Information
-
Patent Grant
-
D303951
-
Patent Number
D303,951
-
Date Filed
Thursday, March 27, 198638 years ago
-
Date Issued
Tuesday, October 10, 198934 years ago
-
Inventors
-
Original Assignees
-
Examiners
-
-
US Classifications
Field of Search
US
- D13 23
- 174 16 HS
- 361 386
- 361 388
- 357 81
- 165 801
- 165 802
- 165 803
-
-
Claims
- The ornamental design for a heat-sink cover for leadless electronic chip-carrier sockets, as shown and described.
US Referenced Citations (3)