Heat removal design for LED bulbs

Information

  • Patent Grant
  • 8853921
  • Patent Number
    8,853,921
  • Date Filed
    Tuesday, August 27, 2013
    10 years ago
  • Date Issued
    Tuesday, October 7, 2014
    9 years ago
  • CPC
    • F21V29/248
  • US Classifications
    Field of Search
    • CPC
    • F21Y2101/02
    • F21Y2111/007
    • F21Y2111/005
    • F21Y2103/003
    • F21Y2105/001
    • F21Y2111/001
    • F21Y2111/002
    • F21V29/248
    • F21V29/30
    • F21V3/005
    • F21V31/04
    • H01L33/648
    • H01L33/641
    • Y10S362/80
    • F21S10/002
    • F21S48/215
    • H01K1/58
  • International Classifications
    • H01J1/02
    • H01J7/24
    • H01J61/52
    • H01K1/58
    • F21V29/00
Abstract
An LED bulb having bulb-shaped shell and thermally conductive fluid or gel within the shell. The bulb includes at least one LED within the shell. The bulb includes at least one LED within the shell and a base. The base can be configured to fit within an electrical socket and can include a series of screw threads and a base pin, wherein the screw threads and base pin are dimensioned to be received within a standard electrical socket. Alternatively, the base can be configured to fit within a suitable electric socket.
Description
FIELD OF THE INVENTION

The present invention relates to replacement of bulbs used for lighting by light emitting diode (LED) bulbs, and more particularly, to the efficient removal of the heat generated by the LEDs in order to permit the replacement bulb to match the light output of the bulb being replaced.


BACKGROUND OF THE INVENTION

An LED consists of a semiconductor junction, which emits light due to a current flowing through the junction. At first sight, it would seem that LEDs should make an excellent replacement for the traditional tungsten filament incandescent bulb. At equal power, they give far more light output than do incandescent bulbs, or, what is the same thing, they use much less power for equal light; and their operational life is orders of magnitude larger, namely, 10-100 thousand hours vs. 1-2 thousand hours.


However, LEDs have a number of drawbacks that have prevented them, so far, from being widely adopted as incandescent replacements. Among the chief of these is that, although LEDs require substantially less power for a given light output than do incandescent bulbs, it still takes many watts to generate adequate light for illumination. Whereas the tungsten filament in an incandescent bulb operates at a temperature of approximately 3000° (degrees) K, an LED, being a semiconductor, cannot be allowed to get hotter than approximately 120° C. The LED thus has a substantial heat problem: If operated in vacuum like an incandescent, or even in air, it would rapidly get too hot and fail. This has limited available LED bulbs to very low power (i.e., less than approximately 3 W), producing insufficient illumination for incandescent replacements. One additional method for getting a “white LED” is to use a colored cover over a blue or other colored LED, such as that made by JKL Lamps™. However, this involves significant loss of light.


One possible solution to this problem is to use a large metallic heatsink, attached to the LEDs. This heatsink would then extend out away from the bulb, removing the heat from the LEDs. This solution is undesirable, and in fact has not been tried, because of the common perception that customers will not use a bulb that is shaped radically differently from the traditionally shaped incandescent bulb; and also from the consideration that the heatsink may make it impossible for the bulb to fit in to pre-existing fixtures.


This invention has the object of developing a light emitting apparatus utilizing light emitting diodes (LEDs), such that the above-described primary problem is effectively solved. It aims at providing a replacement bulb for incandescent lighting having a plurality of LEDs with a light output equal in intensity to that of an incandescent bulb, and whose dissipated power may be effectively removed from the LEDs in such a way that their maximum rated temperature is not exceeded. The apparatus includes a bulb-shaped shell, preferably formed of a plastic such as polycarbonate. The shell and/or the bulb may be transparent, or may contain materials dispersed in it to disperse the light, making it appear not to have point sources of light, and may also contain materials dispersed in it to change the bluish color of the LED light to more yellowish color, more closely resembling the light from normal incandescent bulbs.


SUMMARY OF THE INVENTION

In accordance with one embodiment, an LED bulb comprises: a bulb-shaped shell, wherein the shell may be any shape, or any of the other conventional or decorative shapes used for bulbs; a thermally conductive fluid within the bulb-shaped shell; at least one LED within the bulb-shaped shell; and a base dimensioned to be received within an electrical socket.


In accordance with another embodiment, a method of manufacturing an LED bulb comprises: creating a plastic bulb-shaped shell; at least partially filling the shell with a fluid, wherein the fluid is thermally conductive; and installing at least one LED in the fluid.


In accordance with a further embodiment, a method of manufacturing an LED bulb comprises: creating a plastic bulb-shaped shell; installing at least one LED within the plastic bulb-shaped shell; and at least partially filling the shell with a fluid, wherein the fluid is thermally conductive.





BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention. In the drawings,



FIG. 1 is a cross-sectional view of an LED replacement bulb showing the light-emitting portion of an LED mounted in a fluid.



FIG. 2 is a cross-sectional view of an LED replacement bulb showing an LED embedded in the shell, while remaining in thermal contact with the fluid.



FIG. 3 is a cross-sectional view of an LED replacement bulb showing a plurality of LEDs mounted in a fluid.





DETAILED DESCRIPTION

Reference will now be made in detail to the present preferred embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts. According to the design characteristics, a detailed description of each preferred embodiment is given below.



FIG. 1 shows a cross-sectional view of an LED replacement bulb 10 showing the light-emitting portion of the LED mounted in a fluid according to one embodiment. As shown in FIG. 1, the LED replacement bulb 10 includes a screw-in base 20, a plastic shell 30, a fluid filled inner portion 40, and at least one LED 50. The screw-in base 20 includes a series of screw threads 22 and a base pin 24. The screw-in base 20 is configured to fit within and make electrical contact with a standard electrical socket. The electrical socket is preferably dimensioned to receive an incandescent or other standard light bulb as known in the art. However, it can be appreciated that the screw-in base 20 can be modified to fit within any electrical socket, which is configured to receive an incandescent bulb, such as a bayonet style base. The screw-in base 20 makes electrical contact with the AC power in a socket through its screw threads 22 and its base pin 24. Inside the screw-in base 20 is a power supply (not shown) that converts the AC power to a form suitable for driving the at least one LED 50. The power supply may also be located somewhere other than in the base, either in the bulb or completely external to it.


The at least one LED 50 includes a light emitting portion 52 and a pair of connecting wires 54, which are connected to the power supply. Typically, the light emitting portion 52 of an LED 50 consists of a die, a lead frame where the die is actually placed, and the encapsulation epoxy, which surrounds and protects the die and disperses and color-shifts the light. The die is bonded with conductive epoxy into a recess in one half of the lead frame, called the anvil due to its shape. The recess in the anvil is shaped to project the radiated light forward. The die's top contact wire is bonded to the other lead frame terminal, or post. It can be appreciated that the example set forth is only one embodiment of an LED and that other suitable LED 50 configurations can be used. As shown in FIG. 1, the shell 30 entirely encases the fluid-filled volume 40 so as to prevent leakage. The shell 30 also encases the at least the light-emitting portion 52 of the LED or LEDs 50, with the connecting wires 54 coming out through the shell 30 through a sealed connection to the power supply. It can be appreciated that the shell 30 (or enclosure) may be any shape, or any of the other conventional or decorative shapes used for bulbs, including but not limited to spherical, cylindrical, and “flame” shaped shells 30. Alternatively, the shell 30 could be a tubular element, as used in compact florescent lamps or other designs.


The shell 30 is filled, either completely or partially, with a thermally conductive fluid 60, such as water or a mineral oil. However, it can be appreciated that any suitable gel material can be used in place of the fluid 60, for example one which upon exposure to atmospheric pressure and/or air gels to prevents the fluid 60 from escaping from the bulb 10 if damaged or broken. For example, the gel like material can be hydrogenated poly (2-hydroxyethyl methacrylate). The fluid 60 acts as the means to transfer the heat generated by the LEDs 50 to the shell 30, where it may be removed by radiation and convection, as in a normal incandescent bulb. The fluid 60 may be transparent, or may contain materials dispersed in it to disperse the light, making it appear not to have point sources of light, and may also contain materials dispersed in it to change the bluish color of the LED light to more yellowish color, more closely resembling the light from normal incandescent bulbs. The fluid 60 is preferably electrically insulating. In addition, the fluid 60 is preferably in a static state within the shell 30.


The LEDs 50 are installed in the fluid in such a way as to prevent them from being shorted. If the fluid is electrically insulating, no special measures need to be taken. However, if the fluid is not electrically insulating, the electrically conductive portions of the LEDs 50 may be electrically insulated to prevent shorting.


When the at least one LED 50 or plurality of LEDs 50 are installed in the fluid 60, the shell 30 is sealed with a watertight seal, preferably with the same material as the shell 30. The electrical contacts for powering the LEDs 50 are brought out through the seal before the sealing is accomplished. These leads are connected to the power source for the LEDs, which will preferentially be included inside the remainder of the bulb. The power source is preferably designed to be compatible with pre-existing designs, so that the bulb may directly replace traditional bulbs without requiring any change in the pre-existing fixture.


In another embodiment, the shell 30 and/or the fluid 60 can include a plurality of bubbles (not shown), wherein the bubbles disperse the light from the at least one LED 50. In yet another embodiment, a dye (not shown) can be added to the shell 30 or the fluid 60 within the shell 30, wherein the dye shifts the light of the at least one LED 50 from a first color spectrum to a second color spectrum.



