Patent Application
20140216027
The present invention relates to a heat storage device provided with an alloy or mixed salt having a predetermined eutectic temperature, and to a system provided with the heat storage device.
In recent years, in response to increasing environmental issues, various means have been investigated to effectively utilize exhaust heat arising from production facilities in factories, power plants, automobiles and the like, as thermal energy. Such exhaust heat can be converted to a new energy form and utilized.
As a device for converting exhaust heat to a new energy form, for example, Patent Document 1 discloses a heat treatment device provided with a temperature setting layer which sets a predetermined temperature between two thermoelectric conversion modules which generate electricity from heat. Further, Patent Document 2 discloses a thermoelectric generation system provided with an intermediate heat transport loop which can control heat flow between a high temperature side and a generating element of a low temperature side.
However, because the exhaust heat produced by production facilities in factories, power plants, automobiles and the like is subjected to strong temperature increases and decreases, the temperature is not produced in a stable manner, and therefore, there is the problem that it is not possible to stably provide the energy obtained by utilizing this exhaust heat.
Exhaust heat with such strong increases in temperature, if utilized as a heat source of an energy conversion device such as a thermoelectric conversion module or a sterling engine or the like, may cause the problem of breaking the energy conversion device.
Incidentally, for an alloy or mixed salt having a eutectic reaction, its temperature will increase when heated, and its temperature will drop when the heating is stopped, but in the vicinity of the eutectic point, the temperature changes are gradual. If a heat storage device using such an alloy or mixed salt can be provided between a heat source which generates exhaust heat, and an energy conversion device such as, for example, a thermoelectric conversion module or the like, heat within a fixed temperature range in the vicinity of the eutectic point can be stably provided to an energy conversion device.
The present invention was made in consideration of the above problem, and has the objective of providing a heat storage device which stores heat in a fixed temperature range and can stably store heat.
Further, the present invention has the objective of providing a system which stably operates the energy conversion device, by heat within a fixed temperature range released from the heat storage device.
Further, the present invention has the objective of providing an electric generator system which can maintain a fixed generation rate by heat within a fixed temperature range released from the heat storage device, in the case that the energy conversion device is a thermoelectric conversion module.
The first aspect of the present invention is a heat storage device characterized in having a heat resistant frame which is filled with one type of alloy or mixed salt having a predetermined eutectic temperature, or a heat resistant frame filled with two or more types of alloys or mixed salts having different eutectic temperatures, in order of higher eutectic temperature, adjoining via a wall.
The second aspect of the present invention is a heat storage device according to the first aspect, characterized in that the heat resistant frame filled with one type of alloy or mixed salt having a predetermined eutectic temperature has a heat absorption section and a heat dissipation section.
The third aspect of the present invention is a heat storage device according to the first aspect characterized in that in the case of two or more types of the alloys or mixed salts, the heat resistant frame filled with an alloy (1) or mixed salt (1) having the highest eutectic temperature is a heat absorption section, and the heat resistant frame filled with an alloy (2) or mixed salt (2) having the lowest eutectic temperature is a heat dissipation section
The fourth aspect of the present invention is a heat storage device according to any one of the first to third aspects provided with a heat collection part.
The fifth aspect of the present invention is a heat storage device according to any one of the first to fourth aspects wherein the heat resistant frame is an expandable structure.
The sixth aspect of the present invention is a system characterized in having the heat storage device according to the second aspect, and an energy conversion device connected to the heat dissipation section.
The seventh aspect of the present invention is a system characterized in having the heat storage device according to the third aspect, and an energy conversion device connected to the heat dissipation section.
The eighth aspect of the present invention is a system according to the sixth or seventh aspect, characterized in that the energy conversion device is a thermoelectric conversion module.
The ninth aspect of the present invention is a system according to the sixth or seventh aspect, characterized in that the energy conversion device is a Sterling engine.
The tenth aspect of the present invention is a system according to any one of the sixth to ninth aspects, having a thermal fuse and/or a cooling portion.
The eleventh aspect of the present invention is a method of generating electricity with a thermoelectric module, by using the system according to the eighth aspect, storing heat by absorbing heat in the heat absorption section, and releasing heat from the heat dissipation section as a heat source.
The twelfth aspect of the present invention is a method of operating a Sterling engine using the system according to the ninth aspect, storing heat by absorbing heat in the heat absorption section, and releasing heat from the heat dissipation section as a heat source.
According to the present invention, it is possible to provide a heat storage device which stores heat within a fixed temperature range, and which can stably store heat.
Further, according to the present invention, it is possible to provide a system for stably operating the energy conversion device, by the heat within a fixed temperature range released from the heat storage device.
Furthermore, according to the present invention, in the case that the energy conversion device is a thermoelectric conversion module, it is possible to provide an electric generator system which can maintain a fixed generation rate by heat within a fixed temperature range released from the heat storage device.
Below, embodiments of the invention are explained in detail based on the figures. Further, in the below explanations of the embodiments, for identical constitutions, the same reference numbers are used and explanations thereof are omitted or simplified.
The heat storage device of the present invention is a device for storing heat obtained from a heat source with an unstable temperature as latent heat.
The heat storage device of the present invention stores heat by an alloy or mixed salt having a predetermined eutectic temperature, and this alloy or mixed salt may be of one type, or may be a plurality of types.
The heat storage device 10 according to the first embodiment of the present invention explained below, as one example of the heat storage device of the present invention, uses two types of alloy.
