Heat sink for memory module

Information

  • Patent Grant
  • D1061464
  • Patent Number
    D1,061,464
  • Date Filed
    Thursday, September 28, 2023
    a year ago
  • Date Issued
    Tuesday, February 11, 2025
    a month ago
  • Inventors
    • Lu; Hui-Hsin
  • Original Assignees
  • Examiners
    • Caruso; Rebekah A
    • Holman; Cole Sanders
    Agents
    • Locke Lord LLP
    • Xia, Esq.; Tim Tingkang
Abstract
Description


FIG. 1 is a perspective view of a heat sink for memory module of the claimed design;



FIG. 2 is another perspective view thereof;



FIG. 3 is another perspective view thereof;



FIG. 4 is a front elevational view thereof;



FIG. 5 is a rear elevational view thereof;



FIG. 6 is a left side elevational view thereof;



FIG. 7 is a right side elevational view thereof;



FIG. 8 is a top plan view thereof;



FIG. 9 is a bottom plan view thereof;



FIG. 10 is an enlarged view illustrating the details of the dot-dash area “10” shown in FIG. 1;



FIG. 11 is an enlarged view illustrating the details of the dot-dash area “11” shown in FIG. 2; and,



FIG. 12 is an enlarged view illustrating the details of the dot-dash area “12” shown in FIG. 3.


The broken lines in the drawings depict portions of the heat sink for memory module that form no part of the claimed design.


The dot-dash lines in the figures represent the boundaries of the enlarged areas in which the dot-dash lines form no part of the claimed design.


Claims
  • The ornamental design for a heat sink for memory module, as shown and described.
US Referenced Citations (8)
Number Name Date Kind
D702689 Lin Apr 2014 S
D702690 Lin Apr 2014 S
D717744 Mueller Nov 2014 S
D733145 Chen Jun 2015 S
D842304 Depay Mar 2019 S
D862402 Lin Oct 2019 S
D964947 Lin Sep 2022 S
D1035597 Lu Jul 2024 S
Non-Patent Literature Citations (5)
Entry
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