FIG. 2 shows a cross-sectional view of an LED replacement bulb 10 showing the LED 50 embedded in the shell, while remaining in thermal contact with the fluid 60 according to a further embodiment of this invention. The LED replacement bulb 10 includes a screw-in base 20, a shell 202, a fluid-filled volume 40, and at least one LED 50 with light-emitting part or parts 52. The screw-in base 20 makes electrical contact with the AC power in a socket through its screw threads 22 and its base pin 24. Inside the screw-in base 20 is a power supply (not shown) that converts the AC power to a form suitable for driving the at least one LED 50. The LED or LEDs 50 are comprised of two parts, connecting wires 54 that connect them to the power supply, and the LED or LEDs 52 themselves. The shell 30 entirely encases the fluid-filled volume 40 so as to prevent leakage. The shell 30 also encases the LED or LEDs 50, with the connecting wires 54 connecting to the power supply. In this embodiment, the LED or LEDs 50 are thermally connected to the fluid 40 through a thin shell-wall 70. This shell-wall 70 provides a low thermal resistance path to the fluid 40 for the heat dissipated by the LED or LEDs 50.



FIG. 3 shows a cross-sectional view of an LED replacement bulb 10 comprising a plurality of LEDs 50 mounted in the fluid according to another embodiment of this invention. The LED replacement bulb mainly includes a screw-in base 20, a shell 30, a fluid-filled volume 40, and a plurality of LEDs 50 with connector and support 56. The plurality of LEDs 50 are preferably at least 3 or 4 LED dies arranged to distribute the light source in a suitable configuration. In one embodiment, the plurality of LEDs 50 can be arranged in a tetrahedral configuration. The screw-in base 20 makes electrical contact with the AC power in a socket through its screw threads 22 and its base pin 24. Inside the screw-in base 20 is a power supply (not shown) that converts the AC power to a form suitable for driving the LED or LEDs. The LED or LEDs 50 are comprised of two parts, the connecting wires 56 that connect them to the power supply, and the LED or LEDs 50 themselves. The connecting wires 56 are stiff enough to function as support for the LED or LEDs 50, and also form the interconnects between the LEDs 50 when there are multiple devices. The shell 30 entirely encases the fluid-filled volume 40 so as to prevent leakage. The shell 30 also encases at least the LED or LEDs 50, with the connecting wires 56 coming out through the shell 30 through a sealed connection to the power supply. It can be appreciated that in another embodiment, the support may be a different material from the interconnections or connections.


It can be appreciated that the LED replacement bulbs as shown in FIGS. 1-3 are shown as replacement bulbs for standard incandescent bulbs, however, the bulbs 10 and methods as set forth herein can be adapted to usage with any other powering system or configuration, and can be used for any lighting system, including flashlights, headlights for automobiles or motorcycles, and lanterns.


It will be apparent to those skilled in the art that various modifications and variation can be made to the structure of the present invention without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the present invention cover modifications and variations of this invention provided they fall within the scope of the following claims and their equivalents.

