Patent Application
20250181126
The described embodiments relate generally to electronic components. More particularly, the present embodiments relate to heat dissipating electronic components and methods of minimizing interference with radio-frequency sensitive components.
A recent trend in the design of consumer electronics includes the miniaturization of electronic computing devices. This trend is driven by the consumer's desire for portable, compact, and lightweight devices that maintain the same functionalities as previous devices. Such devices can include personal computers, smartphones, head-mountable displays for alternate/virtual reality (AR/VR) devices, smartwatches, and other wearable electronic devices. These devices include a multitude of electronic components producing heat that must be removed for the electronic device to function as intended. Often, heat management strategies and electrical grounding within devices are limiting factors for how small a device can be. This is because the smaller and more compact the device is, the faster the heat can travel from one component to another within the device, and the less space there is for positioning heat dissipation and electrical grounding components.
In many examples, heat and electrical conduction components create a conduction path, allowing a heat source to transfer thermal energy from one region to another region where the thermal energy can be dissipated by thermal conduction or convection. Conduction components can be primarily metal, which can provide efficient transfer of thermal energy and electricity. As the size of portable computing devices has decreased, electronic components, including heat dissipating and electrical grounding components, can be placed in closer proximity to other components providing different functions, such as an antenna.
However, when heat dissipating and/or electrical grounding components are used, radio-frequency (RF) noise can be produced. This RF noise can affect the performance of other electronic components, such as antennas, which can negatively impact functionality. Additionally, as electrical grounding and heat dissipating components become smaller and more delicate, they can be prone to failure, including bending, twisting, or breaking with use over time.
Therefore, what is needed in the art are structurally durable electronic components capable of dissipating heat and grounding electricity that can be placed in close proximity to other electronic components without producing significant amounts of RF interference when in use.
In one example of the present disclosure, an electronic device includes a heat generating component, an electrical ground, a radio-frequency (RF) sensitive component, a conductor extending from the heat generating component to the electrical ground, and a non-metallic barrier at least partially surrounding the conductor and disposed between the conductor and the RF sensitive component.
In one example, the conductor can include metal. In one example, the heat generating component can include a light-emitting diode (LED). In one example, the non-metallic barrier can define a pathway through which the conductor extends. In one example, the RF sensitive component includes an antenna. In one example, the antenna is a first antenna and the electronic device further includes a second antenna. In one example, the non-metallic barrier is disposed between the conductor and the first antenna, and between the conductor and the second antenna. In one example, the electronic device further includes a housing defining an internal volume and an aperture. In one example, the heat generating component includes an LED configured to emit light through the aperture. In one example, the RF sensitive component is disposed in the internal volume.
In one example of the present disclosure, an electronic component includes a heat source, an electrical ground, a non-conductive body defining a pathway extending from the heat source to the electrical ground, and a conducting material disposed in the pathway.
In one example, the conducting material includes a thermal paste. In other examples, the conducting material includes a metal. In one example, the body includes a plastic material. In one example, the pathway is tortuous. In another example, the pathway extends in three dimensions.
In one example of the present disclosure, an electronic device includes a first electronic component, a second electronic component, an RF barrier extending from the first electronic component to the second electronic component, a pathway defined by the RF barrier, and a conductor extending through the pathway and coupling the first electronic component and the second electronic component.
In one example, the electronic device further includes an antenna disposed adjacent to the RF barrier. In one example, the RF barrier is disposed between the conductor and the antenna. In one example, the conductor includes a thermal paste.
The disclosure will be readily understood by the following detailed description in conjunction with the accompanying drawings, wherein like reference numerals designate like structural elements, and in which:
Reference will now be made in detail to representative embodiments illustrated in the accompanying drawings. It should be understood that the following descriptions are not intended to limit the embodiments to one preferred embodiment. To the contrary, it is intended to cover alternatives, modifications, and equivalents as can be included within the spirit and scope of the described embodiments, as defined by the appended claims.
