Many aspects of the present device can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present device. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
The heat reservoir 20 has a hollow cylindrical configuration and made of highly thermally conductive materials such as aluminum or copper or copper alloys. The heat reservoir 20 has a bigger radius than that of the heat pipe. The evaporating section 120 of the heat pipe extends through the heat reservoir 20, thereby to position the heat reservoir 20 thereon. The heat reservoir 20 comprises an outer wall 211 and a pair of lateral sides 221 connecting with two opposite ends of the outer wall 211 to form a sealed chamber. A second capillary wick structure 22 is formed at an inner surface of the heat reservoir 20 and an outer surface of the evaporating section 120. A second working fluid (not shown) is contained in the heat reservoir 20. A vapor channel 24 is defined along an axial direction of the heat reservoir 20 and is located at a center of the heat reservoir 20 to guide vapor to flow therein. The heat reservoir 20 is vacuum-exhausted to make the second working fluid easy to evaporate.
In use, the heat reservoir 20 mounted on the evaporating section 120 of the heat pipe first absorbs heat from heat resource; the heat is transferred to the second working fluid contained in the heat reservoir 20 whereby the second working fluid evaporates into vapor. The vapor condenses and releases the heat. Then the heat is transferred to the first working fluid contained in the evaporating section 120 so that the first working fluid quickly evaporates into vapor. The generated vapor moves towards and carries the heat simultaneously to the condensing section 160 where the vapor is condensed into liquid after releasing the heat into ambient environment. The heat reservoir 20 has a so large heat absorbing area that the heat from the heat resource can be quickly absorbed by the heat reservoir 20. The absorbed heat is then quickly transferred to the evaporating section 120 and released at the condensing section 160, thereby to reduce the heat resistance of the heat pipe and enhance the maximum heat transfer capacity of the heat pipe.
Alternatively, a cylinder inner wall (not shown) is formed in the heat reservoir 20. The inner wall interconnects the two opposite lateral sides 221. The evaporating section 120 of the heat pipe is inserted into the heat reservoir 20 and is interferentially engaged with the inner wall of the heat reservoir 20, whereby the heat reservoir 20 is positioned on evaporating section 120 of the heat pipe. Alternatively, the heat reservoir 20 is positioned on the evaporating section 120 of the heat pipe by solder means or glue means.
It is to be understood, however, that even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Number | Date | Country | Kind |
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200610060306.1 | Apr 2006 | CN | national |