Claims
  • 1. A light emitting diode (LED) bulb comprising: a shell;a thermally conductive liquid in contact with the shell;a plurality of LEDs thermally connected to the thermally conductive liquid, wherein the thermally conductive liquid and the shell are the only means to transfer heat generated by the plurality of LEDs;a base, wherein the base is configured to receive electrical power; anda support extending into the shell, wherein the plurality of LEDs is connected to the support.
  • 2. The LED bulb as set forth in claim 1, further comprising a power source connected to the plurality of LEDs, and wherein the power source is compatible with pre-existing power sources, permitting the bulb to be used in pre-existing fixtures.
  • 3. The LED bulb as set forth in claim 1, wherein the plurality of LEDs is thermally connected to the liquid through a shell-wall.
  • 4. The LED bulb as set forth in claim 1, wherein the liquid is static.
  • 5. The LED bulb as set forth in claim 1, wherein the liquid gels when exposed to air.
  • 6. The LED bulb as set forth in claim 1, wherein the liquid is mineral oil.
  • 7. The LED bulb as set forth in claim 1, wherein the liquid is water.
  • 8. The LED bulb as set forth in claim 1, further comprising a plurality of bubbles within the liquid, wherein the bubbles are configured to disperse the light from the plurality of LEDs.
  • 9. The LED bulb as set forth in claim 1, further comprising a dye added to the liquid, wherein the dye shifts the light of an LED in the plurality of LEDs from a first color spectrum to a second color spectrum.
  • 10. The LED bulb as set forth in claim 1, further comprising a dye added to the shell, wherein the dye shifts the light of an LED in the plurality of LEDs from a first color spectrum to a second color spectrum.
  • 11. The LED bulb as set forth in claim 1 wherein the plurality of LEDs is configured to emit light through the thermally conductive liquid and the shell.
  • 12. The LED bulb as set forth in claim 1, wherein the LEDs are positioned proximate the middle of the interior volume of the shell.
  • 13. A light emitting diode (LED) bulb comprising: a shell;a thermally conductive liquid within the shell, wherein the thermally conductive liquid is thermally connected to the shell;a plurality of LEDs thermally connected to the thermally conductive liquid, wherein the thermally conductive liquid and the shell are the only means to transfer heat generated by the plurality of LEDs;a base, wherein the base is configured to receive electrical power; anda support within the shell, wherein the plurality of LEDs is connected to the support.
  • 14. The LED bulb as set forth in claim 13, further comprising a power source connected to the plurality of LEDs, and wherein the power source is compatible with pre-existing power sources, permitting the bulb to be used in pre-existing fixtures.
  • 15. The LED bulb as set forth in claim 13 wherein the plurality of LEDs is configured to emit light through the thermally conductive liquid and the shell.
  • 16. A method of manufacturing a light emitting diode (LED) bulb comprising: creating a shell;at least partially filling the interior of the shell with a thermally conductive liquid, wherein the thermally conductive liquid is in contact with the shell;installing a plurality of LEDs on a support;inserting the support with the LEDs within the shell; andelectrically connecting the plurality of LEDs to a base;wherein the plurality of LEDs are thermally connected to the thermally conductive liquid, wherein the thermally conductive liquid and the shell are the only means to transfer heat generated by the plurality of LEDs.
  • 17. The method as set forth in claim 16, further comprising installing a power source for the plurality of LEDs within the bulb, and wherein the power source is compatible with pre-existing power sources, permitting the bulb to be used in preexisting fixtures.
  • 18. The method as set forth in claim 16, wherein installing the plurality of LEDs within the shell comprises: mounting the plurality of LEDs on the support; andinstalling the support within the bulb, wherein the plurality of LEDs is within the shell after the support is installed.
  • 19. The method as set forth in claim 16, wherein the plurality of LEDs is configured to emit light through the thermally conductive liquid and the shell.
  • 20. The method as set forth in claim 16, wherein the LEDs are positioned proximate the middle of the interior volume of the shell.
CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No. 12/299,003, now U.S. Pat. No. 8,547,002, which is a National Phase patent application of PCT/US2007/010470, filed Apr. 27, 2007, which claims priority to U.S. Provisional Patent Application No. 60/797,187, filed May 2, 2006, each of which is hereby incorporated by reference in the present disclosure in its entirety.