Devices described herein are related to electronic components. More particularly, the present embodiments relate to electrical grounding and heat dissipating electronic components and methods of minimizing interference with radio-frequency sensitive components. In one example, an electrical grounding and heat dissipating electronic component configured to dissipate heat away from and electrically ground a heat generating component can include a conductor extending from the heat generating component and through which thermal and/or electrical energy can flow. An electrical ground can provide a termination point wherein the energy can be dispersed. In addition, a non-metallic barrier, such as plastic, can at least partially surround the conductor and be capable of shielding other nearby components, such as antennas, from frequencies that can be produced by the heat dissipating electronic component. In this way, other components sensitive to frequencies produced by the heat dissipating electronic component can be placed in closer proximity to the heat dissipating electronic component and accompanying heat dissipation components.
In one example, an electronic device can include a heat source such as a light-emitting diode (LED) with a necessary grounding path, for example, a conductor which can be made of metal or another conductive material, by which the LED is grounded. In addition, a non-metallic component capable of structurally supporting the conductor and shielding the conductor portion of the LED can be included. In this way, the RF emissions can be reduced, minimizing the required placement distance from an RF sensitive device. In another example, the aforementioned heat dissipating electronic component can be disposed between multiple antennas and can reduce RF emissions radially such that the distance between multiple antennas and the heat generating and dissipating electronic components can be minimized, resulting in a tightly packed configuration of RF sensitive components in the vicinity of the conductor. In such a tightly packed configuration, the non-metallic component can increase or maximize a distance between a metal or other conductive material of the conductor and the RF sensitive components by providing structural support to a smaller conductor and creating a barrier between the conductor and the RF sensitive components.
In another example, an electronic device with heat dissipating components can include a heat source with a grounding path, an electrical ground, and a non-metallic body defining a torturous pathway extending from the heat source to an electrical ground. The pathway can extend in three dimensions, such as a helical path that circularly traverses a first and second axis, which can be normal in orientation, creating a first plane, while remaining concentric with a third axis perpendicular to the first plane. The body defining the pathway can be created by use of additive manufacturing, molding, or other methods, and can terminate at the electrical ground. In such an example, an electrically and thermally conductive fluid or paste can be used to fill the tortuous pathway. In this way, the heat source is able to transmit energy through the electrically conductive fluid via the tortuous pathway to the electrical ground. The tortuous nature of the path can be designed specifically to wind through various other components that may be sensitive to the heat dissipation, including nearby RF sensitive components and antennas, which can be placed in multiple positions relative to the heat generating component and/or the pathway.
In another example, an electronic device including a heat dissipating component can include a grounding path, an electrical ground, and a non-metallic body containing a torturous path extending from a heat source to an electrical ground. The non-metallic portion can be compliant, able to sustain mechanical stresses that can induce bending, torsion, elongation and other similar stresses that can be produced, while still maintaining an electrical pathway wherein energy can be transmitted from a heat source to an electrical ground by means of a thermal paste or other conductive fluid, liquid, or material.
The examples noted above and described below in more detail provide heat dissipation within electronic devices that enable a more compact design. The electrical grounding and heat dissipation components effectively ground and dissipate energy (including heat and electricity) from heat generating electronic components, while shielding the heat path from interfering with nearby RF sensitive components. In this way, those components can be placed in closer proximity to the heat dissipation path, enabling a more compact design, while maintaining or improving device functionalities. In addition, electrical grounding and heat dissipation components and systems described herein can be structurally sound and durable such that the miniaturization of the device and grounding/dissipation components does not reduce the life of the device nor the life and performance of each component over time.
These and other embodiments are discussed below with reference to
In one example, the device 100 can include a housing 102 or multiple housings defining an internal volume. The heat generating components can be disposed within the internal volume or outside the internal volume. In on example, the heat generating component can communicate with the ambient environment through the housing. For example, the electronic heat generating component can be an LED disposed at or on the housing 102, or within the housing 102 and directing light through an aperture defined by the housing 102. The electrical grounding and heat dissipation components and systems described herein can be disposed within the internal volume defined by the housing 102, but can be connected or coupled to the heat generating component, such as an LED, to direct heat and electricity to a grounding component or a heat sink disposed within the internal volume.
