Patent Application
20170199554
This non-provisional application claims priority under 35 U.S.C. ยง119(a) on Patent Application No(s). 105101004 filed in China on Jan. 13, 2016, the entire contents of which are hereby incorporated by reference.
The disclosure relates to a heat dissipation system, more particularly to a heat dissipation system equipped with a thermoelectric cooler.
Electronic products such as tablet computers or notebook computers have been developed to be more powerful because electronic components, such as high performance central processing unit (CPU) and high performance graphics processing unit (GPU), are provided therein. However, the high performance electronic components require lots of energy to operate, which generates a large amount of heat. If the heat is not removed, the performance of the electronic components will be degraded by overheating and thereby causing the electronic components to shutdown. Accordingly, a heat dissipation module is provided for cooling the heat source (e.g. the CPU). In some specific electronic products, the heat dissipation modules is additionally equipped with a thermoelectric cooler (TEC) for improving cooling efficiency.
The present disclosure provides a heat dissipation system for solving the problem that the traditional heat dissipation module is high in energy consumption and large in size.
One embodiment of the disclosure provides a heat dissipation system including a first heat dissipation module, a second heat dissipation module and a thermoelectric cooler. The first heat dissipation module is in thermal contact with at least one heat source. The second heat dissipation module includes a fan and a heat sink. The fan of the second heat dissipation module is disposed on the heat sink. The thermoelectric cooler is spaced apart from the at least one heat source and is in thermal contact with the at least one heat source through the first heat dissipation module. The heat sink of the second heat dissipation module is in thermal contact with the thermoelectric cooler.
The present disclosure will become more fully understood from the detailed description given hereinbelow and the accompanying drawings which are given by way of illustration only and thus are not limitative of the present disclosure and wherein:
In the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the disclosed embodiments. It will be apparent, however, that one or more embodiments may be practiced without these specific details. In other instances, well-known structures and devices are schematically shown in order to simplify the drawing.
Please refer to
In this embodiment, the heat dissipation system 1 includes two first heat dissipation modules 10, a heat conducting plate 20, a thermoelectric cooler 30 and a second heat dissipation module 40. Both of the two first heat dissipation modules 10 are active heat dissipation modules. The two first heat dissipation modules 10 are able to remove heat generated by the heat source 91 and the heat source 92. The second heat dissipation module 40 is in thermal contact with the thermoelectric cooler 30. The thermoelectric cooler 30 is in thermal contact with the two first heat dissipation modules 10 through the heat conducting plate 20. The thermoelectric cooler 30 is spaced apart from the heat sources 91 and 92. That is, the thermoelectric cooler 30 is indirectly in thermal contact with the heat sources 91 and 92.
In detail, taking the first heat dissipation module 10 at the right side of
The first heat absorbing member 111 and the second heat absorbing member 112 are in thermal contact with the first heat dissipating assembly 130 through the first heat conducting member 120. That is, the first heat conducting member 120 is in thermal contact with both of the two heat absorbing members 111 and 112 and the first heat dissipating assembly 130. Specifically, in this embodiment, the first heat conducting member 120 includes a plurality of heat pipes 121. The first heat dissipating assembly 130 includes a first fan 131 and a first heat sink 133. The first fan 131 is, for example, a centrifugal fan disposed on the first heat sink 133. One end of the heat pipes 121 is in thermal contact with the first heat absorbing member 111 and the second heat absorbing member 112 by, for example, adhesion or welding. The other end of the heat pipes 121 is in thermal contact with the first heat sink 133 of the first heat dissipating assembly 130 by, for example, adhesion or welding. Thus, heat absorbed by the first heat absorbing member 111 and the second heat absorbing member 112 is able to be transferred to the first heat dissipating assembly 130 through the first heat conducting member 120 and then dissipated by the first heat dissipating assembly 130. The two first heat dissipation modules 10 share the same second heat absorbing member 112. However, the present disclosure is not limited to the quantity of the heat absorbing members. In other embodiments, the two first heat dissipation modules 10 can be equipped with only one heat absorbing member. In addition, the present is not limited to the quantity of the heat pipes 121. For example, please see the first heat dissipation module 10 at the left side of
The heat conducting plate 20 is made of high thermal conductivity materials such as iron, aluminum or iron-aluminum alloy. In this embodiment, the heat conducting plate 20 is fixed onto the first heat absorbing member 111 and the second heat absorbing member 112 and in thermal contact with the first heat conducting members 120 of the two first heat dissipation modules 10. The thermoelectric cooler 30 is in thermal contact with the heat conducting plate 20 by, for example, adhesion or welding.