The heat storage device 10 is provided with a box shaped heat resistant frame 11, a heat absorption-side heat storing section 12 formed by filling an alloy (1) into the inner section of the heat resistant frame 11 of the heat source 100 side, and a heat dissipation-side heat storing section 13 formed by filling an alloy (2) into the inner section of the heat resistant frame 11, and adjoining the heat absorption-side heat storing section 12 via the partitioning wall 11a of the heat resistant frame 11.
The heat resistant frame 11 is a box shaped body, and has a space of a predetermined volume in its inner section. The heat resistant frame 11 has a partitioning wall 11a which divides into two equal parts the inner section of the heat resistant frame 11 in the lengthwise direction. Namely, the heat resistant frame 11 has two spaces of a predetermined volume which adjoin via a partitioning wall 11a. Further, the heat resistant frame 11 according to the present embodiment is formed as a box shaped body, however, the present invention is not limited to a box shaped body, and may be a shape which can be filled with an alloy, such as a tubular shape. Furthermore, the inner section of the heat resistant frame 11 according to the present embodiment is divided into two equal parts, however, the present embodiment is not limited to being divided into two equal parts, and may be divided into a volume ratio in accordance with the characteristics of the filled alloy and the like. Moreover, in the case that the alloy (1) and the alloy (2) are the same type of alloy, it is possible to exclude the partitioning wall 11a. In this case, the heat resistant frame 11 will have one space.
Further, in the heat resistant frame 11, the face which is on the opposite side of the face which contacts the heat absorption-side heat storing section 12 in the heat dissipation-side heat storing section 13 may be wider than the face which contacts the heat absorption-side heat storing section 12. In this way, for example, in the case that the heat storage device 10 is connected with the thermoelectric conversion module, one heat storage device 10 may adjoin a plurality of thermoelectric conversion modules.
Further, the heat resistant frame 11 may be formed of a heat resistant material of a predetermined thickness (for example, SS, SUS SCH, SCS, and the like).
The heat resistant frame 11 is provided with a box section wherein two spaces are formed, and having one open face, and a cover section which covers the one open face of the box section.
The heat absorption-side heat storing section 12 is formed by filling the alloy (1) into the space of the heat source 100 side of the two spaces of the heat resistant frame 11.
The heat dissipation-side heat storing section 13 is formed by filling the alloy (2) into the space at the opposite side of the heat source 100 side of the two spaces of the heat resistant frame 11.
In the present embodiment, for the heat absorption-side heat storing section 12 and the heat dissipation-side heat storing section 13, the alloy (1) or the alloy (2) are directly filled into the heat resistant frame 11, however, the present invention is not limited to this, and the heat absorption-side heat storing section 12 and the heat dissipation-side heat storing section 13 may respectively be provided with separate frames, where the alloy (1) or the alloy (2) are filled into these frames, and the frames into which the alloy (1) or the alloy (2) is filled may be removably provided in the heat resistant frame 11.
The eutectic temperature of the alloy (1) of the heat absorption-side heat storing section 12 is higher than the eutectic temperature of the alloy (2) of the heat dissipation-side heat storing section 13.
The alloy (1) absorbs fluctuations in the temperature and heat amount of the heat arising from the heat source 100, and provides heat within a predetermined temperature range to the alloy (2).
The alloy (2) absorbs temperature changes of the heat provided from the alloy (1), and stores the heat as heat within a predetermined temperature range.
The alloy (1) and the alloy (2) are alloys having predetermined eutectic temperatures, and alloys with eutectic temperatures included within the temperature range of the heat generated by the heat source 100 are selected.
For example, in the case that the temperature range of the heat generated by the heat source 100 is the range from T1 to T2 in
As shown in
The alloy, for example in the case that its eutectic temperature is 199° C. such as for the Sn—Zn alloy, absorbs heat in the case that the temperature of the alloy is heated to higher than 199° C., and releases heat in the case that it is cooled to lower than 199° C.
The heat absorption amount and heat dissipation amount by the alloy can be adjusted by changing the heat capacity (specific heat×specific weight×volume)+fusion enthalpy. For example, in the case that it is desired to increase the heat absorption amount and heat dissipation amount, it is possible to increase the heat absorption amount and heat dissipation amount of the alloys by composing the alloy of metals having greater specific weights and greater fusion enthalpies, or by increasing the volume.
In the present embodiment, the alloys of the heat absorption-side heat storing section 12 and the heat dissipation-side heat storing section 13 are each different alloys, however, the present invention is not limited to this, and it is possible to make the alloys of the heat absorption-side heat storing section 12 and the heat dissipation-side heat storing section 13 the same. In this case, it is possible to not provide the partitioning wall 11a of the heat resistant frame, so that the heat resistant frame 11 has one space.
Further, in the present embodiment, the space of the inner section of the heat resistant frame 11 is divided into two equal parts, and these two spaces are filled with two types of alloy, however, the present invention is not limited to this, and the inner section of the heat resistant frame 11 may be divided into 3 or more spaces, and each of these spaces may be respectively filled with different alloys. In this case, the alloys are filled in order of higher eutectic temperature from the heat source 100 side.
Further, in the present embodiment, alloys are filled into the heat absorption-side heat storing section 12 and the heat dissipation-side heat storing section 13, however, the present embodiment is not limited to this, and it is possible to fill mixed salts into the heat absorption-side heat storing section 12 and the heat dissipation-side heat storing section 13.
Specific examples of the alloys and mixed salts are indicated below.
Table 1 shows specific examples of the alloy (1) and the alloy (2) for low temperature use. Low temperature use refers to an alloy used in the case that the temperature of the heat generated by the heat source 100 is up to a maximum of 400° C.
