Not applicable.
This invention generally relates to heat exchange systems. More particularly, this invention relates to heat exchanger designs that enhance heat transfer coefficients.
Herein disclosed is a heat exchanger comprising at least one pipe having a centerline, an inlet and an outlet; and a multiplicity of tubes, wherein each tube comprises a centerline, an inner surface, an outer surface, and groves in the direction of the centerline of the tubes; wherein the multiplicity of tubes are placed inside the pipe and the centerline of each tube is perpendicular to the centerline of the pipe. In some embodiments, the thickness of the tube wall is no greater than 0.01 inch. In some embodiments, the pipe is set up horizontally.
In some embodiments, the heat exchanger comprises a multiplicity of baffles wherein the spacing between the baffles decreases in the direction of from the inlet to the outlet of the pipe. In some embodiments, the tubes are made of a metal or alloy with a thermal conductivity that is no less than that of copper. In some cases, it is allowable to use alloys with a thermal conductivity less than copper, such as naval brass.
In some embodiments, the heat exchanger further comprises a galvanic protection mechanism. In some embodiments, the heat exchanger further comprises a hydrophobic coating on the outer surface of each of the tubes or on both the inner surface and the outer surface of each of the tubes. In some embodiments, the hydrophobic coating comprises electroless nickel (Ni) or carbon nanotubes or both. In some cases, the hydrophobic coating further comprises Teflon (PTFE), phosphorous (P), boron (B), boron nitride (BN), silica (Si), or combinations thereof. In some cases, the hydrophobic coating comprises Ni-PTFE, Ni—P-PTFE, Ni—B-PTFE, Ni—P—BN, or Ni—B—BN.
In some embodiments, the heat exchanger further comprises a jet ejector. In some embodiments, the jet ejector is on the liquid-phase side. In some embodiments, the heat exchanger further comprises inflatable seals. In some embodiments, the inner surface of the tubes comprises sand-blasted surface. In some embodiments, the heat exchanger further comprises boiling chips placed inside of the tubes during use of the heat exchangers. In some embodiments, the heat exchanger comprises both the sand-blasted surface on the inner surface of the tubes and the boiling chips during use.
In some embodiments, the heat exchanger further comprises a multiplicity of fittings configured to attach each of the tubes to a tube sheet, wherein the fitting comprises an attaching mechanism configured to attach the fitting to each of the tubes; and a penetration mechanism configured to penetrate the tube sheet, wherein the penetration mechanism comprises a sealing mechanism and a securing mechanism.
In some embodiments, the tubes are replaced with plates having a top surface and a bottom surface. In some embodiments, the plates have dimples. In some embodiments, the heat exchanger comprises a hydrophobic coating on the top surface or on both the top surface and the bottom surface of each of the plates. In some embodiments, the bottom surface of each of the plates comprises sand-blasted surface.
In some embodiments, the heat exchanger further comprises a nucleation promoter. In some embodiments, the nucleation promoter comprises a salt nucleation promoter or a sugar nucleation promoter.
Also disclosed herein is a heat exchange system comprising the heat exchanger disclosed herein, wherein the heat exchanger is configured to receive an incoming feed stream and to discharge a vapor stream. In some embodiments, the heat exchange system further comprises a nucleation promoter fluidly connected to the heat exchanger. In some embodiments, the heat exchange system further comprises a filter utilized in conjunction with the boiling chips. In some embodiments, at least a portion of the discharged vapor stream from the heat exchanger exchanges heat with the incoming feed stream or is mixed with the incoming feed stream or both.
In some embodiments, the heat exchange system further comprises a jet ejector configured to promote vapor circulation. In some embodiments, the heat exchange system further comprises a preheater configured to receive the incoming feed stream upstream of the heat exchanger and to receive the discharged vapor stream from the heat exchanger, wherein the incoming feed stream is heated by the discharged vapor stream.
Disclosed further is a process wherein the heat exchanger as disclosed herein is utilized. In some embodiments, such a process comprises separation of a volatile component from a non-volatile component in a mixture. In some embodiments, the non-volatile component comprises a salt or a sugar. In some embodiments, the volatile component comprises water. In some embodiments, dropwise condensation occurs in the process. In some embodiments, desalination takes place. In some embodiments, the process comprises liquid-gas separation.
Herein disclosed is a method of using a heat exchanger, wherein an aqueous solution and steam are present in the heat exchanger; wherein the heat exchanger comprises a hydrophobic coating; and wherein the operating pressure of the heat exchanger is greater than 50 psia. In some embodiments, the hydrophobic coating comprises electroless nickel (Ni) or carbon nanotubes or both. In some cases, the hydrophobic coating further comprises Teflon (PTFE), phosphorous (P), boron (B), boron nitride (BN), silica (Si), or combinations thereof. In some cases, the hydrophobic coating comprises Ni-PTFE, Ni—P-PTFE, Ni—B-PTFE, Ni—P—BN, or Ni—B—BN.
In some embodiments, the hydrophobic coating is exposed to the steam in the heat exchanger. In some embodiments, the hydrophobic coating promotes drop-wise condensation.
In some embodiments, the method further comprises utilizing a nucleation promoter. In some embodiments, the method further comprises utilizing boiling chips in conjunction with a filter. In some embodiments, the method further comprises discharging steam from the heat exchanger; and utilizing at least a portion of the discharged steam to preheat the aqueous solution or mixing at least a portion of the discharged steam with the aqueous solution or both. In some embodiments, the method further comprises utilizing a jet ejector on the solution side or a jet ejector to promote steam circulation or both.
Herein also disclosed is a method of using a heat exchanger, wherein a vapor phase and a liquid phase are present in the heat exchanger; wherein the heat exchanger comprises a hydrophobic coating; and wherein the overall heat exchange coefficient is greater than 3000 Btu/(h·ft2·° F.).
In some embodiments, the hydrophobic coating comprises electroless nickel (Ni) or carbon nanotubes or both. In some cases, the hydrophobic coating further comprises Teflon (PTFE), phosphorous (P), boron (B), boron nitride (BN), silica (Si), or combinations thereof. In some cases, the hydrophobic coating comprises Ni-PTFE, Ni—P-PTFE, Ni—B-PTFE, Ni—P—BN, or Ni—B—BN.
In some embodiments, the heat exchanger comprises a multiplicity of tubes or plates. In some embodiments, the tubes or plates are made of copper. In some embodiments, the hydrophobic coating is exposed to the vapor phase in the heat exchanger. In some embodiments, the hydrophobic coating promotes drop-wise condensation.
In some embodiments, the method further comprises utilizing a nucleation promoter. In some embodiments, the method further comprises utilizing boiling chips in conjunction with a filter. In some embodiments, the method further comprises discharging a vapor stream from the heat exchanger; and utilizing at least a portion of the discharged vapor stream to preheat the liquid phase or mixing at least a portion of the discharged steam with the liquid phase or both. In some embodiments, the method further comprises utilizing a jet ejector on the liquid-phase side or a jet ejector to promote vapor circulation or both.
Herein disclosed is a heat exchanger. The heat exchanger comprises at least one pipe having a centerline, an inlet and an outlet; and a multiplicity of tubes, wherein each tube comprises a centerline, an inner surface, an outer surface, and groves; wherein the multiplicity of tubes are placed inside the pipe and the centerline of each tube is perpendicular to the centerline of the pipe. Herein also disclosed is a heat exchange system. Such a system comprises the heat exchanger as described herein, wherein the heat exchanger is configured to receive an incoming feed stream and to discharge a vapor stream. Herein also described is a process that utilizes the heat exchanger disclosed herein. Such a process comprises the separation of a volatile component from a non-volatile component in a mixture. In some cases, the non-volatile component comprises a salt or a sugar and the volatile component comprises water.
The foregoing has outlined rather broadly the features and technical advantages of the invention in order that the detailed description of the invention that follows may be better understood. Additional features and advantages of the invention will be described that form the subject of the claims of the invention. It should be appreciated by those skilled in the art that the conception and the specific embodiments disclosed may be readily utilized as a basis for modifying or designing other structures to accomplish the same purposes of the invention. It should also be realized by those skilled in the art that such equivalent constructions do not depart from the spirit and scope of the invention as set forth in the appended claims.
a) shows the compression ratio as a function of salinity and ΔT across the heat exchanger. (Pcond=60 psia=0.4137 MPa, Tcond=292.75° F.=418 K, ΔT in 0.2 K increments)
b) shows the compression ratio as a function of salinity and ΔT across the heat exchanger. Operating point is typical of a seawater desalination system. (Pcond=60 psia=0.4137 MPa, Tcond=292.75° F.=418 K, ΔT in 0.2 K increments)
c) shows the compression ratio as a function of salinity and ΔT across the heat exchanger. Operating point is typical of a brackish water desalination system. (Pcond=60 psia=0.4137 MPa, Tcond=292.75° F.=418 K, ΔT in 0.2 K increments)
a) shows the compression ratio as a function of salinity and ΔT across the heat exchanger. (Pcond=10 psia=0.06895 MPa,
Tcond=193.2° F.=362.7 K, ΔT in 0.2 K increments)
b) shows the compression ratio as a function of salinity and ΔT across the heat exchanger. Operating point is typical of a seawater desalination system. (Pcond=10 psia=0.06895 MPa, Tcond=193.2° F.=362.7 K, ΔT in 0.2 K increments)
c) shows the compression ratio as a function of salinity and ΔT across the heat exchanger. Operating point is typical of a brackish water desalination system. (Pcond=10 psia=0.06895 MPa. Tcond=193.2° F.=362.7 K, ΔT in 0.2 K increments)
a) shows the compression ratio as a function of mass flow ratio for various velocities of motive steam as determined by computational fluid dynamic (CFD) simulation.
b) shows the compression ratio as a function of mass flow ratio for various velocities of motive steam as determined by computational fluid dynamic (CFD) simulation.
