HEAT EXCHANGER PUCK

TECHNICAL FIELD

The present disclosure relates to the field of electronic circuits. More particularly, the present disclosure relates to heat exchanger puck with hydroformed tubing for a liquid coolant system.

BACKGROUND

The background description provided herein is for the purpose of generally presenting the context of the disclosure. Unless otherwise indicated herein, the materials described in this section are not prior art to the claims in this application and are not admitted to be prior art by inclusion in this section.

Manufacture of legacy heat exchanger pucks involve use of dies to form tubes of a liquid coolant system prior to affixation of the tubes within the heat exchanger pucks. After the tubes are formed into a predetermined shape for affixation within the heat exchanger puck, an upper plate and a lower plate of the heat exchanger puck are affixed around the tube, with the upper plate and the lower plate forming a cavity with the predetermined shape in which the tube is located.

In addition to additional time required to complete this two-step process, often the tube does not mate cleanly with one or both of the plates of the heat exchanger puck. When the tube does not mate cleanly, air is introduced between the tube and one or both of the plates, resulting in a lower amount of heat transfer between the plates and the tube. The inefficiency in heat transfer causes compensation to be performed in designs utilizing the heat exchanger puck, such as requiring reduced operation of the computer system to produce less heat.

Further, by forming the tube prior to placement within the heat exchanger puck, the predetermined shapes that the tube could be formed to are limited. As the plates are affixed around the tube after the tube is formed, the cavity or cavities formed in one or both of the plates either need to remain the same width or decrease in width as the cavity extends into the corresponding plate such that the tube does not conflict with the walls of the cavity as the tube is inserted. Correspondingly, the shape of the tube must either remain the same width or decrease in width towards the edge of the tube being inserted into the cavity to avoid conflicts with the walls of the cavity.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments will be readily understood by the following detailed description in conjunction with the accompanying drawings. To facilitate this description, like reference numerals designate like structural elements. Embodiments are illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings.

FIG. 1 illustrates an example heat exchanger puck, according to various embodiments.

FIG. 2 illustrates an example assembly of the heat exchanger puck of FIG. 1, according to various embodiments.

FIG. 3 illustrates a cross-sectional view of example heat exchanger puck components, according to various embodiments.

FIG. 4 illustrates a cross-sectional view of an example heat exchanger puck, according to various embodiments.

FIG. 5 illustrates a cross-sectional view of an example heat exchanger puck resulting from a thinning process applied to the heat exchanger puck of FIG. 4, according to various embodiments.

FIG. 6 illustrates the example heat exchanger puck of FIG. 5 coupled to a component to be cooled, according to various embodiments.

FIG. 7 illustrates an example process of manufacturing a heat exchanger puck, according to various embodiments.

FIG. 8 illustrates a cross-sectional view of an example heat exchanger puck prior to hydroformation, according to various embodiments.

FIG. 9 illustrates a cross-sectional view of the example heat exchanger puck of FIG. 8 after hydroformation, according to various embodiments.

FIG. 10 illustrates an example process of manufacturing a heat exchanger puck with hydroformed tube, according to various embodiments.

FIG. 11 illustrates a cross-sectional view of an example heat exchanger puck with hydroform tooling mold before hydroforming, according to various embodiments.

FIG. 12 illustrates a cross-sectional view of the example heat exchanger puck of FIG. 11 with the hydroform tooling mold after hydroforming, according to various embodiments.

FIG. 13 illustrates a cross-sectional of the example heat exchanger puck of FIG. 11 without the hydroform tooling mold after hydroforming, according to various embodiments.

FIG. 14 illustrates an example process of hydroforming a tube with hydroform tooling mold, according to various embodiments.

FIG. 15 illustrates a cross-sectional view of an example heat exchanger puck with butterfly cavity, according to various embodiments.

FIG. 16 illustrates example tube shapes that may be produced by the hydroforming process, according to various embodiments.

FIG. 17 illustrates a cross-sectional view of an example portion of a heat exchanger puck with ridged cavity, according to various embodiments.

FIG. 18 illustrates example ridged, hydroformed tube shapes, according to various embodiments.

FIG. 19 illustrates a cross-sectional view of an example heat exchanger puck with an affixing hydroformed tube, according to various embodiments.

FIG. 20 illustrates a cross-sectional view of an example heat exchanger puck prior to compression of an upper plate and a lower plate, according to various embodiments.

FIG. 21 illustrates a cross-sectional view of the example heat exchanger puck of FIG. 20 after compression of the upper plate and the lower plate, according to various embodiments.

FIG. 22 illustrates a cross-sectional view of the example heat exchanger puck of FIG. 20 after hydroforming process, according to various embodiments.

FIG. 23 illustrates a cross-sectional view of the example heat exchanger puck of FIG. 20 after removal of the lower plate, according to various embodiments.

FIG. 24 illustrates a cross-sectional view of the example heat exchanger puck of FIG. 20 coupled to a component, according to various embodiments.

FIG. 25 illustrates an example process of producing the heat exchanger puck of FIG. 20, according to various embodiments.

FIG. 26 illustrates an example liquid coolant system that may employ a heat exchanger puck, according to various embodiments.

FIG. 27 illustrates an example liquid coolant system, according to various embodiments.

FIG. 28 illustrates an example unassembled electronic environment with liquid coolant system, according to various embodiments.

FIG. 29 illustrates the example assembled electronic environment with liquid coolant system of FIG. 28, according to various embodiments.

FIG. 30 illustrates an example liquid coolant system applied to electronic components extending varying distances from a printed circuit board, according to various embodiments.

FIG. 31 illustrates an example apparatus for a liquid coolant system, according to various embodiments.

FIG. 32 illustrates an example tube assembly for a liquid coolant system, according to various embodiments.

FIG. 33 illustrates an example tube union, according to various embodiments.

FIG. 34 illustrates an example computer device that may employ the apparatuses and/or methods described herein.

DETAILED DESCRIPTION

Apparatuses and methods associated with heat exchanger puck design are disclosed herein. In embodiments, a heat exchanger puck may include a first plate with a cavity that extends into the first plate from a side of the first plate and a second plate. The second plate may be coupled to the side of the first plate, with the cavity located between the first plate and the second plate to receive a tube of a liquid coolant system, with the tube located, at least partially, within the cavity and hydroformed with the second plate coupled to the first plate.

In the following detailed description, reference is made to the accompanying drawings which form a part hereof wherein like numerals designate like parts throughout, and in which is shown by way of illustration embodiments that may be practiced. It is to be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present disclosure. Therefore, the following detailed description is not to be taken in a limiting sense, and the scope of embodiments is defined by the appended claims and their equivalents.

Aspects of the disclosure are disclosed in the accompanying description. Alternate embodiments of the present disclosure and their equivalents may be devised without parting from the spirit or scope of the present disclosure. It should be noted that like elements disclosed below are indicated by like reference numbers in the drawings.

Various operations may be described as multiple discrete actions or operations in turn, in a manner that is most helpful in understanding the claimed subject matter. However, the order of description should not be construed as to imply that these operations are necessarily order dependent. In particular, these operations may not be performed in the order of presentation. Operations described may be performed in a different order than the described embodiment. Various additional operations may be performed and/or described operations may be omitted in additional embodiments.

For the purposes of the present disclosure, the phrase “A and/or B” means (A), (B), or (A and B). For the purposes of the present disclosure, the phrase “A, B, and/or C” means (A), (B), (C), (A and B), (A and C), (B and C), or (A, B and C).

The description may use the phrases “in an embodiment,” or “in embodiments,” which may each refer to one or more of the same or different embodiments. Furthermore, the terms “comprising,” “including,” “having,” and the like, as used with respect to embodiments of the present disclosure, are synonymous.

As used herein, the term “circuitry” may refer to, be part of, or include an Application Specific Integrated Circuit (ASIC), an electronic circuit, a processor (shared, dedicated, or group) and/or memory (shared, dedicated, or group) that execute one or more software or firmware programs, a combinational logic circuit, and/or other suitable components that provide the described functionality.

The terms “upper plate” and “lower plate” are used herein to refer to plates of heat exchanger pucks. The terms “upper plate” and “lower plate” are used for differentiating the plates and do not necessarily imply or explicitly state an orientation of the plates and/or the heat exchanger pucks disclosed herein.

The terms “upper mold” and “lower mold” are used herein to refer to portions of a hydroform tooling mold. The terms “upper mold” and “lower mold” are used for differentiating the molds and do not necessarily imply or explicitly state an orientation of the molds and/or the hydroform tooling mold disclosed herein.

FIG. 1 illustrates an example heat exchanger puck 100, according to various embodiments. The heat exchanger puck 100 may include a body 102 to receive a tube 104 of a liquid coolant system routed within the body 102. The tube 104 may enter a cavity and/or cavities formed within the body 102 and may be routed within the cavity to a point where the tube 104 exits the body 102.

The heat exchanger puck 100 may be utilized for cooling a component (such as, an electronic component) within a computer environment, an electrical environment, an electro-optical environment, or some combination thereof (which may be generically referred to as ‘electronic environment’). The body 102 of the heat exchanger puck 100 may be affixed to the component to be cooled and may provide heat transfer between the component and the tube 104. In some embodiments, a thermal transfer compound and/or thermal transfer apparatus may be located intermediate to the component and the body 102 to facilitate heat transfer between the component and the body 102.

As will described further throughout this disclosure, the body 102 of the heat exchanger puck 102 may be made of a material with relatively high heat transfer characteristics, such as carbon steel, stainless steel, copper, bronze, brass, titanium, aluminum, thermally conductive polymers, heat conducting plastics, various alloys, or some combination thereof. In some embodiments, the body 102 may include an outer shell made of a durable, high strength metal, such as carbon steel, stainless steel, aluminum, thermally conductive polymers, heat conducting plastics, or some combination thereof. The type of material used for the body 102 may be selected based on desired heat transfer characteristics of the heat exchanger puck 100.

The tube 104 may be made of a material with relatively high heat transfer characteristics and that is resistive to corrosion, such as copper, stainless steel, a copper/nickel alloy, or some combination thereof. The tube 104 may carry liquid from the liquid coolant system within the tube 104. Heat received by the tube 104 from the body 102 may be transferred to the liquid within the tube 104 and the liquid coolant system may circulate the liquid in the tube 104 away from the body 102, the liquid carrying the heat with it away from the body 102. In some embodiments, the tube 104 may be hydroformed within the cavity and/or cavities of the body 102 increasing an amount of contact between the tube 104 and the body 102, which may facilitate the transfer of heat from the body 102 to the tube 104. The process of hydroforming is described in more detail throughout this disclosure.

FIG. 2 illustrates an example assembly 200 of the heat exchanger puck 100 of FIG. 1, according to various embodiments. The assembly 200 may include components 202. Components 202 may include an upper plate 204, a lower plate 206, a tube 208, or some combination thereof. In some embodiments, the components 202 may further include one or more fasteners and/or fastener assemblies 212 to affix the upper plate 204 to the lower plate and/or to mount the heat exchanger puck 100 in the computer environment and/or electrical environment. The reference of plate 204 and 206 as upper and lower plates are merely for ease of understanding, and shall not be construed as limiting on the present disclosure.

The upper plate 204 may include one or more of the features of the body 102 (FIG. 1), including being made of a material with relatively high heat transfer characteristics. The upper plate 204 may have a larger footprint than, or a same size footprints as, the lower plate 206, such that the edges of the upper plate 204 are parallel to or overhang the edges of the lower plate 206 when affixed to each other. In some embodiments, the upper plate 204 may include one or more apertures 214 to receive fasteners and/or fastener assemblies 212 for affixing the upper plate 204 to the lower plate 206 and/or mounting the heat exchanger puck 100 to the component to be cooled within the computer environment, and/or within the electrical environment.

The lower plate 206 may include one or more of the features of the body 102 (FIG. 1), including being made of a material with relatively high heat transfer characteristics. The lower plate 206 may include one or more cavities 210. The cavities 210 may extend into the lower plate 206 from a side of the lower plate 206. In some embodiments, the upper plate 204 may also include one or more cavities that, when the upper plate 204 and the lower plate 206 are affixed to each other, align with the one or more cavities 210 of the lower plate 206. Further, in some embodiments, the lower plate 206 may include one or more apertures 216 to receive fasteners and/or fastener assemblies 212 for affixing the lower plate 206 to the upper plate 204 and/or mounting the heat exchanger puck 100 to the component to be cooled within the computer environment, and/or within the electrical environment.

The tube 208 may be relatively rigid, although may flex when force is applied without breaking or allowing liquid within the tube 208 to leak. The amount of compliance of the tube 208 may depend on the material the tube 208 is made of and/or the shape of the tube 208.

During assembly of the heat exchanger puck 100, portions of the tube 208 may be positioned within the cavities 210 of the lower plate 206. The portions of the tube 208 may become affixed in the cavities 210 through frictional force when the upper plate 204 is affixed to the lower plate 206. In some embodiments, epoxy (such as thermal transfer epoxy) may be applied to one or more of the upper plate 204, the lower plate 206, and the tube 208 and the epoxy may affix two or more of the upper plate 204, the lower plate 206, and the tube 208 together. The epoxy may be cured (such as by heat, light, chemically, or some combination thereof) while the upper plate 204 is compressed to the lower plate 206 with the tube 208 positioned in the cavities 210 of the lower plate 206. The tube 208 may flex and/or deform without breaking when the upper plate 204 is compressed to and/or affixed to the lower plate 206. In some embodiments, a thermal interface material, brazing parts, or some combination thereof may be applied to and/or added to the one or more of the upper plate 204, the lower plate 206, and the tube 208 in lieu of or in addition to the epoxy.

In the example illustrated, straight portions of the tube 208 may be positioned within the cavities 210 when the upper plate 204 is affixed to the lower plate 206. Curved portions of the tube 208 may extend outside the cavities 210 when the upper plate 204 is affixed to the lower plate 206. The example illustrated includes straight cavities 210 for simplicity of machining the lower plate 206, although it is to be understood that in other embodiments, the cavities 210 may include curved portions and the curved portions of the tube 208 may be positioned within the cavities 210 when the upper plate 204 is affixed to the lower plate 206.

As the upper plate 204 and the lower plate 206 may both be made of materials with relatively high heat transfer characteristics, heat may be transferred to the tube 208 from either side of the heat exchanger puck 100, resulting in bidirectional heat transfer. Legacy heat exchanger pucks provide unidirectional heat transfer with heat being transferred from one of the sides to the tube. Accordingly, the embodiments described herein may provide for greater heat transfer to the tube 208 from the heat exchanger puck 100 and/or greater flexibility in placement of the heat exchanger puck 100 while maintaining heat transfer to the tube 208.

FIG. 3 illustrates a cross-sectional view of example heat exchanger puck components 300, according to various embodiments. The heat exchanger puck components 300 may include an upper plate 302, a lower plate 304, and a tube 306 of a liquid coolant system. The upper plate 302, the lower plate 304, and the tube 306 may include one or more of the features of the upper plate 204 (FIG. 2), the lower plate 206 (FIG. 2), the tube 104 (FIG. 1), and the tube 208 (FIG. 2), respectively.

The upper plate 302 may include an aperture 308 to receive a fastener and/or a fastener assembly, such as fasteners and/or fastener assemblies 212 (FIG. 2). The lower plate 304 may include a recess 310 to receive the fastener and/or the fastener assembly. The aperture 308 and the recess 310 may be aligned when affixing the upper plate 302 and the lower plate 304. The fastener and/or fastener assembly may be installed in the aperture 308 and the recess 310 when aligned and may affix the upper plate 302 to the lower plate 304. In some embodiments, the upper plate 302 may be affixed to the lower plate 304 by other means (such as by epoxy) and the fastener and/or fastener assembly may be utilized for mounting the heat exchanger puck formed from the heat exchanger puck components 300 to a component to be cooled, within a computer environment, within an electrical environment, or some combination thereof. In some embodiments, the upper plate 302 may not have the aperture 308 and the lower plate 304 may not have the recess 310, and the upper plate 302 may be affixed to the lower plate 304 by means other than the fastener and/or the fastener assembly, such as by epoxy.

