Heat sink for memory module

Information

  • Patent Grant
  • D1080566
  • Patent Number
    D1,080,566
  • Date Filed
    Wednesday, February 23, 2022
    3 years ago
  • Date Issued
    Tuesday, June 24, 2025
    4 months ago
  • Inventors
    • Lu; Hui-Hsin
  • Original Assignees
  • Examiners
    • Rivas; April
    Agents
    • Skaar Ulbrich Macari, P.A.
Abstract
Description


FIG. 1 is a perspective view of a heat sink for memory module showing the claimed design;



FIG. 2 is another perspective view thereof;



FIG. 3 is a front elevational view thereof;



FIG. 4 is a rear elevational view thereof;



FIG. 5 is a left side elevational view thereof;



FIG. 6 is a right side elevational view thereof;



FIG. 7 is a top plan view thereof; and,



FIG. 8 is a bottom plan view thereof.


The broken lines in the drawings depict portions of the heat sink for memory module that form no part of the claimed design.


Claims
  • The ornamental design for a heat sink for memory module as shown and described.
US Referenced Citations (14)
Number Name Date Kind
D296323 McCarthy Jun 1988 S
D453744 Lee Feb 2002 S
D717744 Mueller Nov 2014 S
D727912 Kang Apr 2015 S
D761744 Mueller Jul 2016 S
D842304 Depay Mar 2019 S
D863311 Depay Oct 2019 S
D868069 Hung Nov 2019 S
D964947 Lin Sep 2022 S
D1005295 Huang Nov 2023 S
D1061464 Lu Feb 2025 S
D1066274 Lu Mar 2025 S
D1070863 Lu Apr 2025 S
20230048165 Yang Feb 2023 A1
Non-Patent Literature Citations (2)
Entry
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