The present invention relates to heat radiation apparatuses, phase-change cooling apparatuses including the heat radiation apparatuses, and methods for radiating heat and, in particular, to a heat radiation apparatus, a phase-change cooling apparatus including the heat radiation apparatus, and a method for radiating heat that are used for cooling an electronic device or the like.
In recent years, with miniaturization and enhanced performance of an electronic device, the amount of heat generation and the heat generation density of the electronic device have been increasing. In order to cool such an electronic device or the like efficiently, it is necessary to adopt a cooling system having high cooling capacity. A phase-change cooling system using phase change of a refrigerant has attracted attention as one of the cooling systems having high cooling capacity.
In a cooling apparatus (phase-change cooling apparatus) by the phase-change cooling system, a refrigerant having received heat in a heat receiving section boils (vaporizes), becomes a gas-liquid two-phase flow, and then flows into a heat radiating section. The gas-phase refrigerant condenses and radiates heat in the heat radiating section; consequently, the heat is transported. In this case, if a liquid-phase refrigerant included in the gas-liquid two-phase flow directly enters a heat-radiating tube constituting the heat radiating section, the heat-radiating tube is blocked in the vicinity of an inlet port, which inhibits the gas-phase refrigerant from entering. As a result, there has been the problem that the refrigerant becomes unable to circulate satisfactorily.
One example of techniques to solve the problem is described in Patent Literature 1. A phase-change cooling apparatus (boiling cooling apparatus) described in Patent Literature 1 includes a refrigerant tank in which to pool a liquid refrigerant, and a heat radiator to liquefy the refrigerant vapor that boils having received heat of a heating element in the refrigerant tank by heat exchange with external fluid (air, for example).
The heat radiator includes a vapor-side header into which the refrigerant vapor having boiled by receiving heat of the heating element in the refrigerant tank flows, a core section composed of a heat-radiating tube and a heat-radiating fin, and a liquid-side header into which condensate liquid having liquefied in the core section flows. The heat-radiating tube connects the vapor-side header to the liquid-side header. One end of the heat-radiating tube is disposed protruding into the vapor-side header from an inner wall surface of a header plate of the vapor-side header, which forms a gas-liquid separating structure.
The above-described configuration can prevent the liquid refrigerant from entering the heat-radiating tube even though the liquid refrigerant scattering with the refrigerant vapor from the refrigerant tank enters the vapor-side header, because the liquid refrigerant and the refrigerant vapor are separated from each other by the gas-liquid separating structure in the vapor-side header. As a result, it is said that the boiling cooling apparatus described in Patent Literature 1 can operate stably because only refrigerant vapor can enter the heat-radiating tube, and a refrigerant can circulate successfully between the refrigerant tank and the heat radiator.
[PTL 1] Japanese Unexamined Patent Application Publication No. 2000-156444 (paragraphs [0010] to [0022], FIG. 1)
As mentioned above, the related phase-change cooling apparatus (boiling cooling apparatus) described in Patent Literature 1 is configured to include the heat radiator in which one end of the heat-radiating tube is disposed protruding into the vapor-side header. The configuration prevents the gas-phase refrigerant from being filled sufficiently into an end of the vapor-side header even though a heat-radiating region is enlarged by increasing the heat-radiating tube in order to enhance cooling capacity, because a flow of the gas-phase refrigerant is prevented due to the protruding end of the heat-radiating tube. As a result, there has been the problem that it is impossible to enhance cooling capacity of the related phase-change cooling apparatus.
As mentioned above, there has been the problem that it is impossible, in a phase-change cooling apparatus in which a refrigerant flows in a gas-liquid two-phase state, to enhance cooling capacity sufficiently even though a heat-radiating region is enlarged.
The object of the present invention is to provide a heat radiation apparatus, a phase-change cooling apparatus including the heat radiation apparatus, and a method for radiating heat that solve the above-mentioned problem that it is impossible, in a phase-change cooling apparatus in which a refrigerant flows in a gas-liquid two-phase state, to enhance cooling capacity sufficiently even though a heat-radiating region is enlarged.
A heat radiation apparatus according to an exemplary aspect of the present invention includes gas-phase refrigerant diffusion means into which a refrigerant in a gas-liquid two-phase state flowing, the gas-phase refrigerant diffusion means being filled with a gas-phase refrigerant included in the refrigerant in the gas-liquid two-phase state; heat-radiating means including a first header, a second header, and a plurality of heat-radiating pipes connecting the first header to the second header, the gas-phase refrigerant flowing through the plurality of heat-radiating pipes; and gas-phase-side connection means for connecting the gas-phase refrigerant diffusion means to the first header, the gas-phase refrigerant flowing in the gas-phase-side connection means.