The lower plate 304 may include one or more cavities 312. Portions of the tube 306 may be aligned with the cavities 312 when forming a heat exchanger puck from the heat exchanger puck components 300. The portions of the tube 306 may become affixed within the cavities 312, between the upper plate 302 and the lower plate 304, when the upper plate 302 is affixed to the lower plate 304. The portions of the tube 304 may be held in position within the cavity by friction among the inner walls 314 of the lower plate 304, the upper plate 302, the tube 306, or some combination generated by the affixation of the upper plate 302 to the lower plate 304. In some embodiments, epoxy (such as thermal transfer epoxy) may be applied to the portions of the tube 306 and/or the inner walls 314 and the epoxy may hold the tube 304 in position when the upper plate 302 is affixed to the lower plate 304. In some embodiments, a thermal interface material, brazing parts, or some combination thereof may be applied to and/or added to the tube and/or inner walls 314 in lieu of or in addition to the epoxy.

FIG. 4 illustrates a cross-sectional view of an example heat exchanger puck 400, according to various embodiments. The heat exchanger puck 400 may be formed using the heat exchanger puck components 300 (FIG. 3), including the upper plate 302, the lower plate 304, the tube 306, or some combination thereof.

In the example illustrated in FIG. 4, the upper plate 302 may be affixed to the lower plate 304 with the portions of the tube 306 positioned within the cavities 312 of the lower plate 304. The upper plate 302 may be affixed to the lower plate 304 by epoxy 402, which may include thermal transfer epoxy. Prior to affixation of the upper plate 302 to the lower plate 304, the epoxy 402 may be applied to one or more of the upper plate 302, the lower plate 304 and the tube 306. The epoxy 402 may undergo a curing process to affix the upper plate 302 to the lower plate 304. The curing process may include applying heat, light, chemicals, or some combination thereof to the epoxy 402 while the upper plate 302 is maintained in contact with the lower plate 304. In some embodiments, a thermal interface material, brazing parts, or some combination thereof may be applied to and/or added to the one or more of the upper plate 302, the lower plate 304, and the tube 306 in lieu of or in addition to the epoxy.

In some embodiments, a hydroforming process may be applied to the portions of the tube 306 when affixed within the cavities and prior to the curing process being applied to the epoxy 402. The hydroforming process may include pressurizing liquid (such as water, oil, or some combination thereof) within the portions of the tube 306, wherein the pressurized liquid causes a circumference of the portions of the tube 306 to expand within the cavity. The process of hydroforming is described in more detail throughout this disclosure.

FIG. 5 illustrates a cross-sectional view of an example heat exchanger puck 500 generated by applying a thinning process to the heat exchanger puck 400 of FIG. 4, according to various embodiments. The heat exchanger puck 500 may be generated by applying the thinning process to a side of the lower plate 304 opposite to the side of the lower plate 304 affixed to the upper plate 302. The thinning process may be applied to the lower plate 304 to reduce the amount of lower plate material between the tube 306 and a component to be cooled, the component to be coupled the side of the lower plate 304 to which the thinning process is applied.

In some embodiments, the thinning process may further be applied to achieve a desired flatness and/or creating a predetermined geometry on the side of the lower plate 304 in lieu of or in addition to thinning the heat exchanger puck 400. For example, it may be desired to have the side of the lower plate 304 as being concave or convex and the thinning process may be applied to achieve this predetermined geometry.

In the example illustrated, the upper plate 302 may be affixed to the lower plate 304. The thinning process may be applied to the side of the lower plate 304 while the upper plate 302 is affixed to the lower plate 304. The thinning process may include removing a portion 502 of the lower plate via a fly cutter, a grinder, a blade, or some combination thereof. The thinning process may leave a remaining portion of the lower plate 504. The remaining portion of the lower plate 504 may provide a thin layer of the material of the lower plate 304 between the side of the lower plate 304 and the tube 306.

FIG. 6 illustrates the example heat exchanger puck 500 of FIG. 5 coupled to a component 602 to be cooled, according to various embodiments. The component 602 may be part of a computer environment, such as computer environment 2104 (FIG. 21). The computer environment may be a computer device. In some embodiments, the component 602 may be part of an electrical environment, such as a power system, a mechanical switch, or some combination thereof.

The component 602 may be mounted to a printed circuit board (PCB) 604 within the computer environment. The component 602 may include one or more leads and/or solder balls to mount the component 602 to the PCB 604 and electrically couple the component 602 to the PCB 604. The component 602 may be computer processor unit, a memory device, a system-on-chip, or some combination thereof. When power is provided to the component 602, the component 602 may produce heat.

A side of the heat exchanger puck 500 may be coupled to a surface of the component 602. The side of the heat exchanger puck 500 may be coupled to the surface of the component 602 by heat transfer epoxy, heat transfer grease, heat transfer adhesive, or some combination thereof. In some embodiments, the side of the heat exchanger puck 500 may be coupled to the component 602 by a fastener, such as a screw. Further, in some embodiments, the heat exchanger puck 500 may be attached to the PCB 604 by a fastener and the side of the heat exchanger puck 500 may be positioned against the component 602 by the heat exchanger puck 500 being attached to the PCB 604.

The heat exchanger puck 500 may be thermally coupled to the component 602 by attachment to the surface of the component 602, such that the heat produced by the component 602 may be transferred to the heat exchanger puck 500 cooling the component 602. The heat exchanger puck 500 may further transfer the heat to liquid coolant flowing within the tube 306.

In some embodiments, the heat exchanger puck 500 may be inverted such that the opposite side of the heat exchanger puck 500 is coupled to the component 602. The opposite side of the heat exchanger puck 500 may be coupled to the component 602 by any of the means of attachment described above for attachment of the side of the heat exchanger puck 500 to the component 602.

In some embodiments, a second component to be cooled may be coupled to a second side of the heat exchanger puck 500 opposite to the side to which the component 602 is coupled. The second side of the heat exchanger puck 500 may be coupled to the second component by any of the means for attachment described above for attachment of the side of the heat exchanger puck 500 to the component 602. In these embodiments, the heat exchanger puck 500 may transfer heat from the component 602 and the second component to the tube 306 to cool both the component 602 and the second component.

FIG. 7 illustrates an example process 700 of manufacturing a heat exchanger puck, according to various embodiments. In 702, an upper plate for a heat exchanger puck may be formed. The upper plate may include one or more of the features of the upper plate 204 (FIG. 2) and/or the upper plate 302 (FIG. 3). The upper plate may be formed by a process of forming and/or machining a plate for a heat exchanger puck known by one having ordinary skill in the art.

In 704, a lower plate for the heat exchanger puck may be formed. The lower plate may include one or more of the features of the lower plate 206 (FIG. 2) and/or the lower plate 304 (FIG. 3). The lower plate may be formed by a process of forming and/or machining a plate for a heat exchanger puck known by one having ordinary skill in the art.

In 706, the upper plate, the lower plate, and a tube of a liquid coolant system may be aligned, as illustrated in FIG. 3. The tube may include one or more of the features of the tube 104 (FIG. 1), the tube 208 (FIG. 2), and/or the tube 306 (FIG. 3). The tube may be aligned with cavities (such as cavities 210 (FIG. 2) and/or cavities 312 (FIG. 3)) formed in the lower plate. The upper plate and the lower plate may be aligned with each other by aligning an aperture (such as the apertures 214 (FIG. 2) and/or the aperture 308 (FIG. 3)) formed in the upper plate with an aperture (such as the apertures 216 (FIG. 2)) and/or a recess (such as recess 310 (FIG. 3)) formed in the lower plate. In some embodiments, the upper plate and the lower plate may be aligned based on marks and/or specific features formed on one or both of the upper plate and the lower plate.

In 708, epoxy (such as epoxy 402) may be applied. The epoxy may be applied to one or more of the upper plate, the lower plate, and the tube. In some embodiments, the epoxy may be applied to inner walls (such as the inner walls 314) of the cavities. In some embodiments, a thermal interface material, brazing parts, or some combination thereof may be applied to and/or added to the one or more of the upper plate, the lower plate, and the tube in lieu of or in addition to the epoxy. Further, in some embodiments, 708 may be omitted and, accordingly, the epoxy may not be applied and the thermal interface material, the brazing parts, or combination thereof, may not be applied and/or added.

In 710, the upper plate and the lower plate of the heat exchanger puck may be compressed together. The side of the lower plate with the cavities formed in it may be compressed to one of the sides of the upper plate. The upper plate and the lower plate may be compressed by applying force/s to one or both of the upper plate and the lower plate. In some embodiments, one or more fasteners and/or fastener assemblies (such as fasteners and/or fastener assemblies 212 (FIG. 2)) may be installed within the upper plate and the lower plate and may provide the compression force. The tube, located in the cavities formed in the lower plate, may be compressed between the upper plate and the lower plate and may be deformed in response to the compression. The deformation of the tube may result in a greater portion of the circumference of the tube contacting either or both of the upper plate and the lower plate than prior to the deformation of the tube.

In 712, the epoxy may be cured. The epoxy may be cured by applying heat, light, chemicals, or some combination thereof, to the epoxy. The epoxy may be cured while the upper plate and the lower plate are compressed together. The cured epoxy may affix the upper plate and the lower plate to each other. The cured epoxy may fill any remaining gaps in the cavities of the lower plate about the tube and may help facilitate heat transfer among the upper plate, the lower plate, and the tube. The force/s compressing the upper plate and the lower plate together may be removed after curing of the epoxy. The resultant heat exchanger puck from 710 and 712 may be as illustrated in FIG. 4.

In some embodiments, the upper plate and the lower plate may be affixed to each other by one or more fasteners and/or fastener assemblies (such as fasteners and/or fastener assemblies 212 (FIG. 2)). In these embodiments, the epoxy may be cured either prior to or after the fasteners and/or the fastener assemblies are installed into the upper plate and the lower plate. In embodiments where the fasteners and/or the fastener assemblies are installed prior to the epoxy being cured, the force/s compressing the upper plate and the lower plate together may be provided by the fasteners and/or the fastener assemblies without additional, external forces being applied to either of the upper plate and the lower plate.

In 714, a thinning process may be applied to the heat exchanger puck, as illustrated in FIG. 5. The thinning process may be applied to the lower plate on a side of the lower plate that opposes the side of the lower plate abutting the upper plate. The thinning process may include removing a portion of the lower plate via a fly cutter, a grinder, a blade, or some combination thereof. The thinning process may remove material of the lower plate leaving a thin layer of the lower plate between the tube and the side of the lower plate from which the material was removed.

In some embodiments, the thinning process may further be applied to achieve a desired flatness and/or creating a predetermined geometry on the side of the lower plate in lieu of or in addition to thinning the heat exchanger. For example, it may be desired to have the side of the lower plate as being concave or convex and the thinning process may be applied to achieve this predetermined geometry.

In 716, the heat exchanger puck may be coupled to a component to be cooled. The side of the lower plate of the heat exchanger puck to which the thinning process was applied may be coupled to the component to be cooled. The heat exchanger puck may be coupled to the component to be cooled via thermal epoxy, thermal grease, thermal adhesive, one or more fasteners, or some combination thereof. The heat exchanger puck may become thermally coupled to the component to be cooled via the attachment of the heat exchanger puck to the component to be cooled and may cool the component.

In some embodiments, the heat exchanger puck may be coupled to the component to be cooled by one of the other sides of the heat exchanger puck to which the thinning process was not applied. Further, in some embodiments, the heat exchanger puck may also be coupled to a second component to be cooled on an opposite side of the heat exchanger puck from which the component to be cooled is coupled. In these embodiments, the heat exchanger puck may cool both the component to be cooled and the second component to be cooled.

In alternate embodiments, some of the operations of process 700 may be combined, divided, omitted, or performed in different orders. For example, but not limited to, lower plate may be formed 704 before upper plate is formed 702.

FIG. 8 illustrates a cross-sectional view of an example heat exchanger puck 800 prior to hydroformation, according to various embodiments. The heat exchanger puck 800 may include one or more of the features of the heat exchanger puck 100 (FIG. 1) and/or the heat exchanger puck 400 (FIG. 4). Manufacture of the heat exchanger puck may include one or more of procedures described in process 700 (FIG. 7).

The heat exchanger puck 800 may include an upper plate 802 and a lower plate 804. The heat exchanger puck 800 may receive a tube 806 of a liquid coolant system. The upper plate 802 may include one or more of the features of the upper plate 204 (FIG. 2) and/or the upper plate 302 (FIG. 3). Cavities 808 may be formed in the upper plate 802. The cavities 808 may extend into the upper plate 802 from a side of the upper plate 802 coupled to the lower plate 804.

The lower plate 804 may include one or more of the features of the lower plate 204 (FIG. 2) and/or the lower plate 304 (FIG. 3). Cavities 810 may be formed in the lower plate 804. The cavities 810 may extend into the lower plate 804 from a side of the lower plate 804 coupled to the upper plate 802. The cavities 810 of the lower plate 804 and the cavities 808 of the upper plate 802 may be aligned when the upper plate 802 and the lower plate 804 are coupled/affixed together generating larger cavities, comprising the cavities 810 and the cavities 808, between the upper plate 802 and the lower plate 804.

The tube 806 may include one or more of the features of the tube 104 (FIG. 1), the tube 208 (FIG. 2), and/or the tube 306 (FIG. 3). Portions of the tube 806 may be located within the larger cavities formed by the aligned cavities 810 and cavities 808. Gaps 812 may be located between the portions of the tube 806 and the upper plate 802 and/or the lower plate 804, with the portions of the tube 806 positioned loosely within the larger cavities. In some embodiments, the portions of the tube 806 may be compressed between the upper plate 802 and the lower plate 804, with portions of the circumference of the tube 806 contacting the upper plate 802 and the lower plate 804. In these embodiments, the tube 806 may be deformed in response to the upper plate 802 and the lower plate 804 being compressed/affixed to each other.

FIG. 9 illustrates a cross-sectional view of the example heat exchanger puck 800 of FIG. 8 after hydroformation, according to various embodiments. The process of hydroforming may include any process of hydroforming materials known to one having ordinary skill in the art. The process of hydroforming may be applied to the portions of the tube 806 located within the larger cavities formed by the aligned cavities 808 and cavities 810. The process of hydroforming may include pressurizing a liquid (such as water, oil, or some combination thereof) within the portions of tube 806. The pressurized liquid may cause the tube 806 to deform in response to force/s applied to the tube 806 via the pressurized liquid. In some embodiments, gas may be pressurized with the portions of the tube 806 rather than, or in addition to, the liquid, the tube 806 deforming in response to the pressurized gas and/or liquid.

A circumference of the tube 806 may expand in response to the pressurized liquid within the tube 806. As the tube 806 expands, the tube 806 may fill in the gaps 812, or some portion thereof, and a greater portion of the circumference of the tube 806 may contact the upper plate 802 and/or the lower plate 804. In some embodiments (such as the embodiment illustrated), an entirety of the circumference of the tube 806 may contact either the upper plate 802 or the lower plate 804. A rate and/or amount of heat transfer between the tube 806 and the upper plate 802 and/or the lower plate 804 may increase based on the increased contact between the circumference of the tube 806 and the upper plate 802 and/or the lower plate 804.

Further, as the tube 806 expands, a thickness of the tube walls 902 of the tube 806 may be reduced. The thickness of the tube walls 902 may be reduced around an entirety of the portions of the tube 806 within the larger cavities or in certain locations (such as locations where the circumference of the tube expanded) of the portions of the tube 806. A rate and/or amount of heat transfer between the tube 806 and/or liquid within the tube 806 and the upper plate 802 and/or the lower plate 804 may increase based on the reduced thickness of the tube walls 902.

FIG. 10 illustrates an example process 1000 of manufacturing a heat exchanger puck with hydroformed tube, according to various embodiments. In 1002, an upper plate for a heat exchanger puck may be formed. The upper plate may include one or more of the features of the upper plate 204 (FIG. 2), the upper plate 302 (FIG. 3), and/or the upper plate 802 (FIG. 8). The upper plate may be formed by a process of forming and/or machining a plate for a heat exchanger puck known by one having ordinary skill in the art.

