Claims
- 1. A heat-sensitive stencil comprising a porous substrate formed of natural and/or synthetic fibers having opposing first and second surfaces, said fibers being tightly bound to each other so that said second surface of said substrate is negative to a wax No. 6 pick test, and a thermoplastic resin film bonded to said first surface of said substrate with an adhesive.
- 2. A heat-sensitive stencil as claimed in claim 1, wherein said first surface of said substrate is negative to a wax No. 4 pick test.
- 3. A heat-sensitive stencil according to claim 2, wherein said substrate is a paper having a thickness of 5-70 .mu.m.
- 4. A heat-sensitive stencil as claimed in claim 1, wherein said substrate is a paper having a thickness of 5-70 .mu.m.
Parent Case Info
This application is a Continuation of application Ser. No. 08/508,686, filed Jul. 28, 1995, now abandoned.
US Referenced Citations (1)
Number |
Name |
Date |
Kind |
5091257 |
Nonogaki et al. |
Feb 1992 |
|
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Continuations (1)
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Number |
Date |
Country |
Parent |
508686 |
Jul 1995 |
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