A method for radiating heat according to an exemplary aspect of the present invention includes receiving a refrigerant in a gas-liquid two-phase state, and generating a diffused gas-phase refrigerant by uniformly diffusing a gas-phase refrigerant included in the refrigerant in the gas-liquid two-phase state; generating a plurality of gas-phase refrigerant flows by making the diffused gas-phase refrigerant branch; and condensing and liquefying each of the plurality of gas-phase refrigerant flows.
According to the heat radiation apparatus, the phase-change cooling apparatus including the heat radiation apparatus, and the method for radiating heat of the present invention, it is possible to enhance cooling capacity sufficiently by enlarging a heat-radiating region even though a phase-change cooling system in which a refrigerant flows in a gas-liquid two-phase state is used.
Example embodiments of the present invention will be described with reference to drawings below.
A refrigerant in a gas-liquid two-phase state flows into the gas-phase refrigerant diffusion section 110, which is filled with a gas-phase refrigerant included in the refrigerant in the gas-liquid two-phase state. The heat radiating section 120 includes a first header 121, a second header 122, and a plurality of heat-radiating pipes 123 connecting the first header 121 to the second header 122. The gas-phase refrigerant flows through the plurality of heat-radiating pipes 123. The gas-phase-side connection 130 connects the gas-phase refrigerant diffusion section 110 to the first header 121, which makes the gas-phase refrigerant flow.
The above-described configuration enables the gas-phase refrigerant included in the refrigerant in the gas-liquid two-phase state to diffuse within and fill the gas-phase refrigerant diffusion section 110, and then flow into the first header 121 constituting the heat radiating section 120 through the gas-phase-side connection 130. Consequently, the heat-radiating pipes 123 do not prevent the gas-phase refrigerant from flowing and diffusing even though a heat-radiating region is enlarged by increasing the number of heat-radiating pipes 123 in order to enhance cooling capacity. Therefore, according to the heat radiation apparatus 100 in the present example embodiment, it is possible to enhance cooling capacity sufficiently by enlarging a heat-radiating region even though a phase-change cooling system in which a refrigerant flows in a gas-liquid two-phase state is used.
The heat radiating section 120 is typically a parallel-flow-type heat radiator as illustrated in
As illustrated in
As illustrated in
As illustrated in
The gas-phase-side connection 130 and the gas-phase refrigerant diffusion section 110 or the upper header (first header 121) can be connected by brazing or welding.
Next, a method for radiating heat according to the present example embodiment will be described.
In the method for radiating heat according to the present example embodiment, first, a refrigerant in a gas-liquid two-phase state is received, and a diffused gas-phase refrigerant is generated by uniformly diffusing a gas-phase refrigerant included in the refrigerant in the gas-liquid two-phase state. Next, a plurality of gas-phase refrigerant flows are generated by making the diffused gas-phase refrigerant branch. Then each of the plurality of gas-phase refrigerant flows is condensed and liquefied. As described above, the gas-phase refrigerant is uniformly diffused and made to turn to the diffused gas-phase refrigerant, and then it is made to branch, which enables the pressure loss to decrease as compared with the case where a gas-phase refrigerant included in a refrigerant in a gas-liquid two-phase state is made to branch directly. In this case, the diffused gas-phase refrigerant can be made to branch so that the flow distribution of a plurality of gas-phase refrigerant flows may become symmetric. In this case, the maximum value of the pressure loss with respect to each of the plurality of gas-phase refrigerant flows can be decreased.
As mentioned above, according to the method for radiating heat of the present example embodiment, it is possible to enhance cooling capacity sufficiently even though a phase-change cooling system in which a refrigerant flows in a gas-liquid two-phase state is used.
Next, a second example embodiment of the present invention will be described.
The heat radiation apparatus 200 according to the present example embodiment includes a gas-phase refrigerant diffusion section 110, a heat radiating section 120, and a gas-phase-side connection 130. A refrigerant in a gas-liquid two-phase state flows into the gas-phase refrigerant diffusion section 110, which a gas-phase refrigerant included in the refrigerant in the gas-liquid two-phase state fills. The heat radiating section 120 includes a first header 121, a second header 122, and a plurality of heat-radiating pipes 123 connecting the first header 121 to the second header 122. The gas-phase refrigerant flows through the plurality of heat-radiating pipes 123. The gas-phase-side connection 130 connects the gas-phase refrigerant diffusion section 110 to the first header 121, which makes the gas-phase refrigerant flow. The configuration above is similar to the configuration of the heat radiation apparatus 100 according to the first example embodiment.
The heat radiation apparatus 200 according to the present example embodiment further includes a liquid-phase refrigerant transport section 210 and a liquid-phase-side connection 220, in addition to the above-described configuration. The liquid-phase refrigerant transport section 210 stores and transports a liquid-phase refrigerant having passed through the heat-radiating pipes 123. The liquid-phase-side connection 220 connects the liquid-phase refrigerant transport section 210 to the second header 122, which makes the liquid-phase refrigerant flow.