In 1004, a lower plate for the heat exchanger puck may be formed. The lower plate may include one or more of the features of the lower plate 206 (FIG. 2), the lower plate 304 (FIG. 3), and/or the lower plate 804 (FIG. 8). The lower plate may be formed by a process of forming and/or machining a plate for a heat exchanger puck known by one having ordinary skill in the art.

In 1006, the upper plate, the lower plate, and a tube of a liquid coolant system may be aligned, as illustrated in FIG. 3. The tube may include one or more of the features of the tube 104 (FIG. 1), the tube 208 (FIG. 2), the tube 306 (FIG. 3), and/or the tube 806 (FIG. 8). The tube may be aligned with cavities (such as cavities 210 (FIG. 2) and/or cavities 312 (FIG. 3)) formed in the lower plate and/or the larger cavities formed by the cavities 808 and 810 (FIG. 8). The upper plate and the lower plate may be aligned with each other by aligning an aperture (such as the apertures 214 (FIG. 2) and/or the aperture 308 (FIG. 3)) formed in the upper plate with an aperture (such as the apertures 216 (FIG. 2)) and/or recess (such as recess 310 (FIG. 3)) formed in the lower plate. In some embodiments, the upper plate and the lower plate may be aligned based on marks and/or specific features formed on one or both of the upper plate and the lower plate.

In 1008, epoxy (such as epoxy 402) may be applied. The epoxy may be applied to one or more of the upper plate, the lower plate, and the tube. In some embodiments, the epoxy may be applied to inner walls (such as the inner walls 314) of the cavities. In some embodiments, a thermal interface material, brazing parts, or some combination thereof may be applied to and/or added to the one or more of the upper plate, the lower plate, and the tube in lieu of or in addition to the epoxy. Further, in some embodiments, 1008 may be omitted and, accordingly, the epoxy may not be applied and the thermal interface material, the brazing parts, or combination thereof, may not be applied and/or added.

In 1010, the upper plate and the lower plate of the heat exchanger puck may be compressed together, as illustrated by heat exchanger puck 800 of FIG. 8. The side of the lower plate with the cavities formed in it may be compressed to one of the sides of the upper plate and/or the side of the upper plate with the cavities formed in it. The upper plate and the lower plate may be compressed by applying force/s to one or both of the upper plate and the lower plate.

In some embodiments, one or more fasteners and/or fastener assemblies (such as fasteners and/or fastener assemblies 212 (FIG. 2)) may be installed within the upper plate and the lower plate and may provide the compression force. The tube, located in the cavities formed in the lower plate, may be compressed between the upper plate and the lower plate and may be deformed in response to the compression. The deformation of the tube may result in a greater portion of the circumference of the tube contacting either or both of the upper plate and the lower plate than when the tube was not deformed.

In 1012, the tube may be hydroformed within the cavities. The tube may be hydroformed by applying a hydroforming process to the portions of the tube within the cavity while the upper plate and the lower plate are compressed together. The process of hydroforming may include one or more of the features of the process of hydroforming described in relation to the heat exchanger puck 800 of FIG. 9.

In 1014, the epoxy may be cured. The epoxy may be cured by applying heat, light, chemicals, or some combination thereof, to the epoxy. The epoxy may be cured while the upper plate and the lower plate are compressed together. The cured epoxy may affix the upper plate and the lower plate to each other. The cured epoxy may fill any remaining gaps in the cavities around the tube and may help facilitate heat transfer among the upper plate, the lower plate, and the tube. The force/s compressing the upper plate and the lower plate together may be removed after curing of the epoxy.

In 1016, a thinning process may be applied to the heat exchanger puck. The thinning process may be applied to the lower plate on a side of the lower plate that opposes the side of the lower plate abutting the upper plate. The thinning process may include removing a portion of the lower plate via a fly cutter, a grinder, a blade, or some combination thereof. The thinning process may remove material of the lower plate leaving a thin layer of the lower plate between the tube and the side of the lower plate from which the material was removed.

In some embodiments, the thinning process may further be applied to achieve a desired flatness and/or creating a predetermined geometry on the side of the lower plate in lieu of or in addition to thinning the heat exchanger puck. For example, it may be desired to have the side of the lower plate as being concave or convex and the thinning process may be applied to achieve this predetermined geometry.

In 1018, the heat exchanger puck may be coupled to a component to be cooled. The side of the lower plate of the heat exchanger puck to which the thinning process was applied may be coupled to the component to be cooled. The heat exchanger puck may be coupled to the component to be cooled via thermal epoxy, thermal grease, thermal adhesive, one or more fasteners, or some combination thereof. The heat exchanger puck may become thermally coupled to the component to be cooled via the attachment of the heat exchanger puck to the component to be cooled and may cool the component.

In alternate embodiments, some of the operations of process 1000 may be combined, divided, omitted, or performed in different orders. For example, but not limited to, lower plate may be formed 1004 before upper plate is formed 1002.

FIG. 11 illustrates a cross-sectional view of a heat exchanger puck 1100 with hydroform tooling mold 1108 before hydroforming, according to various embodiments. A heat exchanger puck 1100 may include pre-hydroformed tube 1102. The pre-hydroformed tube 1102 may include a first portion 1104 routed within the heat exchanger puck 1100 and a second portion 1106 that extends from heat exchanger puck 1100.

A hydroform tooling mold 1108 may be positioned around the second portion 1106 of the pre-hydroformed tube 1102 that extends from the heat exchanger puck 1100. The hydroform tooling mold 1108 may include an upper mold 1410 and a lower mold 1112. The upper mold 1110 and the lower mold 1112 may be positioned on opposing sides of the second portion 1106 of the pre-hydroformed tube 1102 and may form one or more cavities 1114 into which the second portion 1106 of the pre-hydroformed tube 1102 may extend. The upper mold 1110 and the lower mold 1112 may be temporarily affixed to each other around the second portion 1106 of the pre-hydroformed tube 1102.

The upper mold 1110 may have a first plurality of ridges 1116 formed in the upper mold 1110. The lower mold 1112 may include a corresponding second plurality of ridges 1118. When positioned on the opposing sides of the second portion 1106 of the pre-hydroformed tube 1102, the first plurality of ridges 1116 and the second plurality of ridges 1118 may align with each other around at least a portion of the one or more cavities 1114. In some embodiments, the first plurality of the ridges 1116 and the second plurality of ridges 1118, together, may extend around circumferences of the one or more cavities 1114. At least a portion of the second portion 1106 of the pre-hydroformed tube 1102 may extend into the part of the one or more cavities 1114 encompassed by the first plurality of ridges 1116 and the second plurality of ridges 1118.

A hydroforming process may be applied to the first portion 1104 and the second portion 1106 of the pre-hydroformed tube 1102 within the heat exchanger puck 1100 and the one or more cavities 1114, respectively. In the hydroforming process, the first portion 1104 and the second portion 1106 of the pre-hydroformed tube 1102 may expand within the heat exchanger puck 1100 and the one or more cavities 1114, respectively.

FIG. 12 illustrates a cross-sectional view of the heat exchanger puck 1100 of FIG. 11 with hydroform tooling mold 1108 after hydroforming, according to various embodiments. The heat exchanger puck 1100 after hydroforming illustrated in FIG. 11 may be the result of applying a hydroforming process to the pre-hydroformed tube 1102 (FIG. 11) illustrated in FIG. 11.

The heat exchanger puck 1100 after hydroforming may include post-hydroformed tube 1202, produced through application of the hydroforming process to the pre-hydroformed tube 1102. A first portion 1204 of the post-hydroformed tube 1202, which may correspond to the first portion 1104 of the pre-hydroformed tube 1102, may extend within the heat exchanger puck 1100 and may have expanded to fit one or more cavities 1220 formed within the heat exchanger puck 1100 through which the first portion 1204 is routed. A shape of the first portion 1204 may be formed by the heat exchanger puck 1100 as the hydroforming process was applied to the first portion 1104 of the pre-hydroformed tube 1102 while the first portion was located within the one or more cavities 1220.

A second portion 1206 of the post-hydroformed tube 1202, which may correspond to the second portion 1106 of the pre-hydroformed tube 1102, may extend out of the heat exchanger puck 1100 and be routed within the one or more cavities 1114 of the hydroform tooling mold 1108. The second portion 1206 may have expanded to fill the one or more cavities 1114 in response to the hydroforming process. In some embodiments, the second portion 1206 may have expanded in circumference and may not fill the entirety of the one or more cavities 1114. At least part of the second portion 1206 may expand in circumference to fill the first plurality of ridges 1116 and/or the second plurality of ridges 1118. The part of the second portion 1206 that expanded to fill the first plurality of ridges 1116 and/or the second plurality of ridges 1118 may have a ridged profile, with a ridged portion 1222 formed in the second portion 1206 of the post-hydroformed tube 1202.

FIG. 13 illustrates a cross-sectional of the example heat exchanger puck 1100 of FIG. 11 without the hydroform tooling mold 1108 (FIG. 11) after hydroforming, according to various embodiments. The hydroform tooling mold 1108 may have been removed from the second portion 1206 of the post-hydroformed tube 1202 by uncoupling the upper mold 1110 (FIG. 11) from the lower mold 1112 (FIG. 11) and removing the upper mold 1110 and the lower mold 1112 from the second portion 1206 of the post-hydroformed tube 1202.

The second portion 1206 of the post-hydroformed tube 1202 may retain the ridged portion 1222 after removal of the hydroform tooling mold 1108. The ridged portion 1222 may have an increased flexibility as compared to the circular shape of the pre-hydroformed tube 1102 (FIG. 11). Accordingly, the ridged portion 1222 of the post-hydroformed tube 1202 may be flexed allowing for placement of the heat exchanger puck 1100 to compensate for inconsistencies in a location of a component to be cooled onto which the heat exchanger puck 1100 is to be placed.

FIG. 14 illustrates an example process 1400 of hydroforming a tube with hydroform tooling mold, according to various embodiments. In 1402, a hydroform tooling mold (such as hydroform tooling mold 1108 (FIG. 11)) may be positioned around a portion of a pre-hydroformed tube (such as pre-hydroformed tube 1102 (FIG. 11)) that extends from a heat exchanger puck (such as heat exchanger puck 1100 (FIG. 11)). The portion of the pre-hydroformed tube may extend into one or more cavities formed by the hydroform tooling mold.

The hydroform tooling mold may include an upper mold (such as upper mold 1110 (FIG. 11)) and a lower mold (such as lower mold 1112 (FIG. 11)). Positioning the hydroform tooling mold around the portion of the pre-hydroformed tube may include positioning the upper mold around a first portion of the pre-hydroformed tube, positioning the lower mold around a second portion of the pre-hydroformed tube, and temporarily affixing the upper mold and the lower mold together. The upper mold and the lower mold may be temporarily affixed together via one or more fasteners, such as screws, bolts, hinges, similar other fasteners, or some combination thereof.

In 1404, a hydroforming process is applied to the portion of the pre-hydroformed tube. The hydroforming process may include pressurizing liquid within the pre-hydroformed tube, thereby causing the tube to expand. In response to the hydroforming process, the circumference of the pre-hydroformed tube may expand to fill the one or more cavities formed by the hydroform tooling mold, or some portion thereof.

In 1406, the hydroform tooling mold may be removed from the post-hydroformed tube. Removing the hydroform tooling mold may include uncoupling the upper mold from the lower mold, and removing the upper mold and the lower mold from around the post-hydroformed tube. The upper mold and the lower mold may be uncoupled by removing and/or unhooking the fasteners that temporarily affixed the upper mold and the lower mold together in 1402.

While the process 1400 has been described separately, it is to be understood that the process 1400 may be performed in conjunction with, or adjacent in time to, one or more processes of hydroforming a pre-hydroformed tube within a heat exchanger puck. Accordingly, the process 1400 may be performed in conjunction with, or adjacent in time to, process 700 (FIG. 7), process 1000 (FIG. 10), or some combination thereof.

FIG. 15 illustrates a cross-sectional view of an example heat exchanger puck with butterfly cavity, according to various embodiments. Pre-hydroformed heat exchanger puck 1500 may include an upper plate 1502 and a lower plate 1504 with a tube 1506 of a liquid coolant system located within a cavity 1508 formed between the upper plate 1502 and the lower plate 1504. The upper plate 1502 may include one or more of the features of the upper plate 204 (FIG. 2), the upper plate 302 (FIG. 3), and/or the upper plate 802 (FIG. 8). The lower plate 1504 may include one or more of the features of the lower plate 206 (FIG. 2), the lower plate 302 (FIG. 3), and/or the lower plate 804 (FIG. 8). The tube 1506 may include one or more of the features of the tube 104 (FIG. 1), the tube 208 (FIG. 2), the tube 306 (FIG. 3), and/or the tube 806 (FIG. 8).

The tube 1506 may contact portions of the upper plate 1502 and the lower plate 1504. Prior to hydroforming, the tube 1506 may have a narrow middle portion, where the tube 1506 contacts the upper plate 1502 and the lower plate 1504, and rounded outer portions that extend into the wing portion of the butterfly shaped cavity 1508. The shape of the tube 1506 may be formed via deformation of the tube 1506 during compression of the upper plate 1502 and the lower plate 1504 together. Tube walls 1512 of the tube 1506 may be a starting thickness in response to the deformation of the tube 1506 during the compression. Gaps 1510 may be located between the tube 1506 and the upper plate 1502 and the lower plate 1504, where the tube 1506 did not naturally deform to in response to the compression of the upper plate 1502 and the lower plate.

Post-hydroformed heat exchanger puck 1550 may occur from applying a hydroforming process to the pre-hydroformed heat exchanger puck 1500. The circumference of the tube 1506 may have expanded to substantially fill the cavity 1508 in response to liquid 1552 being pressurized (in accordance with the hydroforming process) within the tube 1506, such that a greater portion of the circumference of the tube 1506 contacts either the upper plate 1502 or the lower plate 1504. The tube walls 1512 may decrease in thickness from the starting thickness in response to the expansion of the circumference of the tube 1506. Further, the size of the gaps 1510 may decrease in response to the expansion of the circumference of the tube 1506. In some embodiments, an entirety of the circumference of the tube 1506 may contact either the upper plate 1502 or the lower plate 1504 and there may be no gaps 1510. In some embodiments, the gaps 1510 may be filled with epoxy (such as epoxy 402 (FIG. 4)), which may be cured after completion of the hydroforming process. In some embodiments, a thermal interface material, brazing parts, or some combination thereof may be used to fill the gaps 1510 in lieu of or in addition to the epoxy.

FIG. 16 illustrates example tube shapes that may be produced by the hydroforming process, according to various embodiments. Tube 1600 may be substantially triangular in shape with three substantially flat sides. The tube 1600 may have curved corners of the triangle as a result of the hydroforming process. The tube 1600 may include one or more of the features of the tube 104 (FIG. 1), the tube 208 (FIG. 2), the tube 306 (FIG. 3), and/or the tube 806 (FIG. 8).

An example heat exchanger puck 1602 with triangular cavity 1608 may include the tube 1600. The heat exchanger puck 1602 may further include an upper plate 1604 and a lower plate 1606. The upper plate 1604 may include one or more of the features of the upper plate 204 (FIG. 2), the upper plate 302 (FIG. 3), and/or the upper plate 802 (FIG. 8). The lower plate 1606 may include one or more of the features of the lower plate 206 (FIG. 2), the lower plate 304 (FIG. 3), and/or the lower plate 804 (FIG. 8).

The triangular cavity 1608 may be formed between the upper plate 1604 and the lower plate 1606. The tube 1600 may be located within the triangular cavity 1608 and the shape of the tube 1600 may have been formed via hydroforming while positioned between the upper plate 1604 and the lower plate 1606. Gaps 1610 may be located between the tube 1600 and the upper plate 1604 and/or the lower plate 1606. The gaps 1610 may be filled with epoxy (such as epoxy 402 (FIG. 4)) to facilitate heat transfer among the tube 1600, the upper plate 1604, and the lower plate 1606. In some embodiments, a thermal interface material, brazing parts, or some combination thereof may be used to fill the gaps 1610 in lieu of or in addition to the epoxy.

