Patent Application
20240288226
This application claims priority to and the benefit of Korean Patent Application No. 10-2023-0026108, filed on Feb. 27, 2023, the disclosure of which is incorporated herein by reference in its entirety.
The present invention relates to a heat sink with a multilayer channel structure, and more particularly, to a heat sink with a multilayer channel structure capable of cooling at a high heat flux by delaying a critical heat flux, which is a thermal limit of boiling heat transfer.
The conventional multi-port multi-channel heat sink has a problem in that heat transfer performance near an outlet of a channel is significantly reduced because the closer to the outlet of the channel, the more growth of a velocity/thermal boundary layer and vapor bubble layer. Further, the conventional composite jet impingement cooling technique has a problem in that a jet does not reach an impingement surface due to a strong cross-flow existing near an outlet of a channel, resulting in a rapid decrease in heat transfer performance.
The conventional single-phase heat transfer heat sink technology aims to maximize a heat transfer area by significantly increasing flow complexity, but the pressure drop between an inlet and an outlet increases, accompanied by a rapid increase in pumping power and a rapid decrease in cooling efficiency. In addition, in the conventional phase change heat transfer heat sink technology, a rapid decrease in heat transfer performance occurs when a surface is not rewet and dry-out occurs, which causes a rapid rise in temperature and permanent damage to electronic components and related equipment.
Therefore, the development of a new type of heat sink in which an increase in pressure drop is minimized while preventing a rapid decrease in heat transfer performance that occurs near an outlet of the heat sink is required.
The related art of the present invention is disclosed in Korean Patent Registration No. 10-2244964 (Published on Apr. 27, 2021, title of invention: Thermally Bonded Quartz Dome Heat Sink).
The present invention is directed to providing a heat sink with a multilayer channel structure that is capable of suppressing the growth of a velocity/thermal boundary layer and vapor bubble layer that occurs along each channel by increasing a stagnation area and heat transfer area of jet impingement and increasing flow complexity.
According to an aspect of the present invention, there is provided a heat sink with a multilayer channel structure, which includes a main body part which is provided with an inlet through which a cooling fluid is introduced and an outlet through which the cooling fluid is discharged, a first channel part provided inside the main body part and through which the cooling fluid flows, and a second channel part which is provided inside the main body part and through which the cooling fluid flows, wherein the second channel part is disposed to be stacked on the first channel part, the first channel part and the second channel part extend in different directions, and the second channel part communicates with the first channel part.
The inlet may include a first inlet configured to guide the cooling fluid to the first channel part and a second inlet configured to guide the cooling fluid to the second channel part.
The first inlet and the second inlet may be formed to have different depths.
The first inlet and the second inlet may each be formed in at least one of a circular shape, an elliptical shape, and a polygonal shape.
The first inlet and the second inlet may each be formed in a shape of a long hole.
A long axis of the first inlet and a long axis of the second inlet may be disposed in different directions.
The first inlet and the second inlet may be formed to have different diameters.
The outlet may include a first outlet that communicates with the first channel part and a second outlet that communicates with the second channel part.
A cross section of the first channel part and a cross section of the second channel part may each be formed in at least one of a circular shape, an elliptical shape, and a polygonal shape.
The first channel part and the second channel part may be formed to have different heights.
The first channel part and the first outlet may be formed in the same shape.
The second channel part and the second outlet may be formed in the same shape.
The first channel part may be provided with a first impingement surface on which the cooling fluid introduced through the first inlet impinges.
The first impingement surface may be provided to face the first inlet.
The second channel part may be provided with a second impingement surface on which the cooling fluid introduced through the second inlet impinges.
The second impingement surface may be provided to face the second inlet.
An alternating flow part in which the cooling fluid flowing through the first channel part and the cooling fluid flowing through the second channel part alternately flow may be provided at an intersection part of the first channel part and the second channel part.
The heat sink may further include a heat spreader coupled to an outer surface of the main body part.
The main body part may be provided as a plurality of main body parts, and side surfaces of the plurality of main body parts may be disposed in contact with each other.
The above and other objects, features and advantages of the present invention will become more apparent to those of ordinary skill in the art by describing exemplary embodiments thereof in detail with reference to the accompanying drawings, in which:
Hereinafter, embodiments of a heat sink with a multilayer channel structure according to the present invention will be described with reference to the accompanying drawings. In this process, thicknesses of lines, sizes of components, and the like illustrated in the drawings may be exaggerated for clarity and convenience of description. Further, some terms which will be described below are defined in consideration of functions in the present invention and meanings may vary depending on, for example, a user or operator's intentions or customs. Therefore, the meanings of these terms should be interpreted based on the scope throughout this specification.
Referring to
The main body part 100 includes inlets 110 and outlets 120. The inlets 110 are formed in an outer surface (upper surface in
A plenum chamber may be installed on an outer side (upper side in
The inlet 110 may include a first inlet 111 and a second inlet 112. The first inlet 111 guides the cooling fluid to the first channel part 200, which will be described below. Specifically, the first inlet 111 communicates with the first channel part 200. As the cooling fluid introduced through the first inlet 111 flows through the first channel part 200, internal cooling with high heat transfer performance occurs by the cooling fluid.
