Heat exchanger easy mount system

Abstract

A heat exchange easy mount system is presented. A number of embodiments are presented. The easy mount system includes one or more tabs or appendages extending from the heat exchange unit and locking into holes or cavities in surfaces of an electronic system housing. Another embodiment of the easy mount system includes one or more guide pins extending from the heat exchange unit and into holes or cavities in surfaces of an electronic system housing for additional stability. Yet another embodiment of the easy mount system includes one or more shock absorbers disposed on the tabs or guide pins for reducing shocks associated with movement of the electronic system; reducing noise from the heat exchange unit in operation; and reducing the transmission of vibrations from heat exchange unit in operation to the system housing. Another embodiment includes a tool for easy disengagement of the heat exchange unit from the system housing. Another embodiment of the mounting system includes rails and guides for automatic alignment of the heat exchanger for mounting. This embodiment may also have quick connectors for connecting the heat exchanger to the cooling system, electrical connectors for connecting electrical power to the heat exchanger and may have tabs and/or guide pins.

Description

BACKGROUND OF THE INVENTION

Description of the Related Art

At the heart of data processing and telecommunication devices are processors and other heat-generating components which are becoming increasingly more powerful and generating increasing amounts of heat. As a result, more powerful cooling systems are required to prevent these components from thermal overload and resulting system malfunctions or slowdowns.

Traditional cooling approaches such as heat sinks and heat pipes are unable to practically keep up with this growing heat problem. As these components become increasingly more powerful, the size and weight of air-cooled solutions become more problematic as well. In smaller housings or rack mounted systems, the space required for air-cooled solutions becomes unacceptable. Cooling systems which use a liquid or gas to cool these heat generating components are becoming increasingly needed and more viable. These systems utilize heat transfer units thermally coupled to the heat generating components for absorbing or extracting heat from the heat generating components into a coolant flowing there through. The coolant, now heated, is directed to a heat exchanger where heat is dissipated from the coolant, creating cooled coolant and returned to the heat transfer unit to repeat the cycle.

Liquid cooling for these heat generating components is a more viable approach to this heat problem. A typical liquid cooling system employs one or more heat transfer units thermally coupled to the heat generating components for absorbing heat from the components into the liquid coolant and a heat exchanger which dissipates heat from the coolant and returns cooled liquid to the heat transfer units.

The heat transfer unit typically comprises a housing with a cavity there through for the coolant to flow through. The contact surface (with the heat generating components) must have excellent thermal transfer capability and a wide variety of materials can be used such as copper.

For today's powerful microprocessors, for example, a bulky, heavy air cooled solution such as a heat sink or heat pipe dissipater must then be coupled to heat generating component and to the motherboard for fastening which often causes problems such as breakage of the motherboard from the substantial forces that must be generated to secure the entire assembly and even shipping damage from inertia due to the heavy weight of the air cooled cooling devices.

The cost and complexity of final assembly of motherboards and systems with these large, air cooled solutions also becomes problematic with space problems and expensive, and often damaging, processes for securing the air cooled system to the heat generating component and to the motherboard.

The cost and complexity of final assembly of a powerful cooling solution using liquid or gas is a concern, particularly with respect to the heat exchanger units. Heat exchange units must have sufficient surface area to dissipate the heat generated by the heat generating components. Consequently they must be a certain size and bulk.

Moreover, it is highly desirable to mount the heat exchange units within the system casing or housing. However with the form factors of the system casings shrinking, this becomes increasingly problematic. The assembly time and complexity of this process can be significant.

Additionally, care must be taken to insure that heat exchange units are securely fastened and do not come loose or otherwise cause damage, particularly in the shipping process.

Another concern is the elimination or minimization of noise and vibration of the heat exchange units in operation.

Thus, there is a need in the art for a method and apparatus for space-efficient and cost-effective mounting systems for heat exchange units.

There is also a need in the art for a method and apparatus for simple and cost-effective assembly of these cooling systems.