Tube 1630 may have a substantially quadrilateral shape with four substantially flat sides. The tube 1630 may have curved corners of the quadrilateral shape as a result of the hydroforming process. The tube 1630 may include one or more of the features of the tube 104 (FIG. 1), the tube 208 (FIG. 2), the tube 306 (FIG. 3), and/or the tube 806 (FIG. 8).

An example heat exchanger puck 1632 with quadrilateral cavity 1638 may include the tube 1630. The heat exchanger puck 1632 may further include an upper plate 1634 and a lower plate 1636. The upper plate 1634 may include one or more of the features of the upper plate 204 (FIG. 2), the upper plate 302 (FIG. 3), and/or the upper plate 802 (FIG. 8). The lower plate 1636 may include one or more of the features of the lower plate 206 (FIG. 2), the lower plate 304 (FIG. 3), and/or the lower plate 804 (FIG. 8).

The quadrilateral cavity 1638 may be formed between the upper plate 1634 and the lower plate 1636. The tube 1630 may be located within the quadrilateral cavity 1638 and the shape of the tube 1630 may have been formed via hydroforming while positioned between the upper plate 1034 and the lower plate 1636. Gaps 1640 may be located between the tube 1630 and the upper plate 1634 and/or the lower plate 1636. The gaps 1640 may be filled with epoxy (such as epoxy 402 (FIG. 4)) to facilitate heat transfer among the tube 1630, the upper plate 1634, and the lower plate 1636. In some embodiments, a thermal interface material, brazing parts, or some combination thereof may be used to fill the gaps 1640 in lieu of or in addition to the epoxy.

Tube 1660 may have a substantially pentagonal shape with four substantially flat sides. The tube 1660 may have curved corners of the pentagonal shape as a result of the hydroforming process. The tube 1660 may include one or more of the features of the tube 104 (FIG. 1), the tube 208 (FIG. 2), the tube 306 (FIG. 3), and/or the tube 806 (FIG. 8).

An example heat exchanger puck 1662 with pentagonal cavity 1668 may include the tube 1660. The heat exchanger puck 1662 may further include an upper plate 1664 and a lower plate 1666. The upper plate 1664 may include one or more of the features of the upper plate 204 (FIG. 2), the upper plate 302 (FIG. 3), and/or the upper plate 802 (FIG. 8). The lower plate 1666 may include one or more of the features of the lower plate 206 (FIG. 2), the lower plate 304 (FIG. 3), and/or the lower plate 804 (FIG. 8).

The pentagonal cavity 1668 may be formed between the upper plate 1664 and the lower plate 1666. The tube 1660 may be located within the pentagonal cavity 1668 and the shape of the tube 1660 may have been formed via hydroforming while positioned between the upper plate 1064 and the lower plate 1666. Gaps 1170 may be located between the tube 1660 and the upper plate 1664 and/or the lower plate 1666. The gaps 1170 may be filled with epoxy (such as epoxy 402 (FIG. 4)) to facilitate heat transfer among the tube 1660, the upper plate 1664, and the lower plate 1666. In some embodiments, a thermal interface material, brazing parts, or some combination thereof may be used to fill the gaps 1610 in lieu of or in addition to the epoxy.

It is to be understood that the shapes illustrated in FIG. 16 are examples of some the shapes that may be generated via the hydroforming process and that the shapes that hydroformed tubes may be is not limited to these example shapes. Shapes of hydroformed tubes may include two or more sides, may include curved sides, or some combination thereof, and should not be interpreted to be limited to the shapes illustrated in FIG. 16.

FIG. 17 illustrates a cross-sectional view of an example portion of a heat exchanger puck with ridged cavity, according to various embodiments. A portion of a pre-hydroformed heat exchanger puck 1700 may have a ridged cavity 1702 formed between an upper plate 1704 and a lower plate 1706. The upper plate 1704 may include one or more of the features of the upper plate 204 (FIG. 2), the upper plate 302 (FIG. 3), and/or the upper plate 802 (FIG. 8). The lower plate 1706 may include one or more of the features of the lower plate 206 (FIG. 2), the lower plate 304 (FIG. 3), and/or the lower plate 804 (FIG. 8).

The ridged cavity 1702 may include ridges 1710. A tube 1708 may be positioned within the ridged cavity 1702. The tube 1708 may include one or more of the features of the tube 104 (FIG. 1), the tube 208 (FIG. 2), the tube 306 (FIG. 3), and/or the tube 806 (FIG. 8). The tube 1708 may be compressed between the upper plate 1704 and the lower plate 1706 and may be substantially straight along the length of the tube 1708 prior to being hydroformed.

A portion of a post-hydroformed heat exchanger puck 1750 with ridged cavity 1702 may be formed by applying a hydroforming process to the tube 1708 in the portion of the pre-hydroformed heat exchange puck 1700. The hydroforming process, for hydroforming the tube 1708, may include one or more of the procedures described in relation the hydroforming process described in relation to the heat exchanger puck 800 of FIG. 9 and/or the hydroforming of the tube in 1012. The circumference of the tube 1708 may expand into the ridges 1710, the tube 1708 filling the ridges 1710. The tube 1708 filling the ridges 1710 may operate to maintain a position of the tube 1708 within the ridged cavity 1702 and prevent sliding of the tube 1708 along a length of the cavity.

Maintaining the position of the tube 1708 within the ridged cavity 1702 may act as a strain relief that can protect the integrity of the thermal contact between the tube 1708 and the portion of the post-hydroformed heat exchanger puck 1750. Further, maintaining the position of the tube 1708 within the ridged cavity 1702 may reduce or prevent any stresses applied to portions of the tube outside the portion of the post-hydroformed heat exchanger puck 1750 from translating to the portion of the tube 1708 within the portion of the post-hydroformed heat exchanger puck 1750 preventing or reducing the possibility of damage to the portion of the tube 1708 within the portion of the post-hydroformed heat exchanger puck 1750.

FIG. 18 illustrates example ridged, hydroformed tube shapes, according to various embodiments. As can be observed, tubes may be hydroformed with one or more ridges along a length of the tube. Further, a circumference of the tubes may vary along the length of the tube.

It is to be understood that the shapes illustrated in FIG. 18 are examples of some the shapes that may be generated via the hydroforming process and that the shapes that hydroformed tubes may be is not limited to these example shapes. Shapes of hydroformed tubes may include two or more sides, may include curved sides, may include one or more ridges, or some combination thereof, and should not be interpreted to be limited to the shapes illustrated in FIG. 18.

FIG. 19 illustrates a cross-sectional view of an example heat exchanger puck 1900 with an affixing hydroformed tube 1906, according to various embodiments. The heat exchanger puck 1900 may include an upper plate 1902 and a lower plate 1904. The upper plate 1902 may include one or more of the features of the upper plate 204 (FIG. 2), the upper plate 302 (FIG. 3), and/or the upper plate 802 (FIG. 8). The lower plate 1904 may include one or more of the features of the lower plate 206 (FIG. 2), the lower plate 304 (FIG. 3), and/or the lower plate 804 (FIG. 8).

A cavity 1908 may be formed between the upper plate 1902 and the lower plate 1904. The cavity 1908 may include a first portion where a width of the cavity 1908 increases as the cavity 1908 extends into the upper plate 1902 from the side of the upper plate 1902 abutting the lower plate 1904 and may include a second portion where a width of the cavity 1908 increases as the cavity 1908 extends into the lower plate 1904 from the side of the lower plate 1904 abutting the upper plate 1902. The cavity 1908 illustrated may be substantially hourglass-shaped, however it is to be understood that the affixing characteristic of the tube 1906 may be present in any cavity where the width of the cavity increases as the cavity extends into both the upper plate and the lower plate, where one or more reflex angles of the cavity are produced as the cavity extends into both the upper plate and the lower plate, or some combination thereof.

The tube 1906 may be positioned within the cavity 1908. The tube 1906 may be hydroformed while the upper plate 1902 and the lower plate 1904 are compressed together. The tube may be hydroformed via the hydroforming process described in relation to the heat exchanger puck 800 of FIG. 9 and/or the hydroforming of the tube in 1012. The tube 1906 may expand to fill, or substantially fill, the cavity 1908. After hydroforming, the tube 1906 may become rigid and may affix the upper plate 1902 and/or the lower plate 1904 together, preventing separation of the upper plate 1902 and/or the lower plate 1904.

FIG. 20 illustrates a cross-sectional view of an example heat exchanger puck 2900 prior to compression of an upper plate 2902 and a lower plate 2904, according to various embodiments. The heat exchanger puck 2900 may include the upper plate 2902 and the lower plate 2904. The upper plate 2902 may include one or more of the features of the upper plate 204 (FIG. 2), the upper plate 302 (FIG. 3), the upper plate 802 (FIG. 8), and/or the upper plate 1902 (FIG. 19). The lower plate 1904 may include one or more of the features of the lower plate 206 (FIG. 2), the lower plate 304 (FIG. 3), the lower plate 804 (FIG. 8), and/or the lower plate 1904 (FIG. 19).

The upper plate 2902 may include a cavity 2906 formed within the upper plate 2902, the cavity 2906 extending into the upper plate 2902 from one of the sides of the upper plate 2902. A portion of a tube 2908 may be positioned within the cavity 2906. The tube 2908 may include one or more of the features of the tube 104 (FIG. 1), the tube 208 (FIG. 2), the tube 306 (FIG. 3), the tube 806 (FIG. 8), and/or the tube 1708 (FIG. 17). The tube 2908 may be pre-formed (via press-forming and hydroforming) to a shape that is similar to the shape of the cavity 2906 (as illustrated), or may be a circular tube.

The lower plate 2904 may include a flat surface without any cavities. The flat surface of the lower plate 2904 may be aligned with the side of the upper plate 2902 with the cavity 2906 formed in it. The portion of the tube 2908 may extend out of the cavity 2906 toward the lower plate 2904 when the lower plate 2904 is aligned with the side of the upper plate 2902. In some embodiments, the entirety of the tube 2908 may be located within the cavity 2906, such that the portion of the tube 2908 does not extend outside of the cavity.

FIG. 21 illustrates a cross-sectional view of the example heat exchanger puck 2900 of FIG. 20 after compression of the upper plate 2902 and the lower plate 2904, according to various embodiments. The upper plate 2902 and the lower plate 2904 may be compressed together by applying a compression force to one or both of the upper plate 2902 and the lower plate 2904 urging the upper plate 2902 and the lower plate 2904 toward each other when the upper plate 2902 and the lower plate 2904 are aligned. In response to the compression force being applied, the side of the upper plate 2902 with the cavity 2906 may be pressed against the flat side of the lower plate 2904. The compression force may be maintained while the side of the upper plate 2902 is located against the flat side of the lower plate 2904.

In embodiments where the portion of the tube 2908 extends out of the cavity 2906 toward the lower plate 2904, the lower plate 2904 may contact the tube 2908 as the upper plate 2902 and the lower plate 2904 are being compressed together and may cause the tube 2908 to be deformed as the upper plate 2902 and the lower plate 2904 are compressed together. The tube 2908 may be deformed based on a force being applied to the tube 2908 as the upper plate 2902 and the lower plate 2904 are moved together. When the side of the upper plate 2902 is pressed against the lower plate 2904, the entirety of the tube 2908 may be located within the cavity 2906 based on the deformation of the tube 2908. In embodiments, where the portion of the tube 2908 was within the cavity 2906 prior to the upper plate 2902 and the lower plate 2904 being compressed together, the lower plate 2904 may not contact the tube 2908 when the upper plate 2902 and the lower plate 2904 are being compressed together and the portion of the tube 2908 may not be deformed in response to the upper plate 2902 and the lower plate 2904 being compressed together.

FIG. 22 illustrates a cross-sectional view of the example heat exchanger puck 2900 of FIG. 20 after hydroforming process, according to various embodiments. A hydroforming process may be applied to the tube 2908 while located between the upper plate 2902 and the lower plate 2904. The compression force applied to one or both of the upper plate 2902 and the lower plate 2904 that causes the upper plate 2902 and the lower plate 2904 to be pressed together may be maintained throughout the hydroforming process.

The process of hydroforming may include one or more of the features of the process of hydroforming described in relation to the heat exchanger puck 800 of FIG. 9. In response to the hydroforming process, the walls of the tube 2908 may expand to abut the inner walls of the cavity 2906 or the portion of the flat side of the lower plate 2904 that abuts the cavity 2906 when the upper plate 2902 and the lower plate 2904 are pressed together. In some embodiments, the entirety of the walls of the tube 2908 may abut the inner walls of the cavity 2906 or the portion of the flat side of the lower plate 2904. In other embodiment, a portion of the walls of the tube 2908 may be separated from the inner walls of the cavity 2906 and the flat side of the lower plate 2904, such that less than the entirety of the walls of the tube 2908 abut the inner walls of the cavity 2906 or the portion of the flat side of the lower plate 2904.

FIG. 23 illustrates a cross-sectional view of the example heat exchanger puck 2900 of FIG. 20 after removal of the lower plate 2904 (FIG. 22), according to various embodiments. The lower plate 2904 may be removed from abutting the side of the upper plate 2902 after completion of the hydroforming process. The lower plate 2904 may be removed by removing and/or seizing the compression force being applied to one or both of the upper plate 2902 and the lower plate 2904.

In response to the lower plate 2904 being removed, a portion of the tube 2908 that was in contact with the lower plate 2904 after the hydroforming process may be exposed to the external environment. The portion of the tube 2908 that abutted the upper plate 2902 after the hydroforming process may still abut the upper plate 2902 after removal of the lower plate 2904. The position of the tube 2908 may be maintained after the removal of the lower plate 2904 based on the contact between the tube 2908 and the upper plate 2902.

FIG. 24 illustrates a cross-sectional view of the example heat exchanger puck 2900 of FIG. 20 coupled to a component 3302, according to various embodiments. The component 3302 may include one or more of the features of the component 602 (FIG. 6). The component 3302 may be a component that produces heat and is to be cooled by the heat exchanger puck 2900. The component 3302 may be mounted to a PCB within an electronic environment. The component 3302 may produce heat in response to power being supplied to the component 3302 and/or the electronic environment.

The heat exchanger puck 2900 may be positioned against the component 3302, with the exposed portion of the tube 2908 abutting the surface of the component 3302. With the heat exchanger puck 2900 positioned against the component 3302, the exposed portion of the tube 2908 may be in direct contact with the surface of the component 3302 or thermal transfer material (such as thermal grease, thermally-conductive tape, and/or thermal epoxy) applied to the surface of the component 3302. Further, the side of the upper plate 2902, or some portion thereof, into which the cavity extends 2906 may be in direct contact with the surface of the component 3302. The heat exchanger puck 2900 may be coupled to the component 3302 via fasteners, thermally-conductive adhesives (such as thermal epoxy or thermally-conductive tape), force applied to the heat exchanger puck 2900 in the direction of the component 3302, or some combination thereof.

When the heat exchanger puck 2900 is positioned against the component 3302, heat from the component 3302 may be transferred from the component 3302 to the heat exchanger puck 2900. The heat transferred may be transferred to the tube 2908, which, in turn, may transfer the heat to liquid within the tube 2908. The liquid may be circulated through the tube 2908, with the liquid carrying the heat away from the heat exchanger puck 2900 and the component 3302 as the liquid is circulated.

FIG. 25 illustrates an example process 3400 of producing the heat exchanger puck 2900 of FIG. 20, according to various embodiments. In 3402, the upper plate 2902 (FIG. 20) may be formed. The upper plate 2902 may be formed of a material with relatively high heat transfer characteristics, such as carbon steel, stainless steel, copper, bronze, brass, titanium, aluminum, thermally conductive polymers, heat conducting plastics, various alloys, or some combination thereof. Forming the upper plate 2902 may include forming the cavity 2906 (FIG. 20) within the upper plate 2902. The cavity 2906 may be formed by drilling, cutting, grinding, etching, or some combination thereof, into a surface of the upper plate 2902.

