This application relates to a field of heat exchange, and specifically to a heat exchanger and a method thereof, and a heat exchange system having the heat exchanger.
In related technologies, due to low surface temperature of heat exchangers in the operation of heat exchange systems, when the temperature is lower than the dew point temperature, condensed water may be generated on a surface, and even frost may form, thereby affecting the heat exchange efficiency of the heat exchangers. Therefore, related heat exchangers need dehumidification treatment. In related technologies, the surface of the heat exchanger is treated with a lithium salt desiccant or a silica gel hygroscopic material. However, the lithium salt desiccant is not friendly to metal surfaces, and the silicone hygroscopic material is not sticky. Therefore, it is necessary to add an additional adhesive to make it adhere to the surface of the heat exchanger. In summary, the heat exchanger in the related technologies needs to be improved.
According to one aspect of the present disclosure, a heat exchanger is provided. The heat exchanger comprises a first collecting pipe, a second collecting pipe, a plurality of heat exchange tubes, at least one fin and a hygroscopic colloid. The tube is respectively connected with the first collecting pipe and the second collecting pipe, the heat exchange tube comprises a pipe wall and a refrigerant flow channel for a refrigerant to circulate, the heat exchange tube comprises a first end and a second end extends along an extension direction thereof, the refrigerant flow channel extends from the first end to the second end along the extension direction of the heat exchange tube and extends through the heat exchange tube, and the refrigerant flow channel of the heat exchange tube communicates with an inner cavity of the first collecting pipe and an inner cavity of the second collecting pipe. The fin is at least partially arranged between two adjacent heat exchange tubes. The hygroscopic colloid is adhered to at least part of an outer surface of the heat exchange tube and/or at least part of an outer surface of the fin.
According to another aspect of the present disclosure, a heat exchange system is provided. The heat exchange system comprises a compressor, at least one first heat exchanger, a throttling device and at least one second heat exchanger. At least partial surface of the first heat exchanger and/or the second heat exchanger is covered with a hygroscopic colloid. When a refrigerant flows in the heat exchange system, the refrigerant flows into the first heat exchanger through the compressor, flows into the throttling device after heat exchange occurs in the first heat exchanger, then flows into the second heat exchanger and flows into the compressor again after heat exchange occurs in the second heat exchanger.
According to another aspect of the present disclosure, a method for making a heat exchanger is provided. The method for making a heat exchanger includes steps of providing a collecting pipe, a plurality of heat exchange tubes and at least one fin, inserting first ends and second ends of the plurality of heat exchange tubes into corresponding openings of the collecting pipe respectively, assembling the fins between two adjacent heat exchange tubes, and performing a welding treatment after the assembly is completed; and providing a hygroscopic colloid, covering the hygroscopic colloid on the heat exchanger, and then performing a low temperature curing treatment; wherein a covering method is one or more of spraying, brushing and dipping, and a temperature of the curing treatment is 40° C. to 70° C.
At least partial surface of the heat exchanger of the present disclosure is covered with a hygroscopic colloid material. The hygroscopic colloidal material can be directly covered on a metal surface due to its adhesiveness to the metal surface, and the hygroscopic colloidal material is friendly to metal surfaces.
Here, exemplary embodiments will be described in detail, and examples thereof are shown in the drawings. When the following description refers to the drawings, unless otherwise indicated, same numbers in different drawings indicate the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all implementation embodiments consistent with the present disclosure. On the contrary, they are only examples of devices and methods consistent with some aspects of the present disclosure as described in detail in the accompanying claims.
The terms used in the present disclosure are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure. In the description of present disclosure, it should be understood that the terms “center”, “longitudinal”, “transverse”, “length”, “width”, “thickness”, “upper”, “lower”, “front”, ““back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inner”, “outer”, “clockwise”, “counterclockwise” and other directions or positional relationships are based on the orientation or positional relationships shown in the drawings. They are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as a restriction of the present disclosure. In addition, the terms “first” and “second” are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined with “first” and “second” may explicitly or implicitly include one or more of these features. In the description of present disclosure, “a plurality of” means two or more than two, unless otherwise specifically defined.