In the illustrated example of
In the illustrated embodiment, the lights 304 can include heat generating LEDs that produce heat and require electrical grounding. The heat dissipation and electrical grounding components and systems described herein can be included in the head-mountable device 300 to dissipate heat generated by the lights 304 and electrically ground the lights 304.
Any of the features, components, and/or parts, including the arrangements and configurations thereof shown in
In at least one example, the first electronic component 404 can include a heat generating electrical component. In one example, the first electronic component 404 can include an LED producing light. One or more examples of electronic components can include light sources producing light in various light spectra, including visible and infrared wavelengths. In one example, the second electronic component 410 can include an electrical grounding component and/or a heat sink. The second electronic component 410 can be configured to electrically ground the first electronic component 404 and/or conduct and disperse heat generated by the first electronic component 404.
In at least one example, the device 400 can also include a sensitive component 414. In one example, the sensitive component 414 can include an RF sensitive component 414. The RF sensitive component 414 can be any electronic component configured for receiving or sending RF signals, such as an antenna, or any other component sensitive to RF signals whose function would be affected by the electricity or heat conducted through the conductor 408 from the first electronic component 404 to the second electronic component 410. In one example, the RF sensitive component 414 can be a heat sensitive component 414 affected by heat such that changes in temperature affect the function or performance of the heat sensitive component 414. For example, the heat sensitive component 414 could be a component affected by heat generated by adjacent electronic components within the device 400, such as by heat generated by the first electronic component 404, the heat transferred through the conductor 408, and/or the heat absorbed or dispersed by the second electronic component 410.
In at least one embodiment, the device 400 can also include a barrier 412 disposed between the conductor 408 and the sensitive component 414. In one example, the barrier can at least partially surround the conductor 408 to shield the sensitive component 414 from heat and/or electricity conducted through the conductor 408 during use. In examples where the sensitive component 414 is an RF sensitive component 414, the barrier 412 can be an RF barrier 412 configured to block RF interference from the electricity passing through the conductor 408 from the RF sensitive component 414. Likewise, in examples where the sensitive component 414 is a heat sensitive component 414, the barrier 412 can be a heat barrier 412 configured to insulate the heat sensitive component 414 from heat passing through the conductor 408.
A minimum distance “D” between the sensitive component 414 and the conductor 408 can be a design requirement to avoid interference that negatively affects the performance of the sensitive device 414. The closer the sensitive component 414 is to the heat or electricity passing through the conductor 408, the worse the interference may be. In at least one example, the barrier 412 disposed between the conductor 408 and the sensitive component 414 reduces this interference, and thus, reduces the minimum distance D required to reduce interference. In this way, the barrier 412 enables the sensitive component 414 to be disposed closer to the conductor 480 within the device than the sensitive component 414 otherwise could be without the presence of the barrier 412. In this way, the barrier 412 allows for a more compact, smaller form factor of the device 400 without negatively affecting the performance thereof.
In addition, the barrier 412 can be configured to structurally support the conductor 408 such that forces acting on either the first or second electronic components 404, 410 are transferred through the barrier 408 and reducing the forces transferred through the conductor 408. Such forces acting on the first or second electronic components 404, 408 can include impacts from a user dropping the device 400 during use, pressing on either electronic component 404, 410 during use, or other motions, impacts, or contacts resulting in forces acting thereon.