In 3404, the lower plate 2904 (FIG. 20) may be formed. The lower plate 2902 may be formed of any rigid material. In some embodiments, the lower plate 2902 may not have relatively high heat transfer characteristics. Forming the lower plate 2902 may include shaping one of the surfaces of the lower plate 2904 to be substantially flat (allowing for any roughness or variances of the surface that may be presented through forming of the surface or inherent within the material).

In 3406, the upper plate 2902, the lower plate 2904, and the tube 2908 (FIG. 20) may be aligned. The tube 2908, or some portion thereof, may be positioned within the cavity 2906 (FIG. 20) of the upper plate 2902 during alignment. The lower plate 2904 may be aligned with the upper plate 2902, with the flat surface of the lower plate 2904 facing the side of the upper plate 2902 into which the cavity 2906 extends.

In 3408, the upper plate 2902 and the lower plate 2904 may be compressed together. Compressing the upper plate 2902 and the lower plate 2904 together may include applying a compression force to one or both of the upper plate 2902 and the lower plate 2904, urging the upper plate 2902 and the lower plate 2904 together. When compressed together, the flat surface of the lower plate 2094 may be pressed against the side of the upper plate 2902 into which the cavity 2906 extends.

In response to the upper plate 2902 and the lower plate 2904, the tube 2908 may be deformed to fit within the cavity 2906. In other embodiments, the tube 2908 may fit within the cavity 2906 prior to the upper plate 2902 and the lower plate 2904 being compressed together, and the tube 2908 may not be deformed in response to the upper plate 2902 and the lower plate 2904 being compressed together.

In 3410, a hydroform process may be performed with respect to the tube. The hydroform process may include one or more of the features of the hydroform process described in relation to the heat exchanger puck 2900 of FIG. 22. In response to the hydroform process, the walls of the tube 2908 may expand to abut the inner walls of the cavity 2906 and/or the lower plate 2904. The entirety of the walls of the tube 2908 may abut either the inner walls of the cavity 2906 or the lower plate 2904 after completion of the hydroform process. In other embodiments, a portion of the walls of the tube 2908 may be separate from the inner walls of the cavity 2906 and the lower plate 2908 after completion of the hydroform process.

In 3412, the lower plate 2904 is removed from the heat exchanger puck 2900. The lower plate 2904 may be removed by removing and/or seizing the compression force being applied to one or both of the lower plate 2904 and the upper plate 2902. In response to the lower plate 2904 being removed, the portion of the tube 2908 that abutted the lower plate 2904 after completion of the hydroform process may be exposed to the external environment.

In 3414, the heat exchanger puck 2900 may be coupled to the component 3302 (FIG. 24). The heat exchanger puck 2900 may be positioned against the component 3302 with the portion of the tube 2908 that was exposed to the external environment abutting the surface of the component 3302. With the heat exchanger puck 2900 positioned against the component 3302, the exposed portion of the tube 2908 may be in direct contact with the surface of the component 3302 or thermal transfer material (such as thermal grease, thermally-conductive tape, and/or thermal epoxy) applied to the surface of the component 3302. Further, the side of the upper plate 2902, or some portion thereof, into which the cavity extends 2906 may be in direct contact with the surface of the component 3302. The heat exchanger puck 2900 may be coupled to the component 3302 via fasteners, thermally-conductive adhesives (such as thermal epoxy or thermally-conductive tape), force applied to the heat exchanger puck 2900 in the direction of the component 3302, or some combination thereof.

In alternate embodiments, some of the operations of process 3400 may be combined, divided, omitted, or performed in different orders.

FIG. 26 illustrates an example liquid coolant system 2000 that may employ a heat exchanger puck 2002, according to various embodiments. The liquid coolant system 2000 may be located within a computer environment 2004, such as a computer device. In some embodiments, the liquid coolant system 2000 may be located within an electrical environment, such as power systems, mechanical switches, or some combination thereof.

The liquid coolant system 2000 may include a pump 2006. The pump 2006 may be coupled to a tube 2008 of the liquid coolant system 2000 and may circulate liquid (such as water, oil, or some combination thereof) within the tube 2008. In some embodiments, the pump 2006 may circulate vapor within the tube in lieu of, or in addition to, the liquid. In some embodiments, the pump 2006 may include a coolant system (such as an air conditioner, fans to blow and/or draw air across the tube 2008, or some combination thereof).

The tube 2008 may carry the liquid from an output of the pump 2006 in a path within the computer environment back to an input of the pump 2006. The tube 2008 may include one or more of the features of the tube 104 (FIG. 1), the tube 208 (FIG. 2), the tube 306 (FIG. 3), and the tube 806 (FIG. 8). The tube 2008 may receive heat from the computer environment 2004 and may transfer heat to the liquid circulating within the tube 2008.

The heat exchanger puck 2002 may be coupled to the tube 2008, such as in accordance with the embodiments of the heat exchanger described herein. The heat exchanger puck 2002 may include one or more features of the heat exchanger puck 100 (FIG. 1), the heat exchanger puck 400 (FIG. 4), the heat exchanger puck 800 (FIG. 8), the heat exchanger puck 1550 (FIG. 15), the heat exchanger puck 1750 (FIG. 17), and/or the heat exchanger puck 1900 (FIG. 19). The heat exchanger puck 2002 may be mounted to a component within the computer environment 2004 to be cooled, such as the integrated circuit package 2010. The integrated circuit package 2010 may be a computer processor unit, a memory device, a system-on-chip, or some combination thereof. Heat from the integrated circuit package 2010 may be transferred to the tube 2008 via the heat exchanger puck 2002, which in turn may transfer the heat to the liquid within the tube 2008. The liquid within the tube 2008 may be circulated back to the pump 2006, where the liquid may be cooled and pumped back into the tube 2008.

The heat exchanger puck 2002 may include one or more cavities, such as the one or more cavities 210 (FIG. 2), the one or more cavities 312 (FIG. 3), the one or more cavities 810 (FIG. 8), the cavity 1508 (FIG. 15), the triangular cavity 1608 (FIG. 16), the quadrilateral cavity 1638 (FIG. 16), the pentagonal cavity 1668 (FIG. 16), the ridged cavity 1702 (FIG. 17), and/or the cavity 1908 (FIG. 19). A portion of the tube 2008 may be located within the one or more cavities of the heat exchanger puck 2002 and may enter the one or more cavities through one or more openings formed in a side of the heat exchanger puck 2002.

A shape of the one or more cavities may affect a flexibility of the tube at the one or more openings where the tube 2008 enters the one or more cavities. The shape of the one or more cavities may include shapes with a width of the cavity being less than a length of the cavity. In these embodiments, the tube 2008 located within the one or more cavities may be more flexible in directions corresponding to the width of the cavity and/or less flexible in directions corresponding to the length of the cavity at the one or more openings and/or outside the one or more cavities. Such shapes with a width of the cavity being less than a length of the cavity may include an ellipse, a butterfly shape (as illustrated in FIG. 15), and/or an hour-glass shape (as illustrated in FIG. 19). In embodiments that have the ellipse-shaped cavities, the flexibility of the tube 2008 located within the one or more cavities may present increased flexibility in directions corresponding to the smallest diameter of the ellipse shape and/or decreased flexibility in directions corresponding to the largest diameter of the ellipse shape at the one or more openings and/or outside of the one or more cavities.

The portion of the tube 2008 may be formed to fit the shape of the one or more cavities by the heat exchanger puck 2002. In some embodiments, the heat exchanger puck 2002 may include a first plate, where the one or more cavities extend into the first plate from a side of the first plate, and a second plate that may be coupled to the side of the first plate. The portion of the tube 2008 located within the one or more cavities may be press-formed to fit the shape of the one or more cavities as the second plate is coupled to the side of the first plate.

In some embodiments, a hydroforming process may be applied to the portion of the tube 2008 as the portion of the tube 2008 is located within the one or more cavities to fit the portion of the tube 2008 to the shape of the one or more cavities. The hydroforming process may result in tube wall thickness of the portion of the tube 2008 to be decreased. The decreased tube wall thickness of the portion of the tube 2008 may increase the flexibility of the tube 2008 at the one or more openings.

A flexibility of the tube 2008 may further be affected by a length of the tube 2008 between the pump 2006 and the heat exchanger puck 2002. Increasing the length of the tube 2008 between the pump 2006 and the heat exchanger puck 2002 may increase the flexibility of the tube 2008, whereas decreasing the length of the tube 2008 between the pump 2006 and the heat exchanger puck 2002 may decrease the flexibility of the tube 2008. The length of the tube between the pump 2006 and the heat exchanger puck 2002 may be selected based on a predetermined flexibility of the tube 2008 between the pump 2006 and the heat exchanger puck 2002.

Further, in some embodiments, a profile of the tube 2008 outside of the heat exchanger puck 2002 may be modified to affect the flexibility of the tube 2008. The profile of the tube 2008 may be selected based on a predetermined flexibility for the portions of the tube that extend outside of the heat exchanger puck 2002. In some embodiments, the profile of the tube 2008 may be formed to an elliptical shape along a length, or a portion of the length, of the tube 2008 that extends outside of the heat exchanger puck 2002. In these embodiments, the portion of the tube 2008 that extends outside of the heat exchanger puck 2002 may present increased flexibility in directions corresponding to the smallest diameter of the elliptical shape and/or decreased flexibility in directions corresponding to the largest diameter of the elliptical shape.

In some embodiments, a second heat exchanger puck 2012 may be coupled to the tube, such as in accordance with the embodiments of the heat exchanger described herein. The second heat exchanger puck 2012 may include one or more features of the heat exchanger puck 2002. The second heat exchanger puck 2012 may be mounted to a second component within the computer environment 2004 to be cooled, such as the second integrated circuit package 2014. The second integrated circuit package 2014 may be a second computer processor unit, a second memory device, a second system-on-chip, or some combination thereof. Heat from the second integrated circuit package 2014 may be transferred to the tube 2008 via the second heat exchanger puck 2012, which in turn may transfer the heat to the liquid within the tube 2008. The liquid within the tube 2008 may be circulated back to the pump 2006, where the liquid may be cooled and pumped back into the tube 2008.

In embodiments with the second heat exchanger puck 2012, a distance between the portion of the tube 2008 located within the heat exchanger puck 2002 and the portion of the tube 2008 located within the second heat exchanger puck 2012 may be selected based on a predetermined flexibility for the portion of the tube 2008 that extends between the heat exchanger puck 2002 and the second heat exchanger puck 2012. Further, a profile of the portion of the tube 2008 may be selected based on the predetermined flexibility of the portion of the tube 2008 that extends between the heat exchanger puck 2002 and the second heat exchanger puck 2012.

FIG. 27 illustrates an example liquid coolant system 2100, according to various embodiments. The liquid coolant system 2100, or a portion thereof, may be disposed within an electronic environment and may cool one or more components within the electronic environment.

The example liquid coolant system 2100 may include a rigid support plate 2102. The rigid support plate 2102 may be formed of a rigid, or substantially rigid, material, such as sheet metal, aluminum, copper, iron, stainless steel, rigid plastic, rigid rubber, metal alloys, or some combination thereof. The rigid support plate 2102 may be substantially flat and may omit expensive machining processes employed for producing legacy support plates, which may save manufacturing time and cost. The rigid support plate 2102 may act as a backbone for the liquid coolant system 2100 and may be used for maintaining a position of the liquid coolant system 2100 (or portions thereof), mounting the liquid coolant system 2100 to a component within the electronic environment (such as a printed circuit board within the electronic environment), providing rigid support for portions of the liquid coolant system 2100, receiving and dissipating heat, or some combination thereof.

One or more apertures 2104 may be formed in the rigid support plate 2102. When the rigid support plate 2102 is disposed within the electronic environment, the apertures 2104 may align with one or more components within the electronic environment. The apertures 2104 may allow for access to the components through the rigid support plate 2102. Sizes of the apertures 2104 may be dependent on the components with which the apertures 2104 align. The apertures 2104 may be formed to be larger than or the same size as the components to which each of the apertures 2104 aligns. In some embodiments, the apertures 2104 may be smaller than the components to which each of the apertures 2104 aligns, but larger than or the same size as a portion of the electronic component to be cooled.

The liquid coolant system 2000 may include a pump 2106. The pump 2106 may be coupled to a tube 2108 of the liquid coolant system 2000 and may provide pressure to move liquid within the tube 2108. The pump 2106 may cause the liquid to be circulated through the tube 2108 from a first end of the tube 2108 coupled to the pump 2106 to a second end of the tube 2108 coupled to the pump 2106. As the liquid is circulated through the tube 2108, heat may be captured within the liquid (from the one or more components) and transferred back to the pump 2106. In some embodiments, the pump 2106 may further include a cooling system to cool the liquid, such as a fan, an air conditioner, a heat exchanger, or some combination thereof.

The tube 2108 may be coupled to the pump 2106 and may carry the liquid throughout the liquid coolant system 2000. The tube 2108 may receive the liquid from the pump 2106 at a first end of the tube 2108 and may circulate the liquid through the liquid coolant system 2000 to a second end of the tube 2108 where the liquid is delivered back to the pump 2106.

The tube 2108 may be made of a material with relatively high heat transfer characteristics and that is resistive to corrosion, such as copper, stainless steel, a copper/nickel alloy, or some combination thereof. The tube 2108 may have a threshold flexibility, where the tube 2108 may flex a certain amount without the integrity of the tube 2108 being compromised, allowing the liquid to leak from the tube 2108. The threshold flexibility of the tube 2108 may be affected by a profile of the tube 2108, or a portion thereof. The profile of the tube 2108 may be any of the shapes described throughout this disclosure and may vary along the length of the tube 2108. The profile of the tube 2108 may be formed via press-forming, hydroforming, similar operations of forming tubes within a liquid coolant system known by one having ordinary skill in the art, or some combination thereof.

Further, the threshold flexibility may vary depending on the direction of flex of the tube 2108. For example, a profile of the tube 2108 may be narrower along a first axis than along a second axis. The tube 2108 may have an increased threshold flexibility to flex in the direction of the first axis than if the tube 2108 was round and a decreased threshold flexibility to flex in the direction of the second axis than if the tube 2108 was round based on the profile being narrower along the first axis than along the second axis. Further, the threshold flexibility to flex in the direction of the first axis may be greater than the threshold flexibility to flex in the direction of the second axis based on the profile being narrower along the first axis than along the second axis.

The liquid coolant system may further include one or more heat exchanger pucks 2110. The heat exchanger pucks 2110 may include one or more of the features of the heat exchanger puck 100 (FIG. 1), the heat exchanger puck 400 (FIG. 4), the heat exchanger puck 500 (FIG. 5), the heat exchanger puck 800 (FIG. 8), the heat exchanger puck 1100 (FIG. 11), the heat exchanger puck 1602 (FIG. 16), the heat exchanger puck 1632 (FIG. 16), the heat exchanger puck 1662 (FIG. 16), the heat exchanger puck 1900 (FIG. 19), the heat exchanger puck 2002 (FIG. 20), the post-hydroformed heat exchanger puck 1550 (FIG. 15), the post-hydroformed heat exchanger puck 1750 (FIG. 17), any other heat exchanger puck known to one having ordinary skill in the art, or some combination thereof. Further, the heat exchanger pucks 2110 may differ, with different ones of the heat exchanger pucks 2110 having different sizes, different shapes, different features, or some combination thereof.

The heat exchanger pucks 2110 may be coupled to the tube 2108 along different portions of the tube 2108. The tube 2108 may extend within cavities formed within the heat exchanger pucks 2110 and may be fixed within the cavities formed within the heat exchanger pucks 2110. In some embodiments, the tube 2108 may be affixed to or contact a surface of the heat exchanger pucks 2110, or a portion of the heat exchanger pucks 2110, rather than extending within the cavities formed within the heat exchanger pucks 2110. The coupling of the heat exchanger pucks 2110 to the tube 2108 may allow for transferring of heat from the heat exchanger pucks 2110 to the tube 2108, which may, in turn, transfer heat to the liquid circulating within the tube 2108.

