Patent Application
20110075431
The present invention relates to a heat dissipation structure for LED lamp, and more particularly to an LED lamp heat dissipation structure that has simple structure and small volume to enable the LED lamp to have reduced volume, good heat dissipation effect, and lowered manufacturing cost.
The light-emitting-diode (LED) lamp, due to its low power consumption and high brightness, has been widely developed and applied to various kinds of products in recent years. However, LEDs in working would produce a large amount of heat, which would adversely affect the service life of the LEDs or even cause burnout of the LEDs. Therefore, most of the conventional LED lamps are provided with a heat dissipation structure to dissipate the heat produced by the working LEDs, so as to maintain the LEDs in normal operation. Conventional heat dissipation structure for LED lamp often includes large-area aluminum radiating fins to dissipate the largest part of the produced heat. These large-area aluminum radiating fins prevent the LED lamp from having a small volume and produce heat concentration effect, and are therefore not the best way for heat dissipation. Moreover, the large-volume aluminum radiating fins disadvantageously require high cost.
It is therefore tried by the inventor to develop an improved LED lamp heat dissipation structure that is simple, low cost, and small in volume.
A primary object of the present invention is to provide a heat dissipation structure for LED lamp, so that the LED lamp has simple heat dissipation structure to enable reduced manufacturing cost, reduced lamp volume, increased heat dissipation effect, and accordingly, increased competing ability in the market.
To achieve the above and other objects, the heat dissipation structure for LED lamp according to a preferred embodiment of the present invention includes one or more mounting plates, a bottom locating plate into which lower ends of the mounting plates are inserted, a top locating plate connected to upper ends of the mounting plates, and a heat radiating member arranged beneath the top locating plate. The mounting plate and the top and bottom locating plates each are provided with a metal layer, and a plurality of LEDs is welded at respective leads to the metal layers. The top locating plate and the metal layer thereof are provided with a plurality of tiny perforations.
When the heat dissipation structure is assembled to a lamp holder to form an LED lamp and the LEDs are lightened, heat produced by the LEDs during working is radiated from the metal layers on the mounting plates, the bottom locating plate and the top locating plate, and from the heat radiating member, which together provide a relatively large heat radiating area; meanwhile, the perforations provided on the top locating plate allow convection of air in the LED lamp, and openings and an annular space provided on the lamp holder allow exchange of air inside and outside the LED lamp, allowing the LED lamp to have simple heat dissipation structure, reduced volume, increased heat dissipation efficiency, and reduced manufacturing cost.
In the present invention, the mounting plates are circuit boards, and the metal layers thereof are printed circuits arranged on the circuit boards.
In the present invention, the metal layers can be provided on one single side or two opposite sides of the circuit boards to provide increased heat dissipation area.
In the present invention, the heat radiating member provided beneath the top locating plate is a long metal strip wound into a roll to provide increased heat radiating area within a small volume. And, by taking advantage of the expansion of the heated metal strip of the heat radiating member, good air convection in the LED lamp can be achieved.
The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein
The present invention will now be described with some preferred embodiments thereof. For the purpose of easy to understand, elements that are the same in the preferred embodiments are denoted by the same reference numerals.
Please refer to
The one or more mounting plates 1 each are provided with a metal layer 11. A plurality of LEDs 4 is welded at respective leads to the metal layers 11 on the one or more mounting plates 1. In the illustrated first embodiment, the one or more mounting plates 1 are circuit boards, and the metal layers 11 are printed circuits arranged on the circuit boards; and the metal layers 11 can be provided on one single side or on two opposite sides of the circuit boards.
The bottom locating plate 2, into which lower ends of the one or more mounting plates are inserted, is provided with a metal layer 21. A plurality of LEDs 4 is welded at respective leads to the metal layer 21. In the illustrated first embodiment, the bottom locating plate 2 is a circuit board, and the metal layer 21 is a printed circuit arranged on the circuit board; and the metal layer 21 can be provided on one single sided or on two opposite sides of the circuit board.
The top locating plate 3, to which upper ends of the one or more mounting plates 1 are connected, is provided with a metal layer 31. A plurality of LEDs 4 is welded at respective leads to the metal layers 31. In the illustrated first embodiment, the top locating plate 3 is a circuit board, and the metal layer 31 is a printed circuit arranged on the circuit board; and the metal layer 31 can be provided on one single sided or on two opposite sides of the circuit board. And, the top locating plate 3 and the metal layer 31 are provided with a plurality of tiny perforations 32.
The heat radiating member 5 is located beneath the top locating plate 3, and includes a long metal strip, an end of which is welded to the top locating plate 3 while an opposing end of which is inward wound to form a roll.
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To assemble the heat dissipation structure of the present invention to the lamp holder 6 to form an LED lamp, the bottom locating plate 2 is fixed to the lamp holder 6. When the LEDs 4 are lightened, heat produced by these LEDs 4 during working can be radiated from the metal layers 11, 21, 31 on the mounting plates 1, the bottom locating plate 2 and the top locating plate 3, and from the heat radiating member 5, which together provide a relatively large heat radiating area. Meanwhile, the perforations 32 provided on the top locating plate 3 allow air convection due to relatively hot air and relatively cool air in upper and lower portions, respectively, in the lamp shade 61. The openings 63 and the annular space 64 also allow exchange of air inside and outside the lamp shade 61. With these arrangements, heat produced by the LEDs 4 during working can be effectively dissipated into open air surrounding the LED lamp while the LED lamp has a reduced volume. Moreover, the heat dissipation structure for LED lamp according to the present invention has simple structure and can therefore be produced at reduced cost.
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In brief, the heat dissipation structure for LED lamp according to the present invention has the following advantages: (1) having simple structure to enable reduced manufacturing cost; (2) providing good heat dissipation effect; and (3) allowing the LED lamp to have reduced volume and accordingly upgraded competing ability in the market.
It is understood the heat dissipation member is not necessarily wound into a roll but can be a long metal strip being, for example, differently folded or bent into a reduced volume while providing a large heat radiating area. Further, the metal layer and the heat radiating member according to a preferred embodiment of the present invention can be copper foil, which provides good heat conductivity and ductility to achieve the heat dissipation function. However, it is understood other metals with good heat conductivity and ductility can also be used in the present invention. Therefore, while the present invention has been described with some preferred embodiments thereof, it is understood that many changes and modifications in the described embodiments can be carried out without departing from the scope and the spirit of the invention that is intended to be limited only by the appended claims.