There is also a need in the art for a method and apparatus for secure mounting of the heat exchange units and for methods and apparatus to ensure low noise and low vibration operation of the heat exchange units.

SUMMARY OF THE INVENTION

A method and apparatus for mounting a heat exchange unit to an electronic system housing comprising one or more appendages extending from the heat exchange unit or the system housing; one or more appendage holes in the electronic system housing or the heat exchange unit, respectively, and aligned to receive the tabs; and wherein when the appendages are aligned with the holes and inserted therein, the heat exchange unit is mounted and secured to the electronic system housing.

The method and apparatus for mounting a heat exchange unit to an electronic system housing as described above within the housing of the electronic system.

The method and apparatus for mounting a heat exchange unit to an electronic system housing as described above further comprising one or more guide pins extending from the heat exchange unit or the system housing; one or more guide pin holes in the housing or the heat exchange unit, respectively, aligned to receive the guide pins; and wherein the guide pins are inserted into the guide pin holes when the appendages are inserted into the appendage holes, the guide pins providing further stability for the heat exchange unit mounted to the housing.

The method and apparatus for mounting a heat exchange unit to an electronic system housing as described above further comprising one or more shock absorbers disposed between the heat exchange unit and the housing.

The method and apparatus for mounting a heat exchange unit to an electronic system housing as described above wherein the shock absorbers are aligned to reduce shocks associated with movement of the electronic system; to reduce noise of the heat exchange unit in operation; and/or reduce the transmission of any vibration of the heat exchange unit in operation to the electronic system housing.

The method and apparatus for mounting a heat exchange unit to an electronic system housing as described above wherein the shock absorbers are coupled to the guide pins.

The method and apparatus for mounting a heat exchange unit to an electronic system housing as described above further comprising one or more shock absorbers disposed between the heat exchange unit and the housing.

The method and apparatus for mounting a heat exchange unit to an electronic system housing as described above wherein the shock absorbers are aligned to reduce shocks associated with movement of the electronic system; to reduce noise of the heat exchange unit in operation; and/or reduce the transmission of any vibration of the heat exchange unit in operation to the electronic system housing.

The method and apparatus for mounting a heat exchange unit to an electronic system housing as described above wherein the appendages are designed to require the use of a special tool to easily disengage such appendages from the appendage holes.

The method and apparatus for the mounting system as described above and further comprising guide means for aligning the heat exchange unit with the housing such that the appendages and the appendage holes are aligned for insertion.

The method and apparatus for the mounting system as described above wherein the guide means also align the guide pins and the guide pin holes for insertion.

The method and apparatus for the mounting system as described above further comprising one or more quick connectors having an insert and a receptacle and disposed such that one or more inserts and receptacles engage when a heat exchange unit is mounted to the electronic system thereby enabling coolant communication and disconnect when the heat exchange unit is dismounted from the electronic system thereby disabling coolant communication.

The method and apparatus for the mounting system as described above further comprising one or more electrical connectors and electrical receptacles for engaging when a heat exchange unit is mounted to the electronic system thereby enabling electrical power to the heat exchange unit and disconnect when the heat exchange unit is dismounted from the electronic system thereby disabling power from the heat exchange unit.

A method and apparatus for a mounting system for one or more heat exchange units to an electronic system housing comprising guide means for aligning and mounting the heat exchange units with/to the housing such that insertion of the heat exchange units fully into the guide means mounts the heat exchangers to the housing.

The method and apparatus for the mounting system as described above further comprising one or more quick connectors having an insert and a receptacle and disposed such that one or more inserts and receptacles engage when a heat exchange unit is mounted to the electronic system thereby enabling coolant communication and disconnect when the heat exchange unit is dismounted from the electronic system thereby disabling coolant communication.

The method and apparatus for the mounting system as described above further comprising one or more electrical connectors and electrical receptacles for engaging when a heat exchange unit is mounted to the electronic system thereby enabling electrical power to the heat exchange unit and disconnect when the heat exchange unit is dismounted from the electronic system, disabling power from the heat exchange unit.