As illustrated in
As illustrated in
The heat radiating section 120 may be configured to include a plurality of heat-radiating regions (heat radiators). That is to say, as illustrated in
In this case, the gas-phase-side connection 130 is configured to include a plurality of gas-phase-side connection structures 330 each of which connects the gas-phase refrigerant diffusion section 110 to the first header region 321, which a gas-phase refrigerant flows through. The gas-phase-side connection structure 330 can be configured to connect the gas-phase refrigerant diffusion section 110 to a central region in a longitudinal direction of the first header region 321, respectively.
As illustrated in
In the heat radiation apparatus 300 described above, it is desirable for the cross-sectional area of the gas-phase refrigerant diffusion section 110 to be larger than the cross-sectional area of the first header region 321 because the gas-phase refrigerant diffusion section 110 has to supply the gas-phase refrigerant to the plurality of heat-radiating regions 320. It is also desirable, in order to reduce pressure loss, for the gas-phase-side connection structure 330 connecting the gas-phase refrigerant diffusion section 110 to each upper header (first header region 321) to include a pipe structure (pipe) with the cross-sectional area comparable to that of the upper header.
Next, the operations of the heat radiation apparatus 200 and the heat radiation apparatus 300 according to the present example embodiment will be described.
In phase-change cooling apparatuses, a refrigerant is transported in a state where gas-liquid two phases are mixed (a gas-liquid two-phase state). The reason is as follows. The liquid-phase refrigerant having received heat in a heat receiving apparatus (vaporization section) vaporizes and then flows into the gas-phase refrigerant diffusion section 110. In the heat receiving apparatus, not all the liquid-phase refrigerants phase-change to gas-phase refrigerants, but part of the refrigerants flows remaining in the liquid-phase refrigerant.
The refrigerant flowing in the gas-phase refrigerant diffusion section 110 branches and flows into each of the plurality of heat radiators (the heat radiating section 120, the heat-radiating regions 320) connected to the gas-phase refrigerant diffusion section 110. The refrigerant flows into the upper header (the first header 121, the first header region 321) of each heat radiator through the gas-phase-side connection structure 330.
The refrigerant in the gas-liquid two-phase state including the liquid-phase refrigerant having flowed into the upper header bumps against a wall surface of the upper header, and the liquid-phase refrigerant mixed with the gas-phase refrigerant drops. The reason is as follows. The liquid-phase refrigerant is larger in density than the gas-phase refrigerant; accordingly, it loses its momentum and drops under its own weight. In contrast, the gas-phase refrigerant is distributed in the upper part within the upper header because it is smaller in density than the liquid-phase refrigerant; accordingly, the gas-phase refrigerant loses a smaller amount of momentum compared to the liquid-phase refrigerant even though the gas-phase refrigerant bumps against the wall surface of the upper header. This makes the gas-phase refrigerant move along the wall surface of the upper header in the longitudinal direction of the upper header.
The gas-phase refrigerant having moved in the longitudinal direction of the upper header flows, from its opening, into each heat-radiating tube (the heat-radiating pipes 123, 323) connected to the upper header, and radiates the heat having received in the heat receiving apparatus, in the region where a fin is connected on the outside.
Here, as illustrated in
If a liquid-phase refrigerant is mixed in a gas-phase refrigerant, the gas-phase refrigerant is prevented from flowing because the liquid-phase refrigerant is larger in density than the gas-phase refrigerant. This makes it difficult to distribute the gas-phase refrigerant efficiently to each heat-radiating tube. However, the configurations of the heat radiation apparatus 200 and the heat radiation apparatus 300 according to the present example embodiment make it possible to increase the amount of gas-phase refrigerant that can move within the upper header. Consequently, the gas-phase refrigerant can be supplied more equally to each heat-radiating tube. This enables the cooling performance to improve.
In contrast, the liquid-phase refrigerant condensed in each heat-radiating tube drops due to the action of gravity, and flows into the lower header (the second header 122, the second header region 322). Not all the refrigerant flowing into the lower header is a liquid-phase refrigerant, but a gas-phase refrigerant is mixed in part of the refrigerant. Because the gas-phase refrigerant is smaller in density than the liquid-phase refrigerant, the gas-phase refrigerant remains in the upper part of the lower header. In this case, the heat radiation apparatus 200 and the heat radiation apparatus 300 according to the present example embodiment have a configuration in which the second end E2 of the heat-radiating tube (the heat-radiating pipe 123, 323) extends into the lower header (the second header 122, the second header region 322), as illustrated in
Because the gas-phase refrigerant is smaller in density than the liquid-phase refrigerant, the gas-phase refrigerant is higher in flow velocity than the liquid-phase refrigerant, which sometimes prevents the liquid-phase refrigerant from flowing. In the heat radiation apparatus 200 and the heat radiation apparatus 300 according to the present example embodiment, however, it is possible to drain the liquid-phase refrigerant out into the liquid-phase refrigerant transport section 210 efficiently because the flow of the gas-phase refrigerant in the lower header is limited as mentioned above.