Table 2 shows specific examples of alloys for low temperature use other than the alloys shown in Table 1, and mixed salts for low temperature use.
Table 3 shows specific examples of the alloy (1) and the alloy (2) for medium temperature use. Medium temperature use refers to alloys used in the case that the temperature of the heat generated by the heat source 100 is up to a maximum of 800° C.
Table 4 shows specific examples of alloys for medium temperature use other than those shown in Table 3 and mixed salts for medium temperature use.
Table 5 shows specific examples of the alloy (1) and alloy (2) for high temperature use. High temperature use refers to an alloy used in the case that the temperature of the heat generated by the heat source 100 is up to a maximum of 1000° C.
Table 6 shows specific examples of alloys for high temperature use other than those shown in Table 5.
A method of manufacturing the heat storage device 10 is explained.
First, a heat resistant frame 11 having two spaces forming a heat absorption-side heat storing section 12 and a heat dissipation-side heat storing section 13 is produced divided into a box section and a cover section.
Next, depending on the temperature range of the heat generated by the heat source 100, the type of the alloy (1) and the alloy (2) are selected.
The two types of simple metals composing the alloy (1) are combined in a predetermined weight ratio, are melted by heating in a crucible furnace, and poured into the space forming the heat absorption-side heat storing section 12 in the box section. Further, the two types of simple metals composing the alloy (2) are combined in a predetermined weight ratio, are melted by heating in a crucible furnace, and poured into the space forming the heat dissipation-side heat storing section 13 in the box section.
Next, the cover section is installed in the box section.
Further, in order to prevent heat loss, the heat storage device 10 may be wrapped with a heat insulating material.
In a state where heat is not generated by the heat source 100, the alloy (1) of the heat absorption-side heat storing section 12 and the alloy (2) of the heat dissipation-side heat storing section 13 are in the solid state.
When heat is generated by the heat source 100, first, the temperature of the alloy (1) increases. Once the alloy (1) increases its temperature to the eutectic temperature, this temperature is held for a prescribed time, and afterward this, it enters a solid-liquid coexistence state, and the increase in temperature becomes gradual.
The heat of the alloy (1) is transmitted to the alloy (2). Once the alloy (2) increases its temperature to the eutectic temperature, this temperature is held for a prescribed time, and afterward this, it enters a solid-liquid coexistence state, and the increase in temperature becomes gradual.
In the case that a thermoelectric conversion module is installed in the heat storage device 10, the heat of this alloy (2) is transmitted to the thermoelectric conversion module.
Further, the heat storage device 10 is capable of absorbing temperature fluctuations of the heat, by means of the heat absorption/heat dissipation reaction in the vicinity of the eutectic temperature, but in the case that the alloy (1) and/or alloy (2) have a eutectic reaction and a eutectoid reaction, they are also capable of absorbing temperature fluctuations of the heat by means of the heat absorption/heat dissipation reaction in the vicinity of the eutectoid temperature.
Next, the Variation Example 1 of the heat storage device is explained.
In the heat storage device 10A, the heat absorption-side heat storing section 12A is provided with a heat collection part 12b. The volume ratio of the alloy (1) to the alloy (2) in the heat storage device 10A is approximately 3:7.
The heat absorption-side heat storing section 12A is provided with a section where an alloy (1) is filled into a space of the heat source 100 side of the two spaces divided by the partitioning wall 11a of the heat resistant frame 11, a tubular body 12a filled with the alloy (1), and a heat collection part 12b formed with a helical form at the outer circumference of the tubular body 12a.
The heat collection part 12b is a part which absorbs the heat of a gas or a liquid, and is a fin which increases the area in contact with a gas. The heat absorbed by the heat collection part 12b is transmitted to the tubular body 12a, and is absorbed by the alloy (1) filled into the tubular body 12a. By providing the heat collection part 12b, in the case of absorbing heat from a gas or a liquid, it is possible to increase the efficiency of heat absorption.
Further,
Next, the Variation Example 2 of the heat storage device is explained.
In Variation Example 2 the heat resistant frame is not provided with a partitioning wall, and it differs from Variation Example 1 in the point that one type of alloy is filled into the space of the heat resistant frame and the tubular body.
The heat storage device 10A′ is provided with a heat resistant frame body 11A having one space, a tubular body 12a, and a heat collection part 12b formed in a spiral shape at the outer periphery of the tubular body 12a, and the spaces of the heat resistant frame 11A and the tubular body 12a are filled with the same type of alloy (1).
Next, Variation Example 3 of the heat storage device is explained.
The heat storage device 10B is provided with a thermal fuse 15 at the heat source 100 side of the heat absorption-side heat storing section 12. The volume ratio of the alloy (1) and the alloy (2) in the heat storage device 10B is approximately 4:6.
The thermal fuse 15 is provided with a fusible alloy 15a which fuses at a predetermined temperature, and retaining members 15b which retain the fusible alloy 15a.
The fusible alloy 15a is formed of an alloy which fuses in the vicinity of the temperature at which the alloy (1) is capable of absorbing heat. The fusion point of the fusible alloy 15a is higher than the eutectic temperature of the alloy (1), and lower than the fusion point of the alloy (1).
The retaining member 15b is formed of a material having at least a higher fusion point than the alloy (1) for high temperature use (maximum 1000° C.), for example copper or the like.
