1. Field of the Invention
The present disclosure relates to magnetic assemblies, and more particularly to heat transfer in magnetic assemblies.
2. Description of Related Art
A traditional magnetic assembly includes a wound magnetic core with copper windings placed in a metal housing. This assembly is typically potted with thermally conducting, electrically insulating material. During operation, such assemblies generate heat in amounts that must be dissipated to avoid damaging the components. Due to the need to electrically insulate the wires, and due to manufacturing tolerances, the potting material is typically used liberally to bridge the gap between the housing, which serves as a heat sink, and the windings and core. The length of the thermal path through the potting material, and the relatively low thermal conductivity of the potting material, limit operation capacity of the assembly due to the risk of overheating.
Such conventional methods and systems have generally been considered satisfactory for their intended purpose. However, there is still a need in the art for improved heat transfer in magnetic assemblies. The present disclosure provides a solution for this need.
A magnetic assembly includes a winding and a housing disposed about the winding. The housing includes an interior surface contoured to conform to the winding to facilitate heat transfer between the winding and the housing.
The interior surface of the housing can be spaced apart from the winding with a substantially constant gap width between the winding and the interior surface. The gap can be configured to electrically insulate the winding from the housing. A potting material can be disposed between the winding and the interior surface of the housing for electrical insulation between the winding and the housing, and for thermal conduction between the winding and the housing. It is contemplated that the interior surface of the housing can be contoured to conform to individual strands of the winding. A magnetic core can be included, wherein the winding is a copper winding wound about the magnetic core, and wherein the housing includes aluminum, for example.
A method of manufacturing a magnetic assembly includes forming a contoured interior surface on a housing and assembling a winding into the housing such that the interior surface of the housing conforms to the winding to facilitate heat transfer between the winding and the housing.
The method can include determining the outer contour of the winding, wherein forming a contoured interior surface includes forming the contoured interior surface to have a substantially constant gap width between the winding and the interior surface. It is also contemplated that the method can include disposing potting material between the winding and the interior surface of the housing for electrical insulation between the winding and the housing and for thermal conduction between the winding and the housing. In another aspect, forming a contoured interior surface can include forming the contoured interior surface to match the contour determined for the winding, e.g., forming the contoured interior surface to conform to individual strands of the winding.
In another aspect, determining the outer contour of the winding can include using rapid scanning. Forming the contoured interior surface can include using additive manufacturing, computer numerical control (CNC) machining, or the like, to form the contoured interior surface based on the outer contour determined using rapid scanning.
These and other features of the systems and methods of the subject disclosure will become more readily apparent to those skilled in the art from the following detailed description of the preferred embodiments taken in conjunction with the drawings.
So that those skilled in the art to which the subject disclosure appertains will readily understand how to make and use the devices and methods of the subject disclosure without undue experimentation, preferred embodiments thereof will be described in detail herein below with reference to certain figures, wherein:
Reference will now be made to the drawings wherein like reference numerals identify similar structural features or aspects of the subject disclosure. For purposes of explanation and illustration, and not limitation, a partial view of an exemplary embodiment of a magnetic assembly in accordance with the disclosure is shown in
Magnetic assembly 100 includes a winding 102 wound about the magnetic core 104 and a housing 106 disposed about winding 102. Magnetic assembly 100 can be used, for example, as an inductor in an electrical system. Winding 102 can be a copper winding, and housing 102 can be made of aluminum, for example.
As indicated in
Interior surface 108 of housing 106 is spaced apart from winding 102 with a substantially constant gap width G between winding 102 and interior surface 108. Gap width G is taken normal to opposed positions of surface 108 and the outer surface 112 of winding 102.
With reference now to
By contrast, in accordance with this disclosure, magnetic assembly 100 of
Referring now to
Method 150 includes forming a contoured interior surface on a housing, as indicated by box 154. Forming a contoured interior surface can include forming the contoured interior surface to have a substantially constant gap width, e.g., gap width G, between the winding and the interior surface. This can include using the geometry determined from the model of the outer surface of the winding, with an offset for the constant gap width to form the contoured interior surface to match the contour determined for the winding. Forming the contoured interior surface can include conform the interior surface to individual strands of the winding, as shown in
With the contoured interior surface formed, the winding can be assembled into the housing such that the interior surface of the housing conforms to the winding, as indicated by box 156. Potting material, e.g., potting material 110, can be disposed between the winding and the interior surface of the housing, as indicated by box 158.
The methods and systems of the present disclosure, as described above and shown in the drawings, provide for magnetic assemblies with superior properties including enhanced heat transfer. While the apparatus and methods of the subject disclosure have been shown and described with reference to preferred embodiments, those skilled in the art will readily appreciate that changes and/or modifications may be made thereto without departing from the spirit and scope of the subject disclosure.
This application is a divisional of U.S. patent application Ser. No. 14/454,925 filed Aug. 8, 2014, which is incorporated by reference herein in its entirety.
Number | Date | Country | |
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Parent | 14454925 | Aug 2014 | US |
Child | 15358867 | US |