Number | Name | Date | Kind |
---|---|---|---|
3170512 | Smith | Feb 1965 | |
3384154 | Milton | May 1968 | |
3696861 | Webb | Oct 1972 | |
3825064 | Inoue | Jul 1974 | |
3990862 | Dahl et al. | Nov 1976 | |
4179911 | Saier et al. | Dec 1979 | |
4182412 | Shum | Jan 1980 | |
4232056 | Grant et al. | Nov 1980 | |
4258783 | Alber | Mar 1981 |
Number | Date | Country |
---|---|---|
52-14259 | Feb 1977 | JPX |
Entry |
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Heat Transfer from Silicon Chips and Wafers, Noth, IBM Technical Disclosure Bulletin, vol. 17, No. 12, May 1975, p. 3544. |
Tubular Hollow Cathode Sputtering onto Substrates of Complex Shape, Thornton et al., J. Vac. Sci. Technol., vol. 12, No. 1, Jan./Feb. 1975, pp. 93-97. |
Snap-on Nucleate Boiling Promoter, Chu et al., IBM Technical Disclosure Bulletin, vol. No. 3, Aug. 1968, pp. 277-278. |