Thus, according to the heat radiation apparatus 200 and the heat radiation apparatus 300 of the present example embodiment, the gas-phase refrigerant is not prevented from flowing due to the mixed liquid-phase refrigerant, which makes it easier to distribute the gas-phase refrigerant equally to each heat-radiating tube. In addition, it is possible to drain the liquid-phase refrigerant condensed in the heat radiating section 120 out into the liquid-phase refrigerant transport section 210 efficiently without being blocked by the flow of the gas-phase refrigerant having flowed into the lower header remaining uncondensed. This makes it possible to improve the cooling performance of the heat radiation apparatuses 200 and 300.
As described above, according to the heat radiation apparatus 200 and the heat radiation apparatus 300 of the present example embodiment, it is possible to enhance cooling capacity sufficiently by enlarging a heat-radiating region even though a phase-change cooling system in which a refrigerant flows in a gas-liquid two-phase state is used.
Next, a third example embodiment of the present invention will be described.
The phase-change cooling apparatus 1000 according to the present example embodiment includes a heat radiation apparatus 1100, a heat receiving apparatus 1200, a first connection 1300, and a second connection 1400.
The heat radiation apparatus 1100 has a configuration similar to that of the heat radiation apparatus 200 or the heat radiation apparatus 300 according to the above-described second example embodiment, and includes the gas-phase refrigerant diffusion section 110, the heat radiating section 120, the gas-phase-side connection 130, the liquid-phase refrigerant transport section 210, and the liquid-phase-side connection 220. The heat radiation apparatus 1100 is typically a condenser that makes a gas-phase refrigerant condense and liquefy.
The heat receiving apparatus 1200 generates a refrigerant in a gas-liquid two-phase state by receiving heat from a cooling target. That is to say, the heat receiving apparatus 1200 includes a vaporizer that contains a refrigerant and generates a gas-liquid two-phase refrigerant by receiving heat.
The first connection 1300 connects the heat receiving apparatus 1200 to the gas-phase refrigerant diffusion section 110. The second connection 1400 connects the heat receiving apparatus 1200 to the liquid-phase refrigerant transport section 210.
The refrigerant in the gas-liquid two-phase state generated in the heat receiving apparatus 1200 passes through the first connection 1300, and then flows into the heat radiating section 120 through the gas-phase-side connection 130 from the gas-phase refrigerant diffusion section 110 in the heat radiation apparatus 1100. The liquid-phase refrigerant having condensed and liquefied in the heat radiating section 120 flows into the liquid-phase refrigerant transport section 210 through the liquid-phase-side connection 220, and flows back to the heat receiving apparatus 1200 through the second connection 1400. In this way, a phase-change cooling cycle is completed.
The phase-change cooling apparatus 1000 can be configured to include the heat receiving apparatus 1200 placed inside a building and the heat radiation apparatus 1100 placed outside the building, for example. Specifically, for example, the heat receiving apparatus 1200 is placed in a factory, a data center, or the like in order to receive heat generated in a server room or the like. The heat radiation apparatus 1100 is also placed in order to radiate heat received in the heat receiving apparatus 1100 to outside air.
The phase-change cooling apparatus 1000 is not limited to employing the phase-change cooling system with natural circulation of the refrigerant, but it can be also configured as a pump-circulation-type phase-change cooling apparatus by including a pump for refrigerant circulation in the second connection 1400.
The phase-change cooling apparatus 1000 according to the present example embodiment is configured to include the heat radiation apparatus 1100 configured similarly to the heat radiation apparatus 200 or the heat radiation apparatus 300 according to the second example embodiment. Therefore, as mentioned above, it is possible to enhance cooling capacity sufficiently by enlarging a heat-radiating region even though a phase-change cooling system in which a refrigerant flows in a gas-liquid two-phase state is used.
While the invention has been particularly shown and described with reference to example embodiments thereof, the invention is not limited to these embodiments. It will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention as defined by the claims.
This application is based upon and claims the benefit of priority from Japanese patent application No. 2015-253988, filed on Dec. 25, 2015, the disclosure of which is incorporated herein in its entirety by reference.
Number | Date | Country | Kind |
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2015-253988 | Dec 2015 | JP | national |
Filing Document | Filing Date | Country | Kind |
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PCT/JP2016/087783 | 12/19/2016 | WO | 00 |