When the temperature of the heat generated by the heat source 100 is a temperature at which the alloy (1) can absorb heat, the thermal fuse 15 absorbs heat and transmits this heat to the alloy (1), and when the temperature of the heat generated by the heat source 100 exceeds the temperature at which the alloy (1) can absorb heat, the fusible alloy 15a fuses, and the transmission of heat to the alloy (1) is stopped.
The heat storage device 10B shown in
Next, Variation Example 4 of the heat storage device is explained.
In the heat storage device 10C, the heat resistant frame 11B is a bellows-shaped expansion pipe (a bellows). In the case that the heat from the heat source 100 is absorbed from the heat absorption-side heat storing section 12 of the heat storage device 10C, and discharged from the heat dissipation-side heat storing section 13, the volumes of the alloy (1) and the alloy (2) expand more than in the solid state. Further, a gas in the heat resistant frame 11B also expands by heating. Because the heat resistant frame 11B is capable of elongating when the alloy and the gas in such a heat resistant frame 11B expand, it is possible to prevent damage to the heat resistant frame, and leaking of the alloy from the heat resistant frame.
Further,
The thermal energy conversion system according to the second embodiment of the present invention is a system which generates electricity by utilizing the heat obtained from the heat source.
The thermal energy conversion system 1 is provided with a heat storage device 10 facing a heat source 100 which generates heat, a thermoelectric conversion module 20 in contact with the heat storage device 10 at the opposite side of the heat source 100, and a cooling device 30 in contact with the thermoelectric conversion module 20. Further, the thermal energy conversion system 1 according to the present embodiment is provided with a cooling device 30, however, in the present invention the cooling device 30 is not an essential constituent.
The heat storage device 10 has the same constitution as in the first embodiment, and it explanation is omitted.
The thermoelectric conversion module 20 is provided with a thermoelectric conversion layer 20a, and a pair of electrode layers 20b which sandwich the thermoelectric conversion layer 20a, one of which is in contact with the heat storage device 10, and the other is in contact with the cooling device 30. The thermoelectric conversion module 20 converts heat to electric power by utilizing the Seebeck effect generating an electromotive force corresponding to a temperature difference, this temperature difference formed by one of the electrode layers 20b being held at a high temperature, and the other held at a low temperature.
As the thermoelectric conversion material constituting the thermoelectric conversion layer 20a, for example, a silicon germanium (SiGe) system material may be used for high temperature applications, and an oxide system, cluster system, LAST (Ag, Pb, Sb, Te system), TAGS (Te, Ag, Ge, Sb system) system material may be used for high temperature applications, and a magnesium silicide (Mg2Si) system, PbTe system, Co—Sb system, Zn—Sb system, Mn—Si system material may be used for intermediate temperature applications, and bismuth-tellurium (Bi2Te3) system material may be used for low temperature applications.
An insulating layer may be provided between the heat storage device 10 and the electrode layer 20b, and between the cooling device 30 and the electrode layer 20b.
The cooling device 30 is provided with a cooling pipe 30a through which a coolant which is a liquid or a gas is made to flow (the arrow mark in
Further, in general, the thermal contact resistance between two solids depends on the surface roughness of the contact surfaces of the respective solids, and the contact pressure between the solids, and the like. Accordingly, in order to optimize the heat transmission from the heat storage device 10 to the thermoelectric conversion module 20, and the heat transmission from the thermoelectric conversion module 20 to the cooling device 30, it is preferable to reduce the surface roughness of the contact faces, and increase the contact pressure.
Next, Variation Example 1 of the thermal energy conversion system is explained.
The thermal energy conversion system 1A differs from the thermal energy conversion system 1 in the point that an opening 16 is formed on a face facing the thermoelectric conversion module 20 of the heat resistant frame 11C, at the heat storage device 10D (refer to
A minute gap 25 may be present between the heat storage device 10D and the thermoelectric conversion module 20. In the thermal energy conversion system 1A, for the alloy (2) of the heat dissipation-side heat storage section 13, an alloy which does not discharge a liquid phase from the gap 25 because, at the eutectic temperature, a dendrite structure (columnar structure) prevents excess melting of the liquid phase (for example 30Sn-70Zn), is adapted.
Herein, each of the numbers attached to the disclosure of the 30Sn-70Zn alloy indicates the content ratio, and for example the disclosure of a 30Sn-70Zn alloy indicates that the content ratio of Sn is 30%, and the content ratio of Zn is 70%. Below, the numbers attached to the disclosures of the alloys have the same meaning.
In the thermal energy conversion system 1A, the alloy (2) maintains its temperature for a predetermined time once the temperature increases to the eutectic temperature, and after this, it reaches a state where solid and liquid coexist, wherein the dendrite phase and the liquid phase are mixed, and the dendrite phase seals the gap, preventing excessive discharge of the liquid phase. Further, the liquid phase wets the electrode 20b and facilitates heat transmission of the alloy (2) and the electrode layer 20b.
Next, Variation Example 2 of the thermal energy conversion system is explained.
The thermal energy conversion system 1B differs from the thermal energy conversion system 1 (refer to
The heat storage device 10′ differs from the heat storage device 10 (refer to
The alloy (1) and the alloy (2), or the alloy (3) and the alloy (4), may be the same kind of alloy, or may be different alloys. Further, in the case that the alloys (1) to (4) are respectively different alloys, they are preferably alloys such that the order of the alloys (1) to (4) from the heat source 100 side is by higher eutectic point.
