Heat sink for memory modules

Information

  • Patent Grant
  • D956706
  • Patent Number
    D956,706
  • Date Filed
    Thursday, August 6, 2020
    4 years ago
  • Date Issued
    Tuesday, July 5, 2022
    2 years ago
  • Inventors
    • Chung; Young Suk
  • Original Assignees
  • Examiners
    • Sikder; Selina
    Agents
    • Sughrue Mion, PLLC
Abstract
Description


FIG. 1 is a top, front perspective view of the heat sink for memory modules;



FIG. 2 is a front view thereof;



FIG. 3 is a rear view thereof;



FIG. 4 is a left side view thereof;



FIG. 5 is a right side view thereof;



FIG. 6 is a top view thereof; and,



FIG. 7 is a bottom view thereof.


Claims
  • The ornamental design for a heat sink for memory modules, as shown and described.
US Referenced Citations (23)
Number Name Date Kind
6377460 Pohl Apr 2002 B1
D531965 Stathakis Nov 2006 S
7215551 Wang May 2007 B2
7312996 Chang Dec 2007 B2
7457122 Lai Nov 2008 B2
D597966 Shih Aug 2009 S
7715197 Tian May 2010 B2
7738252 Schuette Jun 2010 B2
D626521 Chen Nov 2010 S
8411443 Chen Apr 2013 B2
D689829 Chen Sep 2013 S
D793400 Lin Aug 2017 S
10667431 Lunsman May 2020 B1
20030011993 Summers Jan 2003 A1
20030026076 Wei Feb 2003 A1
20060268523 Lin Nov 2006 A1
20090034183 Chen Feb 2009 A1
20090122481 Chang May 2009 A1
20090190304 Meyer, IV Jul 2009 A1
20090294099 Chen Dec 2009 A1
20110088870 Lee Apr 2011 A1
20130186595 Hsieh Jul 2013 A1
20140202675 Chen Jul 2014 A1