In at least one example, the barrier 412 contacts or is directly or indirectly connected or coupled with the first and/or second electronic component 404, 410 to absorb all forces acting thereon. In at least one example, the barrier 412 contacts or is directly or indirectly coupled with the first and/or second electronic component 404, 410 to absorb at least some of forces acting thereon. In at least one example, the barrier 412 contacts, or is directly or indirectly coupled with, the first and/or second electronic component 404, 410 to absorb a majority of forces acting thereon. In this way, the material of the conductor 408 can be chosen to maximize electrical and heat conduction without limiting the material selection to those materials that also provide necessary structural support to the conductor 408 absent the barrier 412. For example, the conductor can be a soft metal with high conductivity even if the soft metal would otherwise be insufficiently strong without the barrier. In one example, the conductor 408 can include a gel or a liquid conducting material that provides minimal structural support within the device such that the barrier 412 provides much of, or most of, the support.
In at least one example, the barrier can include a durable and strong material, including non-conductive materials such as plastics, rubbers, ceramics, and so forth. In at least one example, the conductor 408 can include any suitable conducting metal, gel, composite material, or ceramic. In one example, the conductor 408 includes aluminum. In one example, the conductor 408 includes copper, gold, or other metals or metal alloys. In one example, the conductor 408 includes sheet metal. The material of the conductor 408 can vary depending on the sensitive component 414 disposed within the device 400 such that the material of the conductor 408 is tuned to reduce RF interference with the sensitive component 414.
Any of the features, components, and/or parts, including the arrangements and configurations thereof shown in
In one example, one or more of the RF sensitive components 514a-c can be disposed within the internal volume 503. In one example, one or more of the RF sensitive components 514a-c can be disposed outside the internal volume 503 and/or outside the housing 502. In one example, as illustrated in
In at least one example, the device 500 also includes a conductor 508 extending from the heat generating component 504 to the electrical ground 510, and a non-metallic barrier 512 at least partially surrounding the conductor 508 and disposed between the conductor 508 and one or more of the RF sensitive components 514a-c. In at least one example, the non-metallic barrier 512 can completely surround the conductor 508. In the illustrated example of
In at least one example, the non-metallic barrier 512 defines a pathway through which the conductor 508 extends. In one or more examples, the non-metallic barrier 512 can be molded, additively manufactured, machined, or otherwise formed to define an enclosed pathway extending through the non-metallic barrier 512. The pathway can be an enclosed pathway terminating at openings defined by the barrier 512. The enclosed pathway can include an elongate pathway, for example a tubular pathway, with opposing ends at respective openings defined by the non-metallic barrier 512. A first end of the pathway can terminate at the heat generating component 504 and the second end of the pathway can terminate at the electrical ground 510. The term “enclosed” can refer to a pathway fully defined by the non-metallic barrier 512 such that the only access to the pathway includes opening at either end defined by the non-metallic barrier 512, as noted above. In such examples, the conductor 508 can be disposed at least partially within the non-metallic barrier 512 and can extend through the pathway defined thereby. In at least one example, the conductor 508 can include a metal. In at least one example, the conductor 508 can include a thermal paste. In at least one example, the conductor 508 can include plastic bonded with an embedded metal. In at least one example of the device 500, the heat generating component 504 can include an LED. In at least one example, the LED 504 can be configured to emit light through the aperture 505.
As noted with reference to other examples described herein, the non-metallic barrier 512 of
Accordingly, in the example shown in
Any of the features, components, and/or parts, including the arrangements and configurations thereof shown in
In at least one example, one or more of the RF sensitive components 614a-b can include an antenna. In at least one example, the device 600 also includes a conductor 608 extending from the heat generating component 604 to the electrical ground 610 and a non-metallic barrier 612 at least partially surrounding the conductor 608 and disposed between the conductor 608 and one or more of the RF sensitive components 614a-b. In at least one example, the first and/or second RF sensitive components 614a, 614b can be disposed adjacent to the non-metallic barrier 612 such that no other components are disposed therebetween. In the illustrated example of
In at least one example, the non-metallic barrier 612 can contact or otherwise be coupled with one or more brackets 602 of the device 600. In this way, forces transferred through the bracket 602 can be transferred through the non-metallic barrier 612, and forces transferred through the non-metallic barrier 612 can be transferred to the bracket 602. In this way, forces transferring through the conductor 608 and/or the heat generating component 604 are minimized during use.