In the thermal energy conversion system 1B, the thermoelectric conversion material of the thermoelectric conversion module 20 is for intermediate and high temperature use (for example, a Mg2Si system material), and the thermoelectric conversion material of the thermoelectric conversion module 20A is preferably for low temperature use (for example, a Bi2Te2 system material).
Next, Variation Example 3 of the thermal energy conversion system is explained.
The thermal energy conversion system according to Variation Example 3 is provided with a Sterling engine instead of the thermoelectric conversion module 20.
The thermal energy conversion system according to Variation Example 3 is a system which operates a Sterling engine using as a heat source the heat obtained from a heat source.
The Sterling engine is provided with a cylinder, and a reciprocating moving piston inside the cylinder.
In the thermal energy conversion system according to Variation Example 3, a heat storage device or cooling device contacts the wall surface of the cylinder, and by repeating the expansion and compression of the gas inside the cylinder, the piston is made to reciprocate, and the thermal energy is converted into kinetic energy.
First, a Reference Example is explained.
In the Reference Example, the heat storage device is not provided, the high temperature side of the thermoelectric conversion module is heated, the cooled side is cooled, and the temperature changes of the high temperature side and the low temperature side, and the open-circuit voltage of the thermoelectric conversion module were measured over time.
In the Reference Example, the following module was used as the thermoelectric conversion module.
Product name: Thermo Module
Model No.: T150-60-127
Manufacturer name: S. T. S. Company
1. Thermoelectric element: Bi—Te system (actually measured element size: approximately □1.3×1.5 mm)
2. Number of elements: 254 (127 pairs)
3. Module size: 39.6×39.6×4.16 (mm)
Further, in the Reference Example, a low carbon steel plate of a thickness of 10 mm is disposed at the high temperature side of the thermoelectric conversion module, and a water cooled low carbon steel plate box is disposed at the low temperature side, and the low carbon steel plate at the high temperature side was intermittently heated by a burner.
The long-and-short dashed line indicates the temperature changes of the high temperature side of the thermoelectric conversion module.
The long-and-two-short dashed line indicates the temperature changes at the low temperature side of the thermoelectric conversion module.
The solid line indicates the changes in the open-circuit voltage of the thermoelectric conversion module.
As shown in
Below, Examples of the present invention are presented and discussed in detail. Further, the present invention is not at all limited by the following examples.
In Examples 1 to 6 explained below, a thermocouple was provided connected to a measuring device (Graphtec Co., midi LOGGER GL200) at predetermined locations of the heat storage device of the embodiments, the heat absorption-side heat storing section of the heat storage device was heated by the heat source, and the temperature fluctuations of the predetermined locations over time were measured. Further, in Examples 7 to 10, in addition to the temperature fluctuations of the predetermined locations of the thermal energy conversion system, the open-circuit voltage of the thermoelectric conversion module was measured.
Example 1 is an example using the heat storage device 10A′ (refer to
The thermocouple provided at the measurement location A (the dotted line in
The thermocouple provided at the measurement location B (the long-and-short dashed line in
The thermocouple provided at the measurement location C (the long-and-two-short dashed line in
The thermocouple provided at the measurement location D (the thick dotted line in
The thermocouple provided at the measurement location E (the thick long-and-short dashed line in
The thermocouple provided at the measurement location F (the thick long-and-two-short dashed line in
The thermocouple provided at the measurement location G (the solid line in
The thermocouple provided at the measurement location H (the broken line in
The dotted line indicates the temperature changes of the central section of the heat source measured at the measurement location A.
The long-and-short dashed line indicates the temperature changes of the alloy (1) filled into the central section of the tubular body 12a measured at the measurement location B.
The long-and-two-short dashed line indicates the temperature changes of the alloy (1) filled into the vicinity of the heat resistant frame 11A of the tubular body 12a measured at the measurement location C.
The thick dotted line indicates the temperature changes in the vicinity of the heat resistant frame 11A of the heat source measured at the measurement location D.
The thick long-and-short dashed line indicates the temperature changes of the alloy (1) filled into the vicinity of the tubular body 12a of the heat resistant frame 11A measured at the measurement location E.
The thick long-and-two-short dashed line indicates the temperature changes of the alloy (1) filled into the central section of the heat resistant frame 11A measured at the measurement location F.
The solid line indicates the temperature changes of the alloy (1) filled into the vicinity of the heat release side of the heat resistant frame 11A measured at the measurement location G.
The broken line indicates the temperature changes of the heat dissipation side of the heat resistant frame 11A measured at the measurement location H.
In Example 1, 50Sn-50Zn was used as the alloy (1), and was intermittently heated by the heat source.
As shown in
Accordingly, it was possible to confirm that the heat storage device of the present invention can store heat within a fixed temperature range.
The thermocouple provided at the measurement location A (the dotted line in
The thermocouple provided at the measurement location B (the long-and-short dashed line in
The thermocouple provided at the measurement location C (the long-and-two-short dashed line in
The thermocouple provided at the measurement location D (the thick long-and-short dashed line in
The thermocouple provided at the measurement location E (the thick long-and-two-short dashed line in
The thermocouple provided at the measurement location F (the broken line in
The thermocouple provided at the measurement location G (the thick dotted line in
The dotted line indicates the temperature changes of the heating section measured at the measurement location A.
The long-and-short dashed line indicates the temperature changes of the heat source side of the alloy (1) measured at the measurement location B.
The long-and-two-short dashed line indicates the temperature changes of the alloy (2) side of the alloy (1) measured at the measurement location C.
The thick long-and-short dashed line indicates the temperature changes of the alloy (1) side of the alloy (2) measured at the measurement location D.