The method and apparatus for the mounting system as described above further comprising one or more appendages extending from the heat exchange unit or the system housing; one or more appendage holes in the electronic system housing or the heat exchange unit, respectively, and aligned to receive the appendages; and wherein, when the heat exchange units are inserted into the guide means, the appendages are aligned with the holes and inserted therein.

The method and apparatus for the mounting system as described above further comprising one or more guide pins extending from the heat exchange unit or the system housing; one or more guide pin holes in the housing or the heat exchange unit, respectively, aligned to receive the guide pins; and wherein, when the heat exchange units are inserted into the guide means, the guide pins are inserted into the guide pin holes.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 depicts a schematic drawing of a cooling system.

FIG. 2A depicts a three-dimension view of a heat exchange unit with a mounting system thereon.

FIG. 2B depicts a partial, three-dimensional view of an electronic system housing for mounting the heat exchange unit.

FIG. 2C depicts a cross-sectional view of mounting tabs or appendages, guide pins, a surface of the system housing and shock absorbers.

FIG. 2D depicts a cross-sectional view of mounting tabs or appendages and a tool for disengaging the mounting tabs or appendages from the surface of the system

DETAILED DESCRIPTION

Whilst the making and using of various embodiments of the present invention are discussed in detail below, it should be appreciated that the present invention provides many applicable inventive concepts, which can be embodied in a wide variety of specific contexts. The specific embodiments discussed herein are merely illustrative of specific ways to make and use the invention and do not limit the scope of the invention.

It should be understood that the principles and applications disclosed herein can be applied in a wide range of data processing systems, telecommunication systems and other systems such as electrical and electronic systems. In the present invention, heat produced by a heat generating component, such as, but not limited to, a microprocessor in a data processing system, is transferred to a coolant in a heat transfer unit and dissipated in the cooling system. Liquid cooling solves performance and reliability problems associated with heating of various heat generating components in electronic systems.

The present invention may be utilized in a number of computing, communications, and personal convenience applications. For example, the present invention could be implemented in a variety of servers, workstations, exchanges, networks, controllers, digital switches, routers, personal computers which are portable or stationary, cell phones, and personal digital assistants (PDAs) and many others.

The present invention is equally applicable to a number of heat-generating components (e.g., central processing units, optical devices, data storage devices, digital signal processors or any component that generates significant heat in operation) within such systems. Furthermore, the dissipation of heat in this cooling system may be accomplished in any number of ways by a heat exchange unit of various designs, but which are not discussed in detail in this application. The present invention may even be combined with a heat exchanger as part of a single unit to constitute the entire cooling system.

Referring now to FIG. 1, a schematic diagram of a cooling system 100 is depicted. Coolant cooled by the heat exchange unit 101 flows from an outlet 106 of the heat exchange unit 101 through a conduit 105B, through the insert 112 of a quick connector 114/112, through a receptacle 114 of the quick connector 114/112 through conduit 105A to an inlet 108 of a heat transfer unit 102. Heat transfer unit 102 is thermally coupled to a heat generating component 103 such as, but not limited to, a microprocessor. The coolant flows though the heat transfer unit and absorbs heat from the heat generating component 103, thereby cooling the heat generating component 103. The heated coolant then exits the heat transfer unit 102 at outlet 109 and flows through conduit 104A to the receptacle 113 of quick connector 113/111, through the insert 111 of the quick connector 113/111, through conduit 104B to the inlet 107 of the heat exchange unit 101. As the coolant flows through the heat exchange unit 101, heat is dissipated there from and cooled coolant is delivered to the outlet 106 of the heat exchange unit 101 to repeat the cycle. A motor 116 for driving a pump (not shown), for example, in heat exchange unit 101 is also depicted along with electrical power conduits 117 for the motor 116.

It will be further appreciated that the use of quick connectors 113/111 and 114/112 are optional in the cooling system 100. Reference is made to pending U.S. patent application Ser. No. 11/361,943 for a more complete description of quick connectors and their function.

