FIG. 1 is a perspective view of a heat sink for memory module of the claimed design;
FIG. 2 is another perspective view thereof;
FIG. 3 is another perspective view thereof;
FIG. 4 is a front elevational view thereof;
FIG. 5 is a rear elevational view thereof;
FIG. 6 is a left side elevational view thereof;
FIG. 7 is a right side elevational view thereof;
FIG. 8 is a top plan view thereof;
FIG. 9 is a bottom plan view thereof;
FIG. 10 is an enlarged view illustrating the details of the dot-dash area “10” shown in FIG. 1;
FIG. 11 is an enlarged view illustrating the details of the dot-dash area “11” shown in FIG. 2; and,
FIG. 12 is an enlarged view illustrating the details of the dot-dash area “12” shown in FIG. 3.
The broken lines in the drawings depict portions of the heat sink for memory module that form no part of the claimed design.
The dot-dash lines in the figures represent the boundaries of the enlarged areas in which the dot-dash lines form no part of the claimed design.