Heat sink for memory module

Information

  • Patent Grant
  • D1035597
  • Patent Number
    D1,035,597
  • Date Filed
    Thursday, December 15, 2022
    2 years ago
  • Date Issued
    Tuesday, July 16, 2024
    6 months ago
  • Inventors
    • Lu; Hui-Hsin
  • Original Assignees
  • Examiners
    • Rivas; April
    Agents
    • Locke Lord LLP
    • Xia, Esq.; Tim Tingkang
Abstract
Description


FIG. 1 is a perspective view of a heat sink for memory module of the claimed design;



FIG. 2 is another perspective view of FIG. 1;



FIG. 3 is a front elevation view of FIG. 1;



FIG. 4 is a rear elevation view of FIG. 1;



FIG. 5 is a left side elevation view of FIG. 1;



FIG. 6 is a right side elevation view of FIG. 1;



FIG. 7 is a top plan view of FIG. 1;



FIG. 8 is a bottom plan view of FIG. 1; and,



FIG. 9 is an enlarged partial view illustrating the details of the dot-dash area “9” shown in FIG. 2.


The dash-dash broken lines in the drawings depict portions of the article and environmental subject matter that form no part of the claimed design.


The dot-dash lines in the figures represent the boundaries of the enlarged areas in which the dot-dash lines form no part of the claimed design.


Claims
  • The ornamental design for a heat sink for memory module, as shown and described.
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