When the liquid coolant system 2100 is disposed within the electronic environment, the heat exchanger pucks 2110 may align with the apertures 2104 formed within the rigid support plate 2102. The heat exchanger pucks 2110 may extend into the apertures 2104 and may contact the components of the electronic environment that are aligned with the apertures 2104. The heat exchanger pucks 2110 may be thermally coupled with the components, allowing heat from, or generated by, the components to be transferred to the heat exchanger pucks 2110 for transfer to the liquid circulating within the tube 2108. In some embodiments, the heat exchanger pucks 2110 may be affixed to the corresponding components within the electronic environment via fasteners, thermally-conductive adhesives (such as thermal epoxy or thermally-conductive tape), or some combination thereof.

The liquid coolant system 2100 may further include one or more fasteners (or fastener assemblies) 2112 that may attach the tube 2108, one or more of the heat exchanger pucks 2110, or some combination thereof, to the rigid support plate 2102. The fasteners 2112 may include screws, bolts, rivets, similar types of fasteners, or some combination thereof. In some embodiments, the fasteners 2112 may further include a fixture (such as a formed piece of metal, plastic, or other rigid material), a spring, or some combination thereof that may contact the tube 2108 or heat exchanger puck 2110, or some portion thereof, and maintain the tube 2108 or heat exchanger puck 2110, or the portion thereof, against the rigid support plate 2102.

The fasteners 2112, when installed, may affix a portion of the tube 2108 and/or the heat exchanger pucks 2110 to the rigid support plate 2102. The affixation of the portion of the tube 2108 and/or the heat exchanger pucks 2110 may limit a distance to which the tube 2108 and/or the heat exchanger pucks 2110 may be flexed without compromising the integrity of the tube 2108. For example, without the fastener 2112a, the heat exchanger puck 2110a may be translated two centimeters in any direction without compromising the integrity of the tube 2108, whereas with the fastener 2112a installed, the heat exchanger puck 2110a may be limited to a translation of five millimeters in any direction without compromising the integrity of the tube 2108.

When disposed within an electronic environment, portions of the liquid coolant system 2100 may be located within the electronic environment while other portions may be located outside of the electronic environment. For example, the pump 2106 and a portion of the tube 2108 may extend outside of the electronic environment, while the rigid support plate 2102, the heat exchanger pucks 2110 and another portion of the tube 2108 may be disposed within the electronic environment.

Further, when disposed within the electronic environment, portions of the liquid coolant system 2100 may be affixed to a component (such as a printed circuit board, an electronic component, a case, or some combination thereof) within the electronic environment, while other portions may be detached from the components in the electronic environment. For example, the rigid support plate 2102 may be affixed to a printed circuit board within the electronic environment, while the tube 2108 and the heat exchanger pucks 2110 are detached from the components in the electronic environment. In some embodiments, portions of the tube 2108 may be affixed to the rigid support plate (such as via fasteners 2112) with translation and flexibility of the portions of the tubes impeded by the affixation, whereas other portions of the tube 2108 may be detached from the rigid support plate 2102 allowing the other portions to be freely translated and flexed.

FIG. 28 illustrates an example unassembled electronic environment 2200 with liquid coolant system 2202, according to various embodiments. The liquid coolant system 2202 may include one or more of the features of the liquid coolant system 2100 (FIG. 21). The illustrated unassembled electronic environment 2200 with liquid coolant system 2202 may illustrate an arrangement of the electronic environment 2200 and the liquid coolant system 2202 prior to the liquid coolant system 2202 being disposed within the electronic environment 2200.

The electronic environment 2200 may include a printed circuit board (PCB) 2204. The PCB 2204 may include one or more components 2206 mounted to the PCB 2204. The components 2206 may be mounted to a surface of the PCB 2204 and may extend from the surface. While the components 2206 illustrated in the electronic environment 2200 are shown as extending a same distance from the surface of the PCB 2204, it is to be understood that, in other embodiments, the components 2206 may extend different distances from the surface of the PCB 2204.

The liquid coolant system 2202 may include a rigid support plate 2208. The rigid support plate 2208 may include one or more of the features of the rigid support plate 2102 (FIG. 21), including the apertures 2104. The rigid support plate 2208 may include one or more apertures 2222 (illustrated in dotted lines to indicate formed within a center of the rigid support plate) formed in the rigid support plate 2208. The apertures 2222 may include one or more of the features of the apertures 2104 (FIG. 21). The apertures 2222 may be formed in locations in the rigid support plate 2208 with a same layout as the components 2206. Accordingly, when disposed within the electronic environment 2200, the apertures 2222 may align with the components 2206 such that the components 2206 may extend into the apertures 2222 when the rigid support plate 2208 is mounted to the PCB 2204.

The liquid coolant system 2202 may include a tube assembly 2210. The tube assembly 2210 may include a tube 2212. The tube 2212 may include one or more of the features of the tube 2108 (FIG. 21), including being flexible up to a threshold flexibility and carrying liquid of the liquid coolant system 2202.

The tube 2210 may include an inlet 2214 and an outlet 2216. The inlet 2214 and the outlet 2216 may be coupled to a pump (not shown), such as the pump 2106 (FIG. 21). The inlet 2214 may receive liquid exiting from the pump that is circulated through the tube 2212 and to the outlet 2216 that directs the liquid back into the pump. In some embodiments, the inlet 2214 and the outlet 2216 or tubes extending from the pump may include tube unions that allow the inlet 2214 and the outlet 2216 to be separated from the pump. Accordingly, the tube assembly 2210 may be separable from the pump, allowing for the tube assembly 2210 and/or the pump to be interchanged as desired.

The tube assembly 2210 may include one or more heat exchanger pucks 2218. The heat exchanger pucks 2218 may include one or more of the features of the heat exchanger pucks 2110 (FIG. 21). The heat exchanger pucks 2218 may be coupled to the tube 2212. The tube 2212 may extend through cavities formed in the heat exchanger pucks 2218 and portions of the tube 2212 may be affixed within the cavities of each of the heat exchanger pucks 2218. The heat exchanger pucks 2218 may be located along a plane located parallel to the PCB 2204 when the tube assembly 2210 is oriented as to be disposed within the electronic environment 2200. In particular, when the tube assembly 2210 is oriented as to be disposed within the electronic environment 2220, the heat exchanger pucks 2218 may be a uniform distance from the PCB 2204 of the electronic environment 2220.

In some embodiments (such as illustrated in FIG. 29), the heat exchanger pucks 2218 may be located along different planes located parallel to the PCB 2204 when the tube assembly is oriented as to be disposed within the electronic environment 2200, such that the heat exchanger pucks 2218 are different distances from the PCB 2204. The heat exchanger pucks 2218 may be designed to be located on different planes based on the components 2206 extending different distances from the PCB 2204, differences in desired compression force between the different heat exchanger pucks 2218 and the corresponding components 2206, or some combination thereof.

FIG. 29 illustrates the example assembled electronic environment 2200 with liquid coolant system 2202 of FIG. 28, according to various embodiments. The illustrated electronic environment 2200 with the liquid coolant system 2202 may illustrate the electronic environment 2200 with the liquid coolant system 2202 disposed within the electronic environment 2200.

When the liquid coolant system 2202 is disposed in the electronic environment 2200, the rigid support plate 2208 may be attached to the PCB 2204 by one or more fasteners 2302. The fasteners 2302 may include one or more of the features of the fasteners 2112 (FIG. 21). The fasteners 2302 may extend through apertures formed in the PCB 2204 and apertures formed in the rigid support plate 2208 and may use heads of the fasteners 2302, bolts attached to the fasteners 2302, threading formed within the apertures, or some combination thereof to attach the rigid support plate 2208 to the PCB 2204. In some embodiments, the fasteners 2302 may be surface mount-type fasteners and may attach the rigid support plate 2208 to the PCB 2204 by attachment means attached to the rigid support plate 2208 and/or the PCB 2204.

The fasteners 2302 may include standoffs to maintain a distance between the rigid support plate 2208 and the PCB 2204. In some embodiments, the rigid support plate 2208 may be positioned against the PCB 2204 and/or one or more components mounted to the PCB 2204 (such as the components 2206), and the fasteners 2302 may maintain the rigid support plate 2208 against the PCB 2204 and/or the components. Further, in some embodiments, the rigid support plate 2208 may be affixed to the PCB 2204 and/or another portion of the electronic environment 2200 (such as a case of the electronic environment 2200) via epoxy.

Further, when the liquid coolant system 2202 is disposed in the electronic environment 2200, portions of the tube 2212 may be attached to the rigid support plate 2208 by fasteners 2304. The fasteners 2304 may include one or more of the features of the fasteners 2112 (FIG. 21).

The fasteners 2304 may attach a portion of the tube 2212 to the rigid support 2208, such as a first fastener 2304a may attach a first portion of the tube 2306a to the rigid support 2208 and a second fastener 2304b may attach a second portion of the tube 2306b to the rigid support. The first fastener 2304a and the second fastener 2304b may maintain a distance of the first portion of the tube 2306a and the second portion of the tube 2306b, respectively, from the rigid support plate 2208, may limit the first portion of the tube 2306a and the second portion of the tube 2306b to a maximum distance from the rigid support plate 2208 while allowing the first portion of the tube 2306a and the second portion of the tube 2306b to move closer to the rigid support plate 2208, or some combination thereof. In some embodiments, the first fastener 2304a and the second fastener 2304b may prevent, or limit the ability of, the first portion of the tube 2306a and the second portion of the tube 2306b, respectively, from flexing.

The remainder of the tube 2212 (referring to the portions of the tube not including the first portion of the tube 2306a and the second portion of the tube 2306b) may be detached from the rigid support plate 2208. The remainder of the tube 2212 may flex and translate in response to force being applied to the remainder of the tube 2212. An amount of translation of the remainder of the tube 2212 may be limited by the attached first portion of the tube 2306a and the attached second portion of the tube 2306b. The amount of translation of the remainder of the tube 2212 may be dependent on the flexibility of material that the tube is formed of, the profile of the tube (or portions thereof), the distance/s of the portion of the remainder of the tube 2212 from the attached portions (such as the attached first portion of the tube 2306a and the attached second portion of the tube 2306b), or some combination thereof. Generally, portions of the remainder of the tube 2212 that are farther from the attached portions may translate a greater distance than portions of the remainder of the tube 2212 that are closer to the attached portions.

In some embodiments, the fasteners 2304 may be used to generate a compression force between the heat exchanger pucks 2218 and the components 2206. In a default state, absent forces being applied to the heat exchanger pucks 2218, the heat exchanger pucks 2218 may be located a certain distance from a main body 2220 of the tube 2212. The fasteners 2304, when installed, may force the main body 2220 to a distance from the components 2206 that is less than the certain distance between the heat exchanger pucks 2218 and the main body 2220 when in the default state. In these embodiments, the unattached remainder of the tube 2212, or some portion thereof, may flex as the surface of the heat exchanger pucks 2218 are compressed against the components 2206. The unattached remainder of the tube 2212 may present a resistance force to flexing, which may be translated to the heat exchanger pucks 2218 and generate a compression force between the heat exchanger pucks 2218 and the components 2206. The amount of resistance force to flexing for the unattached remainder of the tube 2212 may be dependent on the flexibility of material that the tube is formed of, the profile of the tube (or portions thereof), the distance/s of the portion of the remainder of the tube 2212 from the attached portions (such as the attached first portion of the tube 2306a and the attached second portion of the tube 2306b), or some combination thereof.

In some embodiments, the fasteners 2304 may include springs located between a head of each of the fasteners 2304 and the main body 2220 of the tube 2212. The springs may be coil springs, volute springs, leaf springs, Belleville washers/springs, or some combination thereof. When the liquid coolant system 2202 is disposed within the electronic environment 2200, the springs may become compressed between the heads of the fasteners 2304 and the main body 2220 of the tube 2212 and may apply a force to the main body 2220 tube 2212 urging the main body 2220 toward the rigid support plate 2208. The force generated by the springs may be transferred to the heat exchanger pucks 2218 via the tube 2218, causing the heat exchanger pucks 2218 to be compressed to the components 2206. The spring may be selected based on a desired compression between the heat exchanger pucks 2218 and the components 2206, a distance between the spring and the heat exchanger pucks 2218, a profile of the tube 2212, or some combination thereof.

In some embodiments, the amount of compression force between the heat exchanger pucks 2218 and the component 2206 may vary among the different heat exchanger pucks 2218. The compression force for each of the heat exchanger pucks 2218 may be dependent on the location of the fasteners 2304 relative to the heat exchanger pucks 2218, the distance that the fasteners 2304 maintain the main body 2220 of the tube 2212 from the rigid support plate 2208, the spring/s of each of the fasteners 2304, the flexibility of the tube 2212, or some combination thereof. For example, one of the heat exchanger pucks 2218 may exhibit a first amount of compression force between the heat exchanger puck 2218 and the corresponding component 2206 when the liquid coolant system 2202 is disposed within the electronic environment 2200, while a second one of the heat exchanger pucks 2218 may exhibit a second amount of compression force, greater than the first amount, between the second one of the heat exchanger pucks 2218 and the corresponding component 2206.

FIG. 30 illustrates an example liquid coolant system 2402 applied to electronic components 2404 extending varying distances from a PCB 2408, according to various embodiments. The liquid coolant system 2402 may include one or more of the features of the liquid coolant system 2100 (FIG. 21), the liquid coolant system 2202 (FIG. 22), or some combination thereof. The liquid coolant system 2402 is illustrated without the rigid support plate and fasteners to clearly illustrate the relationship between heat exchanger pucks 2406 and the electronic components 2404. However, it is to be understood that the rigid support plate and fasteners are generally included in the liquid coolant system 2402 and may be oriented within the liquid coolant system 2402 in the same orientation, or similar orientation, to the rigid support plate 2208 (FIG. 23), the fasteners 2302 (FIG. 23), and the fasteners 2304 (FIG. 23) when the liquid coolant system 2402 is disposed within electronic environment 2400.

The liquid coolant system 2402 may include a tube 2410 for carrying liquid of the liquid coolant system 2402. The tube 2410 may include one or more of the features of the tube 2108 (FIG. 21), the tube 2212 (FIG. 22), or some combination thereof. The liquid coolant system 2402 may further include one or more heat exchanger pucks 2406. The heat exchanger pucks 2406 may include one or more features of the heat exchanger pucks 2110 (FIG. 21), the heat exchanger pucks 2218 (FIG. 22), or some combination thereof.

The heat exchanger pucks 2406 may include a first heat exchanger puck 2406a, a second heat exchanger puck 2406b, and a third heat exchanger puck 2406c. In default state where no forces are being applied to the heat exchanger pucks 2406, the heat exchanger pucks 2406 may all be located along a plane located parallel to the PCB 2408 when the liquid coolant system 2402 is oriented to be disposed within the electronic environment 2400. Accordingly, when in the default state, the first heat exchanger puck 2406a, the second heat exchanger puck 2406b, and the third heat exchanger puck 2406c may be a same distance from the PCB 2408 when the liquid coolant system 2402 is oriented to be disposed in the electronic environment 2400 and without forces being applied to the heat exchanger pucks 2406.

The electronic environment 2400 may include one or more electronic components 2404, such as first electronic component 2404a, second electronic component 2404b, and third electronic component 2404c. The electronic components 2404 may include one or more of the features of the components 2206 (FIG. 22). The electronic components 2404 may be affixed to a PCB 2408 of the electronic environment 2400 and may extend from a surface of the PCB 2408. The electronic components 2404 may extend different distances from the PCB 2408. For example, in the illustrated embodiment, the second electronic component 2404b may extend a shorter distance from the surface of the PCB 2408 than the first electronic component 2404a and the third electronic component 2404c.

When the liquid coolant system 2402 is disposed within the electronic environment 2400, a first heat exchanger puck 2406a may be thermally coupled to the first electronic component 2404a, a second heat exchanger puck 2406b may be thermally coupled to the second electronic component 2404b, and a third heat exchanger puck 2406c may be thermally coupled to the third electronic component 2404c. The heat exchanger pucks 2406 may be thermally coupled to the electronic components 2404 by positioning the heat exchanger pucks 2406 against the surfaces of the electronic components 2404 opposite to the PCB 2408. Due to the differences in the distance that the electronic components 2404 extend from the PCB 2408, one or more of the heat exchanger pucks 2406 may be displaced or translated from the position of the heat exchanger pucks 2406 in the default state. The tube 2410 may flex in response from the heat exchanger pucks 2406 being displaced or translated from the default state. In the example illustrated, the first heat exchanger puck 2406a and the third heat exchanger puck 2406c may displace or translate from their positions in the default state due to the first electronic component 2404a and the third electronic component 2404c extending further from the PCB 2408 than the second electronic component 2404b. Accordingly, the liquid coolant system 2402 may compensate for differences in the extension of the electronic components 2404 from the PCB 2408, which legacy liquid coolant systems cannot. This may allow for cheaper production costs due to less rigid standards for placement of the electronic components 2404.