In at least one example, the non-metallic barrier 612 defines a pathway through which the conductor 608 extends. In one or more examples, the non-metallic barrier 612 can be molded, additively manufactured, machined, or otherwise formed to define a pathway extending through the non-metallic barrier 612. In such examples, the conductor 608 can be disposed at least partially within the non-metallic barrier 612 and extending through the pathway defined thereby. In at least one example, the conductor 608 can include a metal. In at least one example, the conductor 608 can include a thermal paste. In at least one example of the device 600, the heat generating component 604 can include an LED. In at least one example, the LED 604 can be configured to emit light through the aperture 605.
As noted with reference to other examples described herein, the non-metallic barrier 612 of
Accordingly, in the example shown in
Any of the features, components, and/or parts, including the arrangements and configurations thereof shown in
In at least one example, a conducting material 708 can be disposed within the pathway 718 and extend from the heat source 704 and the electrical ground 710 to conduct electricity and heat away from the heat source 704 and into the electrical ground 710. The electrical ground 710 can also be a heat sink in one or more examples. The pathway 718 can be an enclosed pathway terminating at openings defined by the body 712. The enclosed pathway 718 can include an elongate pathway, for example a tubular pathway, with opposing ends at respective openings defined by the body 712. A first end of the pathway 718 can terminate at the heat source 704 and the second end of the pathway can terminate at the electrical ground 710. The term “enclosed” can refer to a pathway fully defined by the body 712 such that the only access to the pathway 718 includes opening at either end defined by the body 712, as noted above.
In at least one example, the body 712 can be additively manufactured or otherwise formed to define the irregular, non-linear, and/or tortuous pathway 718 and then a thermal paste, gel, or conducting liquid can be injected into the pathway 718. In one example, after the pathway 718 is formed, heated liquid metal can be injected or molded into the pathway 718 and can then cool/solidify therein. Once the pathway 718 has been defined by the formation of the body 712, material portions of the body 712 can be removed to accommodate or provide space for various other components within an electronic device, including RF sensitive components or other heat sensitive components requiring shielding from the conducting material 708. That is, while the illustrated body 712 shown in
Any of the features, components, and/or parts, including the arrangements and configurations thereof shown in
In this way, the body 812 can be an RF and/or heat barrier, similar to other barriers and RF barriers described with reference to other examples. In at least one example, the pathway 818 defined by the body 812 can include a central longitudinal axis extending in two or three dimensions. In this way, the pathway 808 can be formed to wind and extend between various RF sensitive and/or heat sensitive components within a device, which may be positioned at any location relative to the heat source and/or electrical ground, such that the body 812 is disposed between any heat or RF sensitive components and the pathway 818. In at least one example, the body 812 can be a non-metallic barrier configured to structurally support a device or components therein, including the heat source 804 and the electrical ground 810. In at least one example, the body 812 can include a plastic material.
Any of the features, components, and/or parts, including the arrangements and configurations thereof shown in
According to some examples, personal information data can be used the present exemplary system and method to enhance and improve the function and personal experience of a user. However, if personal information data is gathered and/or used, it should be gathered and used according to well established and authorized secure privacy policies and practices that are appropriate for the type of data collected. While personal information data may be used by the present exemplary systems and methods, such information is not necessary for performance of the contemplated systems and methods.
Furthermore, it will be understood that the present systems and methods can be varied and combined, or incorporated with alternative components. The scope of the present systems and methods will be further understood by the following claims.
This application is a National Stage filing based off of PCT Application No. PCT/US2023/024206, filed 1 Jun. 2023, and entitled “HEAT SINK ASSEMBLY” which claims priority to U.S. Provisional Patent Application No. 63/365,766, filed 2 Jun. 2022, and entitled “HEAT SINK ASSEMBLY,” the entire disclosure of which is hereby incorporated by reference.
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/US2023/024206 | 6/1/2023 | WO |
| Number | Date | Country | |
|---|---|---|---|
| 63365766 | Jun 2022 | US |