US Referenced Citations (365)
Number Name Date Kind
3962675 Rowley et al. Jun 1976 A
4025290 Giangiulio May 1977 A
4039885 van Boekhold et al. Aug 1977 A
4077076 Masters Mar 1978 A
4211955 Ray Jul 1980 A
4271458 George, Jr. Jun 1981 A
4290095 Schmidt Sep 1981 A
4325107 MacLeod Apr 1982 A
4336855 Chen Jun 1982 A
4346329 Schmidt Aug 1982 A
4405744 Greinecker et al. Sep 1983 A
4511952 Vanbragt Apr 1985 A
4539516 Thompson Sep 1985 A
4611512 Honda Sep 1986 A
4647331 Koury, Jr. et al. Mar 1987 A
4650509 Vanbragt Mar 1987 A
4656564 Felder Apr 1987 A
4658532 McFarland et al. Apr 1987 A
4663558 Endo May 1987 A
4727289 Uchida Feb 1988 A
4728999 Dannatt et al. Mar 1988 A
4840383 Lombardo Jun 1989 A
4843266 Szanto et al. Jun 1989 A
4875852 Ferren Oct 1989 A
4876632 Osterhout et al. Oct 1989 A
4904991 Jones Feb 1990 A
4916352 Haim et al. Apr 1990 A
4942685 Lin Jul 1990 A
4947300 Wen Aug 1990 A
4967330 Bell et al. Oct 1990 A
4994705 Linder et al. Feb 1991 A
5008588 Nakahara Apr 1991 A
5065226 Kluitmans et al. Nov 1991 A
5065291 Frost et al. Nov 1991 A
5119831 Robin et al. Jun 1992 A
5136213 Sacchetti Aug 1992 A
5224773 Arimura Jul 1993 A
5237490 Ferng Aug 1993 A
5303124 Wrobel Apr 1994 A
5358880 Lebby et al. Oct 1994 A
5377000 Berends Dec 1994 A
5405208 Hsieh Apr 1995 A
5463280 Johnson Oct 1995 A
5496184 Garrett et al. Mar 1996 A
5514627 Lowery et al. May 1996 A
5528474 Roney et al. Jun 1996 A
5561347 Nakamura et al. Oct 1996 A
5585783 Hall Dec 1996 A
5622423 Lee Apr 1997 A
5630660 Chen May 1997 A
5662490 Ogawa Sep 1997 A
5664866 Reniger et al. Sep 1997 A
5667295 Tsui Sep 1997 A
5684354 Gleckman Nov 1997 A
5685637 Chapman et al. Nov 1997 A
5688042 Madadi et al. Nov 1997 A
5726535 Yan Mar 1998 A
5803588 Costa Sep 1998 A
5807157 Penjuke Sep 1998 A
5887967 Chang Mar 1999 A
5890794 Abtahi et al. Apr 1999 A
5892325 Gleckman Apr 1999 A
5899557 McDermott May 1999 A
5929568 Eggers Jul 1999 A
5931562 Arato Aug 1999 A
5931570 Yamuro Aug 1999 A
5936599 Reymond Aug 1999 A
5941626 Yamuro Aug 1999 A
5947588 Huang Sep 1999 A
5952916 Yamabe Sep 1999 A
5963126 Karlin et al. Oct 1999 A
5982059 Anderson Nov 1999 A
5984494 Chapman et al. Nov 1999 A
6003033 Amano et al. Dec 1999 A
6043591 Gleckman Mar 2000 A
6087764 Matei Jul 2000 A
6095671 Hutain Aug 2000 A
6102809 Nichols Aug 2000 A
6120312 Shu Sep 2000 A
6123631 Ginder Sep 2000 A
6147367 Yang et al. Nov 2000 A
6158451 Wu Dec 2000 A
6183310 Shu Feb 2001 B1
6184628 Ruthenberg Feb 2001 B1
6227679 Zhang et al. May 2001 B1
6254939 Cowan et al. Jul 2001 B1
6258699 Chang et al. Jul 2001 B1
6268801 Wu Jul 2001 B1
6273580 Coleman et al. Aug 2001 B1
6276822 Bedrosian et al. Aug 2001 B1
6277685 Lin et al. Aug 2001 B1
6313892 Gleckman Nov 2001 B2
6316911 Moskowitz et al. Nov 2001 B1
6332692 McCurdy Dec 2001 B1
6338647 Fernandez et al. Jan 2002 B1
6357902 Horowitz Mar 2002 B1
6382582 Brown May 2002 B1
6426704 Hutchison Jul 2002 B1
6471562 Liu Oct 2002 B1
6478449 Lee et al. Nov 2002 B2
6480389 Shie et al. Nov 2002 B1
6488392 Lu Dec 2002 B1
6496237 Gleckman Dec 2002 B1
6504301 Lowery Jan 2003 B1
6513955 Waltz Feb 2003 B1
6523976 Turnbull et al. Feb 2003 B1
6528954 Lys et al. Mar 2003 B1
6534988 Flory, IV Mar 2003 B2
6541800 Barnett et al. Apr 2003 B2
6547417 Lee Apr 2003 B2
6568834 Scianna May 2003 B1
6582100 Hochstein et al. Jun 2003 B1
6608272 Garcia Aug 2003 B2
6612712 Nepil Sep 2003 B2
6619829 Chen Sep 2003 B1
6626557 Taylor Sep 2003 B1
6639360 Roberts et al. Oct 2003 B2
6655810 Hayashi et al. Dec 2003 B2
6659632 Chen Dec 2003 B2
6685852 Setlur et al. Feb 2004 B2
6709132 Ishibashi Mar 2004 B2
6711426 Benaron et al. Mar 2004 B2
