Heat reflector for semiconductor manufacturing equipment

Information

  • Patent Grant
  • D1053157
  • Patent Number
    D1,053,157
  • Date Filed
    Tuesday, January 24, 2023
    2 years ago
  • Date Issued
    Tuesday, December 3, 2024
    5 months ago
  • Inventors
    • Sato; Akihiro
  • Original Assignees
  • Examiners
    • Oswecki; Elizabeth J
    Agents
    • FITCH, EVEN, TABIN & FLANNERY, LLP
  • US Classifications
    Field of Search
    • US
    • D13 102
    • D13 182
    • D13 184
    • D13 199
    • D13 101
    • D13 129
    • D13 118
    • D13 123
    • D13 132
    • D15 144
    • D15 1441
    • D15 199
    • 118 715000
    • 156 345330
    • 156 345340
    • CPC
    • C30B25/10
    • C30B25/16
    • H01L21/67
    • H01L21/68
    • H01L21/687
    • H01L21/67309
    • H01L21/67115
    • H01L21/67005
    • H01L21/67011
    • H01L21/67098
    • H01L21/67132
    • H01L21/67248
    • H01L27/14629
    • H05K7/20409
    • C23C14/50
    • C23C16/44
    • C23C16/4401
    • C23C16/4582
    • C23C16/4583
    • C23C16/4584
    • C23C16/4585
    • C23C16/4586
    • C23C16/48
  • International Classifications
    • 1303
    • Term of Grant
      15Years
      Disclaimer
      This patent is subject to a terminal disclaimer.
Abstract
Description


FIG. 1 is a front, top and right side perspective view of a heat reflector for semiconductor manufacturing equipment, showing my new design;



FIG. 2 is a front elevational view thereof;



FIG. 3 is a rear elevational view thereof;



FIG. 4 is a left side elevational view thereof;



FIG. 5 is a right side elevational view thereof;



FIG. 6 is a top plan view thereof;



FIG. 7 is a bottom plan view thereof;



FIG. 8 is a cross-sectional view taken along line 8-8 in FIG. 2; and,



FIG. 9 is an enlarged portion view taken from the encircled portion, labeled “FIG. 9,” in FIG. 8.


The dot-dashed lines show the boundary of the enlarged portion view of FIG. 9 in FIGS. 8 and 9, and form no part of the claimed design.


The surface members shown in FIGS. 1 and 2 are made of a transparent material with a mirror finish inside the frame of the transparent material.


Claims
  • The ornamental design for a heat reflector for semiconductor manufacturing equipment as shown and described.
Priority Claims (1)
Number Date Country Kind
2022-017170 D Aug 2022 JP national
US Referenced Citations (15)
Number Name Date Kind
5088006 del Puerto Feb 1992 A
6035100 Bierman Mar 2000 A
6108491 Anderson Aug 2000 A
6815645 Abe Nov 2004 B2
7772527 Choi Aug 2010 B2
D654883 Honma Feb 2012 S
D654884 Honma Feb 2012 S
D804437 Kantor Dec 2017 S
D818961 Yamaguchi May 2018 S
D849422 Tai May 2019 S
10283637 Hung May 2019 B2
10453713 Cho Oct 2019 B2
D924823 Saiki et al. Jul 2021 S
D981972 Morita Mar 2023 S
D1003834 Okajima Nov 2023 S
Foreign Referenced Citations (2)
Number Date Country
307244983 Sep 2021 CN
1624353 Feb 2019 JP
Non-Patent Literature Citations (1)
Entry
113 Applied Materials Reflector Plate, Inject, 300MM Radiance Plus 0041-12156,https://www.ebay.com/itm/114949674079, 2024. (Year: 2024).