Overview. Herein disclosed is a heat exchanger. En an embodiment, the heat exchanger comprises at least one pipe having a centerline, an inlet and an outlet; and a multiplicity of tubes, wherein each tube comprises a centerline, an inner surface, an outer surface, and vertical groves; wherein the multiplicity of tubes are placed inside the pipe and the centerline of each tube is perpendicular to the centerline of the pipe. For example,
In a further embodiment, the heat exchanger comprises a multiplicity of baffles wherein the spacing between the baffles decreases in the direction of from the inlet to the outlet of the pipe. For example,
In another embodiment, the tubes of the heat exchanger are made of a metal or alloy with a thermal conductivity that is no less than that of copper. In some cases, it is allowable to use alloys with a thermal conductivity less than copper, such as naval brass. In an embodiment, the heat exchanger further comprises a galvanic protection mechanism.
In yet another embodiment, the heat exchanger further comprises a hydrophobic coating on the outer surface of each of the tubes or on both the inner surface and the outer surface of each of the tubes. The coating on the outside surface of the tubes promotes vapor condensation or vapor nucleation, which increases the heat transfer coefficient. In some embodiments, the heat exchanger is used as an evaporator. In some cases, the hydrophobic coating comprises electroless nickel or carbon nanotubes or both.
In an embodiment, the heat exchanger further comprises a jet ejector. As shown in
In a further embodiment, the inner surface of the tubes comprises sand-blasted surface. Such sand-blasted surface promotes nucleation for the liquid phase. In yet another embodiment, the heat exchanger comprises boiling chips placed inside of the tubes during use of the heat exchanger. Such boiling chips comprise insoluble material, porous material, or rough material, e.g., Teflon chips. The boiling chips also promote nucleation in the liquid phase. In an embodiment, the heat exchanger comprises both the sand-blasted surface on the inner surface of the tubes and the boiling chips during use.
In another embodiment, the heat exchanger further comprises a multiplicity of fittings configured to attach each of the tubes to a tube sheet, wherein the fitting comprises an attaching mechanism configured to attach the fitting to each of the tubes; and a penetration mechanism configured to penetrate the tube sheet, wherein the penetration mechanism comprises a sealing mechanism and a securing mechanism. An example of such fittings is show in
In an embodiment, the tubes of the heat exchanger are replaced with plates having a top surface and a bottom surface. In some cases, the plates have dimples. In some cases, the heat exchanger further comprises a hydrophobic coating on the top surface or on both the top surface and the bottom surface of each of the plates. In some cases, the bottom surface of each of the plates comprises sand blasted surface.
Herein also disclosed is a heat exchange system. Such a system comprises the heat exchanger as described herein, wherein the heat exchanger is configured to receive an incoming feed stream and to discharge a vapor stream. In some cases, the heat exchange system further comprises a salt nucleation promoter fluidly connected to the heat exchanger. Such a salt nucleation promoter is configured to cause the salt in the liquid phase to precipitate continuously and be removed. In some further cases, the heat exchange system further comprises a preheater configured to receive the incoming feed stream upstream of the heat exchanger and to receive the discharged vapor stream from the heat exchanger, wherein the incoming feed stream is heated by the discharged vapor stream.
Herein also described is a process that utilizes the heat exchanger disclosed herein. In some cases, such a process comprises the separation of a volatile component from a non-volatile component in a mixture. In some cases, the non-volatile component comprises a salt or a sugar. In some cases, the volatile component comprises water. In some cases, dropwise condensation occurs in the process. In some cases, desalination occurs in the process. In some cases, the process comprises liquid-gas separation.
Herein disclosed is a method of using a heat exchanger, wherein an aqueous solution and steam are present in the heat exchanger; wherein the heat exchanger comprises a hydrophobic coating; and wherein the operating pressure of the heat exchanger is greater than 50 psia. In some cases, the hydrophobic coating comprises electroless nickel or carbon nanotubes or both. In some embodiments, the hydrophobic coating is exposed to the steam in the heat exchanger. In some cases, the hydrophobic coating promotes vapor nucleation.
Herein further described is a method of using a heat exchanger, wherein a vapor phase and a liquid phase are present in the heat exchanger; wherein the heat exchanger comprises a hydrophobic coating; and wherein the overall heat transfer coefficient is greater than 3000 Btu/(h·ft2·° F.). Table 4 and Table 5 show the comparison of heat transfer coefficients between the heat exchanger of this disclosure and conventional heat exchangers (the first row in Table 4 shows the results without the coating). In some cases, the hydrophobic coating comprises electroless nickel or carbon nanotubes or both. In some cases, the heat exchanger comprises a multiplicity of tubes or plates. In some cases, the tubes or plates are made of copper. In some cases, the hydrophobic coating is exposed to the vapor phase in the heat exchanger. In some embodiments, the hydrophobic coating promotes vapor nucleation.
In an embodiment, nickel-Teflon coating is used in a heat exchanger that operates at high pressures (for example, P>45 psia or P>50 psia).
This technology may be used to desalinate water (e.g., brackish water, seawater), remove water from fermentation broth, concentrate sugar solutions, concentrate protein syrup, and other applications involving the separation of a volatile component from a nonvolatile component. For simplicity, in the descriptions below, the application is assumed to be water desalination.
The saturated high-pressure steam that exits the desuperheater enters the condensing side of the right-most evaporator. As this steam condenses, it evaporates water from the boiling side thereby producing steam that may be fed to the middle evaporator. In the middle evaporator, the steam condenses, which causes more steam to be produced on the boiling-water side. This steam then enters the left-most evaporator where it condenses and evaporates water from boiling side. The water evaporated from the boiling side enters the compressor, as previously described.
The evaporators are operated at elevated temperature and pressure, which accomplishes the following: (1) the physical size of the compressor is reduced, thereby reducing its cost; and (2) in the evaporators, high heat transfer coefficients are obtained.
The primary disadvantage of operating at elevated temperature is that it promotes scaling on heat exchanger surfaces, primarily from salts with “reverse solubility,” i.e., those salts in which the solubility decreases at elevated temperature. Examples of reverse solubility salts are calcium carbonate, magnesium carbonate, calcium sulfate, and magnesium sulfate. Commonly, to limit scaling, the maximum heat exchanger temperature is ˜120° C.; however, at this temperature and pressure, the compressor is physically large and heat transfer coefficients are poor. It is highly desirable to increase the operating temperature, which requires methods to address scale formation such as the following: (1) Remove carbonates from the feed water by acidification and stripping the resulting carbon dioxide; (2) Remove sulfates via ion exchange; (3) Promote salt nucleation in the bulk fluid rather than on surfaces; (4) Abrade heat exchanger surfaces with circulating “cleaning balls” commonly made from rubber; and (5) Apply non-stick coatings to heat exchanger surfaces.
To preheat the feed to the evaporators, a sensible heat exchanger is employed, which exchanges thermal energy between the incoming feed water and the discharged distilled water and concentrated brine. As shown in
In an alternative embodiment, in a co-current series manner, the preheated feed water could be added to the right-most evaporator. In this arrangement, as the brine flows from right to left, it becomes ever more concentrated. In the right-most evaporator (lowest brine concentration), the pressure ratio between the condensing steam and boiling water is minimal. In the left-most evaporator (highest brine concentration), the pressure ratio between the condensing steam and boiling water is maximal.
In another embodiment, in a parallel manner, the preheated feed water could be divided into three portions and added to each of the evaporators. In this embodiment, each evaporator has the maximum salt concentration; therefore, the pressure ratio between the condensing steam and boiling water is maximal in each evaporator, which adversely affects energy efficiency because the compressor has the maximum compression ratio.
Regardless of the flow arrangement, each evaporator operates at a different temperature; therefore, to conserve energy, sensible heat exchangers are employed between each evaporator.
Because noncondensible gases are present in the feed water, it will be necessary to purge them from the system. The purged steam is most steam with small amounts of noncondensibles. The purge stream may be simply vented to the atmosphere; however, this wastes the energy in the steam. Alternatively, as shown in
In the evaporators, the steam-side heat transfer coefficient improves by inducing a circulating flow. This is accomplished by using a jet ejector driven by high-pressure steam. A portion of this circulating flow may be bled and fed directly into the incoming feed, thereby assisting with preheating.
