This application is based upon and claims the benefit of priority from the prior Japanese Patent Application No. 2014-194488, filed on Sep. 24, 2014, the entire contents of which are incorporated herein by reference.
Embodiments described herein relate generally to a heat sink having a heat dissipating fin and to a lighting device.
A light emitting diode (LED) which is placed in a lighting device generates heat so that the temperature of the light emitting diode rises, since electrical energy is converted into thermal energy when current flows. As a result, the light emitting diode becomes in a high temperature state and may cause decrease of brightness or life. A lighting device which is provided with a heat sink of thermally conductive material such as metal so as to dissipate produced heat is known.
However, for example, a down-lighting device is difficult to enhance heat dissipating effect by natural convection, because the down-lighting device needs to be attached to a ceiling etc. and an obstacle such as a ceiling board or a heat insulating member which blocks air flow is arranged around a heat sink.
A heat sink according to an embodiment includes a base plate having cutting portions, and a heat dissipating fin which is provided perpendicularly to a principal plane of the base plate and is a member having a sectional shape in a direction horizontal to the principal plane of the base plate. The sectional shape is constant substantially in a perpendicular direction.
A lighting device according to an embodiment includes a heat sink and a light emitting unit. The heat sink is provided with a base plate having cutting portions, and a heat dissipating fin which is provided perpendicularly to a principal plane of the base plate and is a member having a sectional shape in a direction horizontal to the principal plane of the base plate. The sectional shape is constant substantially in a perpendicular direction. The light emitting unit is provided on a surface of the base plate opposite to another surface of the base plate on which the heat dissipating fin is arranged.
Hereinafter, further embodiments will be described with reference to the drawings. In the drawings, the same reference numerals denote the same or similar portions respectively.
The drawings are schematic or conceptual, and a relation between a thickness and a width of each part, a size ratio of parts etc. are not necessarily the same as actual ones. Even when the same parts are illustrated, different dimensions or different ratios may be expressed depending on drawings.
A heat sink and a lighting device according to an embodiment will be described with reference to
As shown in
The base plate 11 can be formed by stamping out with a die or cutting using a material with high thermal conductivity such as an aluminum alloy or a copper, for example. A thermal insulating material 14 is provided to surround the base plate 11, the heat sink 10, the light emitting unit 20 and the optical element portion 13 with a distance from the base plate 11, the heat sink 10, the light emitting unit 20 and the optical element portion 13. The thermal insulating material 14 is fixed to the ceiling board 15.
The base plate 11 has a plurality of cutting portions 30. The cutting portions 30 are formed at plural locations desirably. The cutting portions 30 are arranged to surround the light emitting unit 20 when the light emitting unit 20 is seen from a side of the heat sink 10.
The plurality of cutting portions can be arranged radially and on a circle substantially centered at a center of the base plate 11, for example. By arranging the cutting portions 30 in this way, heat generated from the light emitting unit 20 can be radiated uniformly and efficiently. The cutting portions 30 may be formed simultaneously when the base plate 11 is formed by stamping out with a die, or may be formed by cutting in a post-processing. The cutting portions 30 may have cut and raised portions 19 as described below.
The heat dissipating fin 12 is provided perpendicularly to a principal plane of the base plate 11 and is a member having a sectional shape in a direction horizontal to the principal plane of the base plate. The sectional shape is constant substantially in a perpendicular direction. The heat dissipating fin 12 can be formed by extrusion or stamping out with a die, for example, using a material with high thermal conductivity such as aluminum alloy. The heat dissipating fin 12 can be a radial member composed of a plurality of fin portions 12a which are directed from the center of the base plate 11 to the circumference of the base plate 11 and, with the configuration heat generated from the light emitting unit 20 can be diffused uniformly, efficiently. The shape of the heat dissipating fin 12 is radial, but the invention is not limited to the configuration and the shape of the heat dissipating fin 12 may be a shape composed of a lot of flat plates or a lot of pins. In order to connect the base plate 11 and the heat dissipating fin 12, methods such as screwing, soldering and brazing and other methods by which thermal connection is obtained can be used.
The light emitting unit 20 is provided on a surface of the base plate opposite to another surface of the base plate on which the heat dissipating fin 12 is arranged. The light emitting unit 20 has at least one light emitting element which is arranged in a housing formed of resin, metal or ceramics, for example. A light emitting diode or a laser diode may be used for the light emitting element. The light emitting unit 20 is not limited to the configuration that the at least one light emitting element is provided in the housing, but can also be a simplified unit having a substrate and a light emitting element.
The optical element portion 13 may be a cylindrical member formed of metal such as aluminum or resin. The optical element portion 13 is provided in a direction in which the light emitting unit 20 radiates light, so as to control a light radiated from the light emitting unit 20, for example, so as to reflect the light. A paint which increases reflecting rate may be applied on an inner surface of the cylindrical member constituting the optical element portion 13 so that the light is suppressed to be absorbed in the optical element portion 13 and light emission efficiency is increased.
As shown in
As shown in
As shown in
As shown in
As shown in
As shown in
As described above, according to the heat sink and the lighting device according to the embodiment, sufficient heat dissipation can be realized without enlarging a heat sink even in an environment where flow of air is restricted.
While certain embodiments have been described, these embodiments have been presented by way of example only, and are not intended to limit the scope of the inventions. Indeed, the novel embodiments described herein may be embodied in a variety of other forms; furthermore, various omissions, substitutions and changes in the form of the embodiments described herein may be made without departing from the spirit of the inventions. The accompanying claims and their equivalents are intended to cover such forms or modifications as would fall within the scope and spirit of the inventions.
Number | Date | Country | Kind |
---|---|---|---|
2014-194488 | Sep 2014 | JP | national |