Claims
- 1. A method for manufacturing a heat resistant resin film, comprised of a heat resistant resin, with a metal thin film, comprising the steps of:
biasing a conductive material to one surface of the heat resistant resin film; and applying electrolytic plating to the heat resistant resin film by using the conductive material biased to the one surface of the heat resistant resin film as an electrode to form a metal thin film on the heat resistant resin film.
- 2. The method according to claim 1, wherein the step of biasing uses a difference in specific gravity between the heat resistant resin and the conductive material.
- 3. The method according to claim 2, wherein the use of the difference in specific gravity between the heat resistant resin and the conductive material is a centrifugal molding method in which at least one of an inorganic conductive material and an organic conductive material is subjected to gradient molding.
- 4. The method according to claim 2, wherein the use of the difference in specific gravity between the heat resistant resin and the conductive material is dipping in which at least one of an inorganic conductive material and an organic conductive material is collected near the one surface.
- 5. The method according to claim 1, further comprising the steps of etching the one surface of the heat resistant resin film so that the conductive material existing near the one surface acts as an electrode,
wherein the etching is one of abrasion, sandblasting, and chemical etching.
- 6. The method according to claim 1, wherein the conductive material is metal particles.
- 7. The method according to claim 1, wherein the conductive material is organic conductive polymer.
- 8. The method according to claim 1, wherein the heat resistant resin film is comprised of a heat resistant resin having polyimide as a main component.
- 9. The method according to claim 1, further comprising the step of forming the heat resistant resin film into an endless belt shape.
- 10. The method according to claim 9, wherein the metal thin film generates heat due to electromagnetic induction heating.
- 11. The method according to claim 3, further comprising the steps of mixing the heat resistant resin and a plurality of materials having a difference in specific gravity from each other,
wherein at least one of the plurality of materials is a conductive material.
- 12. The method according to claim 11, wherein the plurality of materials are different in particle size from one another.
- 13. A method for manufacturing a fixing belt for heating toner to fix the toner on a recording medium, comprising the steps of:
biasing a conductive material in a heat resistant resin layer comprised of a heat resistant resin to one surface of the heat resistant resin layer, thereby forming an electrode composed of the conductive material on the one surface of the heat resistant resin layer; and applying electrolytic plating to the heat resistant resin layer by using the electrode to form a metal thin film on the electrode.
- 14. The method according to claim 13, wherein the step of biasing uses a difference in specific gravity between the heat resistant resin and the conductive material.
- 15. The method according to claim 14, wherein the use of the difference in specific gravity between the heat resistant resin and the conductive material is a centrifugal molding method in which at least one of an inorganic conductive material and an organic conductive material is subjected to gradient molding.
- 16. The method according to claim 14, wherein the use of the difference in specific gravity between the heat resistant resin and the conductive material is dipping in which at least one of an inorganic conductive material and an organic conductive material is collected near the one surface.
- 17. The method according to claim 13, further comprising the steps of etching the one surface of the heat resistant resin layer so that the conductive material existing near the one surface acts as an electrode,
wherein the etching is one of abrasion, sandblasting, and chemical etching.
- 18. The method according to claim 13, wherein the conductive material is metal particles.
- 19. The method according to claim 13, wherein the conductive material is organic conductive polymer.
- 20. The method according to claim 13, wherein the heat resistant resin has polyimide as a main component.
Priority Claims (2)
Number |
Date |
Country |
Kind |
2000-387345 |
Dec 2000 |
JP |
|
2001-210647 |
Jul 2001 |
JP |
|
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application is a divisional application of application Ser. No. 09/977,298, filed Oct. 16, 2001, incorporated herein by reference in its entirety.
Divisions (1)
|
Number |
Date |
Country |
Parent |
09977298 |
Oct 2001 |
US |
Child |
10856849 |
Jun 2004 |
US |