In the evaporator, the liquid-side heat transfer coefficient improves by circulating liquid. This may be accomplished using a jet ejector powered by a pump.
As brine concentrates, there is the potential for fouling as salts attach to the heat exchanger surface. To prevent this, a salt nucleation promoter—such as the Colloid-A-Tron produced by Fluid Dynamics—may be incorporated into the circulating flow. The salt nucleation promoter encourages salts to preferentially precipitate in the bulk liquid rather than on solid surfaces, and thus avoid fouling.
To promote vapor nucleation in the circulating liquid, “boiling chips” (e.g., Teflon boiling chips sold by CR Scientific) may be added. A further advantage of introducing boiling chips is that they abrade against the heat exchanger surface and therefore help remove scale. If boiling chips are employed, a separator (e.g., filter) is needed to retain them within the evaporator.
Side view (
Top view (
e shows an alternative method for sealing the tube sheet to the shell. A C-shaped extrusion is attached to the inside shell wall. The inside of the extrusion has one or more grooves that allow an inflatable linear seal to be inserted. During assembly, when the tube sheet is slid into the C-shaped extrusion, the linear seals are not inflated. Once the tube sheet is inserted, the linear seals are inflated. The advantage of this sealing system is that it allows heat exchangers to be rapidly installed or replaced without the difficultly of accessing bolts, as would be needed in a conventional gasket seal.
In
The presence of salt lowers the vapor pressure of water according to the following formula
where
P=actual vapor pressure above the salt solution at temperature T (kPa)
Po=vapor pressure above pure water at temperature T (kPa)
S=salinity (g salt/kg solution)
Using this relationship, the required compression ratio may be calculated as a function of salt concentration, condenser temperature, and heat exchanger ΔT (
b, 8b, and 9b describe the required compression ratios for typical seawater conditions (feed=35 g salt/kg solution, discharge=70 g salt/kg solution).
a and 10b show computational fluid dynamic (CFD) simulations for steam jet ejectors operating at low compression ratios.2 The following equations are valid for M<0.15 kg motive/kg propelled
CR=70.089M3−14.68M2+1.5657M+1 νnozzle=1104 m/s (2)
CR=68.099M3−13.732M2+1.3648M+1 νnozzle=1020 m/s (3)
CR=−7.9692M3+3.7961M2+0.2767M+1 νnozzle=850 m/s (4)
where
{dot over (m)}
feed
+{dot over (m)}
motive
={dot over (m)}
distilled
+{dot over (m)}
brine
+{dot over (m)}
multi (5)
where {dot over (m)}=mass flow rate (kg/s)
To a close approximation, the following are true:
{dot over (m)}
propelled
={dot over (m)}
distilled (6)
{dot over (m)}
motive
={dot over (m)}
sensible
+{dot over (m)}
multi (7)
As previously defined,
The recovery R of distilled water from brine is defined as follows:
A water balance around the system reveals
(1−xfeed){dot over (m)}feed+{dot over (m)}motive+{dot over (m)}distilled+(1−xbrine){dot over (m)}brine+{dot over (m)}multi (10)
where
x=salt mass fraction (kg salt/kg solution)
Assuming that the motive and multi-effect evaporator streams are small relative to the feed stream, this equation simplifies to
The velocity of the motive steam in the jet ejector is determined by performing an energy balance around the jet ejector nozzle, which is assumed to be 95% efficient
Assuming the inlet velocity is negligible, this becomes
if the condenser enthalpy is known and the nozzle velocity is specified, then the required motive enthalpy may be calculated
The jet ejector nozzle is very efficient, so it is nearly isentropic.
A new definition is introduced
Prior to entering the evaporator, steam is added directly to the feed stream to raise the temperature from T2 to Tboil. An energy balance around this point reveals
{dot over (m)}
feed
C
p(Tboil−T2)={dot over (m)}sensibleλ (18)
where
λ=latent heat of vaporization for steam
Assuming the approach temperature in the heat exchanger is approximately the same at all points, the following is true:
(T3−T1)≅(Tboil−T2)≅(Tcond−T2) (19)
This relation may be substituted into Equation 18
Substituting relationships for R (Equation 9) and M(Equation 8) gives
Any steam not sent to the sensible heat exchanger is available for the multi-effect evaporators. The number of evaporator stages N is calculated as follows:
where
N=number of multi-effect evaporator stages
PRoverall=pressure ratio of the entire multi-effect evaporator system
PRi=pressure ratio of a single stage in a multi-effect evaporator
PRi is obtained from
The total amount of distilled water that may be produced from both the vapor-compression system and multi-effect evaporator is
Advantages. In various embodiments, the heat exchange system of this disclosure has the following advantages. The heat exchanger has a hydrophobic coating made from nickel-Teflon, which promotes dropwise condensation and resists fouling. The nickel coating can incorporate carbon nanotubes (with or without Teflon) to promote dropwise condensation and high heat transfer coefficients. The heat exchanger tube has vertical groves that channel the condensed liquid in a vertical path, thus coalescing liquid adhering to the heat exchanger surface, which promotes high heat transfer coefficients. The heat exchanger tube has thin walls and is constructed of high-thermal-conductivity metal (e.g., copper), which promotes high heat transfer coefficients. In some cases, the thickness of the tube wall is no greater than 0.01 inch. To protect the metal from corrosion, galvanic protection may be incorporated into the system. Special fittings are employed that allow the heat exchanger tubes to seal against a thin tube sheet. On the boiling water side, the heat exchanger surface is sandblasted to promote vapor nucleation, which improves the heat transfer coefficient. On the boiling water side, “boiling chips” can be incorporated to promote vapor nucleation, which improves the heat transfer coefficient and scours the heat exchanger surface to keep it clean. An appropriate recovery system (e.g., filter) is employed to retain the boiling chips within the system. On the boiling water side, nucleation promoters can be employed to encourage solids to precipitate in the bulk liquid rather than on solid surfaces. On the boiling water side, forced convection is induced with a jet ejector powered by a liquid pump. On the condensing side, steam is circulated, which promotes high heat transfer coefficients. Although a mechanical means could be employed, a steam-powered jet ejector is preferred. On the condensing side, baffles are employed to maintain a high steam velocity past the tubes. As the steam flows, the baffles are more closely spaced to maintain a near-uniform velocity past the tubes. A heat exchanger is incorporated to allow purged steam to preheat incoming feed water. Appropriate piping is incorporated to preheat incoming feed water with the same steam used in the steam-powered jet ejector. An optimized jet ejector may be employed to compress vapors. An inflatable seal for rapid and easy installation of heat exchangers.
In Tables 1 and 5, the operating conditions explored by researchers prior to this disclosure resulted in very low heat transfer coefficients for nickel-Teflon coatings. In these prior studies, the operating pressure was low (P<45 psia). We achieved surprisingly high heat transfer coefficients because we operate at high pressures where the vapor density is sufficiently high to achieve exceptional performance.
Assumptions
xfeed=1500 ppm=1.5 g salt/kg solution
xbrine=35,000 ppm=35 g salt/kg solution
Pcond=0.8274 MPa=120 psia
TN=50° C.=323.15 K (Nth stage of multi-effect evaporator)
PN=0.012345 MPa=0.122 atm=1.79 psia (Nth stage of multi-effect evaporator)
Calculations
Assuming the nozzle is nearly isentropic, this enthalpy may be obtained with the following conditions:
This calculation shows that theoretically, 1 kg of motive steam may produce 385 kg of distilled water. In reality, this number will be reduced because of heat losses and pressure drops.
Assumptions
xfeed=35,000 ppm=35 g salt/kg solution
xbrine=70,000 ppm=70 g salt/kg solution
Pcond=0.8274 MPa=120 psia
TN=50° C.=323.15 K (Nth stage of multi-effect evaporator)
PN=0.012345 MPa=0.122 atm=1.79 psia (Nth stage of multi-effect evaporator)
Calculations
Assuming the nozzle is nearly isentropic, this enthalpy may be obtained with the following conditions:
This calculation shows that theoretically, 1 kg of motive steam may produce 164 kg of distilled water. In reality, this number will be reduced because of heat losses and pressure drops.
Heat transfer coefficients were measured in vertical heat exchangers. Two different square, thin-sheet plate designs were tested. One had round-dimpled spacers, and the other had round-shaped vertical-grooved spacers. In both cases, the experimental plates were mounted in a sealed two-chamber apparatus with condensing saturated steam on one side and boiling liquid water on the other. The liquid-side heat transfer mechanism employed either natural or forced convection pool boiling of saturated water. The steam-side heat transfer mechanism was condensing saturated steam with either filmwise or dropwise condensation.
Three different plate materials were tested: (1) 0.030-in-thick naval brass 464 (2) 0.008-in thick copper, and (3) 0.005-in-thick titanium grade 2.