In the description of present disclosure, it should be noted that, unless otherwise clearly defined and limited, the terms “installation”, “connection” and “communication” should be interpreted broadly. For example, it can be a fixed connection, a detachable connection or an integral connection. It can be a mechanical connection or an electrical connection. It can be a direct connection or an indirect connection through an intermediary. It can be a communication between two elements or an interaction between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in present disclosure can be understood according to specific circumstances.
In present disclosure, unless expressly stipulated and defined otherwise, a first feature located “above” or “under” a second feature may include the first feature and the second feature are in direct contact, or may include the first feature and the second feature are not in direct contact but through other features between them. Moreover, the first feature located “above”, “on top of” and “on” the second feature includes the first feature is located directly above and obliquely above the second feature, or it simply means that the level of the first feature is higher than the second feature. The first feature located “below”, “at bottom of” and “under” the second feature includes the first feature is located directly below and obliquely below the second feature, or it simply means that the level of the first feature is lower than the second feature. The exemplary embodiments of the present disclosure will be described in detail below with reference to the drawings. In the case of no conflict, the following embodiments and features in the embodiments can be mutually supplemented or combined.
The terms used in present disclosure are only for the purpose of describing specific embodiments and are not intended to limit the disclosure. The singular forms of “a”, “said” and “the” used in present disclosure and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings.
The exemplary embodiments of the present disclosure will be described in detail below with reference to the drawings. In the case of no conflict, the following embodiments and features in the implementation can be combined with each other.
Related heat exchangers, especially in air conditioning systems, when used as an evaporator during system operation, due to their low surface temperature, condensed water may be generated on the outer surface of the heat exchanger, which may even further cause frosting. However, the generation of condensed water or frost will cause the heat exchange efficiency of the heat exchanger to decrease, thereby making it difficult for the heat exchanger to exert better heat exchange performance. Hence, it is necessary to avoid condensed water or frost on the outer surface of the heat exchanger. One way is to bond hygroscopic or desiccant materials on the surface of the heat exchanger, such as silica gel and its physical or chemical compound desiccant, so as to reduce the impact of the wet load on the air conditioning systems. However since silica gel itself is not sticky, it is necessary to spray a layer of adhesive on the surface of the heat exchanger first. The adhesive can bond silica gel or its physical or chemical composite desiccant material to the metal surface. Since silica gel has a porous structure, the use of a binder will cause the micropores of silica gel to be blocked, thereby reducing moisture absorption. Moreover, the use of adhesives may also be detrimental to the heat exchange of the heat exchanger. In addition, the moisture absorption of silica gel itself (about 0.35 g/g) is relatively small. Although halogen salts and silica gel can be used in heat exchangers, the moisture absorption performance is greatly improved, but after the halogen salts absorb moisture, electrochemical corrosion will occur on the metal surface, which shortens the life of the heat exchanger.
An embodiment of the present disclosure provides a heat exchanger which is simple to manufacture. The outer surface of the heat exchanger is covered with a hygroscopic colloid. Due to the viscosity of the hygroscopic colloid itself, the fluidity of the gel after drying is not strong. Therefore, no additional binder is required. At room temperature, a pH value of the hygroscopic colloid is between 6 to 8, and it can be directly coated on a metal surface, such as a surface of aluminum or copper, and it is friendly to the metal surface. The hygroscopic colloidal material has a large moisture absorption capacity, which is better than silica gel and its composite materials. Inventors believe that the solute properties of the hygroscopic colloidal material are stable. For example, the solute of the zinc oxide gel is the metal oxide zinc oxide, and the solute material is more friendly to metals, especially copper or aluminum. At the same time, metal oxides such as zinc oxide have good thermal conductivity, and their covering on the surface of the heat exchanger can also relatively reduce the influence of the adhesive on the heat exchange performance of the heat exchanger.
