Patent Application
20120188716
1. Technical Field
The disclosure generally relates to a heat dissipation system, and especially to a heat dissipation system for improving heat dissipation efficiency of multiple heat sources in a computer system.
2. Description of Related Art
A small form factor (SFF) is a computer form factor designed to minimize the spatial volume of a desktop computer. A typical SFF includes a CPU fan and a system fan in a computer case. A plurality of mass storage devices (hard disc driver, optical disc driver) is positioned in the computer case. A heat sink is mounted on the CPU to remove heat, and the CPU fan is fixed on the heat sink to blow airflow through the heat sink. The temperature of the airflow increases by removing the heat generated by the CPU as it passes through the heat sink. The heated airflow is then exhausted from the computer case by the system fan. However, the typical SFF heat dissipation system may be a side-flow type with the fan disposed at a side of the heat sink and plurality of heat pipes fixed on the heat sink. The typical SFF heat dissipation system can only dissipate heat for the single CPU and needs to use heat pipes, which are not efficient and increases the cost.
Therefore there is a room for improvement in the art.
Many aspects of the embodiments can be better understood with references to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
The disclosure is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings in which like references indicate similar elements. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
Referring to
Referring to
Two slots 233 are defined on two opposite sides of the plurality of parallel fins 232. The fan bracket 24 includes a frame 241 and four support legs 242 on corners of the frame 241. Two clamp portions 2411 are defined on two opposite sides of the frame 241 corresponding to the slots 233. The clamp portions 2411 are locked in the corresponding slots 233 to fix the fan bracket 24 on the heat sink 23. The support legs 242 are fixed in the corresponding securing holes (not shown) on the motherboard 20 to fix the heat sink 23 on the motherboard 20. An air outlet opening 2412 is defined on a top plate of the frame 241 for directing airflow from the first fan 25 toward the heat sink 23. Four clasps 2413 and protrusion portions 2414 are defined on the corners of the frame 241 adjacent to the air outlet opening 2412.
The first fan 25 includes a shell 251 and a plurality of fan blades 252. The rotating axis of the first fan 25 is perpendicular to the motherboard 20. A plurality of fixing holes 2511 are defined on corners of a top plate and a bottom plate of the shell 251. The protrusion portions 2414 pass through the corresponding fixing holes 2511. The clasps 2413 clamp edges of the top plate and the bottom plate of the shell 251 to fix the first fan 25 on the fan bracket 24.
A second fan 26 is fixed on the side plate 12 facing to the heat sink 23. A rotating axis of the second fan 26 is parallel to the motherboard 20. The base plate 11 includes a drive device 30 mounted beside the motherboard 20. The drive device 30 is adjacent to the front plate 13. A plurality of air inlet holes 121 are defined on the side plate 12. Cool air from outside is able to flow through an air inlet opening of the first fan 25 via the plurality of air inlet holes 121 and the drive device 30. In one embodiment, the first heat source 21 is a CPU; the second heat source 22 is a voltage regulating chip; and the drive device 30 is an optical disc drive.
Referring to
The heat dissipation system is a down-flow type with the first fan 25 disposed on top of the heat sink 23. The rotating axis of the first fan 25 is perpendicular to that of the second fan 26. An air path (not shown) is defined between the plurality of air inlet holes 121 and the back plate 14. The air path directs airflow toward the heat sink 23 via the drive device 30 and the first fan 25. The air path directs airflow out of the computer case 10 via the second fan 26. The heat dissipation system can dissipate heat from the heat sink 23 and the second heat source 22 at the same time. And heat pipes in the typical heat dissipation system are not needed. Therefore heat dissipation efficiency is improved and cost is largely decreased.
It is to be understood, however, that even though numerous characteristics and advantages have been set forth in the foregoing description of preferred embodiments, together with details of the structures and functions of the preferred embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
| Number | Date | Country | Kind |
|---|---|---|---|
| 201110028513.X | Jan 2011 | CN | national |