The first plate was round-dimpled 0.030-in-thick naval brass (k=67 Btu/(h⊙ft⊙° F.)), which was roughened via sand-blasting on the liquid side to promote nucleation. The condensing metal surface was either bare (filmwise condensation) or coated with 0.000025-in-thick layer of Ni—P-PTFE (dropwise condensation). Shearing steam on the condensing surface enhanced the overall heat transfer coefficient by 1.6 times and forced liquid convection increased it by additional 1.4 times. Interestingly, excessive shearing steam reduced the overall heat transfer coefficient. Presumably, this occurred because a film formed that increased the thermal resistance across the plate and disrupted the dropwise condensation mode. Without coating, the best operating point delivered U=2,900 Btu/(h·ft2·° F.) (saturated steam T=331° F., P=104.7 psia, ΔT=0.35° F.). With 0.000025-in Ni—P-PTFE hydrophobic coating, the best operating point delivered an overall heat transfer coefficient U=17,500 Btu/(h·ft2·° F.) (Saturated steam T=331° F., P=104.7 psia, ΔT=0.35° F., shearing steam ν=0.53 ft/s, R≈1 lb shearing steam/lb condensate, saturated liquid side ν=5.15 ft/s).
The second plate was round-dimpled 0.008-in-thick copper (k=231 Btu/(h⊙ft⊙° F.)). The plate surfaces in both chambers were modified with 0.000025-in Ni—P-PTFE hydrophobic layer. Experiments on this plate were performed under two different conditions in the saturated liquid chamber: (1) forced convection and (2) forced convection with PTFE boiling stones as a dynamic nucleation agent. For the first condition, the best operating point delivered an overall heat transfer coefficient U=28,000 Btu/(h·ft2·° F.) (saturated steam T=331° F., P=104.7 psia, ΔT=0.35° F., shearing steam ν=1.4 ft/s, R≈1 lb shearing steam/lb condensate, saturated liquid side ν=5.15 ft/s). For the second condition, the best operating point delivered an overall heat transfer coefficient U=32,000 Btu/(h·ft2·° F.) (saturated steam T=331° F., P=104.7 psia, ΔT=0.35° F., steam velocity ν=1.6 ft/s, R≈1 lb shearing steam/lb condensate, saturated liquid velocity ν=5.15 ft/s).
The third round-dimpled plate was made of grade-2 bare 0.005-in-thick titanium (k=12.65 Btu/(h⊙ft⊙° F.)). The best design point delivered U=13,700 Btu/(h⊙ft2⊙° F.) (saturated steam T=331° F., P=104.7 psia, ΔT=0.35° F., steam velocity ν=0.5 ft/s, R=1.5 lb shearing steam/lb, saturated liquid velocity ν=5.15 ft/s).
The fourth plate was vertical-grooved 0.008-in-thick copper (k=231 Btu/(h⊙ft⊙F)) coated with 0.000025-in Ni—P-PTFE hydrophobic coating. The best design point delivered U=33,800 Btu/(h⊙ft2⊙° F.) (saturated steam T=331° F., P=104.7 psia, ΔT=0.35° F., steam velocity ν=0.53 ft/s, R≈0.43 lb shearing steam/lb condensate, saturated liquid velocity ν=5.15 ft/s). The last experiment was performed on the copper plate previously described but with a modified chemistry for the coating. Lead-free 0.0001-in-thick hydrophobic Ni—P-PTFE delivered 21% better heat transfer coefficient. For this case, the best design point was U=42,400 Btu/(h⊙ft2⊙° F.) (saturated steam T=331° F., P=104.7 psia, ΔT=0.35° F., steam velocity ν=0.76 ft/s, R≈0.6 lb shearing steam/lb condensate, saturated liquid velocity ν=5.15 ft/s).
1.1 Heat Transfer Enhancement Techniques
Active and passive heat transfer enhancement techniques for heat exchangers have been investigated intensively. Fourth-generation heat transfer technology involves simultaneous application of several techniques to produce an enhancement larger than the individual techniques operating separately. Dropwise condensation has been studied for the past 60 years. Experiments with brass tubes show dropwise condensation has heat transfer coefficients 1.6-28.6 times greater than filmwise condensation.
The experiments in this disclosure enhanced heat transfer by simultaneously employing the following: (1) passive electroless Ni—P-PTFE thin-hydrophobic coating to promote dropwise condensation on the steam side and to inhibit fouling in the boiling side, (2) passive roughened surface and active nucleation sites with suspended PTFE boiling stones to promote nucleation in the saturated liquid side, (3) active forced convection circulating saturated liquid in the boiling chamber, and (4) active shearing steam on the condensing surface.
This study measures the heat transfer with pool boiling (liquid side) and dropwise condensation (steam side). The following factors were investigated:
1.2. Theoretical Calculation
Neglecting fouling, theoretical calculation of the overall heat transfer coefficient may be performed using
where
U=overall heat transfer coefficient (Btu/(h⊙ft2⊙° F.))
x=plate thickness (ft)
k=thermal conductivity (Btu/(h⊙ft⊙° F.))
hcond=condensation heat transfer coefficient (Btu/(h⊙ft2⊙° F.))
hboiling=boiling heat transfer coefficient (Btu/(h⊙ft2⊙° F.))
Measured heat transfer coefficients U are obtained from
where:
q=heat flux (Btu/(h⊙ft2))
m=condensate collected from the apparatus (lb/h)
hfg=latent heat of condensation (Btu/lb)
A=effective heat transfer area=0.694 ft2
ΔT=temperature differential across the plate (° F.)
Using data from the literature, Lara estimated the heat transfer coefficient of an innovative sheet-shell heat exchanger with passive surface modifications on the condensing heat transfer surface. Lara assumed the surface was modified with self-assembled monolayer (SAM) of an organic hydrophobic coating. On the steam side, he estimated hcond=57,000 Btu/(h⊙ft2⊙° F.) for gravity-controlled dropwise condensation of steam. On the liquid side, he estimated hboiling=180,000 Btu/(h⊙ft2{grave over (◯)}⊙° F.) for natural convection pool boiling. Using 0.007-in-thick naval brass plate with a monolayer of PTFE hydrophobic coating, he estimated an overall heat transfer coefficient U=31,500 Btu/(h⊙ft2⊙° F.).
In pool boiling; heat flux across the plate evaporates micro and macro layers of the vertical surface during bubble growth. The level of turbulence imposed by forced convection helps coalesce small bubbles with large bubbles carrying upwards the maximum possible amount of latent heat. In the pool boiling side, the total heat transfer coefficient increases by adding forced convection. Trends for forced convective boiling of water indicate that operating at high pressure increases the critical heat flux (CHF) (i.e., the maximum heat flux attainable) compared to low-pressure operation. It is well known that increasing surface roughness is a cost-effective way to enhance nucleate boiling compared to other more sophisticated techniques.
During dropwise condensation, the heat transfer process is controlled by the developed intermolecular force field, which is composed of surface tension, gravity, and free surface energy. The positive influence of sweeping steam on the condensing surface has been studied. This innovative sheet-shell heat exchanger has a unique ability to sweep steam on its vertical condensation surface. Additionally, literature shows that for a vertically grooved surface, the heat flux increased up to 80% in a shear-steam dropwise condensation process.
Factors leading to enhanced boiling on surfaces are surface microroughness and porous microstructures, which provide the following benefits: (1) sufficient active nucleation sites at low wall superheats, (2) evaporation of liquid films within a very small confined space, and (3) increase in the effective heat transfer area.
Dropwise condensation performs best at higher pressures and small temperature differentials across the plate. Moreover, high operating pressures increase steam density which allows mechanical vapor-compression (MVC) desalination systems to use smaller compressors. The StarRotor compressor is a key component of the MVC system because of its low energy consumption and low capital cost.
Table 1 summarizes the most recent literature in Ni—P-PTFE coatings applications on condensers.
Section 2. Experimental Apparatus and Procedure
Test surfaces. The hydrophobic Ni—P-PTFE coating resists fouling, corrosion, and friction while promoting dropwise condensation. Ni—P-PTFE electroless composite plating was made of 75 to 80 vol % high-phosphorus nickel matrix and 20 to 25 vol % of PTFE (polytetrafluoroethylene). Microplating Inc. applied the thin hydrophobic coating. Two types of coating were applied: Ni—P-PTFE and lead-free Ni—P-PTFE (see Table 2).
The electroless hydrophobic coating thickness (h) is governed by the coating deposition rate (γ) and deposition time (t) by the expression: h=γ⊙t. Therefore, a thin coating may be obtained by using a short deposition time. Because of the high thermal resistance of PTFE, a very thin hydrophobic coat is desired. A 0.000025-in-thick hydrophobic Ni—P-PTFE coating (k=3.141 Btu/(h⊙ft⊙° F.)) has negligible thermal resistance (x/k=7.96×(h⊙ft2⊙° F.)/Btu).