The thick long-and-two-short dashed line indicates the temperature changes of the side opposite to the alloy (1) side of the alloy (2) measured at the measurement location E.
The broken line indicates the temperature changes of the side opposite to the heating section of the heat resistant frame 11 measured at the measurement location F.
The thick dotted line indicates the temperature changes of the coolant of the cooling device 30 measured at the measurement location G.
The solid line indicates the changes of the open-circuit voltage of the thermoelectric conversion module 20.
Examples 2 to 7 are examples using the heat storage device 10 according to the first embodiment (refer to
In Example 2, the alloys (1) and (2) were respectively filled into two spaces of 100 mm×100 mm×50 mm in the heat resistant frame, and a 15Al-85Zn alloy was used as the alloy (1), and a 30Sn-70Zn alloy was used as the alloy (2), and intermittent heating was carried out with a burner.
As shown in
Accordingly, it was possible to confirm that the heat storage device of the present invention was able to store heat within a fixed temperature range.
In Example 3, the alloys (1) and (2) were respectively filled into two spaces of 100 mm×100 mm×50 mm in the heat resistant frame, and a 15Al-85Zn alloy was used as the alloy (1), and a 30Sn-70Zn alloy was used as the alloy (2), and continuous heating was carried out with a burner.
As shown in
Accordingly, it was possible to confirm that the heat storage device of the present invention was able to store heat within a fixed temperature range.
In Example 4, the alloys (1) and (2) were respectively filled into two spaces of 100 mm×100 mm×50 mm in the heat resistant frame, and an 86Al-11Si-3Cu alloy was used as the alloy (1), and an 80Al-20Mg alloy was used as the alloy (2), and intermittent heating was carried out with a burner.
As shown in
Accordingly, it was possible to confirm that the heat storage device of the present invention was able to store heat within a fixed temperature range.
In Example 5, the alloys (1) and (2) were respectively filled into two spaces of 100 mm×100 mm×50 mm in the heat resistant frame, and an 80Al-20Ni alloy was used as the alloy (1), and a 93Al-7Si alloy was used as the alloy (2), and intermittent heating was carried out with a burner.
As shown in
Accordingly, it was possible to confirm that the heat storage device of the present invention was able to store heat within a fixed temperature range.
In Example 6, the alloys (1) and (2) were respectively filled into two spaces of 100 mm×100 mm×50 mm in the heat resistant frame, and a 30Sn-70Zn alloy was used as the alloy (1) and the alloy (2), and intermittent heating was carried out with a burner.
As shown in
In Example 7, the alloys (1) and (2) were respectively filled into two spaces of 100 mm×100 mm×50 mm in the heat resistant frame, and a 15Al-85Zn alloy was used as the alloy (1), and a 30Sn-70Zn alloy was used as the alloy (2), and intermittent heating was carried out with a burner.
Further, in Example 7, the following module was used as the thermoelectric conversion module 20.
Product name: Thermo•Module
Model No.: T150-60-127
Manufacturer: S. T. S. Company
Constitution:
1. Thermoelectric element: Bi—Te system (actual measured size: approximately □1.3×1.5 mm)
2. Number of elements: 254 (127 pairs)
3. Module size: 39.6×39.6×4.16 (mm)
Further, a thermally conductive sheet (graphite sheet) was used at the contact face of the electrode of the thermoelectric module 20 and the heat storage device 10
Further, grease (Dow Corning Toray Co. Ltd.: SC102 COMPOUND (thermally conductive material)) was applied to the electrode of the cooling device 30 side of the thermoelectric module 20.
As shown in
In Example 8, the alloys (1) and (2) were respectively filled into two spaces of 100 mm×100 mm×50 mm in the heat resistant frame, and an 80Al-20Ni alloy was used as the alloy (1), and a 93Al-7Si alloy was used as the alloy (2), and intermittent heating was carried out with a burner.
Further, in Example 8, the following module was used as the thermoelectric conversion module 20.
Product name: Unireg Type Mg2Si Thermoelectric Conversion Module
Model number: prototype
Manufacturer: Nippon Thermostat Co. Ltd.
Constitution:
1. Thermoelectric element: Mg2Si (element size: 4 mm□×10 mm)
2. Number of elements: 9
3. Module size: 28×28×12 (mm)
Further, grease (Dow Corning Toray Co. Ltd.: SC102 COMPOUND (thermally conductive material)) was applied to the electrode of the cooling device 30 side of the thermoelectric module 20.
As shown in
Further, it was possible to confirm that the alloy (2) was held within a fixed temperature range (about 577° C.) for a period of 30 min after the burner was turned off and the heating was stopped, and the open-circuit voltage of the thermoelectric module 20 was maintained at about 0.35 V.
In Example 9, the alloys (1) and (2) were respectively filled into two spaces of 60 mm×60 mm×15 mm of the heat resistant frame, and a 15Al-85Zn alloy was used as the alloy (1), and a 30Sn-70Zn was used as the alloy (2), and intermittent heating was applied with a burner.
Further, in Example 9, the same module as in Example 7 was used as the thermoelectric conversion module 20.
As shown in
In Example 10, the alloys (1) and (2) were respectively filled into two spaces of 60 mm×60 mm×15 mm of the heat resistant frame, and a 30Sn-70Zn was used as the alloys (1) and (2), and intermittent heating was carried out with a burner.
Further, in Example 10, the same module as in Example 7 was used as the thermoelectric conversion module 20.