The application of zinc oxide gel material to heat exchanger dehumidification effectively solves the problems of low moisture absorption of existing materials and the need for binders. The embodiment of the present disclosure provides a heat exchange system including the heat exchanger. The heat exchanger can be used as an evaporator in a heat pump air conditioning system. It is easy to understand that, in addition to being used as a heat exchanger in a heat pump system, the heat exchanger can also be used in other occasions where heat is exchanged with air. There is no restriction here.
The hygroscopic colloid covered by the heat exchanger of this embodiment includes but is not limited to zinc oxide gel. This embodiment takes zinc oxide material as an example. Of course, according to the rules of the periodic table and the periodic law of the elements, for example, the sol material formed by the same group of elements or elements near the diagonal also has similar properties, and is also within the protection scope of the present disclosure.
A reaction equation of the above reaction is:
4Zn(CH3COO)2·2H2O→Zn4O(CH3COO)6+7H2O+CH3COOH
CH3COOH+NaHCO3→CH3COONa+H2O+CO2↑
It should be noted that in the step S4, to adjust the pH value, some salts that are weakly alkaline after hydrolysis, such as sodium bicarbonate, or weak bases, such as ammonia can be selected. In this way, it is convenient to control the pH value to a required pH value. Among them, the heating temperature in the step S3 can be 40° C. to 100° C., for example, it can be heated at 70° C. The heating method can be water bath heating or direct heating. In this way, it is beneficial to accelerate the dissolution of zinc acetate dihydrate. The stirring speed can be selected from 200 to 600 r/min. In this embodiment, the stirring speed is 300 r/min.
After 100 hours of absorbing moisture, the moisture absorption of M1 zinc oxide gel reaches 42%, and the moisture absorption of M2 is 34%. The moisture absorption of M4 silica gel/glycerol composite is 36%, which is 2% more than M2. This is mainly because after the addition of glycerol, the saturated vapor pressure of silica gel is reduced, which can absorb water faster. After 100 hours, the moisture absorption of M3 reaches 8%, and the moisture absorption is the smallest. Because of its large pore size, it will also release moisture while absorbing moisture.
After 240 hours, the moisture absorption of M1 is the largest, reaching 75%. It is followed by M2 of which the moisture absorption is 54%. The moisture absorption of M3 is 42%. Because of the limited size of silica gel pores, after glycerol is adsorbed inside, the volume that can be used for water storage becomes smaller. The last is M4 of which the moisture absorption is 12%. The inventors believe that the above result is mainly because the zinc oxide gel contains a large amount of hydrophilic groups.
A regeneration rate is defined as the percentage of water desorbed by a certain mass of the material to the original saturated water. As shown in
As shown in
The heat exchanger 100 of an embodiment of the present disclosure may include a collecting pipe 10, a plurality of heat exchange tubes 20 and at least one fin 30. The collecting pipe 10 has an inner cavity (not shown in the figure) for a refrigerant to circulate, and the shape of the collecting pipe 10 is a circular pipe. The number of the collecting pipe 10 is two, namely a first collecting pipe 11 and a second collecting pipe 12. The first collecting pipe 11 and the second collecting pipe 12 are arranged substantially in parallel. It should be noted that, in some embodiments, the heat exchanger may only include one collecting pipe, as long as it meets the design or heat exchange requirements. Optionally, in some other embodiments, the heat exchanger may also include a plurality of the collecting pipes. A communication structure can be arranged between adjacent collecting pipes and flow paths can be set as needed, which is not limited here. The heat exchanger in this embodiment includes two such collecting pipes. In this embodiment, it is noted that when the heat exchanger 100 and air generally undergo heat exchange only one time, it is often referred to as a single-layer heat exchanger in the industry. In some other embodiments, the heat exchanger may also have no fin 30, as long as it meets the heat exchange requirements, which is not limited here.
Of course, in some other embodiments, the collecting pipe 10 may also be a D-shaped or square pipe. The specific shape of the collecting pipe 10 is not limited, as long as its burst pressure meets the needs of the system. The relative position of the collecting pipe 10 is also not limited, as long as it meets the actual installation requirements. The number of the collecting pipe 10 can also be only one, as long as it meets the heat exchange requirement, which is not limited here. The collecting pipe 10 in the embodiment of the present disclosure is a round pipe as an example.