6713961 Honda et al. Mar 2004 B2
6734633 Matsuba et al. May 2004 B2
6741029 Matsubara et al. May 2004 B2
6742907 Funamoto et al. Jun 2004 B2
6746885 Cao Jun 2004 B2
6750824 Shen Jun 2004 B1
6773192 Chao Aug 2004 B1
6786625 Wesson Sep 2004 B2
6789348 Kneller et al. Sep 2004 B1
6791259 Stokes et al. Sep 2004 B1
6791283 Bowman et al. Sep 2004 B2
6793362 Tai Sep 2004 B2
6793363 Jensen Sep 2004 B2
6796698 Sommers et al. Sep 2004 B2
6805461 Witte Oct 2004 B2
6819049 Bohmer et al. Nov 2004 B1
6819056 Lin Nov 2004 B2
6828590 Hsiung Dec 2004 B2
6864513 Lin et al. Mar 2005 B2
6864554 Lin et al. Mar 2005 B2
6881980 Ting Apr 2005 B1
6886963 Lodhie May 2005 B2
6903380 Barnett et al. Jun 2005 B2
6905231 Dickie Jun 2005 B2
6910794 Rice Jun 2005 B2
6911678 Fujisawa et al. Jun 2005 B2
6911915 Wu et al. Jun 2005 B2
6926973 Suzuki et al. Aug 2005 B2
6927683 Sugimoto et al. Aug 2005 B2
6932638 Burrows et al. Aug 2005 B1
6936857 Doxsee et al. Aug 2005 B2
6943357 Srivastava et al. Sep 2005 B2
6948829 Verdes et al. Sep 2005 B2
6956243 Chin Oct 2005 B1
6964878 Horng et al. Nov 2005 B2
6967445 Jewell et al. Nov 2005 B1
6971760 Archer et al. Dec 2005 B2
6974924 Agnatovech et al. Dec 2005 B2
6982518 Chou et al. Jan 2006 B2
6983506 Brown Jan 2006 B1
7022260 Morioka Apr 2006 B2
7042150 Yasuda May 2006 B2
7058103 Ishida et al. Jun 2006 B2
D525374 Maxik et al. Jul 2006 S
7073920 Konkle, Jr. et al. Jul 2006 B2
7074631 Erchak et al. Jul 2006 B2
7075112 Roberts et al. Jul 2006 B2
7078732 Reeh et al. Jul 2006 B1
D527119 Maxik et al. Aug 2006 S
7086756 Maxik Aug 2006 B2
7086767 Sidwell et al. Aug 2006 B2
D528673 Maxik et al. Sep 2006 S
D531740 Maxik Nov 2006 S
D532532 Maxik Nov 2006 S
7138666 Erchak et al. Nov 2006 B2
7161311 Mueller et al. Jan 2007 B2
7186016 Jao Mar 2007 B2
7213934 Zarian et al. May 2007 B2
7239080 Ng et al. Jul 2007 B2
7241039 Hulse Jul 2007 B2
7246919 Porchia et al. Jul 2007 B2
7261454 Ng Aug 2007 B2
7270446 Chang et al. Sep 2007 B2
7288798 Chang et al. Oct 2007 B2
7315119 Ng et al. Jan 2008 B2
7319293 Maxik Jan 2008 B2
7344279 Mueller et al. Mar 2008 B2
7350933 Ng et al. Apr 2008 B2
7367692 Maxik May 2008 B2
7396142 Laizure, Jr. et al. Jul 2008 B2
7489031 Roberts et al. Feb 2009 B2
7513669 Chua et al. Apr 2009 B2
7524097 Turnbull et al. Apr 2009 B2
7550319 Wang et al. Jun 2009 B2
7677765 Tajul et al. Mar 2010 B2
8075172 Davey et al. Dec 2011 B2
20010008436 Gleckman Jul 2001 A1
20010009400 Maeno et al. Jul 2001 A1
20010019134 Chang et al. Sep 2001 A1
20010026447 Herrera Oct 2001 A1
20010035264 Padmanabhan Nov 2001 A1
20010053077 Anwly-Davies et al. Dec 2001 A1
20020021573 Zhang Feb 2002 A1
20020039872 Asai et al. Apr 2002 A1
20020068775 Munzenberger Jun 2002 A1
20020070449 Yagi et al. Jun 2002 A1
20020085379 Han et al. Jul 2002 A1
20020093287 Chen Jul 2002 A1
20020097586 Horowitz Jul 2002 A1
20020113244 Barnett et al. Aug 2002 A1
20020117692 Lin Aug 2002 A1
20020126491 Chen Sep 2002 A1
20020145863 Stultz Oct 2002 A1
20020149312 Roberts et al. Oct 2002 A1
20020153829 Asai et al. Oct 2002 A1
20020154449 Raphael et al. Oct 2002 A1
20020176246 Chen Nov 2002 A1
20020183438 Amarasekera et al. Dec 2002 A1
20020186538 Kase et al. Dec 2002 A1
20020191416 Wesson Dec 2002 A1
20030025449 Rossner Feb 2003 A1
20030043579 Rong et al. Mar 2003 A1
20030048632 Archer Mar 2003 A1
20030058658 Lee Mar 2003 A1
20030072156 Pohlert et al. Apr 2003 A1
20030079387 Derose May 2003 A1
20030111955 McNulty et al. Jun 2003 A1
20030128629 Stevens Jul 2003 A1
20030142508 Lee Jul 2003 A1
20030164666 Crunk Sep 2003 A1
20030185020 Stekelenburg Oct 2003 A1
20030193841 Crunk Oct 2003 A1