The thermocouple provided at the measurement location A (the long-and-short dashed line in
The thermocouple provided at the measurement location B (the thick long-and-short dashed line in
The thermocouple provided at measurement location C (the dotted line in
The long-and-short dashed line indicates the temperature changes of the alloy (1) measured at the measurement location A.
The long-and-two-short dashed line indicates the temperature changes of the alloy (2) measured at the measurement location B.
The dotted line indicates the temperature changes of the cooling portion cooled by the coolant of the cooling device 30 measured at the measurement location C.
The solid line indicates the changes of the open-circuit voltage of the thermoelectric module 20.
As shown in
Further, in Example 9 and Example 10, the size of the heat resistant frame is smaller than in Example 7 and Example 8, and the amount of the filled alloy is about 1/10, therefore the temperature variations that can be absorbed are smaller, and as a result, the variations in the open-circuit voltage of the thermoelectric conversion module 20 are greater than in Example 7 and Example 8. Therefore, such a thermal energy conversion system of small size is preferably applied in the case that the temperature variations of the heat source are small, and in the case that there are constraints on the installation size. Further, if necessary, a plurality of heat resistant frames or thermal energy conversion systems may be combined, or a plurality of heat resistant frames or thermal energy conversion systems may be connected and used.
Example 11 assumes the absorption of heat from the atmosphere of a chimney, and its conversion to electric power, and is constituted of the thermal energy conversion system 110 as shown in
As shown in
A thermoelectric conversion module 150 is disposed at the heat dissipation side of the heat storage frame 141A, and a cooling device 160 is further disposed at the low temperature side of the thermoelectric conversion module 150. The heat storage frame 141A, the thermoelectric conversion module 150, and the cooling device 160 are fixed with M10 bolts.
The thermoelectric conversion module 150 uses the following modules.
Product name: Thermo•Module
Model no.: T150-60-127
Manufacturer name: S. T. S. Company
Constitution:
1. Thermoelectric elements: Bi—Te system (actual measured size: about □1.3×1.5 mm)
2. Number of elements: 254 (127 pairs)
3. Module size: 39.6×39.6×4.16 (mm)
Further, a thermally conductive sheet (graphite sheet) is sandwiched between the thermoelectric conversion module 150 and the heat storage frame 141A. Furthermore, grease (Dow Corning Toray Co. Ltd.: SC102 COMPOUND (thermally conductive material)) was applied at the electrode of the cooling device 160 side of the thermoelectric conversion module 150.
Further, in order to measure the temperature changes, thermocouples are provided at the measurement location indicated by A to F in
The measurement location A is a position 60 mm below the aerofin tube 140, and measures the atmospheric temperature in the central portion of the chimney 120.
The measurement location B measures the alloy temperature inside the aerofin tube 140.
The measurement location C measures the alloy temperature inside the heat absorption-side heat storing section 142A.
The measurement location D measures the alloy temperature of a portion in the vicinity of the heat absorption-side heat storing section 142A, in the inside of the heat dissipation-side heat storing section 143A.
The measurement location E measures the alloy temperature of a portion in the vicinity of the thermoelectric conversion module 150, in the inside of the heat dissipation-side heat storing section 143A.
The measurement location F measures the temperature of the cooling water flowing in the cooling device 160.
The temperature changes of each of the measurement locations when the chimney 120 was intermittently heated by the burner 130, and the changes of the open-circuit voltage of the thermoelectric conversion module 150 are shown in
As shown in
Further, even when intermittently heating such that the atmospheric temperature in the central portion of the chimney 120 is within the range of 200 to 550° C., it was possible to confirm that the temperature of the alloy of the heat dissipation-side heat storing section 143A was held at about 199° C. which is the eutectic temperature of 30Sn-70Zn, and the open-circuit voltage of the thermoelectric conversion module 150 was maintained at about 5 V.
Further, after fully stopping the heating, for a period of about 30 min, it was possible to confirm that the temperature of the alloy of the heat dissipation-side heat storing section 143A is held at about 199° C., and the open-circuit voltage of the thermoelectric conversion module 150 is maintained at about 5 V.
In Example 12, in order to confirm the effects of the thermal fuse, a thermal energy conversion system 170 was constituted as shown in
As shown in
At the high temperature side of the heat storage frame 180, a thermal fuse 190 was provided so as to sandwich a thermally conductive sheet (graphite sheet). The thermal fuse 190 is cylindrical, and is stored in a case (□60 mm) made of a heat resistant material. The thermal fuse 190 is provided with a fusible alloy 191 of zinc having a fusion point of 419° C. which is lower than the fusion point of 450° C. of the 15Al-85Zn alloy, and retaining members 192A, 192B made of SS400 and which retain the fusible alloy 191. Further, the total thickness of the thermal fuse 190 is 30 mm, the thickness of the fusible alloy 191 is 6 mm, and the thickness of the retaining members 192A, 192B is 12 mm.
The thermoelectric conversion module 200 is disposed at the heat release side of the heat storage frame 180 so as to sandwich a thermally conductive sheet (graphite sheet), and a cooling device 210 is further provided at the low temperature side of the thermoelectric conversion module. As the thermoelectric conversion module 200, the same module as in Example 11 is used. Further, as the cooling device 210, a water cooled heat sink (manufactured by Takagi Manufacture: S-200W, made of oxygen free copper, 80 mm×80 mm×19 mm, surface roughness 1.6 a) was used. Furthermore, grease (Dow Corning Toray Co. Ltd.: SC102 COMPOUND (thermally conductive material)) was applied at the electrode of the cooling device 210 side of the thermoelectric conversion module 200.
