The present invention relates to a heat exchanging device according to the preamble of claim 1.
Such a heat exchanging device is known from DE 39 29 004 A1. This publication shows a heat exchanger with double plates having on inside and outside surfaces profiles that are constructed as beads or webs lying perpendicular to the direction of flow. These webs are arranged one after the other in the flow direction and their height is less than the spacing of adjacent webs. The webs are intended here to bring about turbulence in the flowing medium and thus an improved heat transfer.
DE 38 22 890 A1 shows a cooling arrangement with a blower and a plurality of parallel cooling elements, each comprising elongated cooling webs and gap openings interspersed between them, wherein the cooling webs of every two adjacent cooling elements are offset from one another such that in the direction of flow the cooling webs of one cooling element cover the gap opening of the adjacent cooling element.
DE 198 13 119 A1 shows a turbulence heat recapture device with profiled plates, the profiles of which are inclined alternately one from the other by the same angle from the longitudinal direction of the pressure gradient. The intention thereby is to generate a turbulent flow that improves heat exchanger performance.
Such heat exchanging devices are used, for instance, to cool electronic components such as microprocessors or chips. A distinction is generally made between active and passive cooling units. In active cooling units, subassemblies such as fans or ventilators are used to support the removal of heat with the aid of a fluid stream, or to make it possible at all. The fluid stream thus generated flows through a cooling body that is coupled to a heat source and absorbs heat from it. Known cooling bodies have a rib or column structure and are partially roughened on the surface. The fluid flowing around or through the cooling body thereby absorbs the heat. Air is mainly used as fluid in the cooling of processors. Since air is a very poor conductor of heat, the cooling bodies must be designed to be relatively large in order to have a heat output surface that is large in proportion to the heat intake surface. For this purpose, it is proposed in the prior, not previously published German Patent Application No. 100 41 829 that the heat-output surface be substantially larger than the heat intake surface, which is achieved by a specified structuring in the form of channels and in the form of furrows that are fluidically connected to the channels.
Cooling devices with a substrate through which channels extend are also known from DE 196 19 060 A1 and EP 0 308 576 A2. The channels in those cases can be rectangular or circular.
DE 92 14 061 U1 describes a cooling body whose heat-intake surface comprises ribs and furrows to increase surface area.
One problem for active heat exchanging devices, alongside their large dimensions, is the power requirement for the device for generating the fluid flow. For an effective transfer of heat, a relatively high power consumption and usually a need for space for the corresponding equipment such as a fan result. Another complication is that a good transfer of heat from the heat output surface to the fluid takes place only if the heat output surface has a relatively high flow resistance to the fluid stream. This in turn requires a stronger fan, however.
The problem of the invention is therefore to create a heat exchanging device that brings high heat exchange performance with a low flow resistance. The heat exchanging device should also have a small space requirement and enable a good transfer of heat even for air as the fluid.
This problem is solved with the characteristics recited in claim 1. Advantageous configurations and refinements of the invention can be deduced from the subordinate claims.
The basic principle of the invention is that webs of low height, lying perpendicular to the direction of flow of the fluid, that project from the surface of the substrate are provided and that channels passing entirely through the substrate are present.
Transfer of heat between the fluid and the substrate takes place only in a very thin boundary layer directly at the surface of the substrate. To increase the transfer of heat, the fluid is directed such that localized turbulences, which increase the transfer of heat between fluid and substrate without substantially increasing the flow resistance, are generated by geometric features of the surface. To generate these turbulences, the regularly arranged webs acting as micro obstacles are provided, as well as regularly arranged channels that extend through the substrate. The substrate is in essence a thin plate that is placed a slight distance above the hot surface of an object that is to be cooled, or a cold one to be heated. Turbulences are formed at the regularly arranged micro obstacles, primarily on the inflow side of the micro obstacles due to collision with the micro obstacles in the area of the channels. Moreover, a kind of inverse chimney effect occurs, i.e., a part of the inflowing fluid moves from above the plate through the channel into the vicinity of or directly onto the hot or cold surface of the object, where an additional coupling of heat to fluid likewise occurs.
The substrate need have only a few channels and webs (micro obstacles) in the direction of flow. Preferably, three channels and webs, arranged in succession in the direction of flow, are sufficient, since studies showed that the heat transfer is maximal in the area of the second and third channels. The fluid absorbs the most heat in this area, which also has the effect that, due to expansion of the fluid, it undergoes an acceleration which supports the removal of heat by the heated fluid.
The substrate can be placed by way of spacers and by means of welding, gluing, soldering, etc. on the hot surface of the object that is to be cooled or the cold one to be heated. The spacers are preferably also webs that extend along the entire substrate in the direction of flow, so that channels for the fluid likewise are created between the object and the bottom of the substrate.
The bond between the substrate and the surface to be cooled or heated is preferably made of thermally conductive material. The substrate can consist of a thermally conductive material such as aluminum, copper or the like. It can also be made, however, of another material such as silicon that is merely coated with a thermally conductive layer. The base material of the substrate thus need not itself be thermally conductive.
The substrate with the webs and, optionally, the channels can be produced by conventional machining processes such as milling or punching from, for example, aluminum plates, or also by etching or surface coating processes, as in the case of silicon.
