Patent Application
20070240852
Many aspects of the present device can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present device. Moreover, in the drawings like reference numerals designate corresponding parts throughout the several views.
The first and second heat reservoirs 20, 21 each have a hollow cylindrical configuration and is made of highly thermally conductive materials such as aluminum or copper or copper alloys. The first heat reservoir 20 has a bigger radius than that of evaporating section C of the heat pipe, whilst the second heat reservoir 21 has a bigger radius than that of condensing section A of the heat pipe. The evaporating and condensing sections C, A of the heat pipe respectively extends through the first and second heat reservoirs 20, 21, thereby positioning the first and second heat reservoirs 20, 21 thereon. The first and second heat reservoirs 20, 21 each include an outer wall 211 and a pair of lateral sides 221 connecting two opposite ends of the outer wall 211 with the corresponding evaporating and condensing sections C, A of the heat pipe to form a sealed chamber. A second capillary wick structure 22 is disposed on an inner surface of the first heat reservoir 20 and an outer surface of the evaporating section C, whilst another second capillary wick structure 22 is disposed on an inner surface of the second heat reservoir 21 and an outer surface of the condensing section A. Second working fluids (not shown) are respectively contained in the first and second heat reservoirs 20, 21. Two vapor channels 24 are respectively defined along axial directions of the first and second heat reservoirs 20, 21 and located in a center of the corresponding first and second heat reservoirs 20, 21 to guide vapor to flow therein. The first and second heat reservoirs 20, 21 are vacuum-exhausted to make the second working fluid easy to evaporate.
As the first heat reservoir 20 at the evaporating section C of the heat pipe absorbs heat from a heat source (not shown), the second working fluid contained in the first heat reservoir 20 absorbs the heat and evaporates, and simultaneously transfers the heat to the evaporating section C of the heat pipe. The evaporating section C of the heat pipe absorbs the heat from the first heat reservoir 20, and the first working fluid contained in the evaporating section C absorbs the heat and evaporates, and then carries the heat to the condensing section A in the form of vapor. Then, the heat is carried by the first working fluid in the form of vapor to the condensing section A where the heat is transferred to the second heat reservoir 21. The second working fluid contained in the second heat reservoir 21 absorbs the heat and evaporates. The first and second heat reservoirs 20, 21 have so big heat dissipating areas that the heat pipe can quickly and largely absorb and dissipate heat, thereby reducing the heat resistance of the heat pipe and enhancing the maximum heat transfer capacity of the heat pipe. The temperature differential across the length of the heat pipe is therefore reduced.
Alternatively, there may be a cylinder inner wall (not shown) formed in each of the first and second heat reservoirs 20, 21. The opposite lateral sides 221 of the first heat reservoir 20 interconnects the outer wall 211 with the inner wall thereof to form a sealed chamber, whilst the opposite lateral sides 221 of the second heat reservoir 21 interconnects the outer wall 211 with the inner wall thereof to form another sealed chamber. The evaporating and condensing sections C, A of the heat pipe are respectively inserted into the first and second heat reservoirs 20, 21, and interferentially engage with the inner walls of the first and second heat reservoirs 20, 21, whereby the first and second heat reservoirs 20, 21 are positioned on evaporating and condensing sections C, A of the heat pipe. Alternatively, the first and second heat reservoirs 20, 21 are positioned on the evaporating and condensing sections C, A of the heat pipe by metallurgical or adhesive means.
It is to be understood, however, that even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
| Number | Date | Country | Kind |
|---|---|---|---|
| 200610060304.2 | Apr 2006 | CN | national |
This application is related to co-pending U.S. patent application Ser. No. 11/309,309, entitled “HEAT PIPE”, filed on Jul. 25, 2006, and co-pending U.S. patent application Ser. No. 11/309,312, entitled “HEAT PIPE” and filed on Jul. 25, 2006. The present application and the co-pending applications are assigned to the same assignee. The disclosures of the above-identified co-pending applications are incorporated herein by reference.