The experiments were conducted by condensing saturated steam on 12 in×12 in square vertical plate that had 100 equally distributed round dimples that are 0.75-in diameter and 0.125-in deep separated by 1-in centers. Because the mounting mechanism blocked some of the plate, the effective heat transfer area was 10 in×10 in or 0.694 ft2. (Note. This area does not include the additional area from the surface features such as dimples or grooves.)
Four plate substrates were tested:
(1) 0.030-in-thick naval brass 464 plate, the entire surface was modified with 0.000025-in-thick Ni—P-PTFE hydrophobic coating. Prior to coating, the boiling surface was sand blasted.
(2) 0.008-in-thick copper, which was fully coated with 0.000025-in-thick Ni—P-PTFE hydrophobic layer. Because it buckled the plate, no sand blasting was employed.
(3) bare 0.005-in-thick titanium grade 2. Because it buckled the plate, no sand blasting was employed.
(4) 0.008-in-thick vertical grooved copper, which was fully coated with 0.000025-in-thick Ni—P-PTFE hydrophobic layer. The last experiment was performed on this plate with lead-free 0.0001-in-thick hydrophobic Ni—P-PTFE coating. Because it buckled the plate, no sand blasting was employed. The bottoms of the grooves were ˜0.12 inches in diameter.
Apparatus and Procedure
The experimental apparatus was tailored to observe and manipulate key heat transfer variables.
To prevent the test plate from deforming under high differential pressure, a support system was required. Two types were employed:
a) A pin grid extended to the housing wall. This was used for Plates 1 and 2.
b) A solid aluminum plate wrapped with a thin copper plate emulating the actual channel configuration in both the liquid and the steam sides. This was used for Plates 3 and 4.
High-pressure steam enters valve V1 into cyclone C1 where liquid is separated, thus ensuring the steam quality entering the apparatus is 1.0. Pressure regulator V2 sets the condenser pressure, which is measured by pressure gauge P. The steam enters the condenser, which has a 0.125-in gap that is set by the thickness of the aluminum plate inserted into the condenser. At the bottom of the condenser, condensate flows into sight glass S2. By manually opening valve V4, the liquid level in sight glass. S2 may be maintained constant. The drained liquid is collected in graduated cylinder G1 and is measured over a 90-s interval. (Note: This manual method of collecting condensate was more reproducible than steam traps.)
The rate of shearing steam flowing past the plate is regulated by valve. Cyclone separates liquid entrained with the shearing steam. The collected liquid enters sight glass; by manually opening valve, the liquid level in sight glass is kept constant. The drained liquid collected in graduated cylinder is measured over a 90-s interval. The sum of the liquid collected in graduated cylinders is m in Equation 1.3. The steam exiting cyclone enters heat exchanger where it condenses and is collected in graduated cylinder over a 90-s interval. The amount of liquid collected in graduated cylinder is compared to the amount of liquid collected in graduated cylinders so that the ratio R of each flow may be measured. Knowing the gap g (0.125 in), the plate depth, and the steam density allows the velocity of the shearing steam ν to be measured.
In separate outlets, the experimental apparatus may collect the shearing steam condensate and the condensate exiting the condensing chamber. The flow ratio R between the shearing steam condensate and the condensing chamber condensate provides an index of how fast the shearing steam travels along the condensing surface while inducing forced-convection heat transfer.
The boiling side is flooded with tap water; sight glass ensures the liquid level is kept constant. If necessary, excess liquid may be drained or make up water added by manually opening three-way valve. The steam evaporated from the boiler enters heat exchanger where it condenses. The condensate is heated to saturation using electric resistance heater. If necessary, make-up steam may be added to the boiler by opening valves.
To induce forced convection in the boiler, a pump (Cole-Parmer No. 7301-40, 115 GPM, high-temperature rated, with stainless steel impeller, with Viton seals) circulates the liquid. An all-metal flow meter (Flow Line Options, Model 12ABH120DLT, max temp=400° F.) measures the rate of circulating liquid. Knowing the gap f and the plate dimensions, the liquid velocity may be calculated.
To ensure that non-condensable gases are removed from the system, valves allow a small stream to be purged to the atmosphere. The differential pressure between the two chambers is measured using differential pressure gauges (Orange Research, diaphragm-type, rotary magnet sensor scales). One operates from 0 to 2 psid and the other operates from 0 to 10 psid. The measured pressure differential ΔP between chambers and the steam pressure P allows ΔT to be determined using steam tables.
Four thermocouples (Type J/316 stainless steel sheath, ⅛-in diameter) measure the temperatures in each quadrant of the condenser. Similarly, four thermocouples measure the temperatures in each quadrant of the boiler. Because thermocouples are not particularly accurate, they were not used to measure ΔT across the test plate. Instead, their purpose was to ensure uniform temperatures in each quadrant of the boiler and of the condenser. Using steam tables, the thermocouple readings were found to be consistent with the readings taken by the pressure gauge P and differential pressure gauges.
Thermal losses from insulation are calculated by opening valves, which equalizes the pressures in both chambers with saturated steam so there is no temperature difference across the plate. The condensate is collected and used to determine the heat loss through the steam-side insulation. This collected steady-state condensate serves as the baseline, which is subtracted from the condensate collected during experiments; the net condensate collected (m) is substituted in Equation 1.3 to calculate heat flux. This allows the heat transfer through the plate to be measured without interference from heat loss through the insulation.
The temperature differential ΔT between the steam side and the liquid side is set by the amount of cooling water flowing through the heat exchanger, the amount of make-up steam added through valves, and the heat added through resistance heater. The apparatus is allowed to operate until steady state is reached. Condensate is collected for 90-s periods. Five similar readings are required before the mean value is recorded.
Sample Calculation:
The overall heat transfer coefficient is calculated from Equation 1.2
where the heat flux q is calculated from Equation 1.3
q=(m⊙hfg)/A
The latent heat of condensation hfg is determined from steam tables based on the condensing steam pressure reading. For ΔT=0.35° F. and P=104.7 psia
h
fg=(1188.9−301.97)Btu/lbm=886.93 Btu/lbm
The effective heat transfer area without area adjustments due to dimpling is 0.694 ft2.
During the experiment, the collected condensate was 110 mL/90 s (i.e., 1.22 mL/s) and the condensate collected during the heat loss evaluation was 22 mL/90 s (i.e., 0.24 mL/s); therefore,
The overall heat transfer coefficient is
To avoid plate damage during start-up and shut-down, the pressure differential should not exceed 2 psid. This is accomplished by opening valves, which ensures pressures are equal during start-up and shut-down
Overall heat transfer coefficient measurements were performed within a steam pressure range from 55 to 105 psia. For each experiment performed at a constant steam pressure P, various temperature differentials ΔT were employed across the plate. This allows U or q to be measured as a function of P and ΔT.
The experimental apparatus may create both gravity-controlled and steam shearing-controlled condensation with varying shearing steam velocities over the condensing surface. In this fashion, it is possible to measure U and q at different shearing velocities and compare both modes of condensation.
Some experiments included dynamic nucleation sites in the saturated liquid chamber by circulating Teflon boiling stones (Saint-Gobain Chemware D1069103 boiling stones).
Table 3 summarizes the experimental conditions.
Section 3. Heat Transfer in Dimpled-Naval Brass 464 Plates
Naval brass 464 plates (Cu 59.62 wt %, Zn 39.2 wt %, Sn 0.5-1 wt %, Fe wt % Max 0.1, Pb wt % Max 0.2) had thermal conductivity k=67 Btu/(h⊙ft⊙° F.). Bare surface on the condensing chamber produced filmwise condensation, whereas thin hydrophobic coating promoted dropwise condensation. This experiment allows the benefits of dropwise condensation to be quantified.
3.1. Bare Naval Brass 464
A bare 0.030-in-thick plate was tested. The water-side surface was modified with sand-blasting to favor nucleation during pool boiling. The steam side was supplied with saturated steam at T=331° F. and P=104.7 psia. The ΔT ranged from 0.5 to 4.7° F. The effect of shearing steam on the condensing surface was also studied.
3.2. Thin Hydrophobic Coating on Naval Brass 464
Naval brass 464 surfaces were modified using Ni—P-PTFE hydrophobic coating. The test was performed with natural convection in the condensing chamber. Shearing steam was provided on the condensing side.
3.3. Effect of Forced Convection on the Water Side
In addition to shearing steam over the condensing surface, forced convection on the liquid side of the test plate was induced by a centrifugal circulating pump.
The following empirical equations describe each curve shown in
U=7064(ΔT)−0.832 (P=104.7 psia) (3.1)
U=4119(ΔT)−0.819 (P=76.7 psia) (3.2)
U=2810(ΔT)−0.714 (P=59.2 psia) (3.3)
These equations may be used to calculate the heat flux:
q=UΔT=7064(ΔT)1−0.832=7064(ΔT)0.198 (P=104.7 psia) (3.4)
q=UΔT=4119(ΔT)1−0.819=4119(ΔT)0.180 (P=76.7 psia) (3.5)
q=UΔT=2810(ΔT)1−0.772=2810(ΔT)0.286 (P=59.2 psia) (3.6)
3.4. Correlation of Heat Exchanger Performance with Pressure
Previously,
U=4.271(P)1.777 (ΔT=0.35° F.) (3.7)
U=3.323(P)1.712 (ΔT=0.70° F.) (3.8)
U=2.916(P)1.679 (ΔT=1.0° F.) (3.9)
U=2.265(P)1.615 (ΔT=2.0° F.) (3.10)
U=1.956(P)1.577 (ΔT=3.0° F.) (3.11)
High operating pressures allow advanced vapor-compression desalination systems to use smaller compressors.