While the tube 2410 may flex as the heat exchanger pucks 2406 are displaced or translated from the positions of the heat exchanger pucks 2406 in the default state, the tube 2410 may resist flexing. The resistance to flexing of the tube 2410 may cause the portion of the tube 2410 that is flexing to generate an increased compression force between the heat exchanger pucks 2406 being displaced or translated and the corresponding electronic components 2404. In the example illustrated, the compression force between the first heat exchanger puck 2406a and the first electronic component 2404a, and the third heat exchanger puck 2406c and the third electronic component 2404c may be greater than the compression force between the second heat exchanger puck 2406b and the second electronic component 2404b due to the flexing of the tube 2410 in response to the first heat exchanger puck 2406a and the third heat exchanger puck 2406c being displaced from their locations in the default state.

In some embodiments, the positions of the heat exchanger pucks 2406 in the default state may be designed to generate greater compression force between some of the heat exchanger pucks 2406 than others. Accordingly, the liquid coolant system 2402 may present different compression forces for different heat exchanger pucks 2406. This may allow the liquid coolant system 2402 to be designed for electronic components 2404 that can withstand different compression forces without damage, for different thermal compounds located between the heat exchanger pucks 2406 and the electronic components 2404 that may operate properly or better with different compression forces, or some combination thereof.

FIG. 31 illustrates an example apparatus 2500 for a liquid coolant system, according to various embodiments. The apparatus 2500 may include a rigid support plate 2510. The rigid support plate 2510 may include one or more of the features of the rigid support plate 2102 (FIG. 21), the rigid support plate 2208 (FIG. 22), or some combination thereof. The rigid support plate 2510 may be mounted within an electronic environment via fasteners, solder, welding, adhesives (such as epoxy), similar attachment means, or some combination thereof. In some embodiments, the rigid support plate 2510 may be formed as part of the electronic environment, such as the rigid support plate 2510 being formed as part of an enclosure, case, or structure of the electronic environment.

The rigid support plate 2510 may include one or more apertures 2512. The apertures 2512 may include one or more of the features of the apertures 2104 (FIG. 21). When the rigid support plate 2510 is mounted within the electronic environment, the apertures 2512 may align with electronic components within the electronic environment.

The apparatus 2500 may include a tube assembly 2502 with one or more heat exchanger pucks 2504. The heat exchanger pucks 2504 may include one or more features of the heat exchanger pucks 2110 (FIG. 21), the heat exchanger pucks 2218 (FIG. 22), the heat exchanger pucks 2406 (FIG. 24), or some combination thereof. When the apparatus 2500 is disposed within an electrical environment, the heat exchanger pucks 2504 may be thermally coupled to one or more electronic components (such as the components 2206 (FIG. 22), the electronic components 2404 (FIG. 24), or some combination thereof). The heat exchanger pucks 2504 may be located within the apertures 2512 aligned with the electronic components and may be thermally coupled with the electronic components via contact with surfaces of the electronic components. The heat exchanger pucks 2504 may be positioned against a surface of the electronic components to provide the thermal coupling. In some embodiments, a thermal transfer material (such as thermal grease, thermally-conductive tape, and/or thermal epoxy) may be located between the heat exchanger pucks 2504 and the surface of the electronic components.

The tube assembly 2502 may include a tube 2506 to carry liquid of the liquid coolant system. The tube 2506 may include one or more of the features of the tube 2108 (FIG. 21), the tube 2212 (FIG. 22), the tube 2410 (FIG. 24), or some combination thereof. The tube 2506 may be thermally coupled to the heat exchanger pucks 2504, and liquid circulating within the tube 2506 may receive heat from the heat exchanger pucks 2504 and transfer the heat away from the heat exchanger pucks 2504.

The tube assembly 2502 may further include one or more fasteners 2508. The fasteners 2508 may include one or more of the features of the fasteners 2112 (FIG. 21), the fasteners 2304 (FIG. 23), or some combination thereof. The fasteners 2508 may affix portions of the tube 2506, the heat exchanger pucks 2504, or some combination thereof, to the rigid support plate 2510, elements or features within the electronic environment, or some combination thereof.

The fasteners 2508 may include springs 2504 located between a head of the fasteners and the portions of the tube 2506 and/or the heat exchanger pucks 2504 that the fasteners 2508 are affixing to the rigid support plate 2510 and/or the elements or features within the electronic environment. The springs 2504 may be coil springs, volute springs, leaf springs, Belleville washers/springs, or some combination thereof. The springs 2504 may be compressed when the fasteners 2508 affix the portions of the tube 2506 and/or the heat exchanger pucks 2504 and may apply a force to the portions of the tube 2506 and/or the heat exchanger pucks 2504 urging the tube 2506 and/or the heat exchanger pucks 2504 toward rigid support plate 2510 and/or the part of the electronic environment to which the rigid support plate 2510 is mounted. The force applied by the springs 2504 may be translated via the tube 2506, or directly applied, to the heat exchanger pucks 2504 and may generate a compression force between the heat exchanger pucks 2504 and the electronic components.

In some embodiments, the fasteners 2508 may include spacers 2518 and/or interface members 2520 located between the springs 2514 and the portions of the tube 2506 and/or the heat exchanger pucks 2504 that the fasteners 2508 affix to the rigid support plate 2510 and/or the elements or features within the electronic environment. The spacers 2518 and/or the interface members 2520 may contact the portions of the tube 2506 and/or the heat exchanger pucks 2504 and may transfer the force from the springs 2514 to the portions of the tube 2506 and/or the heat exchanger pucks 2504. Further, in some embodiments, one or more of the spacers 2518 and/or the interface members 2520 may contact the portions of the tube 2506 and/or the heat exchanger pucks 2504 in more than one location and may spread the force applied by the springs 2514 between the contact locations.

Further, in some embodiments, the tube assembly 2502 may include one or more mounting plates 2516. The mounting plates 2516 may be attached to portions of the tube 2506. When the apparatus 2500 is disposed within the electronic environment, the mounting plates 2516 may be affixed to the rigid support plate 2510, one or more elements or features within the electronic environment, or some combination thereof. When affixed, the mounting plates 2516 may further affix the portions of the tube 2506 attached to the mounting plates 2516 to the rigid support plate 2510, the elements or features within the electronic environment, or some combination thereof.

The tube 2506 may include an inlet 2522 and an outlet 2524. The inlet 2522 and the outlet 2524 may be coupled to a pump (such as the pump 2106) that may provide pressure to circulate liquid within the tube 2506. It is to be understood that the titles of the inlet 2522 and the outlet 2524 do not imply a direction of the circulation of the liquid within the tube 2506, and the liquid may enter the tube either through the inlet 2522 or the outlet 2524 and exit through the outlet 2524 or the inlet 2522, respectively.

FIG. 32 illustrates an example tube assembly 2600 for a liquid coolant system, according to various embodiments. The tube assembly 2600 may include a tube 2602 for carrying liquid of the liquid coolant system. The tube 2602 may include one or more of the features of the tube 2108 (FIG. 21), the tube 2212 (FIG. 22), the tube 2410 (FIG. 24), the tube 2506 (FIG. 25), or some combination thereof.

The tube 2602 may include one or more tube unions 2604. The tube unions 2604 may provide for separation of portions of the tube 2602. For example, tube union 2604a and tube union 2604b may allow a first portion of the tube 2602a to be separated from the rest of the tube 2602a. The first portion of the tube 2602a may be interchanged when separated, such that a different shaped portion of a tube may replace the first portion of the tube 2602a. In some embodiments, the first portion of the tube 2602a may be affixed to a heat exchanger puck (such as the heat exchanger pucks 2110, the heat exchanger pucks 2218, the heat exchanger pucks 2406, the heat exchanger pucks 2504, or some combination thereof) and interchanging the first portion of the tube 2602a may allow for interchanging of the heat exchanger puck with a different heat exchanger puck. For example, a heat exchanger puck without a heat sink may be interchanged for a heat exchanger puck with a heat sink via separation of the portions of the tubes attached to the tube unions 2604.

FIG. 33 illustrates an example tube union 2700, according to various embodiments. The tube union 2700 may be an example of the tube unions 2604 (FIG. 26). The tube union 2700 may be attached to a first tube on a first end of the tube union 2700. A circumference of the tube union 2700 may be greater than a circumference of the first tube 2702. The tube union 2700 may be formed of the same material as the first tube 2702.

The tube union 2700 may include a cavity 2704 formed in a second end of the tube union 2700. The cavity 2704 may attach to a hollow center of the tube 2702 that may carry liquid within a liquid coolant system. The cavity 2704 may have a circumference equal to, or larger than, the circumference of the first tube 2702. In some embodiments, the circumference of the cavity 2704 may decrease from the second end of tube union 2700 to the first end of the tube union 2700.

The cavity 2704 may receive a second tube 2706. When inserted within the cavity 2704, the second tube 2706 may become affixed to the tube union 2700. The second tube 2706 may be affixed to the tube union 2700 via friction force between the second tube 2700 and the tube union 2700, an adhesive (such as epoxy), or some combination thereof. In some embodiments, the walls of the cavity 2704 and a portion of the second tube 2706 may be threaded and the second tube 2706 may be screwed into the tube union 2700.

FIG. 34 illustrates an example computer device 2800 that may employ the apparatuses and/or methods described herein (e.g., the heat exchanger puck 100, the heat exchanger puck 300, the heat exchanger puck 800, the heat exchanger puck 1500, the heat exchanger puck 1700, the heat exchanger puck 1900, the liquid coolant system 2100, the electronic environment 2200, the liquid coolant system 2202, the electronic environment 2400, the liquid coolant system 2402, the apparatus 2500, and/or the tube assembly 2600), in accordance with various embodiments. As shown, computer device 2800 may include a number of components, such as one or more processor(s) 2804 (one shown) and at least one communication chip 2806. In various embodiments, the one or more processor(s) 2804 each may include one or more processor cores. In various embodiments, the at least one communication chip 2806 may be physically and electrically coupled to the one or more processor(s) 2804. In further implementations, the communication chip 2806 may be part of the one or more processor(s) 2804. In various embodiments, computing device 2800 may include printed circuit board (PCB) 2802. For these embodiments, the one or more processor(s) 2804 and communication chip 2806 may be disposed thereon. In alternate embodiments, the various components may be coupled without the employment of PCB 2802.

Depending on its applications, computer device 2800 may include other components that may or may not be physically and electrically coupled to the PCB 2802. These other components include, but are not limited to, memory controller 2826, volatile memory (e.g., dynamic random access memory (DRAM) 2820), non-volatile memory such as read only memory (ROM) 2824, flash memory 2822, storage device 2854 (e.g., a hard-disk drive (HDD)), an I/O controller 2841, a digital signal processor (not shown), a crypto processor (not shown), a graphics processor 2830, one or more antenna 2828, a display (not shown), a touch screen display 2832, a touch screen controller 2846, a battery 2836, an audio codec (not shown), a video codec (not shown), a global positioning system (GPS) device 2840, a compass 2842, an accelerometer (not shown), a gyroscope (not shown), a speaker 2850, a camera 2852, and a mass storage device (such as hard disk drive, a solid state drive, compact disk (CD), digital versatile disk (DVD)) (not shown), and so forth.

In various embodiments, one or more components of the computer device 2800 may include the heat exchanger puck 100, the heat exchanger puck 300, the heat exchanger puck 800, the heat exchanger puck 1500, the heat exchanger puck 1700, the heat exchanger puck 1900, the heat exchanger pucks 2110, the heat exchanger pucks 2218, the heat exchanger pucks 2406, and/or the heat exchanger pucks 2504 described herein. For example, the heat exchanger puck 100, the heat exchanger puck 300, the heat exchanger puck 800, the heat exchanger puck 1500, the heat exchanger puck 1700, the heat exchanger puck 1900, the heat exchanger pucks 2110, the heat exchanger pucks 2218, the heat exchanger pucks 2406, and/or the heat exchanger pucks 2504 may be coupled and/or mounted to I/O controller 2841, processor 2804, memory controller 2826, and/or another component of computer device 2800.

In various implementations, the computer device 2800 may be a laptop, a netbook, a notebook, an ultrabook, a smartphone, a computing tablet, a personal digital assistant (PDA), an ultra-mobile PC, a mobile phone, a desktop computer, a server, a printer, a scanner, a monitor, a set-top box, an entertainment control unit (e.g., a gaming console or automotive entertainment unit), a digital camera, an appliance, a portable music player, or a digital video recorder. In further implementations, the computer device 2800 may be any other electronic device that processes data.

Example 1 may include a heat exchanger puck, comprising a first plate of the heat exchanger puck with a cavity that extends into the first plate from a side of the first plate, a second plate of the heat exchanger puck coupled to the side of the first plate with the cavity located between the first plate and the second plate, and a tube of a liquid coolant system located, at least partially, within the cavity, the tube formed to fit the cavity created by the first plate and the second plate.

Example 2 may include the heat exchanger puck of example 1, wherein the first plate is to contact the tube around a first portion of a circumference of the tube and the second plate is to contact the tube around a second portion of the circumference.

Example 3 may include the heat exchanger puck of example 2, wherein the first portion of the circumference and the second portion of the circumference together are an entirety of the circumference of the tube.

Example 4 may include the heat exchanger puck of any of the examples 1-3, wherein the cavity is a first cavity, and wherein the second plate comprises a second cavity that extends into the second plate from a side of the second plate coupled to the first plate, wherein the second cavity is aligned with the first cavity, to at least partially receive the tube.

Example 5 may include the heat exchanger puck of any of the examples 1-3, wherein a width of the cavity increases as the cavity extends into the first plate from the side of the first plate, and wherein a side wall of the first plate contacts the tube where the width of the cavity has increased from the side of the first plate.

Example 6 may include the heat exchanger puck of any of the examples 1-3, wherein the first plate and the second plate are cold plates.

Example 7 may include the heat exchanger puck of any of the examples 1-3, wherein the hydroformed tube is pentagon shaped.

Example 8 may include the heat exchanger puck of example 1, wherein the hydroformed tube is butterfly shaped.

Example 9 may include the heat exchanger puck of any of the examples 1-3, wherein the tube is formed to fit the cavity created by the first plate and the second plate while the tube resides within the cavity created by the first plate and the second plate.

Example 10 may include a liquid coolant system, comprising a tube to carry liquid coolant within the liquid coolant system, a pump coupled to the tube to provide pressure to move the liquid coolant within the tube, and a heat exchanger puck coupled to a portion of the tube, the portion of the tube located within a cavity of the heat exchanger puck and formed to fit the cavity by the heat exchanger puck, wherein the heat exchanger puck is to be attached to an electronic device.

Example 11 may include the liquid coolant system of example 10, wherein the portion of the tube is formed to a shape based on a predetermined pressure drop associated with the portion of the tube.

Example 12 may include the liquid coolant system of any of the examples 10 and 12, wherein the heat exchanger puck includes a first plate and a second plate, the cavity of the heat exchanger puck formed between the first plate and the second plate, and wherein the portion of the tube is formed to fit the cavity by the first plate and the second plate as the first plate is affixed to the second plate.

Example 13 may include the liquid coolant system of any of the examples 10 and 11, wherein the heat exchanger puck includes a first plate and a second plate, the cavity of the heat exchanger puck formed between the first plate and the second plate, and wherein the first plate and the second plate are constructed of thermal conductive material to transfer heat to the liquid carried within the tube.

