This application claims the priority benefit of Taiwan patent application number 100103031 filed on Jan. 27, 2011.
The present invention relates to a heat-dissipation structure; and more particularly to a heat-dissipation structure that includes at least one tube embedded in a main body of a base by pour molding or injection molding one or more types of materials to serve as a water passage in the base, so as to reduce the manufacturing cost and avoid the risk of water leakage. The present invention also relates to a method of manufacturing the above-described heat-dissipation structure.
While the currently developed electronic devices have constantly increased computing performance, electronic elements provided inside these electronic devices also produce increased amount of heat during operation thereof. Usually, a heat sink or a set of radiating fins is provided on a heat-producing electronic element to enable increased heat-dissipation area and accordingly, upgraded heat-dissipation effect thereof. However, the conventional heat sink and radiating fins dissipate heat by way of radiating the heat into ambient environment, and only a limited heat-dissipation effect can be achieved with them. Therefore, a liquid-cooling thermal module has been developed and widely employed in electronic devices for the same to have enhanced heat-dissipation performance.
Among others, water-cooling thermal modules have been most widely employed for heat dissipation. A currently available water-cooling thermal module includes a water block, a pump, and a water tank that are serially connected to one another via at least one tube to form a heat-dissipation circulation loop.
The water block is made of a copper material and is internally formed with a plurality of water passages, which are serially connected to the pump and the water tank via the tube. When the water block is in contact with at least one heat source to absorb heat therefrom, the heat absorbed by the water block can be carried away from the water block by a heat-dissipation liquid, i.e. water, pumped out of the water tank by the pump and flowed into the water passages in the water block. The heat-dissipation liquid carrying the heat then flows through the water block back into the water tank to complete one cycle of heat exchange.
The water passages in the water block are mainly formed by mechanically machining, such as milling, one side of the water block to produce grooves, and the grooves are then covered with another material to form the water passages.
The water block is usually made of a material with good heat-transfer efficiency, such as a copper material. Then, the selected copper material is fabricated to form the water block. Since the water block has only one side in contact with the heat source to transfer heat, all other sides of the water block are ineffective areas in terms of heat dissipation. Therefore, a large part of the cost for the copper material is wasted.
Further, when the water block has been used for a period of time, the material thereof tends to become broken or damaged due to oxidation or degradation, resulting in leaking of the heat-dissipation liquid out of the water passages, which will no doubt cause very serious problem to the water-cooling electronic device using same. Therefore, the prior art water-cooling thermal module has the following disadvantages: (1) being subject to water leakage; and (2) requiring relatively high manufacturing cost.
A primary object of the present invention is to provide a heat-dissipation structure capable of preventing leakage of water therefrom.
Another object of the present invention is to provide a method of manufacturing heat-dissipation structure that enables reduced manufacturing cost of a heat-dissipation structure.
To achieve the above and other objects, the heat-dissipation structure according to the present invention includes a base having a main body and at least one tube. The tube has an inlet, an outlet, and a tube body. The tube body is embedded in the main body while the outlet and the inlet are exposed from the main body.
To achieve the above and other objects, the method of manufacturing heat-dissipation structure according to an embodiment of the present invention includes the following steps:
providing a mold having a mold cavity and a tube; and
positioning the tube in the mold cavity of the mold, and forming a main body in the mold by pour molding to embed the tube in the main body.
To achieve the above and other objects, the method of manufacturing heat-dissipation structure according to another embodiment of the present invention includes the following steps:
providing a mold having a mold cavity, a first body, and a tube; and
positioning the tube on a top of the first body; placing the first body having the tube positioned thereon in the mold cavity of the mold; and forming a second body on the top of the first body to cover the first body and the tube, so that the second body, the first body, and the tube form an integral body.
To achieve the above and other objects, the method of manufacturing heat-dissipation structure according to a further embodiment of the present invention includes the following steps:
providing a mold having a mold cavity, a first body having a groove provided on a top thereof, and a tube; and
setting the tube in the groove on the top of the first body, placing the first body having the tube set in the groove in the mold cavity of the mold, and forming a second body on the top of the first body to cover the first body and the tube, so that the second body, the first body and the tube form an integral body.
With the present invention, the heat-dissipation structure can be formed with one or more types of materials and the tube embedded in the base can serve as a water passage, enabling the heat-dissipation structure to be manufactured at reduced material, labor and time costs, and to avoid the risk of water leakage. Therefore, the present invention has the following advantages: (1) saving the manufacturing cost; and (2) avoiding the risk of water leakage.