In a refinement of the invention, guide plates can be provided at the inflow or the outflow end of the substrate to support the flow of fluid into the channel between the substrate and the object surface to be cooled or heated.
According to a refinement of the invention, a thin plate, preferably roughened on the side facing the substrate or likewise having webs corresponding to the webs of the substrate, is arranged above the substrate for the formation of a channel that is also closed towards the top. This plate acting as a top cover improves the flowing off of the fluid, particularly in the last section before the outflow end.
The heat-exchanging devices according to the invention can be combined modularly with one another, with a variety of arrangements of individual modules being possible.
Generally the flow direction in the interior of the heat exchanging device is tangential to the bottom and top sides of the substrate. The flow of fluid to the individual modules can also be perpendicular to the bottom and top sides of the substrate, with means then being provided to deflect the inflowing fluid.
The invention will be explained more extensively below on the basis of one embodiment in conjunction with the drawing.
a-10c, a front view, a plan view and a cross section of the arrangement of
This application claims priority of German application 102 33 736.5, filed Jul. 24, 2002, the entire disclosure of which is hereby incorporated by reference.
Reference is made first to
Upstream of the channels 4 in the inflow direction 10, webs 12.1, 12.2 running perpendicular to inflow direction 10 are provided; as is best recognized from
From the plan view of
It is recognizable from the sectional view of
In one concrete example of an embodiment, the substrate has a length L of 16.5 mm in flow direction 10 and a width B of 58 mm perpendicular to flow direction 10 (cf.
12 is 0.3 mm and is allowed to be at most only half the length DL of channels 4. With this configuration, a cooling power of ca. 20 W was achieved for an incoming flow velocity of ca. 5 m/sec and a temperature of ca. 340 K of the object to be cooled.
With such a heat exchanging device, moreover, an enlargement of surface area by a factor of at least 2 can be achieved for improved heat transfer as compared to a flat surface, since the inside walls of channels 4 and the outside surfaces of webs 12 are also active as surfaces for heat transfer.
From
An individual heat exchanging device according to the previously described embodiments of
As is recognizable from
From the sectional view of
In general, it can be added that an essential advantage of the heat exchanging device according to the invention is that, compared to prior art, it produces equal cooling power for a markedly reduced fluid flow rate or better cooling power at the same flow rate. Thereby one obtains a lower power consumption by the fan, a noise reduction, a weight reduction and smaller, cheaper fans, a smaller overall space requirement and thus also lower logistics costs.
In conclusion, it should also be pointed out that the substrate with the channels and the webs can be employed as a general purpose heat exchanger, i.e., for heating an object by subjecting it to a flow of a hot medium or for targeted heating of a medium (fluid) such as a process gas.
It should also be mentioned that the fluid flow can also be generated by moving the substrate and the object to be cooled or heated, on which the substrate is placed, with respect to a medium. For instance, the substrate can be mounted on a vehicle such as a car or a ship which generates the fluid flow as it moves.
The following general rules can be propounded for the dimensioning of channels 4 and 8 and webs 12 as well as spacers 7:
The length of turbulence zone TL (
In view of the above, it will be seen that the several objects of the invention are achieved and other advantageous results attained.
As various changes could be made in the above methods and products without departing from the scope of the invention, it is intended that all matter contained in the above description and shown in the accompanying drawings shall be interpreted as illustrative and not in a limiting sense.
Number | Date | Country | Kind |
---|---|---|---|
102 33 736 | Jul 2002 | DE | national |
Filing Document | Filing Date | Country | Kind | 371c Date |
---|---|---|---|---|
PCT/EP03/08182 | 7/24/2003 | WO | 00 | 1/19/2005 |
Publishing Document | Publishing Date | Country | Kind |
---|---|---|---|
WO2004/011867 | 2/5/2004 | WO | A |
Number | Name | Date | Kind |
---|---|---|---|
4851965 | Gabuzda et al. | Jul 1989 | A |
4859805 | Kawakami et al. | Aug 1989 | A |
5077601 | Hatada et al. | Dec 1991 | A |
5195576 | Hatada et al. | Mar 1993 | A |
5428503 | Matsushima et al. | Jun 1995 | A |
5508883 | Lumbra et al. | Apr 1996 | A |
5563768 | Perdue | Oct 1996 | A |
5576932 | Bishop et al. | Nov 1996 | A |
5763950 | Fujisaki et al. | Jun 1998 | A |
5787975 | Grenier et al. | Aug 1998 | A |
6067227 | Katsui et al. | May 2000 | A |
6781834 | Nair et al. | Aug 2004 | B2 |
20050082035 | Debashisu et al. | Apr 2005 | A1 |
Number | Date | Country |
---|---|---|
38 22 890 | Sep 1989 | DE |
39 29 004 | Mar 1991 | DE |
92 14 061 | Oct 1992 | DE |
196 19 060 | Nov 1997 | DE |
198 13 119 | Oct 1999 | DE |
100 41 829 | Mar 2002 | DE |
102 33 736 | Apr 2004 | DE |
0 308 576 | Mar 1989 | EP |
11-186762 | Jul 1999 | JP |
Number | Date | Country | |
---|---|---|---|
20050252644 A1 | Nov 2005 | US |