The second inlet 112 guides the cooling fluid to the second channel part 300. Specifically, the second inlet 112 communicates with the second channel part 300. As the cooling fluid introduced through the second inlet 112 flows through the second channel part 300, internal cooling with high heat transfer performance occurs by the cooling fluid.
The first inlet 111 and the second inlet 112 may have a transverse section formed in at least one of a circular shape, an elliptical shape, and a polygonal shape. For example, as illustrated in
As illustrated in
As illustrated in
The outlets 120 are formed in outer surfaces of the main body part 100 (left and right surfaces in
The outlet 120 may include a first outlet 121 and a second outlet 122.
The first outlet 121 is formed on one outer surface (left surface in
The second outlets 122 are formed in another outer surface (right surface in
The first channel parts 200 are provided inside the main body part 100. Specifically, the first channel parts 200 are formed to pass through an interior of the main body part 100. The cooling fluid introduced through the inlet 110 flows through the first channel part 200 toward the outlet 120. In
The first channel part 200 may be provided with a first impingement surface 210 on which the cooling fluid introduced through the first inlet 111 impinges. In this case, the first impingement surface 210 may be formed on an inner surface of the first channel part 200 to face the first inlet 111. Specifically, as a cooling fluid jet passing through the first inlet 111 jet-impinges with the first impingement surface 210, jet impingement cooling occurs within the first channel part 200.
The second channel part 300 is provided inside the main body part 100. Specifically, the second channel part 300 is formed to pass through the interior of the main body part 100. The cooling fluid introduced through the inlet 110 flows through the second channel part 300 toward the outlet 120. In
The second channel part 300 may be provided with a second impingement surface 310 on which the cooling fluid introduced through the second inlet 112 impinges. In this case, the second impingement surface 310 may be formed on an inner surface of the second channel part 300 to face the second inlet 112. Specifically, as a cooling fluid jet passing through the second inlet 112 jet-impinges with the second impingement surface 310, jet impingement cooling occurs within the second channel part 300.
The first channel part 200 and the second channel part 300 are disposed to be stacked. For example, the first channel part 200 and the second channel part 300 may be located vertically. Therefore, as illustrated in
The first channel part 200 and the second channel part 300 extend in different directions. For example, the first channel part 200 and the second channel part 300 may be disposed to intersect with each other.
As illustrated in
The first channel part 200 and the second channel part 300 may be formed to have different heights. As an example, as illustrated in
The first channel part 200 and the second channel part 300 communicate with each other. Specifically, the first channel part 200 and the second channel part 300 communicate with each other at an intersection part thereof. Therefore, the cooling fluid introduced through the first inlet 111 may flow through the first channel part 200 and the second channel part 300, and the cooling fluid introduced through the second inlet 112 may flow through the first channel part 200 and the second channel part 300.
Further, the cooling fluid flowing through the second channel part 300 may be discharged to the outside of the main body part 100 through the first outlet 121, and the cooling fluid flowing through the first channel part 200 may be discharged to the outside of the main body part 100 through the second outlet 122.
An alternating flow part 130 in which the cooling fluid flowing through the first channel part 200 and the cooling fluid flowing through the second channel part 300 alternately flow may be provided at the intersection part of the first channel part 200 and the second channel part 300. Specifically, the alternating flow between the first channel part 200 and the second channel part 300 occurs in the alternating flow part 130.
A heat sink 1 with a multilayer channel structure according to another embodiment of the present invention may further include a heat spreader 400.
Referring to
A heat sink 1 with a multilayer channel structure according to still another embodiment of the present invention may include a plurality of main body parts 100. Referring to
In the heat sink 1 with the multilayer channel structure according to the embodiment of the present invention, the growth of a velocity/thermal boundary layer and vapor bubble layer that occurs along the first channel parts 200 and the second channel parts 300 may be suppressed by increasing a stagnation area and heat transfer area of jet impingement and increasing flow complexity, and thus, overheating of electronic components and related equipment that are becoming more integrated and miniaturized may be prevented.
Through complex jet impingement with the multilayer channel structure according to the embodiment of the present invention, the heat sink 1 may enable heat transfer performance and critical heat flux to be improved.
According to the present invention, the growth of a velocity/thermal boundary layer and vapor bubble layer that occurs along first channel parts and second channel parts can be suppressed by increasing a stagnation area and heat transfer area of jet impingement and increasing flow complexity, and thus overheating of electronic components and related equipment that are becoming more integrated and miniaturized can be prevented.
Further, according to the present invention, heat transfer performance and critical heat flux can be improved through complex jet impingement.
While the present invention has been described with reference to embodiments illustrated in the accompanying drawings, the embodiments should be considered in a descriptive sense only, and it should be understood by those skilled in the art that various alterations and equivalent other embodiments may be made. Therefore, the scope of the present invention should be defined by only the following claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 10-2023-0026108 | Feb 2023 | KR | national |