It will be appreciated that all of the embodiments of the present invention encompasses the use of any form or type of heat transfer unit 102 or the combination of different types of heat transfer units. The heat transfer unit 102 can be used with one or more heat generating components.

It will be understood that, in all of the embodiments of the present invention, any number and type of heat exchange units may be employed in any of the embodiments of the present invention including heat exchange units with or without reservoirs; with or without a pump; and with or without fans or other air flow devices. It should also be appreciated that a remotely mounted or external heat exchange unit may also be used. The heat exchange unit 101 may be used to cool one or more heat transfer units 102 connected in series or parallel or any combination thereof.

Any number of coolants, liquid or gas, may be used with any of embodiments of the present invention such as, for example, a propylene-glycol based coolant. The scope of this invention also includes refrigerated cooling systems of all types including, but not limited to, systems utilizing both conventional Freon and chilled coolant systems. This refrigerated cooling embodiment would include, for example, a heat exchange unit including a heat exchanger, a compressor, and an expansion valve or other flow control device, either in a single piece of equipment or as separate components, in conjunction with the heat transfer units herein to cool the heat generating components thermally coupled to the heat transfer units. Solid state refrigeration may also be utilized.

Whenever possible, it is desirable to orient the heat transfer unit 102 as shown in FIG. 1 and all of the embodiments of the present invention so that cooled coolant is received at a point below where heated coolant exits the heat transfer unit 102. This orientation allows the cooling system to take advantage of convective circulation of the coolant since heated coolant will naturally rise and cooled coolant will naturally drop. In this manner, the thermodynamics of the coolant can assist forced circulation, by a pump for example, and provide additional cooling of the heat generating components even after power is shut down to the electronic system through convective circulation. Similarly, and for the same reasons, it is desirable to orient the heat exchange unit 101 as shown in FIG. 1 and any of the embodiments of the present invention so that heated coolant is received at a point above where cooled coolant exits the heat exchange unit 101.

FIGS. 2A, 2B, 2C and 2D depict the heat exchange unit easy mount system 200 of the present invention. In FIG. 2A, a heat exchange unit 201 is depicted three-dimensionally with a heated coolant inlet 207 and a cooled coolant outlet 206. Alternatively, in lieu of or in addition to inlet 207 and outlet 206, quick connector inserts 111 and 112 may be used for the heat exchange unit inlet and outlet, respectively. Extending from surface 208 of the heat exchange unit 201 are a pair of mounting appendages or tabs 209 and a pair of guide pins 210. Extending from surface 211 of the heat exchange unit 201 are another pair of mounting appendages or tabs 212 and another pair of guide pins 213. An optional, electrical connector 237 is also depicted to mate with electrical receptacle 238, if used, for the purpose of providing electrical power to a motor, for example, 116 in FIG. 1, when the heat exchange unit 201 is mounted.

Mounting tabs 209 and 212 have a narrowed end point 214 for ease of insertion into a surface of the electronic system casing or housing. These mounting tabs 209 are also depicted with a straight surface 215 which will snap and lock into place against a exterior surface of the electronic system casing or housing after the pointed end 214 is inserted into cavities or holes in the surface of the electronic system casing or housing. Mounting tabs 209 and 212 may be made out of a variety of materials including, but not limited to, metals or plastics. The mounting tabs must be rigid enough to secure and lock into place, yet flexible enough to bend slightly as they are being inserted into the cavities or holes in the surface of the electronic system casing or housing. Preferably, the tabs are resiliently flexible. The shape of the mounting tabs 209 and 212 may also take a variety of forms so long as they easily insert into the cavities or holes in the surface of the electronic system casing or housing and remain secured thereto after insertion.

For added integrity and to further prevent against damage to the heat exchange unit 101 and the electronic system, particularly during shipping, guide pins 210 and 213 are included. The guide pins 210 and 213 may be composed of any number of materials such as steel, for example, and may be of any shape and thickness. In FIG. 2A, guide pins 210 and 213 are depicted as solid cylindrical steel pins extending from surfaces 208 and 211 of the heat exchange unit. During assembly, these guide pins 210 and 213 insert into cavities or holes in a surface of the electronic system casing or housing at the same time as the mounting tabs 209 and 212 are inserted and they preferably form a snug fit within these holes or cavities in the system casing or housing.

