and changes depending on the bending angle α. As the bending angle α becomes sharper, the widths of the first slit 56 and the second slit 57 become narrower. The dimension of the bending angle α or the horizontal width a needs to be appropriately set depending on requirements in a place in which the heat dissipation member 100 is actually used.
In the description of the heat dissipation member 100 illustrated in
A plurality of third slits 51, 52 linearly arranged forms slit rows that are arranged through non-slit portions with a predetermined length, the third slits 51, 52 being linear slits with a predetermined length. The non-slit portion refers to a portion between the slit 51 and the slit 51 and a portion between the slit 52 and the slit 52. The slit rows are formed parallel to one another at intervals in a direction orthogonal to the third slits 51, 52.
The third slits 51, 52 are both formed in a direction orthogonal to the first slit 56 and the second slit 57, that is, in the X axis direction. The third slit 51 is formed across the top surface 54 of the protrusion band and both side wall portions thereof, that is, in
The other third slit 52 is formed, in the middle location between the two third slits 51, 51, across the bottom surface 55 of the recess band and both side wall portions thereof, that is, in
The intervals (d/2) between the third slit 51 and the third slit 52 are all desirably equal to one another, but all of the intervals do not need to be equal to one another at all times. The distance d may be approximately 0.1 mm to 10 mm. The raw sheet 50a illustrated in
A perspective view of a heat dissipation member 100a after the bending of the raw sheet 50a is illustrated in
An example of a case of producing the heat dissipation member 100 by bending the raw sheet 50 will be described with reference to
At the time of initiating bending, the X axis direction and the Y axis direction are matched, and the raw sheet 50 is disposed between the movable press dies 61 and the fixed press dies 62 of the pressing machine 60 in an opened state. The state is illustrated in
After the bending, the press dies are opened, the bent raw sheet 50 is moved forward in a feed direction (the X axis direction) in
After that, a work of the above-described press operation and the above-described compression operation is repeated as many times as needed, whereby it is possible to manufacture the heat dissipation member 100 or the heat dissipation member 100a illustrated in
Resin Material 300
A heat dissipation sheet 200 is obtained by burying the heat dissipation member 100 (or the heat dissipation member 100a) in a resin material 300. The resin material 300 may be a single resin body or a resin loaded with a filler in order to improve functions. Examples of the resin include moisture-curable or ambient temperature-curable thermosetting resins (any of a one-liquid type and a two-liquid-mixing type are available) such as a silicone resin, an epoxy resin, and a urethane resin and thermoplastic resins such as a polyamide resin, a polyphenylene sulfide resin, and a polyimide resin. Examples of the filler include metal fillers such as copper, aluminum, silver, nickel, and zinc and inorganic fillers such as alumina, silica, boron nitride, zinc oxide, magnesium oxide, and graphite. A mixed material obtained by grinding a material that is used to manufacture the heat dissipation member 100 (100a) in a particle form and mixing the particles into the resin material 300 can also be used.
Manufacturing of Heat Dissipation Sheet 200
The heat dissipation member 100 (100a) can be buried in the resin material 300 using a predetermined method.
Advantages of Heat Dissipation Sheet 200
As described above, the heat dissipation sheet 200 of the present embodiment is manufactured by using the heat dissipation member 100 (100a) obtained by bending the raw sheet 50 or one highly thermally conductive thin plate-like raw sheet 50a having the third slits 51, 52 formed in the X axis direction as a structural material and burying all of the heat dissipation member in the resin material 300.
The heat dissipation member 100 (100a) is one structure, has an area in a wide surface direction, and furthermore, is also continuously oriented in the thickness direction, and thus a thermally conductive path that is not cut in the middle in the thickness direction is formed. Parts (the top surfaces 54 and the bottom surface 55) of the heat dissipation member 100 (100a) are respectively located on the top and bottom surfaces of the heat dissipation sheet 200 in a wide area, and thus it is possible to efficiently conduct heat in the interface with an adherend (a heat generator or the like), and thermal resistance during actual use can be decreased. The first slits 56 and the second slits 57 that extend in the Y axis direction are provided, and the heat dissipation member is also capable of flexibly transforming in the X axis direction. In a case in which the heat dissipation member 100a illustrated in
Since the first slits 56 and the second slits 57 are provided, a spatial region that is continuously connected in the three-axis directions is formed, and thus the property of allowing the resin material 300 to be loaded at the time of burying the heat dissipation member in the resin material 300 is excellent. When the heat dissipation member 100a including the third slits 51, 52 is employed, a superior loading property is maintained. Therefore, the resin material 300 does not drop off from the heat dissipation sheet 200 after being loaded, and the durability also improves.