Further, in order to measure the temperature changes, thermocouples were provided at the measurement locations indicated by A to F in
The measurement location A measures the temperature of the retaining member 192A which is the heat receiving side.
The measurement location B measures the temperature of the fusible alloy 191.
The measurement location C measures the temperature of the retaining member 192B which is the heat transmitting side.
The measurement location D measures the alloy temperature of a portion in the vicinity of the thermal fuse 190, in the inside of the heat absorption-side heat storing section 181.
The measurement location E measures the alloy temperature of a portion in the vicinity of the thermoelectric conversion module 200, in the inside of the heat dissipation-side heat storing section 182.
The measurement location F measures the temperature of the cooling water flowing in the cooling device 210.
The temperature changes at each measurement location when intermittently heating the thermal fuse 190 of
As shown in
Further, the time from when the temperature of the fusible alloy 191 drops, and the fusion of the fusible alloy 191 is temporarily stopped, until it next fuses and a gap arises is first the length t1 in
In Example 13, a thermal energy conversion system 220 was constituted as shown in
A partitioning plate is provided in the central portion of the heat storage frame 230, dividing the two spaces of the heat absorption-side heat storing section 231 and the heat dissipation-side heat storing section 232, and a 20Sn-80Zn alloy is filled into the heat absorption-side heat storing section 231, and an 80Sn-20Zn alloy is filled into the heat dissipation-side heat storing section 232.
The quartz glass plates 233A, 233B was integrally mounted on the flange plate, and the quartz glass rod 234 was mounted on the quartz glass plate 233A. Further, a contact type digital sensor, (KEYENCE CORPORATION, sensor head GT2-H12, amp GT2-70MCN), not shown in the drawings, made it possible to measure changes in the overall length of the heat storage frame 230 via the silica glass rod 234.
The thermoelectric conversion module 240 is disposed so as to sandwich a thermally conductive sheet (graphite sheet) at the heat dissipation side of the heat storage frame 230, and the cooling device 250 is further disposed at the low temperature side of the thermoelectric conversion module 240. The cooling device 250 presses against the thermoelectric conversion module 240 with a pressing force of about 4 kgF by a compression coil spring. As the thermoelectric conversion module, the same module as in Example 11 was used. Further, as the cooling device 250, a water cooled heat sink (manufactured by Takagi Manufacturing Co.: S-200W, made of oxygen free copper, 80 mm×80 mm×19 mm, surface roughness 1.6 a) was used. Furthermore, grease (Dow Corning Toray Co. Ltd.: SC102 COMPOUND (thermally conductive material)) was applied at the electrode of the cooling device 250 side of the thermoelectric conversion module 240.
Further, in order to measure the temperature changes, thermocouples were provided at the measurement locations indicated by A to E in
The measurement location A measures the temperature of the flange plate of the burner side.
The measurement location B measures the alloy temperature inside the heat absorption-side heat storing section 231.
The measurement location C measures the alloy temperature inside the heat dissipation-side heat storing section 232.
The measurement location D measures the temperature of flange plate of the thermoelectric conversion module 240 side.
The measurement location E measures the temperature of the cooling water flowing inside the cooling device 250.
The temperature changes of each of the measurement locations when the thermal energy conversion system 220 shown in
As shown in
It was possible to confirm that the heat storage frame 230 extends by a maximum of about 1 mm along with the temperature increase, and further, contracts along with the temperature decrease after the heating was stopped, in conformance with the heating cycle.
In Example 14, in order to confirm the influence by the type of cooling device, a thermal energy conversion system 260 as shown in
The temperature changes of each of the measurement locations when the thermal energy conversion system 260 shown in
As shown in
In Example 15, in order to investigate other constitutions using a bellows shaped expansion pipe (bellows) in the heat storage frame, a thermal energy conversion system 280 as shown in
As shown in
At the heat dissipation side of the heat storage frame 290, the thermoelectric conversion module 300 was disposed so as to sandwich a thermally conductive sheet (graphite sheet), and the cooling device 310 was further disposed at the low temperature side of the thermoelectric conversion module 300. The cooling device 310 pressed against the thermoelectric conversion module 300 with a pressing force of about 4 kgF by a compression coil spring. As the thermoelectric conversion module 300, the same module as in Example 11 was used. Further, as the cooling device 310, a water cooled heat sink (manufactured by Takagi Manufacturing Co.: S-200W, made of oxygen free copper, 80 mm×80 mm×19 mm, surface roughness 1.6 a) was used. Furthermore, grease (Dow Corning Toray Co. Ltd.: SC102 COMPOUND (thermally conductive material)) was applied at the electrode of the cooling device 310 side of the thermoelectric conversion module 300.
Further, in order to measure the temperature changes, thermocouples were provided at the measurement locations indicated by A to C in
The measurement location A measures the alloy temperature inside the heat absorption-side heat storing section 291.
The measurement location B measures the alloy temperature inside the heat dissipation-side heat storing section 292.
The measurement location C measures the temperature of the cooling water flowing inside the cooling device 310.
The temperature changes of each of the measurement locations when the thermal energy conversion system 280 shown in
As shown in
Furthermore, the expansion of the heat storage frame 290 along with the temperature increase was one mountain part (about 5 mm) of the bellows.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2011-075255 | Mar 2011 | JP | national |
| Filing Document | Filing Date | Country | Kind | 371c Date |
|---|---|---|---|---|
| PCT/JP2012/058613 | 3/30/2012 | WO | 00 | 12/23/2013 |