There are a plurality of the heat exchange tubes 20 which are arranged along an axial direction of the collecting pipe 10 and are arranged substantially in parallel. Each of the plurality of heat exchange tubes 20 has a first end 221 and a second end 222. As shown in
When the heat exchanger 100 is used as an evaporator in a heat exchange system, its outer surface usually has a lower temperature. The moisture in the air is easy to condense on the surface of the evaporator, forming a water film, or further frost, which affects the heat exchange performance of the evaporator. At least partial surface of the heat exchanger is covered with the hygroscopic colloid 40. The hygroscopic colloid 40 can absorb moisture or moisture on the surface of the evaporator through its unique hygroscopic characteristics, so as to delay or avoid the formation of water film on the surface of the evaporator, and then to delay or avoid frost on the evaporator surface. Finally, the heat exchange performance of the evaporator is maintained to a certain extent, or the rapid decline of the heat exchange performance of the evaporator is delayed. It is worth noting that the surface of the heat exchanger in the related art is covered with functional materials, such as corrosion-resistant materials. Specifically, it is covered on the outer surface of the entire heat exchanger. Since the functional materials will affect the heat transfer effect, the heat transfer performance of the entire heat exchanger will decrease. However, the hygroscopic colloid 40 used in the present disclosure, due to the viscosity of the hygroscopic colloid itself, it does not have strong fluidity in a gel state after drying, so no additional binder is required. This has little effect on the heat exchange performance of the heat exchanger. The hygroscopic colloid 40 can be directly coated on a metal surface, such as a surface of aluminum or copper. The hygroscopic colloid 40 is friendly to the metal surface. The hygroscopic colloid 40 material has a large moisture absorption capacity, which is better than silica gel and its composite materials. The inventors believe that the solute properties of hygroscopic colloidal materials are stable. For example, the solute of zinc oxide gel is metal oxide zinc oxide. The solute materials are relatively friendly to metals. At the same time, metal oxides, such as zinc oxide, have good thermal conductivity. The covering on the surface of the heat exchanger can also relatively reduce the influence of the heat exchange performance of the heat exchanger. In addition, the hygroscopic colloid 40 may be covered on part of the outer surface of the heat exchanger, especially part of the fin. In other words, the hygroscopic colloid is covered on the frost-prone portions of the heat exchanger, and the hygroscopicity of the hygroscopic colloid 40 is used to delay the generation of water film or frost to a certain extent. In this way, while ensuring the heat exchange efficiency of the heat exchanger, it can also delay the attenuation of the heat exchange efficiency to a certain extent. The specific overlay structure and overlay method will be described in detail in the following description.
It should be noted that the heat exchange tube 20, also known as a flat tube in the industry, has an inner cavity inside for the refrigerant to circulate. As shown in
As shown in
In the embodiment of the present disclosure, the fin 30 has a wave shape as a whole. An extension direction of the wave shape is a length direction of the heat exchange tube 20. The wave crest portions 31 and the wave trough portions 32 are arranged one by one at intervals. The fin 30 is arranged between two adjacent heat exchange tubes 20. The wave crest portions 31 are at least partially in contact with the heat exchange tube 21. The wave trough portions 32 are at least partially in contact with the heat exchange tube 22. The highest point of the wave crest portions 31 is a wave crest surface 311, and the lowest point of the wave trough portions 32 is a wave trough surface 321. The extension direction of the wave crest portions 31 and the wave trough portions 32 at intervals defining the length direction of the fin 30 (the X direction in the figure). A vertical direction between the plane of the wave crest surface 311 and the plane of the wave trough surface 321 defines the height direction of the fin (such as the Z direction in the figure). It can be seen that the length direction of the fin 30 is the same as the length direction of the heat exchange tube 20 (the X direction in the figure). A width direction of the fin 30 is the same as the width direction of the heat exchange tube 20 (the Y direction in the figure). The distance between the heat exchange tubes 20 is the height direction of the fin 30 (the Z direction in the figure).