The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein
The present invention will now be described with some preferred embodiments thereof and with reference to the accompanying drawings. For the purpose of easy to understand, elements that are the same in the preferred embodiments are denoted by the same reference numerals.
Please refer to
Please refer to
Please refer to
In the above-described first, second and third embodiments, the base 1 and the tube can be made of any one of a copper material, an aluminum material, and a stainless steel material; the second part 112 of the main body 11 can be made of a non-metal material, such as a plastic material, or a material with relatively good heat-dissipation efficiency, such as any one of an aluminum material and a copper material, preferably an aluminum material.
In the above-mentioned second and third embodiments, the first part 111, the second part 112, and the tube 12 can together form an integral body by way of insert molding. In this manner, different types of materials can be used to form the heat-dissipation structure of the present invention to achieve the object of saving material cost.
Further, the use of the tube 12 as the water passage in the base 1 is able to avoid water leakage caused by oxidation or degradation of the main body 11 (or the first part 111 and the second part 112).
In a first step S1 according to the first embodiment of the manufacturing method, a mold having a mold cavity and a tube are provided.
More specifically, as can be seen from
Then, in a second step S2, the tube is positioned in the mold cavity of the mold, and a main body is formed by pour molding to embed the tube therein.
More specifically, as can be seen from
A first step S1 according to the second embodiment of the manufacturing method is the same as that in the first embodiment and is therefore not repeatedly described.
Then, in a second step S2, which is different from that in the first embodiment, the tube is positioned in the mold cavity of the mold, and a main body is formed by pour molding to embed the tube therein.
More specifically, as can be seen from
In a first step X1 according to the third embodiment of the manufacturing method, a mold having a mold cavity, a first body, and a tube are provided.
More specifically, as can be seen from
Then, in a second step X2, the tube is positioned on a top of the first body, and the first body with the tube positioned thereon is placed in the mold cavity of the mold; and a second body is formed on the top of the first body to cover the first body and the tube, so that the second body, the first body and the tube form an integral body.
More specifically, as can be seen from
A first step X1 according to the fourth embodiment of the manufacturing method is the same as that in the third embodiment and is therefore not repeatedly described.
Then, in a second step X2, which is different from that in the third embodiment, the tube is positioned on a top of the first body, and the first body with the tube positioned thereon is placed in the mold cavity of the mold; and a second body is formed on the top of the first body to cover the first body and the tube, so that the second body, the first body and the tube form an integral body.
More specifically, as can be seen from
In a first step Y1 according to the fifth embodiment of the manufacturing method, a mold having a mold cavity, a first body having a groove provided on a top thereof, and a tube are provided.
More specifically, as can be seen from
Then, in a second step Y2, the tube is set in the groove on the top of the first body, and the first body with the tube set in the groove is placed in the mold cavity of the mold; and a second body is formed on the top of the first body to cover the first body and the tube, so that the second body, the first body and the tube form an integral body.
More specifically, as can be seen from
A first step Y1 according to the sixth embodiment of the manufacturing method is the same as that in the fifth embodiment and is therefore not repeatedly described.
Then, in a second step Y2, which is different from that in the fifth embodiment, the tube is set in the groove on the top of the first body, and the first body with the tube set in the groove is placed in the mold cavity of the mold; and a second body is formed on the top of the first body to cover the first body and the tube, so that the second body, the first body and the tube form an integral body.
More specifically, as can be seen from
With the first, second and third embodiments of the heat-dissipation structure according to the present invention and the first to the sixth embodiment of the method according to the present invention for manufacturing the heat-dissipation structure, the heat-dissipation structure can be formed with one type or two and more different types of materials to reduce the material, labor and time costs. Further, a material with relatively high heat transfer efficiency, such as a copper material, and a material with relatively high heat dissipation efficiency, such as an aluminum material, can be selected for forming the first part and the second part of the main body, respectively, to embed the tube 12 therebetween by means of insert molding or casting, so as to achieve upgraded heat dissipation efficiency.
Moreover, the use of the tube 12 to replace the water passages for the conventional heat-dissipation structure can not only prevent the risk of water leakage, but also save the time and labor for mechanically forming water passages on the water block, and accordingly, enables increased good yield and reduced manufacturing cost of the heat-dissipation structure.
The present invention has been described with some preferred embodiments thereof and it is understood that many changes and modifications in the described embodiments can be carried out without departing from the scope and the spirit of the invention that is intended to be limited only by the appended claims.
Number | Date | Country | Kind |
---|---|---|---|
100103031 | Jan 2011 | TW | national |