In FIG. 2A, a pair of mounting tabs 209 is depicted as extending from surface 208 of the heat exchange unit 201. Another pair of mounting tabs 212 is depicted extending from surface 211 of the heat exchange unit 201. It will be understood that the present invention applies to any number of such mounting appendages or tabs disposed in any location on any number of surfaces of the heat exchange unit 201. Similarly, FIG. 2A depicts a pair of guide pins 210 extending from surface 208 of the heat exchange unit 201. Another pair of guide pins 213 is depicted extending from surface 211 of the heat exchange unit 201. It will be understood that the present invention applies to any number of such guide pins disposed at any location on any number of surfaces of the heat exchange unit 201.

In FIG. 2B, a partial, three-dimensional view of a casing or housing 220 for the electronic system is depicted including a partial view of two surfaces, 221 and 224, of the housing 220. In surface 221, a pair of cut-outs, holes or cavities 222 is depicted. The holes or cavities 222 are located, sized and aligned so as to accept mounting tabs 209 when the heat exchange unit 201 is mounted to the system housing 220. In surface 221, another pair of cut-outs, holes or cavities 223 is depicted. The holes or cavities 222 are located, sized and aligned so as to accept guide pins 210 when the heat exchange unit 201 is mounted to the system housing 220.

In surface 224, a pair of cut-outs, holes or cavities 225 is depicted. The holes or cavities 222 are located and aligned so as to accept mounting tabs 212 when the heat exchange unit 201 is mounted to the system housing 220. In surface 224, another pair of cut-outs, holes or cavities 226 is depicted. The holes or cavities 222 are located and aligned so as to accept guide pins 213 when the heat exchange unit 201 is mounted to the system housing 220.

Also depicted in FIG. 2B are quick connector receptacles 113 and 114 to be used to mate with quick connector inserts 111 and 112, respectively, when quick connector inserts 111 and 112 are used or deployed as the inlet and outlet, respectively, of the heat exchange unit 201. A conduit or other coolant transport mechanism (not shown) would be coupled to receptacle 113 to transport heated coolant to the heat exchange unit 201 from the heat transfer unit 102 depicted in FIG. 1, for example. Similarly, a conduit or other coolant transport mechanism (not shown) would be coupled to receptacle 114 to transport cooled coolant from the heat exchange unit 201 to the heat transfer unit 102 depicted in FIG. 1, for example.

An optional, electrical receptacle 238 is also depicted to mate with electrical connector 237, if used, for the purpose of providing electrical power to a motor, for example, 116 in FIG. 1, when the heat exchange unit 201 is mounted.

When mounting the heat exchange unit 201 to the system housing 220, the heat exchange unit 201 is placed inside the system housing 220 in the corner there of adjacent to the cut-outs or cavities 222, 223, 225 and 226. The mounting tabs 209 and 212 as well as the guide pins 210 and 213 are aligned with their respective, mating cutouts, holes or cavities, 222, 225, 223 and 226, respectively, in the system housing and then pushed or snapped into place in one easy step. Prior to mounting the heat exchange unit 201, it may be preferable to couple coolant conduits, such as conduits 104 and 105, to the inlet 207 and the outlet 206, respectively, of the heat exchange unit.

It will be understood that the present invention is not limited to the number of surfaces of the system casing 220 nor the number, size, shape and location of the cut-outs or cavities 222, 223, 225 and 226. Similarly, the present invention also includes embodiments of the present invention where the mounting tabs and/or guide pins extend from one or more surfaces of the system casing 220 and insert into cut-outs or cavities in one or more surfaces of the heat exchange unit 201 or any combination of the two. In a further embodiment, each heat exchange unit and the system casing has a combination of mounting tabs and/or guide pins and holes or cavities, the arrangement of mounting tabs and/or guide pins and holes or cavities in any heat exchange unit and the system housing being complementary to that of any other heat exchange unit and system casing to enable easy snap fitting of the heat exchange units to the system casing.