Example 14 may include a method of manufacturing a heat exchanger puck, comprising compressing a first plate of the heat exchanger puck and a second plate of the heat exchanger puck together, the first plate and the second plate forming a cavity between the first plate and the second plate, wherein a portion of a tube of a liquid coolant system is located within the cavity and the compression causes the portion of the tube to deform, and affixing the second plate to the side of the first plate.

Example 15 may include the method of example 14, further comprising applying epoxy to the side of the first plate, wherein affixing the second plate to the side of the first plate includes curing the epoxy while the first plate and the second plate are compressed together.

Example 16 may include the method of any of the examples 14 and 15, further comprising reducing a thickness of the first plate by a flycut process applied to the first plate after affixing of the second plate to the side of the first plate.

Example 17 may include the method of any of the examples 14 and 15, further comprising hydroforming the portion of the tube to the first plate and the second plate after affixing the second plate to the side of the first plate.

Example 18 may include the method of example 17, wherein the hydroforming of the portion of the tube causes a circumference of the portion of the tube to expand.

Example 19 may include the method of example 18, wherein the circumference of the portion of the tube expands to fill the cavity.

Example 20 may include the method of example 17, wherein the hydroforming of the portion of the tube causes a reduction in tube wall thickness of the portion of the tube.

Example 21 may include the method of any of the examples 14 and 15, further comprising attaching the heat exchanger puck to an electronic component to be cooled by the heat exchanger puck.

Example 22 may include a method of manufacturing a heat exchanger puck, comprising affixing a first portion of the heat exchanger puck to a second portion of the heat exchanger puck with a portion of a tube of a liquid coolant system located in a cavity formed between the first portion and the second portion of the heat exchanger puck, and hydroforming the portion of the tube within the cavity.

Example 23 may include the method of example 22, further comprising applying a thermal epoxy to the first portion of the heat exchanger puck, and compressing the first portion and the second portion of the heat exchanger puck together, wherein affixing the first portion of the heat exchanger puck to the second portion of the heat exchanger puck includes curing the thermal epoxy while the first portion and the second portion of the heat exchanger puck are compressed together.

Example 24 may include the method of any of the examples 22 and 23, further comprising machining the first portion of the heat exchanger puck with a first portion of the cavity extending into the first portion of the heat exchanger puck, and machining the second portion of the heat exchanger puck with a second portion of the cavity extending into the second portion of the heat exchanger puck, wherein affixing the first portion of the heat exchanger puck to the second portion of the heat exchanger puck includes aligning the first portion of the cavity with the second portion of the cavity while affixing the first portion of the heat exchanger puck to the second portion of the heat exchanger puck.

Example 25 may include the method of any of the examples 22 and 23, further comprising applying a force to one or both of the first portion of the heat exchanger puck and the second portion of the heat exchanger puck to maintain affixation of the first portion of the heat exchanger puck to the second portion of the heat exchanger puck while hydroforming the portion of the tube, and removing the force after hydroforming the portion of the tube.

Example 26 may include the method of any of the examples 22 and 23, wherein hydroforming the portion of the tube includes expanding the tube to fill the cavity.

Example 27 may include the method of example 26, wherein at least a portion of an exterior of the portion of the tube avoids contact with the first portion of the heat exchanger puck and the second portion of the heat exchanger puck prior to hydroforming the portion of the tube, and wherein an entirety of the exterior of the portion of the tube contacts one or both of the first portion of the heat exchanger puck and the second portion of the heat exchanger puck after hydroforming the portion of the tube.

Example 28 may include a liquid coolant system, comprising a heat exchanger puck with a cavity formed in the heat exchanger puck, a tube to carry liquid coolant within the liquid coolant system, a portion of the tube located within the cavity and that enters the cavity through an opening at a side of the heat exchanger puck, a shape of the cavity to affect flexibility of the tube at the opening, the portion of the tube formed to fit the shape of the cavity by the heat exchanger puck, and a pump coupled to the tube to provide pressure to move the liquid coolant within the tube.

Example 29 may include the liquid coolant system of example 28, wherein the heat exchanger puck includes a first plate with a cavity that extends into the first plate from a side of the first plate, a second plate coupled to the side of the first plate with the cavity located between the first plate and the second plate, wherein the portion of the tube is formed to fit the shape of the cavity as the second plate is coupled to the first plate.

Example 30 may include the liquid coolant system of example 28, wherein the portion of the tube is formed to fit the shape of the cavity via a hydroformation process applied to the portion of the tube as the portion of the tube is located within the cavity.

Example 31 may include the liquid coolant system of example 30, wherein the hydroformation process causes tube wall thickness of the portion of the tube to be decreased, the flexibility of the tube at the opening is increased based on the decreased tube wall thickness.

Example 32 may include the liquid coolant system of any of the examples 28-31, wherein the shape of the cavity is an ellipse, the flexibility of the tube to be increased at the opening in directions corresponding to the smallest diameter of the ellipse.

Example 33 may include the liquid coolant system of any of the examples 28-31, wherein a width of the cavity is less than a length of the cavity, the flexibility of the tube to be increased at the opening in directions corresponding to the width of the cavity.

Example 34 may include the liquid coolant system of any of the examples 28-31, wherein a length of a second portion of the tube located between the heat exchanger puck and the pump is selected based on a predetermined flexibility for the second portion of the tube.

Example 35 may include the liquid coolant system of example 34, wherein a profile of the second portion of the tube is selected based on the predetermined flexibility for the second portion of the tube.

Example 36 may include the liquid coolant system of example 35, wherein the profile of the second portion of the tube includes a ridged portion to promote flexibility of the second portion.

Example 37 may include the liquid coolant system of any of the examples 28-31, further comprising a second heat exchanger puck with a cavity formed in the second heat exchanger puck, a second portion of the tube located within the cavity of the second heat exchanger puck, wherein a distance between the portion of the tube located within the cavity of the heat exchanger puck and the second portion of the tube located within the cavity of the second heat exchanger puck is selected based on a predetermined flexibility for a third portion of the tube located between the heat exchanger puck and the second heat exchanger puck.

Example 38 may include the liquid coolant system of example 37, wherein a profile of the third portion of the tube is selected based on the predetermined flexibility for the third portion of the tube.

Example 39 may include a method of hydroforming a tube of a liquid coolant system, comprising affixing a hydroform tooling mold around the tube, the tube extending within a cavity formed by the hydroform tooling mold, applying a hydroforming process to the tube, the hydroforming process to causing the tube to expand to fill at least a portion of the cavity, and removing the hydroform tooling mold from around the tube.

Example 40 may include the method of example 39, wherein affixing the hydroform tooling mold includes affixing a upper mold of the hydroform tooling mold and a lower mold of the hydroform tooling mold together, the upper mold extending around a first portion of the tube and the second mold extending around a remaining portion of the tube, and wherein removing the hydroform tooling mold includes uncoupling the upper mold from the lower mold, removing the upper mold from around the first portion of the tube, and removing the lower mold from around the remaining portion of the tube.

Example 41 may include the method of any of the examples 39 and 40, wherein the cavity includes a plurality of ridges, and wherein applying the hydroforming process to the tube causes to the tube to expand into the plurality of ridges and develop a ridged portion.

Example 42 may include an apparatus of a liquid coolant system, comprising a rigid support plate to be disposed in an electronic environment, the rigid support plate includes an aperture that aligns with an electronic component of the electronic environment when the rigid support plate is disposed in the electronic environment, a heat exchanger puck to be positioned within the aperture and to be thermally coupled to the electronic component, and a tube to carry liquid coolant of the liquid coolant system to cool the heat exchange puck, a first portion of the tube affixed to the heat exchanger puck, a second portion of the tube affixed to the rigid support plate, and a third portion of the tube, located between the first portion and the second portion, detached from the heat exchanger puck and the rigid support plate.

Example 43 may include the apparatus of example 42, wherein the third portion extends, at least partially, along a surface of the rigid support plate, the surface of the rigid support plate being on an opposite side of the rigid support plate from the electronic component when the rigid support plate is disposed in the electronic environment.

Example 44 may include the apparatus of any of the examples 42 and 43, wherein the heat exchanger puck is translatable to be positioned against a surface of the electronic component, an amount of available translation of the heat exchanger puck based, at least in part, on a length of the third portion.

Example 45 may include the apparatus of any of the examples 42 and 43, wherein the heat exchanger puck is translatable to be positioned against a surface of the electronic component, an amount of available translation of the heat exchanger puck based, at least in part, on a profile of the third portion.

Example 46 may include the apparatus of any of the examples 42 and 43, wherein the third portion is to generate a compression force between the heat exchanger puck and the electronic component when thermally coupled, the compression force being based, at least in part, on a length of the third portion.

Example 47 may include the apparatus of any of the examples 42 and 43, wherein the third portion is to generate a compression force between the heat exchanger puck and the electronic component when thermally coupled, the compression force being based, at least in part, on a profile of the third portion.

Example 48 may include the apparatus of example 45, wherein the profile of the third portion is narrower along a first axis than a second axis.

Example 49 may include the apparatus of example 45, wherein the third portion is corrugated.

Example 50 may include the apparatus of any of the examples 42 and 43, wherein the second portion is affixed to the rigid support plate via fasteners, and wherein the second portion is separable from the rigid support plate via removal of the fasteners.

Example 51 may include the apparatus of any of the examples 42 and 43, wherein the third portion includes tube unions that allow for separation of the first portion from the second portion to allow interchange of the heat exchanger puck.

Example 52 may include the apparatus of any of the examples 42 and 43, further comprising an attachment mechanism to attach the heat exchanger puck to the rigid support plate, the attachment mechanism to provide a compression force between the heat exchanger puck and the electronic component.

Example 53 may include the apparatus of example 52, wherein the attachment mechanism comprises a fastener to attach the heat exchanger puck to the rigid support plate, and a spring located between a head of the fastener and the heat exchanger puck when the fastener attaches the heat exchanger puck to the rigid support plate, the spring to provide the compression force between the heat exchanger puck and the electronic component.

Example 54 may include the apparatus of any of the examples 42 and 43, wherein the electronic component is a first electronic component of the electronic environment, the heat exchanger puck is a first heat exchanger puck, the rigid support plate includes a second aperture that aligns with a second electronic component of the electronic environment when the rigid support plate is disposed in the electronic environment, and wherein the apparatus further comprises a second heat exchanger puck to be positioned within the second aperture and to be thermally coupled to the second electronic component, wherein a fourth portion of the tube is affixed to the second heat exchanger puck and a fifth portion of the tube, located between the second portion and the fourth portion, is detached from the second heat exchanger puck and the rigid support plate.

Example 55 may include the apparatus of example 54, wherein a first compression force, generated by the third portion of the tube, between the first heat exchanger puck and the first electronic component is different than a second compression force, generated by the fifth portion of the tube, between the second heat exchanger puck and the second electronic component.

Example 56 may include the apparatus of example 55, wherein the first compression force, generated by the third portion of the tube, is based, at least in part, on a length of the third portion of the tube, and wherein the second compression force, generated by the fifth portion of the tube, is based, at least in part, on a length or a profile of the fifth portion of the tube.

Example 57 may include the apparatus of example 55, wherein the first compression force, generated by the third portion of the tube, is based, at least in part, on a profile of the third portion of the tube, and wherein the second compression force, generated by the fifth portion of the tube, is based, at least in part, on a length or profile of the fifth portion of the tube.

Example 58 may include the apparatus of example 54, further comprising a first attachment mechanism to attach the first heat exchanger puck to the rigid support plate, and to generate a first compression force between the first heat exchanger puck and the first electronic component when the first attachment mechanism attaches the first heat exchanger puck to the rigid support plate, and a second attachment mechanism to attach the second heat exchanger puck to the rigid support plate, and to generate a second compression force between the second heat exchanger puck and the second electronic component when the second attachment mechanism attaches the second heat exchanger puck to the rigid support plate, the second compression force being different than the first compression force.

Example 59 may include an electronic environment, comprising a printed circuit board (PCB), a rigid support plate mounted to the PCB, the rigid support plate includes an aperture aligned with an electronic component mounted on the PCB, and a liquid coolant system coupled to the rigid support plate, the liquid coolant system comprising a heat exchanger puck positioned within the aperture and thermally coupled to the electronic component, a tube with a first portion of the tube affixed to the heat exchanger puck, a second portion of the tube affixed to the rigid support plate, and a third portion of the tube, located between the first portion and the second portion, detached from the heat exchanger puck and the rigid support plate, and a pump coupled to the tube to provide pressure to move liquid coolant within the tube.

Example 60 may include the electronic environment of example 59, wherein the third portion extends, at least partially, along a surface of the rigid support plate, the surface of the rigid support plate on an opposite side of the rigid support plate from the PCB.

Example 61 may include the electronic environment of any of the examples 59 and 60, wherein the third portion is to generate a compression force between the heat exchanger puck and the electronic component, the compression force based, at least in part, on a length of the third portion.

Example 62 may include the electronic environment of any of the examples 59 and 60, wherein the third portion is to generate a compression force between the heat exchanger puck and the electronic component, the compression force based, at least in part, on a profile of the third portion.

Example 63 may include the electronic environment of example 62, wherein the profile of the third portion is narrower along a first axis than a second axis.

Example 64 may include the electronic environment of example 62, wherein the third portion is corrugated.

Example 65 may include the electronic environment of example 62, wherein the second portion is affixed to the rigid support plate via fasteners, the second portion separable from the rigid support plate via removal of the fasteners.

Example 66 may include the electronic environment of example 62, wherein the third portion includes tube unions that allow for separation of the first portion from the second portion to allow interchange of the heat exchanger puck.

Example 67 may include the electronic environment of example 62, wherein the liquid coolant system further comprises an attachment mechanism that attaches the heat exchanger puck to the rigid support plate, wherein the attachment mechanism is to provide a compression force between the heat exchanger puck and the electronic component.

Example 68 may include the electronic environment of example 67, wherein the attachment mechanism comprises a fastener that attaches the heat exchanger puck to the rigid support plate, and a spring located between a head of the fastener and the heat exchanger puck, wherein the spring is to provide the compression force.

Example 69 may include the electronic environment of any of the examples 59 and 60, wherein the heat exchanger puck is a first heat exchanger puck and the electronic component is a first electronic component, wherein the rigid support plate includes a second aperture aligned with a second electronic component mounted on the PCB, and wherein the liquid coolant system further comprises a second heat exchanger puck positioned within the second aperture and thermally coupled to the second electronic component, wherein a fourth portion of the tube is affixed to the second heat exchanger puck and a fifth portion of the tube, located between the second portion and the fourth portion, is detached from the second heat exchanger puck and the rigid support plate.

Example 70 may include the electronic environment of example 69, wherein a first compression force, to be generated by the third portion of the tube, between the first heat exchanger puck and the first electronic component is different than a second compression force, to be generated by the fifth portion of the tube, between the second heat exchanger puck and the second electronic component.

Example 71 may include the electronic environment of example 70, wherein the first compression force, to be generated by the third portion of the tube, is based, at least in part, on a length of the third portion of the tube, and wherein the second compression force, to be generated by the fifth portion of the tube, is based, at least in part, on a length or a profile of the fifth portion of the tube.

Example 72 may include the electronic environment of example 70, wherein the first compression force, to be generated by the third portion of the tube, is based, at least in part, on a profile of the third portion of the tube, and wherein the second compression force, to be generated by the fifth portion of the tube, is based, at least in part, on a length or a profile of the fifth portion of the tube.

Example 73 may include the electronic environment of example 69, wherein the liquid coolant system further comprises a first attachment mechanism that attaches the first heat exchanger puck to the rigid support plate, wherein the first attachment mechanism generates a first compression force between the first heat exchanger puck and the first electronic component, and a second attachment mechanism that attaches the second heat exchanger puck to the rigid support plate, wherein the second attachment mechanism generates a second compression force between the second heat exchanger puck and the second electronic component, the second compression force different than the first compression force.

It will be apparent to those skilled in the art that various modifications and variations can be made in the disclosed embodiments of the disclosed device and associated methods without departing from the spirit or scope of the disclosure. Thus, it is intended that the present disclosure covers the modifications and variations of the embodiments disclosed above provided that the modifications and variations come within the scope of any claims and their equivalents.

HEAT EXCHANGER PUCK

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