U=4.271(120)1.777≈21,100 Btu/(h⊙ft2⊙° F.)
Section 4. Investigation of Thin Copper Plates
Equation 1.1 shows that for high heat transfer coefficients on both the condensing (hcond) and boiling (hboiling) sides, the material resistance (x/k) limits the overall heat transfer coefficient. Therefore, reducing the material thickness x and increasing the thermal conductivity k will enhance the overall heat transfer coefficient. A 0.008-in-thick copper plate fully coated with Ni—P-PTFE thin-coating was tested (multi-purpose copper alloy 110, Cu>99.0%, cold rolled, soft annealed, excellent soldering property, k=231 Btu/(h⊙ft⊙° F.), McMaster-Carr No. 8944K36).
4.1. Experimental Results
Forced convection is imposed on the saturated liquid side.
For these operating conditions, the optimal shearing steam velocity along the condensing surface was ν=1.4 ft/s.
The following empirical equations describe the curves shown in
U=9978(ΔT)−0.959 (P=104.7 psia) (4.2)
U=6824(ΔT)−0692 (P=82.7 psia) (4.3)
U=4737 (ΔT)−0.564 (P=62.2 psia) (4.4)
These equations may be used to calculate the heat flux:
q=UΔT=9978(ΔT)1−0.959=9978(ΔT)0.046 (P=104.7 psia) (4.5)
q=UΔT=6824(ΔT)1−0.692=6824(ΔT)0.308 (P=82.7 psia) (4.6)
q=UΔT=4737(ΔT)1−0.564=4737(ΔT)0.436 (P=62.7 psia) (4.7)
Using 0.000025-in hydrophobic coating with forced convection on the saturated liquid side,
4.2. Correlation of Thin Copper Heat Exchanger Performance with Pressure
Previously,
U=0.746(P)2.249 (ΔT=0.35° F.) (4.8)
U=1.058(P)2.147 (ΔT=0.40° F.) (4.9)
U=3.659(P)1.178 (ΔT=0.63° F.) (4.10)
U=7.379(P)1.582 (ΔT=0.8° F.) (4.11)
U=17.18(P)1.335 (ΔT=1.16° F.) (4.12)
4.3. Effect of PTFE Boiling Stones into Convective Boiling Side
The following factors affect the modes of condensation and boiling: surface sub-cooling, wall superheat, physical and chemical properties of the surface, and heat flux. Active nucleation sites on the boiling side promoted by PTFE boiling stones overcome bubble surface tension and thereby increase the heat flux across the plate. For a given ΔT, the boiling-side heat transfer coefficient increases, which increases the overall heat transfer coefficient. Additionally, PTFE boiling stones rub against the heat exchanger wall and reduce scale deposits.
In addition to its non-wettability property, Ni—P-PTFE hydrophobic coating also provides surfaces that resist abrasion (0.03 milligrams loss per 1,000 cycles using CS Wheel Taber Abrasion) and corrosion (>1,000 h, ASTM B 117 5% salt water at 35° C.). All these properties benefit MVC desalination. Experiments on heat exchangers show that the coating prevents chemical fouling and biofouling on the boiling surface. Newer non-toxic Ni—P-PTFE coatings employ lead-free technology to comply with stringent drinking water standards (NSF STD 61).
Copper, the plate substrate, does not resist salt water corrosion so active cathode protection may be needed as well to ensure long periods of operation. To some degree, the Ni—P—PTFE coating will resist corrosion, abrasion, and fouling. To obtain sustainable adhesion of hydrophobic layer to the substrate, multi-layer coatings should be applied by installing several Ni—P-PTFE baths with different ratios of cationic surfactant to PTFE particles.
If the plates are soldered together, the coating should be applied to the whole cassette of heat exchanger plates which will prevent damage to coating from the high temperatures employed by the soldering process.
4.4. Experimental Results with PTFE Boiling Stones
Experiments with 3.6 wt % PTFE boiling stones in the liquid side of the apparatus were performed.
A 0.008-in-thick copper plate (k=231 Btu/(h⊙ft2⊙° F.)) was tested. The experiment protocol was described in Section 2. The plate was fully coated with 0.000025-in Ni—P-PTFE hydrophobic coating.
Forced convection was imposed in the saturated liquid side with νsat liq=5.15 ft/s.
The optimal shearing steam velocity along the condensing surface for T=331° F., and P=104.7 psia was ν=1.6 ft/s.
The following empirical equations describe each of the curves shown in
U=13190(ΔT)−0.805 (P=104.7 psia) (4.13)
U=5731(ΔT)−0.788 (P=79.7 psia) (4.14)
U=3030(ΔT)−0.6785 (P=62.7 psia) (4.15)
These equations may be used to calculate the heat flux:
q=UΔT=13190(ΔT)1−0.805=13190(ΔT)0.194 (P=104.7 psia) (4.16)
q=UΔT=5731(ΔT)1−0.788=5731(ΔT)0.212 (P=79.7 psia) (4.17)
q=UΔT=3030(ΔT)1−0.678=3030(ΔT)0.321 (P=62.7 psia) (4.18)
Using 0.000025-in hydrophobic coating with forced convection and PTFE boiling stones (3.6 wt %) on the saturated liquid side,
4.5. Correlation of Heat Exchanger Performance with Pressure
Previously,
U=0.0630(P)2.809 (ΔT=0.35° F.) (4.19)
U=0.0737(P)2.654 (ΔT=0.70° F.) (4.20)
U=0.0799(P)2.573 (ΔT=1.0° F.) (4.21)
U=0.0876(P)2.482 (ΔT=1.5° F.) (4.22)
U=0.0935(P)2.413 (ΔT=2.0° F.) (4.23)
Section 5. Experimental Investigation of Titanium Plates
The low surface energy of titanium promotes dropwise condensation which increases the heat flux. Furthermore, the high resistance of titanium to abrasion and fouling prevents buildup of corrosion products and minimizes external fouling films. Therefore, the resulting overall heat transfer rate of titanium surfaces is often comparable to that of metals with higher thermal conductivity. Additionally, titanium is easy to maintain, which makes it particularly useful in applications in oilfield produced water and carbon sequestration technologies where more aggressive contaminants are found.
5.1. Experimental Results
Forced convection is imposed in the saturated liquid side with vsat liq=5.15 ft/s.
The optimal shearing steam velocity along the condensing surface was ν=0.5 ft/s (T=331° F., P=104.7 psia, ΔT=0.35° F.).
The following empirical equations describe each of the curves shown in
U=−6483 ln(ΔT)+5892 (P=104.7 psia) (5.1)
U=2785(ΔT)−0.596 (P=79.7 psia) (5.2)
U=1900(ΔT)−0.659 (P=62.7 psia) (5.3)
These equations may be used to calculate the heat flux:
q=UΔT=[−6483 ln(ΔT)+5892](ΔT) (P=104.7 psia) (5.4)
q=UΔT=2785(ΔT)1−0.596=2785(ΔT)0.403 (P=79.7 psia) (5.5)
q=UΔT=1900(ΔT)1−0.659=1900 (P=62.7 psia) (5.6)
5.2. Correlation of Heat Exchanger Performance with Pressure
Previously,
U=0.1985(P)2.366 (ΔT=0.35° F.) (5.7)
U=0.3564(P)2.139 (ΔT=0.70° F.) (5.8)
U=0.5636(P)1.974 (ΔT=1.0° F.) (5.9)
U=4.462(P)1.442 (ΔT=1.5° F.) (5.10)
U=411.2(P)0.266 (ΔT=2.0° F.) (5.11)
Section 6
Experimental investigation of 0.008-in-thick copper plates with round-shaped vertical grooves
Round-shaped vertical grooves on the condensing surface help channel the condensing steam so it sheds quickly, which increases the heat flux. The literature suggests that vertical grooves deliver about 25% higher overall heat transfer coefficients. For dropwise condensation, the condensation period involves forming microscopic droplets on the condensation surface, followed by droplet growth, coalescence/growth, and downflow. Liquid conduction resistance dominates dropwise condensation; therefore, reducing the condensation period is an important factor that increases the heat flux associated with dropwise condensation. Vertically grooved hydrophobic surfaces reduce the condensation period and hence enhances heat transfer. Additionally, this study measures the effects of shearing steam on hydrophobic vertically grooved surfaces on thin copper plates.