Other mounting alignment methods may be used as well. For example, the heat exchange unit 201 may include additional appendages or rails 235 depicted in FIG. 2A which would be inserted into guides 236 in FIG. 2B in the housing 220. The rails can be constructed of metal or other suitably rigid material. The rails 235 of heat exchange unit 201 could then be inserted into the guide 236 and when fully inserted, the tabs 209 would be locked in place in the tab holes 222 and the guide pins 210 inserted into the guide pin holes 223. This arrangement allows for automatic alignment of the tabs 209 and guide pins 210 with the tab holes 222 and guide pin holes 223, respectively. In this arrangement, tabs 212, guide pins 213, tab holes 225 and guide pin holes would preferably be eliminated and not used. The rails 235 and guides 236 would also provide extra structural integrity for the heat exchanger easy mount system 200 in addition to automatic alignment and would further reduce assembly time and costs of the system 200.

Additionally, the quick connector inserts 111 and 112 may be used in lieu of inlet 207 and outlet 206, respectively, and together with their mating receptacles 113 and 114, respectively form quick connectors 113/111 and 114/112. In such an arrangement, when the heat exchange unit 201 is fully inserted in to guides 236, automatic alignment and connection of the heat exchange unit to the coolant transport system would occur at the same time the heat exchange unit is mounted. This would further reduce assembly time and cost of the heat exchanger easy mount system 200 and the cooling system 100 of FIG. 1. In this embodiment, the use of any tabs such as tabs 209 and/or any guide pins such as guide pins 210 and there corresponding holes, 222 and 223, respectively, is optional.

If the heat exchange unit 201 requires other connections, such as, for example, electrical power for motor 116 in FIG. 1, then electrical connector 237 and electrical receptacle 238 may be used to provide an automatic and easy (electrical) power connection to the heat exchange unit 201 at the same time the heat exchange unit 201 is mounted and secured into the housing 220. This would reduce assembly time and costs still further.

Alternatively, and particularly for systems requiring more than one heat exchange unit, the heat exchangers 201 could be mounted to a card 239 and the card inserted into the guide 236 for automatic alignment and mounting of the heat exchange units. Rails 235 would not be needed for this arrangement as the card 239 would also serve the function as rails 235. A requisite number of quick connectors like 114/112 and 113/111 would also be preferably used along with one or more electrical connector/receptacle arrangements similar to 2371238. Tabs 209 and/or guide pins 210 (and corresponding tab holes 222 and guide pin holes 223) could be used for all, some or none of the heat exchange units. Moreover, as shown in FIG. 1, one or more conduits 104B and 105B (as shown in FIG. 1) could be fixed to the card and coupled to the inlet 107 and outlet 106 of one or more heat exchange units 101. The other ends of conduits 104B and 105B could be terminated with an insert 111 or 112, respectively, and affixed to the card such that, when the card is fully inserted into the housing, each insert 111 and 112 is automatically aligned and engaged with corresponding mating receptacles 113 and 114, respectively, of the quick connector and thus establish a coolant communication path from the heat exchange unit 101 to the heat transfer unit 102 in FIG. 1 automatically when the card is inserted fully into the housing (220 of FIG. 2B). Similarly, electrical power connections could be automatically established when the card is full inserted into the system. The use of a card would provide substantial structural integrity for the heat exchanger easy mounting system thereby making the use of tabs 209 and guide pins 210 on any of the heat exchange units (201) optional.

In FIG. 2C, a side cross-sectional view of mounting tabs 209 and 210, shock absorbers 231, and surface 221 of the system housing 220 is depicted. Shock absorbers 231 are placed over guide pins 210 just before mounting of the heat exchange unit 201 to the system housing 220, although any time before the mounting is sufficient. Shock absorbers 231 are shown in FIG. 2C as being cylindrical tubing through which guide pins 210 may be inserted. The shock absorbers may comprise any number of materials and configured in a variety shapes and sizes. The shock absorbers 231 are utilized to absorb shocks caused by shipping or moving, for example, and to reduce noise and vibration in the electronic system when the heat exchange unit is in operation.