In this embodiment, the second heat dissipation module 40 is an active heat dissipation module and includes a second heat conducting member 420 and a second heat dissipating assembly 430. In detail, the second heat conducting member 420 includes a heat pipe. The second heat dissipating assembly 430 includes a second fan 431 and a second heat sink 433. The second fan 431 is disposed on the second heat sink 433. The second heat conducting member 420 is in thermal contact with the second heat sink 433 and the thermoelectric cooler 30 by, for example, adhesion or welding.
In detail, please refer to
Please refer back to
The thermoelectric cooler 30 and the second heat dissipation module 40 can be turned on according to a specific circumstance. Specifically, before the temperature of the heat source 91 or 92 reaches a predetermined threshold temperature, the thermoelectric cooler 30 and the second heat dissipation module 40 will not be turned on. Under the circumstances, the heat source 91 and the heat source 92 are cooled by the two first heat dissipation modules 10. When the temperature of the heat source 91 or the heat source 92 reaches or exceeds the predetermined threshold temperature, the thermoelectric cooler 30 and the second heat dissipation module 40 will be turned on, for example, by a controller (not shown in the drawings). In such a case, heat absorbed by the first heat dissipation module 10 is able to be transferred to the thermoelectric cooler 30 through the heat conducting plate 20 and then dissipated by the second heat dissipation module 40, which increases cooling efficiency of the system so as to decrease the temperature of the heat sources effectively.
In other words, before the temperature of the heat source reaching the predetermined threshold temperature, the electronic components of the electronic product 9 mainly rely on the first heat dissipation modules 10 to dissipate heat generated thereby. Thus, the thermoelectric cooler 30 and the second heat dissipation module 40 for cooling the thermoelectric cooler 30 will not be turned on and require no energy. Hence, the amount of energy for cooling the heat sources is reduced.
In addition, in the heat dissipation system 1, the thermoelectric cooler 30 is spaced apart from the heat sources 91 and 92. That is, the thermoelectric cooler 30 is indirectly in thermal contact with the heat sources. A preset temperature of triggering the thermoelectric cooler is no need to be set too low so that the thermoelectric cooler 30 is prevented from being operated too often and too long during cooling the heat sources, which consumes less energy. Therefore, waste heat generated by the thermoelectric cooler 30 is reduced during operation and has less influence on the cooling efficiency. Hence, the second heat dissipation module 40 has no need to be designed large in size, which occupies less inner space of the electronic product 9.
It is noted that the said predetermined threshold temperature can be altered according to actual requirement.
According to the heat dissipation system discussed above, since the thermoelectric cooler is spaced apart from the at least one heat source and in thermal contact with the at least one heat source through the first heat dissipation module, the heat source is indirectly in thermal contact with the thermoelectric cooler but directly in thermal contact with the first heat dissipation module. Thus, the thermoelectric cooler can be turned on or off according to a predetermined threshold temperature. For example, before the temperature of the heat source reaching the predetermined threshold temperature, the electronic components mainly rely on the first heat dissipation modules to remove heat generated by the heat source, the thermoelectric cooler and the second heat dissipation module for cooling the thermoelectric cooler will not be turned on and require no energy. Hence, the amount of energy for cooling the heat source is reduced.
In addition, since the thermoelectric cooler is indirectly in thermal contact with the heat source, a preset temperature of triggering the thermoelectric cooler has no need to be set too low. Thus, the thermoelectric cooler is prevented from being operated too often and too long during cooling the heat source, which consumes less energy.
Moreover, the second heat dissipation module for cooling the thermoelectric cooler is an active heat dissipation module, which is able to effectively cool the thermoelectric cooler. Therefore, the thermoelectric cooler requires less energy to operate so that waste heat generated by the thermoelectric cooler is reduced during operation and has less influence on the cooling efficiency. In addition, the heat dissipation system of the present disclosure is not need to be equipped with any additional large size heat dissipation module for removing the waste heat, which is favorable for developing light and thin electronic products.
| Number | Date | Country | Kind |
|---|---|---|---|
| 105101004 | Jan 2016 | TW | national |
