Patent Application
20110214846
1. Field of the Invention
The present invention relates to a heat sink, and in particular to a heat sink and a method for manufacturing the same.
2. Description of Prior Art
With the increase of the operating speed of a processor (such as: CPU) in a computer, the amount of heat generated by the processor also increases accordingly. On the other hand, since an electronic product having such a processor is required to be made more compact, the heat sink associated with the processor has to be designed to meet the requirements for miniaturization, which becomes an important issue for the manufacturers in this art.
The conventional heat sink is constituted of a plurality of heat-dissipating fins. These heat-dissipating fins are mostly made of copper or aluminum. Although the copper-made heat-dissipating fins have the better heat-dissipating efficiency, however, the total weight and cost of such copper-made heat-dissipating fins are large. Although the aluminum-made heat-dissipating fins have a smaller weight and cost, the heat-dissipating efficiency is inferior to that of the copper-made heat-dissipating fins. Further, when the aluminum-made heat-dissipating fins are combined with different materials, a nickel-plating process has to be performed to facilitate the combination of the aluminum-made heat-dissipating fins with the copper-made heat-conducting plate or heat pipes.
In view of the above, the present inventor proposes a novel heat sink based on his expert experience and delicate researches.
The present invention is to provide a heat sink and a method for manufacturing the same, whereby the heat-dissipating area and thus the heat-dissipating efficiency of the heat sink can be increased greatly, and the stability and soldering ability of different materials can be improved.
The present invention further provides a heat sink including a plurality of heat-dissipating fins. One surface of each of the heat-dissipating fins is formed with a metallic coating layer by spraying. At least one end of any one of the heat-dissipating fins is bent to have a fold. Any two adjacent heat-dissipating fins are connected to each other by stacking the respective folds.
The present invention provides a method for manufacturing a heat sink, which including steps of: a) preparing a metallic belt; b) providing a spraying device for spraying a metallic coating layer on one surface of the metallic belt; c) providing a stamping device for blanking the metallic belt to form a heat-dissipating fin; and d) stacking a plurality of heat-dissipating fins to form the heat sink.
The present invention has advantageous features as follows. The surface of aluminum-made heat-dissipating fins are directly sprayed with a copper layer, so that the heat-dissipating fins need not be subjected to a nickel-plating process, which conforms to the requirements for environmental protection and reduces the material cost and manufacturing time.
The detailed description and technical contents of the present invention will be described in more detail with reference to the accompanying drawings. However, it should be noted that the drawings are illustrative only, but not used to limit the scope of the present invention.
Please refer to
Furthermore, the heat sink of the present invention includes a heat-conducting plate 30, which is made of a material having good heat conductivity such as copper or the alloys thereof. The metallic coating layer 20 formed outside the fold 12 is tightly adhered to the surface of the heat-conducting plate 30, and then connected to each other by heating.
Please refer to
In step a), a metallic belt 100 is prepared, which is made of a material having good heat conductivity such as aluminum or the alloys thereof.
In step b), a spraying device 6 is provided for spraying a metallic coating layer 20 on one surface of the metallic belt 100. This spraying step is performed by a Cu plasma injection on the whole or partial surface of the metallic belt 100.
In step c), a stamping device is provided for blanking the metallic belt 100a subjected to the step b) to form a heat-dissipating fin 10. The heat-dissipating fin 10 is formed into a U shape with its upper and lower ends being bent to form two folds 12 and 13 respectively that correspond to each other. In this step, one of the folds 12 (or 13) can be provided with a trough 15 (as shown in
In step d), a plurality of heat-dissipating fins 10 are stacked to form the heat sink. The two folds 12 and 13 of any two adjacent heat-dissipating fins 10 are stacked in such a manner that a partitioning channel 14 (as shown in
Further, the method of the present invention further includes a step e) after the step d). In the step e), a heat-conducting plate 30 is provided, on which the heat-dissipating fins 10 are disposed.
Further, the method of the present invention further includes a step f) after the step e). In the step f), a heating device is provided for heating the heat-dissipating fins 10 and the heat-conducting plate 30, thereby connecting the heat-dissipating fins 10 and the heat-conducting plate 30 with the metallic coating layer 20. Specifically speaking, the metallic coating layer 20 is heated to be soldered to the heat-dissipating fins 10 and the heat-conducting plate 30.
Further, the method of the present invention further includes a step e′) to replace the step e). In the step e′), a heat pipe 40 is provided. One end of the heat pipe 40 penetrates the trough 15 (as shown in
On the other hand, the method of the present invention further includes a step f′) after the step e′). In the step f′), a heating device is provided for heating the heat-dissipating fins 10 and the heat pipe 40, thereby connecting the heat-dissipating fins 10 and the heat pipe 40 with the metallic coating layer 20 (as shown in
Please refer to
Although the present invention has been described with reference to the foregoing preferred embodiments, it will be understood that the invention is not limited to the details thereof. Various equivalent variations and modifications can still occur to those skilled in this art in view of the teachings of the present invention. Thus, all such variations and equivalent modifications are also embraced within the scope of the invention as defined in the appended claims.
