Patent Application
20160025422
1. Field
The present disclosure relates to heat transfer systems, more specifically to heat transferring structures and plates.
2. Description of Related Art
Electrical components in circuitry (e.g., aircraft or spacecraft circuits) include heat generating components and require sufficient heat transfer away from the heat generating components in order to function properly. Many mechanisms have been used to accomplish cooling, e.g., fans, heat transfer plates, and actively cooled devices such as tubes or plates including tubes therein for passing coolant adjacent a hot surface. While circuitry continues to shrink in size, developing heat transfer devices sufficient to move heat away from the components is becoming increasingly difficult.
Such conventional methods and systems have generally been considered satisfactory for their intended purpose. However, there is still a need in the art for improved heat transfer devices. Recent advancements in metal based additive manufacturing techniques allow the creation of micro-scale, geometrically complex devices not previously possible with conventional machining. The use of conductive metal and innovative geometries offers many benefits to devices cooling high heat flux energy sources. The present disclosure provides a solution for this need.
In at least one aspect of this disclosure, a heat transfer device includes a body defining a fluid inlet and fluid outlet, and a plurality of channels defined within the body in fluid communication between the fluid inlet and the fluid outlet, wherein the channels are interlaced and fluidly isolated from one another between the fluid inlet and the fluid outlet. The body can define a unitary matrix fluidly isolating the channels from one another between the fluid inlet and the fluid outlet.
The device can be configured to mount to an electrical component. The body can include aluminum or any other suitable material. The body can be about 0.08 inches (about 2 mm) thick or any other suitable thickness. The body can define at least one channel fluid inlet for each channel. The body can also define at least one channel fluid outlet for each channel.
The channels can be wave shaped and such that they are defined by a waveform. The wave shaped channels can be interlaced by defining the waveform of each channel off-phase from each other to avoid intersection and fluid communication of channels.
In some embodiments, the plurality of channels can be aligned in a square grid of rows and columns. In other embodiments, the plurality of channels can be defined diagonally and include at least one bend.
Each channel can be off phase by 180 degrees from each other such that the channels thermally intertwine within the body and are fluidly isolated from one another.
A method includes forming a heat transfer device by forming a body defining a fluid inlet and fluid outlet and a plurality of channels defined within the body in fluid communication between the fluid inlet and the fluid outlet, wherein the channels are interlaced and fluidly isolated from one another between the fluid inlet and the fluid outlet. This can include forming the heat transfer device by additive manufacturing.
These and other features of the systems and methods of the subject disclosure will become more readily apparent to those skilled in the art from the following detailed description taken in conjunction with the drawings.
So that those skilled in the art to which the subject disclosure appertains will readily understand how to make and use the devices and methods of the subject disclosure without undue experimentation, embodiments thereof will be described in detail herein below with reference to certain figures, wherein:
Reference will now be made to the drawings wherein like reference numerals identify similar structural features or aspects of the subject disclosure. For purposes of explanation and illustration, and not limitation, an illustrative view of an embodiment of a heat transfer device in accordance with the disclosure is shown in
Referring generally to
The device 100 can be configured to mount to an electrical component (e.g., a microchip or other suitable device) to transfer heat therefrom and to cool the electrical component. Any other suitable heat transfer application using device 100 is contemplated herein.
Referring to
The minimum thickness is limited by the capabilities of the manufacturing process used to make the channels. The use of additive manufacturing techniques with embodiments of this disclosure allowed channels 107 with dimensions as low as about 0.02 inches (about 0.5 mm) and the overall body thickness as stated above.
The body 101 can define at least one channel fluid inlet 111 for each channel 107 such that each fluid channel connects to fluid inlet 103 at the channel fluid inlet 111. The channel fluid inlets 111 can include any suitable size and/or shape, and can differ from one another in any suitable manner. The body 101 can also define at least one channel fluid outlet 113 for each channel 107 such that each fluid channel connects to fluid outlet 105 at the channel fluid inlet 113. The channel fluid outlets 113 can include any suitable size and/or shape, and can differ from one another in any suitable manner. In this respect, flow can enter the device 100 at the inlet 103, travel into the channels 107 through channel inlets 111, pass through the channels 107, and exit the channels 107 through channel outlets 113 into outlet 105.
The channels 107 each have a wave shape (e.g., sinusoidal as shown in
In some embodiments, the plurality of channels 107 can be aligned in a square grid of rows and/or crossing columns. As shown in
Each channel 107 can be off phase by 180 degrees from channels it is interlaced with, such that the channels 107 intertwine within the body 101 but remain fluidly isolated from one another. Such an arrangement allows consistent thermal transfer between the multiple channels, increasing thermal transfer of the device 100 from a heat source relative to traditional systems.
The channels 107 can have a height (amplitude of the waveform) that is less than the thickness of the body 101, but any suitable height or cross-sectional area within that thickness is contemplated herein. As stated above, the channels 107 can be about 0.02 inches thick
The body 101 can include aluminum or any other suitable thermally conductive material. The material or combination of materials that form the body 101 can be selected on a case-by-case basis to account for thermal transfer properties to efficiently transfer heat to the fluid in the body 101.
As disclosed herein, the heat transfer device 100 efficiently transfers heat from a heat source by allowing a coolant (e.g., water or any other suitable refrigerant) to efficiently pass through the body 101 via the channels 107. The design of the channels 107 allows for a longer path within the body 101 and additional time for heat to transfer to the coolant compared to traditional configurations. Such a compact design allows for much more efficient cooling of small heat generating devices. The diagonally interlaced channel arrangement also mitigates loss of heat transfer due to poor flow distribution as every channel is in thermal communication with every other channel. This is particularly beneficial in two-phase boiling applications where large changes in density can cause flow instability.
In another aspect of this disclosure, a method includes forming a heat transfer device 100 by forming a body 101 that defines a plurality of fluidly isolated channels 107 within the body, wherein the channels 107 are interlaced and fluidly isolated from one another between the fluid inlet 103 and the fluid outlet 105. This can include forming the heat transfer device 101 by additive manufacturing. Any other suitable process for forming the device 100 can be used without departing from the scope of this disclosure.
The methods, devices, and systems of the present disclosure, as described above and shown in the drawings, provide for heat transfer devices with superior properties including increased heat transfer. While the apparatus and methods of the subject disclosure have been shown and described with reference to embodiments, those skilled in the art will readily appreciate that changes and/or modifications may be made thereto without departing from the spirit and scope of the subject disclosure.