It will be appreciated that the shock absorbers may be used with some or all of the guide pins used in the system. They may also be used with some or all of the mounting tabs in the system in addition to or in lieu of their use with guide pins. They may also be used separately or with guide pins and/or mounting tabs between any other surfaces of the heat exchange unit 201 that comes in contact with or very close contact with another surface of the system housing 220. For example, one more shock absorbers 231 could be disposed between the bottom, exterior surface of heat exchange unit 201 and the bottom, interior surface of housing 220. Such shock absorbers may be adhered to either the bottom surface of the heat exchange unit 201 or the bottom surface of the housing 220 at any time prior to assembly of the heat exchange unit 201 to the housing 220. Such a shock absorber may be provided with at least one surface coated with an adhesive protected by a peel away cover which can be easily removed at time of use.

In FIG. 2D, an example of a security tool is depicted. Many system manufacturers may desire to make it difficult for unauthorized de-coupling of the heat exchange unit 201 from the system housing 220 to occur. In such cases, a variety of mechanisms may be used to help achieve this purpose. One example of this is to construct the mounting tabs of very rigid material which would make it difficult for an unauthorized user to un-couple the heat exchange unit 201 from the system housing 220. In such cases, authorized service personnel can be provided with a service tool similar to tool 241 in FIG. 2D.

Tool 241 has a pair of guide pins 242 which an authorized technician, for example, could insert into small cutouts (not shown) in the system housing 220. The guide pins would provide for easy alignment of the tool 241 and help to maintain the alignment when the tool is used. After alignment of tool 241, a knob 243 is rotated. The rotation of the knob 243 causes either end of the tool 241 to extend out of the casing of the tool 241 and engage and spread mounting tabs 209. The mounting tabs 209 can then be removed from their mating cavities or holes 222 in the system housing 220. The technician can use a plurality of tools 241 if needed and as circumstances dictate, to de-couple the heat exchange unit 201 from the system casing 220.

Thus, the present invention has been described herein with reference to particular embodiments for particular applications. Those having ordinary skill in the art and access to the present teachings will recognize additional modifications, applications, and embodiments within the scope thereof.

It is, therefore, intended by the appended claims to cover any and all such applications, modifications, and embodiments within the scope of the present invention.

Claims

1. A mounting system for a heat exchange unit to an electronic system housing comprising: one or more appendages extending from the heat exchange unit or the system housing; one or more appendage holes in the electronic system housing or the heat exchange unit, respectively, and aligned to receive the appendages; and wherein when the appendages are aligned with the holes and inserted therein, the heat exchange unit is mounted and secured to the electronic system housing.

2. The mounting system as set forth in claim 1 for mounting the heat exchange unit within the housing of the electronic system.

3. The mounting system as set forth in claim 1 further comprising; one or more guide pins extending from the heat exchange unit or the system housing; one or more guide pin holes in the housing or the heat exchange unit, respectively, aligned to receive the guide pins; and wherein the guide pins are inserted into the guide pin holes when the appendages are inserted into the appendage holes, the guide pins providing further stability for the heat exchange unit mounted to the housing.

4. The mounting system as set forth in claim 3 further comprising; one or more shock absorbers disposed between the heat exchange unit and the housing.

5. The mounting system as set forth in claim 4 wherein the shock absorbers are aligned to reduce shocks associated with movement of the electronic system; to reduce noise of the heat exchange unit in operation; and/or reduce the transmission of any vibration of the heat exchange unit in operation to the electronic system housing.

6. The mounting system as set forth in claim 5 wherein the shock absorbers are coupled to the guide pins.

7. The mounting system as set forth in claim 1 further comprising; one or more shock absorbers disposed between the heat exchange unit and the housing.

