Claims
- 1. A heat-sensitive recording material comprising a support and a recording layer comprising microcapsules containing a leuco dye and an organic solvent in a core thereof and a color developer outside of said microcapsules capable of reacting with said leuco dye to produce a color, said microcapsules having walls being of a polymer having a glass transition point of from about 60.degree. C. to 200.degree. C.
- 2. A heat-sensitive recording material as in claim 1, wherein said glass transition point is from about 70.degree. C. to 150.degree. C.
- 3. A heat-sensitive recording material as in claim 1, wherein said microcapsule further contains a glass transition point modifier.
- 4. A heat-sensitive recording material as in claim 3, wherein a glass transition modifier is a carbamic acid ester, an aromatic methoxy compound or an organic sulfonamide compound.
- 5. A heat-sensitive recording material as in claim 3, wherein said glass transition point modifier is a phenol compound.
- 6. A heat-sensitive recording material as in claim 5, wherein said glass transition point modifier is p-benzyloxyphenol.
- 7. A heat-sensitive recording material as in claim 6, wherein said microcapsule wall being of a polymer is polyurethane, polyurea or a mixuture thereof.
- 8. A heat-sensitive recording material as in claim 1, wherein said leuco dye has a partial skeletal structure, which undergoes cleavage or fission on contact with a color developer.
- 9. A heat-sensitive recording material as in claim 8, wherein said leuco dye has a partial skeletal structure of a lactone, a lactam, a sultone, a spiropyran, an ester or an amide.
- 10. A heat-sensitive recording material as in claim 1, wherein said color developer is a phenol compound, an organic acid or metal salts thereof, or a hydroxybenzoic acid ester.
- 11. A heat-sensitive recording material as in claim 10, wherein said phenol compound and an organic acid is melt at about 50.degree. C. to 250.degree. C.
- 12. A heat-sensitive recording material as in claim 1, wherein said organic solvent has a boiling point of at least about 180.degree. C.
- 13. A heat-sensitive recording material as in claim 1, wherein said recording layer has a non-volatile matter content of from about 2.5 to 25 g/m.sup.2.
- 14. A heat-sensitive recording material as in claim 1, wherein said microcapsule wall being of a polymer is polyurethane, polyurea, polyamide, polyester, ureaformaldehyde resin or a mixture thereof.
- 15. A heat-sensitive recording material as in claim 1, wherein said microcapsule wall being of a polymer is polyurethane, polyurea or a mixture thereof.
Priority Claims (1)
Number |
Date |
Country |
Kind |
59-99490 |
May 1986 |
JPX |
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Parent Case Info
This application is a continuation-in-part application of Ser. No. 735,227, filed May 17, 1985, now abandoned.
Foreign Referenced Citations (1)
Number |
Date |
Country |
0045090 |
Mar 1983 |
JPX |
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
735227 |
May 1985 |
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