Claims
- 1. A method of covering a substrate with a covering member which is sealed around at least one section of said substrate with a covering member which is sealed around at least one section of said substrate, which method comprises
- (1) providing an assembly comprising a substrate and a covering member, said covering member comprising a heat-shrinkable band portion which has a closed cross-section and passes around at least one section of said substrate; said section comprising an exterior wall portion composed of a first crystalline polymeric composition which has a gel fraction of at most 0.3 and a crystalline melting point T.sub.1 and in which there is dispersed an absorptive material which absorbs electromagnetic radiation; and said band portion comprising a heat-shrinkable interior wall portion composed of a second crystalline polymeric composition which has a gel fraction of at least 0.3 and a crystalline melting point T.sub.2 equal to at least (T.sub.1 +5).degree. C. and which absorbs electromagnetic radiation; and
- (2) exposing the exterior of said heat-shrinkable band portion to electromagnetic radiation, said radiation and said first and second polymeric compositions being such that said band portion absorbs a fraction of said radiation which heats said band portion to its shrinkage temperature and transmits a fraction of said radiation, at least portion of said transmitted fraction being absorbed by said exterior wall portion of the substrate and heating said exterior wall portion of the substrate to a temperature which is at least equal to its crystalline melting point T.sub.1, whereby said interior wall portion of the covering member shrinks into direct sealing contact with said exterior wall portion of the substrate.
- 2. A method according to claim 1 wherein said radiation is infra-red radiation and said heat-shrinkable band portion of the covering member, when exposed to radiation having a wavelength of 1.15 microns, transmits 5 to 40% of the radiation.
- 3. A method according to claim 1 wherein said first polymeric composition comprises an ethylene polymer having a density of 0.90 to 0.94.
- 4. A method according to claim 3 wherein said density is 0.91 to 093.
- 5. A method according to claim 3 wherein said ethylene polymer comprises at least 90% by weight of ethylene units.
- 6. A method according to claim 1 wherein said first polymeric composition has a gel fraction of at most 0.2 and said second polymeric composition has a gel fraction of at least 0.4.
- 7. A method according to claim 6 wherein said first polymeric composition is substantially free from cross-linking.
- 8. A method according to claim 1 wherein T.sub.2 is equal to at least (T.sub.1 +10).degree. C.
- 9. A method according to claim 1 wherein the exterior of said exterior wall portion of the substrate is heated to a temperature of at least T.sub.1 before said band portion is heated to its shrinkage temperature.
- 10. A method according to claim 9 wherein the said exterior wall portion is heated to a temperature of at least T.sub.1 to a depth of at least 0.0005 inch.
- 11. A method according to claim 9 wherein said exterior wall portion is heated to a temperature of not more than (T.sub.1 -5).degree. C. at a depth of 0.075 inch.
- 12. A method according to claim 9 wherein said exterior wall portion is heated to a temperature of at least T.sub.1 to a depth of 0.0005 to 0.005 inch.
CROSS REFERENCE TO RELATED APPLICATION
This application is a continuation-in-part of our copending application Ser. No. 897,805 filed Apr. 19, 1978 now U.S. Pat. No. 4,163,117.
US Referenced Citations (7)
Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
897805 |
Apr 1978 |
|