As shown in
As shown in the embodiment shown in
As shown in
As shown in
It should be noted that the FPI (FPI, namely Fin Per Inch, is a unit commonly used in the industry to express the density of fins) of the fins 30 arranged between the first straight tube sections 251 of the heat exchange tube 20 and the FPI of the fins 30 between the second straight tube sections 252 of the heat exchange tube 20 may be the same or different. As shown in
As shown in
It should be noted that, in the embodiment of the present disclosure, a method of making a single-layer heat exchanger and a multi-layer heat exchanger having a partial surface of the fin covered with a hygroscopic colloid is disclosed.
Taking the single-layer heat exchanger 100 as an example, the collecting pipe 10, the plurality of heat exchange tubes 20 and the heat exchange fins 30 are assembled, and then spraying is performed. That is, the sol in which the hygroscopic colloid 40 is dissolved is coated on a partial area of the surface of the heat exchanger 100 by spraying. During the spraying process, it is necessary to control the spraying of the hygroscopic colloid 40 to the area of the fins to achieve partial coverage. For example, when covering the wave crest portions 31 and/or the wave trough portions 32 of the fins 30, it can be implemented in a manner similar to spraying a slogan. That is, a solid sheet material is used to block the middle area of the fins 30 to expose the area to be sprayed, and then spraying is performed. It is ensured that only the wave crest portions 31 and/or the wave trough portions 32 are covered, and the covering effect is shown in
Taking the multi-layer heat exchanger 200 as an example, the collecting pipe 10, the plurality of heat exchange tubes 20 and the heat exchange fins 30 are assembled, and the first side area (that is, the windward side area) of the heat exchanger 200, the first straight tube sections 251 for example, is immersed in the sol in which the hygroscopic colloid 40 is dissolved, and then left to stand to dry. After the hygroscopic colloid 40 is tightly adsorbed on the fins 30 of the heat exchanger 200, the next step is performed as needed. The thickness of the hygroscopic colloid covering the surface of the heat exchanger 200 is 0.07 mm to 1.00 mm, such as 0.075 mm, 0.2 mm, 0.25 mm, etc., so that the moisture absorption can be guaranteed. The comparison diagrams of the fins before and after covering are shown in
It is noted that the above spraying method may splash on the surface of the heat exchange tubes 20 during the spraying operation. The above immersion method will inevitably cover the hygroscopic colloid 40 on the surface of the heat exchange tubes 20 during the immersion operation, which is not limited here.
As shown in
The foregoing descriptions are only preferred embodiments of the present disclosure, and do not impose any formal restrictions on the present disclosure. Although the present disclosure has been disclosed as above in preferred embodiments, it is not intended to limit this application. Any person skilled in the art can make use of the technical content disclosed above without departing from the scope of the technical solution of the present disclosure. Changes or modifications are equivalent embodiments with equivalent changes. However, without departing from the content of the technical solution of the present disclosure, any simple amendments, equivalent changes and modifications made to the above embodiments based on the technical essence of the present disclosure still fall within the scope of the technical solution of the present disclosure.
Number | Date | Country | Kind |
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201910709088.7 | Aug 2019 | CN | national |
This application is a continuation of National Phase conversion of International (PCT) Patent Application No. PCT/CN2020/105112, filed on Jul. 28, 2020, which further claims priority of a Chinese Patent Application No. 201910709088.7, filed on Aug. 1, 2019 and titled “HEAT EXCHANGER, METHOD FOR MAKING HEAT EXCHANGER, AND HEAT EXCHANGE SYSTEM”, the entire content of which is incorporated herein by reference.
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20230235970 | Ozaki | Jul 2023 | A1 |
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Number | Date | Country | |
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Number | Date | Country | |
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Parent | PCT/CN2020/105112 | Jul 2020 | US |
Child | 17135858 | US |