6.1. Experimental Results
The following empirical equations describe each of the curves shown in
U=12290(ΔT)−0.925 (P=104.7 psia) (6.1)
U=9596(ΔT)−0.941 (P=93.7 psia) (6.2)
U=6396(ΔT)−0.698 (P=74.7 psia) (6.3)
These equations may be used to calculate the heat flux:
q=UΔT=12290(ΔT)1−0.925=12290(ΔT)0.097 (P=104.7 psia) (6.4)
q=UΔT=9596(ΔT)1−0.940=9596(ΔT)0.059 (P=93.7 psia) (6.5)
q=UΔT=6396(ΔT)1−0.698=6396(ΔT)0.302 (P=74.7 psia) (6.6)
6.2 Correlation of Heat Exchanger Performance with Pressure
Previously,
U=0.1275(P)2.682 (ΔT=0.35° F.) (6.7)
U=0.1766(P)2.584 (ΔT=0.40° F.) (6.8)
U=0.5349(P)2.251 (ΔT=0.63° F.) (6.9)
U=1.079(P)2.041 (ΔT=0.84° F.) (6.10)
U=2.371(P)1.805 (ΔT=1.16° F.) (6.11)
Section 7. Effect of Coating Thickness
During this study, the thermal performance of 0.008-in-thick copper substrates was measured with hydrophobic Ni—P-PTFE coatings of the following thickness: (a) 0.00005-in, (b) 0.0005-in, and (c) 0.005-in. The results are compared to the performance of the 0.000025-in coating used in previous studies.
7.1. Experimental Results
Thermal Conductivity Calculation Based on Low Limiting Values
For high-phosphorous electroless Ni—P-PTFE hydrophobic coating, the literature reports a thermal conductivity k=0.013 cal/(cm⊙s⊙° C.) (3.14 Btu/(h⊙ft⊙° F.)). The lowest measured overall heat transfer coefficient (U=8,360 Btu/(h⊙ft2⊙° F.)) corresponds to 0.005-in coating thickness. Assuming the resistance of the boiling, liquid and condensing steam are negligible, analysis of low limiting values shows that
This agrees with the literature value within 15%.
Section 8. Experimental Investigation of Lead-Free Ni—P-PTFE Coating
Desalination technologies for municipal drinking water require NSF STD 61 certification. One of the most observed contaminants during the toxicology review is lead, which unfortunately is commonly used for the hydrophobic Ni—P-PTFE coating. To overcome this problem, a lead-free chemistry should be employed.
In the lead-free coating bath, it was observed that PTFE precipitated on the surface. The reason is yet unknown; however, this effect allowed more PTFE particles to deposit at the surface, which enhanced the hydrophobic effect of the coating. The following data show the overall heat transfer coefficient was increased.
8.1 Experimental Results of Round-Dimpled Plates
The following empirical equations describe the curves shown in
U=11990(ΔT)−0.932 (P=104.7 psia) (8.1)
U=8898(ΔT)−0.853 (P=92.7 psia) (8.2)
U=5599(ΔT)−0.870 (P=84.7 psia) (8.3)
These equations may be used to calculate the heat flux:
q=UΔT=1199(ΔT)1−0.932 (P=104.7 psia) (8.4)
q=UΔT=8898(ΔT)1−0.853 (P=92.7 psia) (8.5)
q=UΔT=5599(ΔT)1−0.870 (P=84.7 psia) (8.6)
8.2 Correlation of Heat Exchanger Performance with Pressure
Previously,
U=0.000534(P)3.855 (ΔT=0.35° F.) (8.7)
U=0.000768(P)3.640 (ΔT=0.70° F.) (8.8)
U=0.000923(P)3.529 (ΔT=1.00° F.) (8.9)
U=0.00117(P)3.403 (ΔT=1.50° F.) (8.10)
U=0.00133(P)3.314 (ΔT=2.00° F.) (8.11)
8.3 Copper Plates 0.008-in-Thick with Round-Shaped Vertical Grooves Coated with 0.0001-in Thick Lead-Free Hydrophobic Ni—P-PTFE Coating
Lead-free hydrophobic 0.0001-in-thick Ni—P-PTFE coating was applied on 0.008-in-thick copper plates with round-shaped vertical grooves. This new coating chemistry delivered 25% higher heat transfer coefficient. As was observed with other heat exchanger plates, there is a specific shearing steam velocity where the heat exchanger performance is maximal.
8.4. Experimental Results
The following empirical equations describe each of the curves shown in
U=18000(ΔT)−0.836 (P=104.7 psia) (8.12)
U=11400(ΔT)−0.826 (P=94.7 psia) (8.13)
U=7140(ΔT)−0.764 (P=64.7 psia) (8.14)
These equations may be used to calculate the heat flux (
q=UΔT=18000(ΔT)1−0.836=18000(ΔT)0.164 (P=104.7 psia) (8.15)
q=UΔT=11400(ΔT)1−0.826=11400(ΔT)0.174 (P=93.7 psia) (8.16)
q=UΔT=7140(ΔT)1−0.764=7140(ΔT)0.236 (P=64.7 psia) (8.17)
8.5 Correlation of Heat Exchanger Performance with Pressure
Previously,
U=5.941(P)1.886 (ΔT=0.35° F.) (8.18)
U=5.842(P)1.865 (ΔT=0.40° F.) (8.19)
U=5.518(P)1.796 (ΔT=0.63° F.) (8.20)
U=5.322(P)1.751 (ΔT=0.84° F.) (8.21)
U=5.101(P)1.702 (ΔT=1.16° F.) (8.22)
Section 9. Conclusions
An experimental investigation of hydrophobic heat exchangers was performed on the test apparatus described in
Table 4 summarizes the results obtained in this disclosure
Compared to naval Brass, copper has superior thermal conductivity, which is essential in this application because the steam-side and liquid-side heat transfer coefficients are so high. Unfortunately, copper does not resist the corrosion effect of salt water compared to naval brass 464. Although Ni—P-PTFE coating will resist wear, corrosion, and fouling, galvanic protection may be needed as well.
Table 5 summarizes literature results. The best heat transfer coefficient shown in the literature was U=3,000 Btu/(h⊙ft2⊙° F.) for ΔT=3.7 to 12.7° F. and P=43.7 psia. In contrast, in the present study, the best heat transfer coefficient was 42,400 Btu/(h⊙ft2⊙° F.) for ΔT=0.35° F. and P=104.7 psia.
Using thin copper with round-shape vertical grooves has multiple benefits: (1) reduce material cost, (2) pack more heat exchanger area into a given heat exchanger volume, (3) easier formation of dimples, and (4) enhance the overall heat transfer coefficient.
Bare grade-2 titanium plates promote dropwise condensation and resists corrosion abrasion and fouling.
Using titanium allows MVC to treat water that has aggressive contaminants such as (1) produced water from oil wells and (2) evacuated brine from natural reservoirs that will be injected with compressed carbon dioxide for carbon sequestration.
High operating pressures have high heat transfer coefficients and they allow mechanical vapor-compression desalination systems to use smaller compressors.
Section 10. Other Applications
Ni—P-PTFE Lead-Free Coating Technology
Recent developments in coating technology show electroless Ni—P-PTFE coating may be applied with lead-free chemistry, which complies with the requirements of NSF Standard 61 for drinking water.
Ni—Cu—P-PTFE Coatings
Experimental results show the corrosion resistance of Ni—Cu—P-PTFE composite coatings is superior to that of Ni—P-PTFE composite coating. Pool boiling tests at atmospheric pressure show 22-μm layer of Ni—Cu—P-PTFE coating has very low surface energy (18 mN/m), thus enhancing the hydrophobic properties of the thin Ni—P-PTFE layer. Additionally, incorporating Cu into the composite coating increases its thermal conductivity.
Carbon Nanotubes (CNT)
Literature reports continuous dropwise condensation of water vapor was observed on a superhydrophobic surfaces with short carbon nanotubes (CNT) deposited on micromachined posts, a two-tier texture mimicking lotus leaves.
On a roughened hydrophobic surface, a liquid drop may exhibit either the Cassie state where the drop sits on the air-filled textures or the Wenzel state where the drop wets cavities of the textures. To date, none of the reported condensation on engineered superhydrophobic surfaces exhibits a sustained Cassie state; instead, the condensate drops partially or fully penetrates into the cavities over the course of condensation.
The apparent contact angle of a roughened hydrophobic surface is enhanced in both the Cassie and Wenzel states; however, the Cassie state is the preferred superhydrophobic state in which a drop has a much smaller contact angle hysteresis and therefore a higher mobility. Continuous dropwise condensation of steam was achieved on a two-tier texture surface, which retains superhydrophobicity during and after condensation. On such micro-nano-structured surfaces, the condensate drops prefer the Cassie state, which is thermodynamically more stable than the Wenzel state. With a hexadecanethiol coating, superhydrophobicity is retained during and after condensation and rapid drop enabled.