20030201903 Shen Oct 2003 A1
20030230045 Krause et al. Dec 2003 A1
20030231510 Tawa et al. Dec 2003 A1
20040001338 Pine Jan 2004 A1
20040004435 Hsu Jan 2004 A1
20040004441 Yano Jan 2004 A1
20040007980 Shibata Jan 2004 A1
20040008525 Shibata Jan 2004 A1
20040014414 Horie et al. Jan 2004 A1
20040039274 Benaron et al. Feb 2004 A1
20040039764 Gonikberg et al. Feb 2004 A1
20040056600 Lapatovich et al. Mar 2004 A1
20040085017 Lee May 2004 A1
20040085758 Deng May 2004 A1
20040101802 Scott May 2004 A1
20040105262 Tseng et al. Jun 2004 A1
20040113549 Roberts et al. Jun 2004 A1
20040114352 Jensen Jun 2004 A1
20040114367 Li Jun 2004 A1
20040125034 Shen Jul 2004 A1
20040125515 Popovich Jul 2004 A1
20040127138 Huang Jul 2004 A1
20040179355 Gabor Sep 2004 A1
20040183458 Lee Sep 2004 A1
20040187313 Zirk et al. Sep 2004 A1
20040189262 McGrath Sep 2004 A1
20040190305 Arik et al. Sep 2004 A1
20040201673 Asai Oct 2004 A1
20040207334 Lin Oct 2004 A1
20040208002 Wu Oct 2004 A1
20040211589 Chou et al. Oct 2004 A1
20040217693 Duggal et al. Nov 2004 A1
20040233661 Taylor Nov 2004 A1
20040245912 Thurk et al. Dec 2004 A1
20040257804 Lee Dec 2004 A1
20040264192 Nagata et al. Dec 2004 A1
20050007010 Lee Jan 2005 A1
20050007770 Bowman et al. Jan 2005 A1
20050011481 Naumann et al. Jan 2005 A1
20050015029 Kim Jan 2005 A1
20050018424 Popovich Jan 2005 A1
20050023540 Yoko et al. Feb 2005 A1
20050030761 Burgess Feb 2005 A1
20050031281 Nath Feb 2005 A1
20050036299 Tsai Feb 2005 A1
20050036616 Huang et al. Feb 2005 A1
20050047170 Hillburger et al. Mar 2005 A1
20050052885 Wu Mar 2005 A1
20050057187 Catalano Mar 2005 A1
20050063185 Monjo et al. Mar 2005 A1
20050067343 Zulauf et al. Mar 2005 A1
20050068776 Ge Mar 2005 A1
20050084229 Babbitt et al. Apr 2005 A1
20050099787 Hayes May 2005 A1
20050105302 Hofmann et al. May 2005 A1
20050110191 Lin May 2005 A1
20050110384 Peterson May 2005 A1
20050111234 Martin et al. May 2005 A1
20050129979 Kambe et al. Jun 2005 A1
20050141221 Yu Jun 2005 A1
20050151664 Kolish et al. Jul 2005 A1
20050152136 Konkle et al. Jul 2005 A1
20050162864 Verdes et al. Jul 2005 A1
20050174065 Janning Aug 2005 A1
20050174769 Yong et al. Aug 2005 A1
20050174780 Park Aug 2005 A1
20050179358 Soules et al. Aug 2005 A1
20050180136 Popovich Aug 2005 A9
20050180137 Hsu Aug 2005 A1
20050190561 Ng et al. Sep 2005 A1
20050207152 Maxik Sep 2005 A1
20050207159 Maxik Sep 2005 A1
20050217996 Liu et al. Oct 2005 A1
20050224829 Negley et al. Oct 2005 A1
20050230691 Amiotti et al. Oct 2005 A1
20050233485 Shishov et al. Oct 2005 A1
20050237995 Puranik Oct 2005 A1
20050243539 Evans et al. Nov 2005 A1
20050243550 Stekelenburg Nov 2005 A1
20050243552 Maxik Nov 2005 A1
20050255026 Barker et al. Nov 2005 A1
20050258446 Raos et al. Nov 2005 A1
20050259419 Sandoval Nov 2005 A1
20050265039 Lodhie et al. Dec 2005 A1
20050270780 Zhang Dec 2005 A1
20050276034 Malpetti Dec 2005 A1
20050276051 Caudle et al. Dec 2005 A1
20050276053 Nortrup et al. Dec 2005 A1
20050276072 Hayashi et al. Dec 2005 A1
20050285494 Cho et al. Dec 2005 A1
20060002110 Dowling et al. Jan 2006 A1
20060007410 Masuoka et al. Jan 2006 A1
20060034077 Chang Feb 2006 A1
20060044803 Edwards Mar 2006 A1
20060050514 Opolka Mar 2006 A1
20060061985 Elkins Mar 2006 A1
20060071591 Takezawa et al. Apr 2006 A1
20060092644 Mok et al. May 2006 A1
20060142946 Goujon et al. Jun 2006 A1
20060145172 Su et al. Jul 2006 A1
20060158886 Lee Jul 2006 A1
20060176699 Crunk Aug 2006 A1
20060187653 Olsson Aug 2006 A1
20060193121 Kamoshita Aug 2006 A1
20060193130 Ishibashi Aug 2006 A1
20060198147 Ge Sep 2006 A1