8. The mounting system as set forth in claim 7 wherein the shock absorbers are aligned to reduce shocks associated with movement of the electronic system; to reduce noise of the heat exchange unit in operation; and/or reduce the transmission of any vibration of the heat exchange unit in operation to the electronic system housing.

9. The mounting system as set forth in claim 1 wherein the appendages are designed to require the use of a special tool to easily disengage such appendages from the appendage holes.

10. The mounting system as set forth in claim 1 further comprising: guide means for aligning the heat exchange unit with the housing such that the appendages and the appendage holes are aligned for insertion.

11. The mounting system as set forth in claim 10 wherein the guide means also align the guide pins and the guide pin holes for insertion.

12. The mounting system as set forth in claim 10 further comprising: one or more quick connectors having an insert and a receptacle and disposed such that one or more inserts and receptacles engage when a heat exchange unit is mounted to the electronic system thereby enabling coolant communication and disconnect when the heat exchange unit is dismounted from the electronic system thereby disabling coolant communication.

13. The mounting system as set forth in claim 12 further comprising; one or more electrical connectors and electrical receptacles for engaging when a heat exchange unit is mounted to the electronic system thereby enabling electrical power to the heat exchange unit and disconnect when the heat exchange unit is dismounted from the electronic system thereby disabling power from the heat exchange unit.

14. A mounting system for one or more heat exchange units to an electronic system housing comprising: guide means for aligning and mounting the heat exchange units with/to the housing such that insertion of the heat exchange units fully into the guide means mounts the heat exchangers to the housing.

15. A mounting system as set forth in claim 14 further comprising: one or more quick connectors having an insert and a receptacle and disposed such that one or more inserts and receptacles engage when a heat exchange unit is mounted to the electronic system thereby enabling coolant communication and disconnect when the heat exchange unit is dismounted from the electronic system thereby disabling coolant communication.

16. The mounting system as set forth in claim 14 further comprising; one or more electrical connectors and electrical receptacles for engaging when a heat exchange unit is mounted to the electronic system thereby enabling electrical power to the heat exchange unit and disconnect when the heat exchange unit is dismounted from the electronic system thereby disabling power from the heat exchange unit.

17. The mounting system as set forth in claim 14 further comprising; one or more appendages extending from the heat exchange unit or the system housing; one or more appendage holes in the electronic system housing or the heat exchange unit, respectively, and aligned to receive the appendages; and wherein, when the heat exchange units are inserted into the guide means, the appendages are aligned with the holes and inserted therein.

18. The mounting system as set forth in claim 14 further comprising; one or more guide pins extending from the heat exchange unit or the system housing; one or more guide pin holes in the housing or the heat exchange unit, respectively, aligned to receive the guide pins; and wherein, when the heat exchange units are inserted into the guide means, the guide pins are inserted into the guide pin holes.

19. A device having one or more heat-generating components and having the mounting system of claim 1.

20. A device having one or more heat-generating components and having the mounting system of claim 5.

21. A device having one or more heat-generating components and having the mounting system of claim 14.

22. A method of mounting and securing a heat exchange unit to the housing of an electronic system comprising the steps of: aligning appendages extending from the heat exchange unit or the housing with holes in the housing or the heat exchange unit, respectively; inserting the appendages into the appendage holes; and wherein, when the appendages are fully inserted into the appendage holes, the heat exchange unit is mounted and secured to the housing.

23. The method of claim 22 further comprising the steps of: aligning one or more guide pins extending from the heat exchange unit or the housing with one or more guide pin holes in the housing or the heat exchange unit, respectively; and inserting the guide pins into the guide pin holes at the same time the appendages are inserted into the appendage holes, the guide pins disposed in the guide pin holes helping to align the heat exchanger for mounting to the housing and further stabilize the mounting of the heat exchange unit to the housing.

24. The method of claim 23 further comprising the step of: attaching shock absorbers to the guide pins to reduce shocks caused by movement of the electronic system; to reduce noise from the heat exchange unit in operation; and/or to reduce the transmission of vibrations from the heat exchanger in operation to the housing.