Heat insulating cylinder for thermal treatment of semiconductor wafers

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Information

Patent Grant
D326272

References
Source

Patent Number
D326,272
Date Filed
Wednesday, January 25, 1989
35 years ago
Date Issued
Tuesday, May 19, 1992
32 years ago

Inventors
- Ken Nakao
- Wataru Ohkase
Original Assignees
- Tel Sagami Limited
Examiners
- Walsh; Donald P.
- Davis; Antoine D.
Agents
- Oblon, Spivak, McClelland, Maier & Neustadt

US Classifications
- D15 - Machines not elsewhere specified
Field of Search
- US
- D15 1441
- 219 390
- 219 411
- 432 6
- 432 33
- 432 239
- 432 241
- 432 253
- 432 258
- 432 260
- 432 261
- Term of Grant
  14Years

Information

Abstract

Description

Claims

The ornamental design for a heat insulating cylinder for thermal treatment of semiconductor wafers, as shown and described.

Priority Claims (1)

Number	Date	Country	Kind
63-29836	Jul 1988	JPX

US Referenced Citations (8)

Number	Name	Date	Kind
D215093	Conc	Sep 1969
D234847	Hoffman	Apr 1975
D258526	Nederman	Mar 1981
3604694	Muller	Sep 1971
3737282	Hearn et al.	Jun 1973
3744650	Henebry et al.	Jul 1973
4761134	Foster	Aug 1988
4849608	Muraoka et al.	Jul 1989

Foreign Referenced Citations (1)

Number	Date	Country
17213	Nov 1988	GBX