On a silicon (Si) substrate, squarely positioned pillars were etched at the center by deep reactive ion etching. The etched Si substrates were coated with a thin layer of chromium Cr (100 nm) and then nickel Ni (20 nm) as catalyst. The CNTs were grown by plasma-enhanced chemical vapor deposition. The substrate was then hydrophobicized either by a 10-nm layer of parylene C coating or by a 10-nm layer of gold coated with a monolayer of 1-hexadecanethiol.
No reports were given on heat transfer coefficients attained. Monolayer coatings should exercise minimum thermal resistance. For the present application, the goal is to apply the described technology to copper substrates.
Ni—P-PTFE-CNT Super-Hydrophobic Composite Coating
Electroless Ni—P—carbon nanotube composite coatings were fabricated successfully and characterized for corrosion applications. Literature shows studies measuring the highest critical pressure that nanocavities of the CNT arrays may sustain before the condensing steam penetrates them. Because the critical pressure is a function of the saturated steam temperature, and our latent heat exchanger requires high pressures, it is our initiative to incorporate PTFE particles in the composite coating. We have confirmed with our coating supplier the chemical compatibility of the composites.
In addition to Ni—P-PTFE coatings, with PTFE (polytetrafluoroethylene, or Teflon) as the hydrophobic additive, other coatings comprising electroless nickel (Ni) may also be used as the hydrophobic coating in the heat exchanger (heat exchange system) of this disclosure. Some examples of coatings comprising electroless nickel are Ni—B-PTFE, Ni—P—BN, and Ni—B—BN.
These alternative coatings comprise, in addition to electroless nickel (Ni), phosphorous (P) or boron (B), depending on the reducing agent. As the matrix of the coating deposits on the surface, it entrains finely divided solids that are added to the bath. PTFE acts as the hydrophobic additive; boron nitride (BN) may also function as the hydrophobic additive. Furthermore, silica (Si) as a finely divided solid may also be added, which imparts abrasion resistance to the coating. The electroless bath may contain other components, such as buffers, wetting agents, and chelating agents.
Electroless nickel-based plating is an autocatalytic process where the substrate (copper or low-carbon steel) develops a potential when it is dipped in a bath (Table 6). Because of the developed potential, both positive and negative ions are attracted towards the substrate surface and release their energy through a charge transfer process. Nickel and other components (phosphorous, boron) deposit on the surface. To the bath, fine suspensions of solid additives—such as polytetrafluoroethylene (PTFE, or Teflon), boron nitride, silica—can be added, which become part of the matrix that deposits on the solid surface.
Tribology properties desired. Desalination/dewatering applications require corrosion resistance, abrasion resistance, and hydrophobicity to handle corrosive salty fluids at high temperature moving with relatively high velocities. The quaternary alloy Ni—P—BN—Si has the following properties:
Nickel—High lubricity, corrosion resistance
Phosphorous—Enhances corrosion resistance
Boron Nitride—A synthetic ceramic that is both oleophobic and hydrophobic
Silica—Reduces friction, enhances hardness and wear resistance
The later two components are added as fine suspensions that are entrained in the nickel coating as it deposits on the surface.
Reducing agents. Depending on the reducing agent used, the baths used for depositing Ni—B alloy can be acidic or alkaline. Table 7 describes the bath composition.
Sodium hypophosphite. Commercially, hypophosphite baths are the most common baths used because of higher deposition rates.
(a) Electrochemical mechanism. The catalytic oxidation of hypophosphite yields electrons at the catalytic surface, which in turn reduce nickel and hydrogen ions:
H2PO2−+H2O→H2PO3−+2H++2e−
Ni2++2e−→Ni
2H++2e−→H2(g)
H2PO2−+2H++e−→P+2H2O
(b) Atomic hydrogen mechanism. Atomic hydrogen is released because of the catalytic dehydrogenation of hypophosphite molecules adsorbed at the surface. The adsorbed active hydrogen reduces nickel at the surface of the catalyst.
H2PO2−+H2O→HPO32−+H++2Hads
2Hads+Ni2+→Ni+2H+
At the catalyst surface, some of the absorbed hydrogen simultaneously reduces a small amount of hypophosphite to water, hydroxyl ion, and phosphorus.
H2PO2−+Hads→H2O+OH−+P
Some of the reducing potential is lost as hydrogen gas:
H2PO2−+H2O→H++HPO32−+H2(g)
Sodium borohydride. Sodium borohydride is the most powerful reducing ion agent available. It can provide four electrons rather than the two electrons provided by sodium hypophosphite. Borohydride-reduced baths are preferred to dimethylamine borane baths.
Borohydrate ions hydrolyze in acid or neutral solutions and will yield boride in the presence of nickel ions; hence, pH control is important to avoid decomposing the bath solution.
The formation of nickel boride is suppressed by maintaining the pH of the solution between 12 and 14. Nickel is the reaction product.
Furthermore, electroless nickel coatings reduced with sodium borohydride have better tribological properties (hardness, wear resistance) than those of deposits reduced with other boron compounds or with sodium hypophosphite.
The following is the main reaction that drives the nickel ion reduction. It releases four electrons.
BH4−+4OH−→BO2−+2H2O+2H(g)+4e−
The presence of boron in the coating is from the following reaction:
BH4−→B+2H2(g)+e−
The reduction reactions are
Ni2++2e−→Ni
2H2O+2e−→2OH−+H2(g)
Chelating/Complexing agent. The functions of the chelating/complexing agents are:
a) Exert buffering action that prevents the pH of the solution from falling too fast
b) Prevent the precipitation of nickel salts, such as basic salts or phosphites
c) Reduce the concentration of free nickel ions by forming meta-stable complexes
d) Influence the reaction mechanism and hence the deposit rate
When borohydride is used as reducing agent, ethylenediamine is the complexing agent with an optimum concentration of 90 g/L.
Buffer agent. Ammonium fluoride improves the deposition rate and the buffering capability of Ni—P bath.
Wetting agents (surfactants). The function of the surfactant is to lower the surface tension of the bath allowing easier spreading and promoting the coating deposition reaction between the bath solution and the substrate (e.g., carbon steel).
Cetyltrimethylammonium bromide (CTAB) improves the surface finish and the hardness. It increases the phosphorus content (hence corrosion resistance) of the Ni—P coating with concentration exceeding about 0.6 g/L.
Effects of annealing on the coating. Heat exposure affects the thickness, hardness, and morphology of the coating. Heat exposure at 400° C. for 1 h promotes nickel grain growth, which results in maximal hardness of electroless nickel coating. However, heat exposure at higher temperatures and longer times leads to progressive decrease of hardness. Boron nitride helps solve the problem. Ni—B coatings exposed to 350-400° C. for 1 h transforms the ammorphous phase to crystalline nickel and nickel boride (Ni3B and Ni2B) phases. Annealing at temperatures higher than 450° C. causes crystalline nickel to grow and converts from Ni2B phase to the more metastable Ni3B phase. Atmosphere-controlled thermal treatments produce better corrosion resistance in electroless Ni—B coatings because of nitrogen diffusion. Nitridation by heat treating the coating in a nitrogen atmosphere in vacuum, increases the microhardness of Ni—P coatings up to 1500 HV 100.
Various dimensions, sizes, quantities, volumes, rates, and other numerical parameters and numbers have been used for purposes of illustration and exemplification of the principles of the invention, and are not intended to limit the invention to the numerical parameters and numbers illustrated, described or otherwise stated herein. Likewise, unless specifically stated, the order of steps is not considered critical. The different teachings of the embodiments discussed below may be employed separately or in any suitable combination to produce desired results.
While preferred embodiments of the invention have been shown and described, modifications thereof can be made by one skilled in the art without departing from the spirit and teachings of the invention. The embodiments described herein are exemplary only, and are not intended to be limiting. Many variations and modifications of the invention disclosed herein are possible and are within the scope of the invention. Where numerical ranges or limitations are expressly stated, such express ranges or limitations should be understood to include iterative ranges or limitations of like magnitude falling within the expressly stated ranges or limitations (e.g., from about 1 to about 10 includes, 2, 3, 4, etc.; greater than 0.10 includes 0.11, 0.12, 0.13, and so forth). Use of the term “optionally” with respect to any element of a claim is intended to mean that the subject element is required, or alternatively, is not required. Both alternatives are intended to be within the scope of the claim. Use of broader terms such as comprises, includes, having, etc. should be understood to provide support for narrower terms such as consisting of, consisting essentially of, comprised substantially of, and the like.
Accordingly, the scope of protection is not limited by the description set out above but is only limited by the claims which follow, that scope including all equivalents of the subject matter of the claims. Each and every claim is incorporated into the specification as an embodiment of the present invention. Thus, the claims are a further description and are an addition to the preferred embodiments of the present invention. The disclosures of all patents, patent applications, and publications cited herein are hereby incorporated by reference, to the extent they provide exemplary, procedural or other details supplementary to those set forth herein.
This application claims the benefit under 35 U.S.C. §119(e) of U.S. Provisional Patent Application No. 61/413,265 filed Nov. 12, 2010, the disclosure of which is hereby incorporated herein by reference.
Number | Date | Country | |
---|---|---|---|
61413265 | Nov 2010 | US |