20060208260 Sakuma et al. Sep 2006 A1
20060226772 Tan et al. Oct 2006 A1
20060243997 Yang et al. Nov 2006 A1
20060250802 Herold Nov 2006 A1
20060255353 Taskar et al. Nov 2006 A1
20060261359 Huang Nov 2006 A1
20060273340 Lv Dec 2006 A1
20060274524 Chang et al. Dec 2006 A1
20060289884 Soules et al. Dec 2006 A1
20070018181 Steen et al. Jan 2007 A1
20070057364 Wang et al. Mar 2007 A1
20070086189 Raos et al. Apr 2007 A1
20070090391 Diamantidis Apr 2007 A1
20070090737 Hu et al. Apr 2007 A1
20070120879 Kanade et al. May 2007 A1
20070125982 Tian et al. Jun 2007 A1
20070139949 Tanda et al. Jun 2007 A1
20070153518 Chen Jul 2007 A1
20070291490 Tajul et al. Dec 2007 A1
20080013316 Chiang Jan 2008 A1
20080048200 Mueller et al. Feb 2008 A1
20080070331 Ke Mar 2008 A1
20090001372 Arik et al. Jan 2009 A1
20090324875 Heikkila Dec 2009 A1
20100177534 Ryu et al. Jul 2010 A1
Foreign Referenced Citations (9)
Number Date Country
0658933 Oct 2001 EP
63-86484 Apr 1988 JP
7-99372 Apr 1995 JP
33-51103 Sep 2002 JP
2003-16806 Jan 2003 JP
02061805 Aug 2002 WO
2004100213 Nov 2004 WO
2005060309 Jun 2005 WO
2007069119 Jun 2007 WO
Non-Patent Literature Citations (19)
Entry
Final Office Action received for U.S. Appl. No. 12/299,049, mailed on Jan. 4, 2012, 24 pages.
Non Final Office Action received for U.S. Appl. No. 12/299,049, mailed on Jun. 16, 2011, 74 pages.
Non Final Office Action received for U.S. Appl. No. 12/299,049, mailed on Mar. 16, 2012, 11 pages.
Final Office Action received for U.S. Appl. No. 12/299,003, mailed on Oct. 5, 2011, 16 pages.
Non Final Office Action received for U.S. Appl. No. 12/299,003, mailed on Apr. 15, 2011, 60 pages.
Non Final Office Action received for U.S. Appl. No. 12/299,003, mailed on Jun. 13, 2012, 23 pages.
Office Action received for Chinese Patent Application No. 200780015112.2, mailed on Apr. 8, 2010, 25 pages (16 pages of English translation and 9 pages of Office Action).
Final Office Action received for U.S. Appl. No. 12/299,049, mailed on Sep. 5, 2012, 15 pages.
Non Final Office Action received for U.S. Appl. No. 12/681,774, mailed on Oct. 4, 2012, 52 pages.
International Preliminary Report on Patentability and Written Opinion received for PCT Patent Application No. PCT/US2007/010469, issued on Nov. 4, 2008, 12 pages.
International Search Report received for PCT Patent Application No. PCT/US2007/010469, mailed on Aug. 7, 2008, 2 pages.
International Search Report received for PCT Patent Application No. PCT/US2007/010470, mailed on Sep. 29, 2008, 7 pages.
International Preliminary Report on Patentability and Written Opinion received for PCT Patent Application No. PCT/US2007/10470, issued on Nov. 27, 2008, 5 pages.
International Search Report and Written Opinion received for PCT Patent Application No. PCT/US2008/011365, mailed on Dec. 5, 2008, 6 pages.
International Preliminary Report on Patentability received for PCT Patent Application No. PCT/US2008/011365, mailed on Apr. 15, 2010, 7 pages.
Office Action received for New Zealand Patent Application No. 573336, mailed on Apr. 19, 2010, 2 pages.
Supplementary European Search Report and Search Opinion received for European Patent Application No. 07776519.6, mailed on Sep. 24, 2010, 8 pages.
Notice of Allowance received for U.S. Appl. No. 12/299,003, mailed on May 24, 2013, 9 pages.
Final Office Action received for U.S. Appl. No. 12/299,003, mailed on Jan. 7, 2013, 13 pages.
Related Publications (1)
Number Date Country
20140167592 A1 Jun 2014 US
Provisional Applications (1)
Number Date Country
60797187 May 2006 US
Continuations (1)
Number Date Country
Parent 12299003 US
Child 14011636 US