FIG. 1 is a perspective view of a heat sink for memory module showing the claimed design;
FIG. 2 is another perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is an enlarged left side elevational view thereof;
FIG. 6 is an enlarged right side elevational view thereof;
FIG. 7 is a top plan view thereof;
FIG. 8 is a bottom plan view thereof;
FIG. 9 is an enlarged view illustrating the details of the dot-dash area “9” indicated in FIG. 1; and,
FIG. 10 is an enlarged view illustrating the details of the dot-dash area “10” indicated in FIG. 8.
The dash-dash broken lines in the drawings illustrate environmental subject matter and portions of the article that form no part of the claimed design.
The dot-dash lines in the figures represent the boundaries of the enlarged areas in which the dot-dash lines, lead line and numeral designation form no part of the claimed design.