In order to further improve the loading property of the resin material 300, it is also possible to form small pores with a diameter of approximately 0.05 mm in all or an appropriate portion of the raw sheet 50 or 50a to an extent in which the contact area with an adherend (a heat generator or the like) is not meaningfully impaired, for example, approximately 1 vol % or less of the entire raw sheet.
As described above, the heat dissipation member 100 (100a) is structurally strong and has a relatively high degree of freedom in bending and thus has an advantage of the increasing degree of freedom in being attached to an electronic component that generates heat for itself such as CPU. The heat dissipation member is capable of following a work shape such as an uneven surface or an R surface in addition to a flat surface and is thus being used in a broadening scope of places. Regarding the aspects of use, not only the use of the heat dissipation sheet 200 that has been loaded with the resin but also an aspect of use in which solely the heat dissipation member 100 (100a) is attached to a work side and then loaded with the resin material 300, thereby producing the heat dissipation sheet 200 become possible.
Other Configurations of Heat Dissipation Sheet
The volume fraction of the heat dissipation member 100 (100a) in the total volume of the heat dissipation sheet 200 is not particularly limited, but is desirably 5% or more and 80% or less. At a volume fraction of less than 5%, it is not possible to increase the thermal conductivity, and thus the heat dissipation sheet is not useful as a heat dissipation material. A region that does not contribute to heat dissipation broadens, and thermal conduction unevenness becomes significant in the heat dissipation sheet, and thus there is likelihood that an unpredictable high-temperature portion may be generated in the product. When the volume fraction exceeds 80%, the thermal conductivity of the heat dissipation sheet becomes high, but the heat dissipation sheet becomes too hard, the interface thermal resistance with a product increases, and there is a likelihood that desired heat dissipation performance cannot be obtained.
The ratio between the thickness of the raw sheet 50 (50a) that configures the heat dissipation member 100 (100a) and the thickness of the heat dissipation sheet 200 is desirably 1:3 or more and 1:10 or less. When the ratio between the thickness of the raw sheet 50 (50a) and the thickness of the heat dissipation sheet 200 is less than 1:3, the flexibility of the heat dissipation member against a compressive stress in the thickness direction decreases, and the flexibility as a heat dissipation sheet is impaired, and thus the interface thermal resistance with a product increases, and there is a likelihood that desired heat dissipation performance cannot be obtained. When the ratio between the thickness of the raw sheet 50 (50a) and the thickness of the heat dissipation sheet 200 exceeds 1:10, it is not possible to increase the volume fraction of the heat dissipation member, and an increase in the thermal conductivity is not possible.
Hereinafter, the superiority of the heat dissipation sheet 200 according to the present disclosure will be described using examples and comparative examples.
0.2 mm-thick pure Cu foils that were the thin plate-like raw sheet 50a illustrated in
As shown in Table 1, in Examples 1, 2, and 3, the heat dissipation members 100a were made to differ in dimensions or shape, thereby providing different volume fractions of the heat dissipation member (Cu) in the heat dissipation sheet 200. The used silicone resin was KE-1870 (addition reaction-type resin) manufactured by Shin-Etsu Chemical Co., Ltd., the curing conditions were 150° C.×30 minutes, the viscosity was 400 mPa·s, and the hardness after curing was 15 (durometer A).
Heat dissipation members 10 and heat dissipation sheets 20 were produced using the same materials and the method of the related art that has been previously described based on
Characteristic Test
For Example Products 1 to 3 and Comparative Example Products 1 to 3, the thermal conductivity and the thermal resistance were measured using the steady method. The results are shown in Table 1.
Evaluation
In Example Products 1, 2, and 3 and Comparative Example Products 1, 2, and 3, the final thicknesses were all equal to one another (2 mm), and the volume fractions of the heat dissipation member and the resin were also almost equal to one another. However, in Example Products 1, 2, and 3, the thermal conductivity improved more significantly compared with those in Comparative Example Products 1, 2, and 3. The thermal resistance became smaller in Example Products 1, 2, and 3 compared with in Comparative Example Products 1, 2, and 3. This results from the fact that the heat dissipation members that were used in the present examples basically had the shape illustrated in
Number | Date | Country | Kind |
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2017-165421 | Aug 2017 | JP | national |