1. Field of the Invention
The present invention relates to a heat transfer medium and a heat transfer method using the same, and more particularly to a heat transfer medium and a heat transfer method using the same in which heat is transferred by absorbing light in the range of infrared rays or visible radiation with a plurality of nano particles applied onto a film.
2. Description of the Prior Art
In case where it needs to crosslink, order, plasticize, or crystallize a film formed on a glass substrate or a plastic substrate using heat treatment, if heat is transferred to the whole substrate, fracture of the glass substrate or deformation of the plastic substrate occurs due to thermal expansion. It causes problems particularly in a process on plastic in that a sintering process requiring high temperature is impossible to perform, and inhomogeneous contraction occurs as well. Thus, there is needed a method capable of transferring heat to a specified portion in rapid time.
In connection with this, the present invention is intended to use a characteristic in which heat is elevated in temperature to 400 through 500° C. within a short time (1 to 2 seconds) through infrared (IR) heating by surface Plasmon effect of nano particles.
Further, another problem arises in that although titanium oxide (TiO2), i.e., a transparent porous electrode material, used in a photovoltaic (PV) cell should be sintered at 470° C., the sintering process cannot be performed in a plastic substrate.
The present invention has been made to solve the foregoing problems of the prior art and therefore an aspect of certain embodiments of the present invention is to apply nano particles of heat transfer medium onto a target device to thereby transfer heat to the target device, and furthermore to apply, as a mask, nano particles onto a infrared transmitting film to transfer heat to a specified portion of a target device to thereby obtain heat transfer effect without leaving unnecessary heat generating material in the device.
That is, using a characteristic capable of transferring heat within a short time through infrared heat transfer by surface Plasmon effect of nano particles, a problem of occurrence of breakage or deformation due to thermal expansion is solved which is generated in annealing or sintering process of a plastic device.
For this purpose, the present invention provides a heat transfer medium and a heat transfer method using the same in which heat is transferred by absorbing light in the range of infrared rays or visible radiation with a plurality of nano particles applied onto a film.
According to the present invention, when nano particles are applied onto a target object, the particles can be removed by etching, and when a transparent film coated thereon with the nano particles is positioned, as a mask, on a target object requiring heat transfer, and then is exposed to infrared rays, heat is transferred to a specified portion of the target object under the coated nano particles. This technology is very useful to a plastic device.
Specifically, in accordance with an aspect of the present invention, there is provided a heat transfer medium comprising a film coated with a plurality of nano particles, which absorb light incident to the film to thereby transfer heat to a target object.
In accordance with another aspect of the present invention, there is provided a heat transfer method using the heat transfer medium, the method comprising the steps of: applying a film with a plurality of nano particles; exposing the film coated with nano particles with light; and transferring heat to a target object through absorption of light incident to the film by the nano particles.
Herein, the nano particles may be applied directly to the target object, or be applied to an interlayer. Further, the nano particles may be applied to a transparent film such that the film is used as a mask while being positioned on a target object.
In the process of heat transfer using the above construction, the arrangement of the nano particles applied onto the film may be changed so as to transfer heat to a specified portion corresponding to the arrangement. Herein, the film may be exposed to light in the range of visible radiation or infrared rays.
In an embodiment, the transparent film is an infrared (IR) transparent film, and the nano particle is Au, Cu, Ag, Ti, Al, Pd, Pt, Rh, Ir, Fe, W, Ni, or combination thereof.
According to the present invention, when nano particles are applied onto a target object, the particles can be removed by etching, and when a transparent film coated thereon with the nano particles is positioned, as a mask, on a target object requiring heat transfer, and then is exposed to infrared rays, heat is transferred to a specified portion of a target object under the coated nano particles.
Such a heat transfer medium is available to a process of annealing an organic film on a plastic. For example, it can be adapted to a semiconductor film (130° C. reordering process) of a channel material and a dielectric (200° C. crosslink process) in OTFT. Further, it can be adapted to an inorganic film on a plastic, such as for example, a crystallization process (200° C.) of ZnO film, that is a channel material of ZnO TFT, and a crystallization process (350° C.) of Si film, that is a channel material of Si TFT.
The above and other objects, features and advantages of the present invention will be more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which:
Hereinafter, the preferred embodiments of the present invention will be described in detail. However, the present invention is not limited to the embodiments below, but may be realized in diverse forms within accompanying claims. The embodiments are merely provided for illustrative purpose and allowing the skilled in the art to easily perform the present invention.
That is, when the film coated with nano particles is exposed to light in the range of visible radiation or infrared rays, the nano particles 11 absorb the light, and transfers heat to the device through a surface plasmon effect according to charge density deviation occurring in a boundary between a metal thin film and a dielectric. Like this, the heat transfer medium including the nano particles 11 applied onto the infrared transparent film 10 can be utilized in a sintering process or an annealing process of a plastic or glass substrate.
In an embodiment, the arrangement of the nano particles on the infrared transparent film is changed to thereby control the heat transfer such that heat is transferred to only a specified portion corresponding to the arrangement of the nano particles. That is, the nano particles are applied to a whole surface or a specified portion of the infrared transparent film, which is required for heat transfer, so that the heat transfer can be performed to the whole surface or the specified portion.
In connection with this, referring to
The gold nano particles used in
From the graphs of
That is, in this case, as set forth before, with changing the arrangement of the nano particles 61 on the infrared transparent film 60, control can be done to heat transfer to only a specified portion corresponding to the arrangement of the nano particles. Specifically, according to the portion 63 of the plastic substrate 62 that is coated with an organic material or other material and needs annealing, the nano particles 61 are applied to only a specified portion of the infrared transparent film 60 in the same shape of the portion 63 needing annealing, so that heat transfer can be performed to only the portion 63 needing annealing, thereby obtaining crystallizing or sintering of the substrate in the same shape as that of the portion needing annealing.
While the present invention has been described with reference to the particular illustrative embodiments and the accompanying drawings, it is not to be limited thereto but will be defined by the appended claims.
It is to be appreciated that those skilled in the art can substitute, change or modify the embodiments into various forms without departing from the scope and spirit of the present invention.
Number | Date | Country | Kind |
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10-2007-0091180 | Sep 2007 | KR | national |
This application is a divisional application of U.S. patent application Ser. No. 12/124,818 filed on May 21, 2008, which claims priority to Korean Patent Application No. 10-2007-0091180 filed on Sep. 7, 2007 in the Korean Intellectual Property Office, the entire contents of which are hereby incorporated by reference.
Number | Date | Country | |
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Parent | 12124818 | May 2008 | US |
Child | 13270790 | US |