Patent Application
20160025423
1. Field
The present disclosure relates to heat transfer systems, more specifically to heat transferring structures and plates.
2. Description of Related Art
Electrical components in circuitry (e.g., aircraft or spacecraft circuits) include heat generating components and require sufficient heat transfer away from the heat generating components in order to function properly. Many mechanisms have been used to accomplish cooling, e.g., fans, heat transfer plates, and actively cooled devices such as tubes or plates including tubes therein for passing coolant adjacent a hot surface. While circuitry continues to shrink in size, developing heat transfer devices sufficient to move heat away from the components is becoming increasingly difficult.
Such conventional methods and systems have generally been considered satisfactory for their intended purpose. However, there is still a need in the art for improved heat transfer devices. Recent advancements in metal based additive manufacturing techniques allow the creation of micro-scale, geometrically complex devices not previously possible with conventional machining. The use of conductive metal and innovative geometries offers many benefits to devices cooling high heat flux energy sources. The present disclosure provides a solution for this need.
A heat transfer device includes a body defining a fluid inlet and fluid outlet. The body also defines a plurality of channels defined within the body in fluid communication between the fluid inlet and the fluid outlet, wherein the channels are fluidly isolated from one another between the fluid inlet and the fluid outlet.
The body can define a unitary matrix fluidly isolating the channels from one another between the fluid inlet and the fluid outlet. The device can be configured to mount to an electrical component (e.g., a microchip or other suitable device).
The body can be about 0.08 inches (about 2 mm) thick or any other suitable thickness. The body can define at least one fluid inlet for each channel. In certain embodiments, the body can define at least one fluid outlet for each channel.
The channels can be square wave shaped defined by a square waveform to provide multiple impingement zones on opposed faces of the body to facilitate heat transfer. The square wave shaped channels disposed adjacent each other can define the square waveforms off-phase from each other.
The plurality of channels can be defined in a series of rows grouped together in at least one branch. Each channel can be off phase of an adjacent channel by 90 degrees. The body can include aluminum or any other suitable material.
In some aspects of this disclosure, a method includes forming a heat transfer device by forming a body defining fluid inlet and fluid outlet and a plurality of channels defined within the body in fluid connection between the fluid inlet and the fluid outlet, wherein the channels are fluidly isolated from one another between the fluid inlet and the fluid outlet. Forming can include forming the heat transfer device by additive manufacturing.
In at least one aspect of this disclosure, a system includes at least one electrical component and at least one heat transfer device including a body defining fluid inlet and fluid outlet and a plurality of channels defined within the body in fluid connection between the fluid inlet and the fluid outlet, wherein the channels are fluidly isolated from one another between the fluid inlet and the fluid outlet.
These and other features of the systems and methods of the subject disclosure will become more readily apparent to those skilled in the art from the following detailed description taken in conjunction with the drawings.
So that those skilled in the art to which the subject disclosure appertains will readily understand how to make and use the devices and methods of the subject disclosure without undue experimentation, embodiments thereof will be described in detail herein below with reference to certain figures, wherein:
Reference will now be made to the drawings wherein like reference numerals identify similar structural features or aspects of the subject disclosure. For purposes of explanation and illustration, and not limitation, an illustrative view of an embodiment of a heat transfer device in accordance with the disclosure is shown in
Referring generally to
The device 100 can be configured to mount to an electrical component (e.g., a microchip or other suitable device) to transfer heat therefrom and to cool the electrical component. Any other suitable heat transfer application using device 100 is contemplated herein.
Referring to
The body 101 can define at least one channel fluid inlet 111 for each channel 107 such that each fluid channel connects to fluid inlet 103 at the channel fluid inlet 111. The channel fluid inlets 111 can include any suitable size and/or shape, and can differ from one another in any suitable manner. The body 101 can also define at least one channel fluid outlet 113 for each channel 107 such that each fluid channel connects to fluid outlet 105 at the channel fluid inlet 113. The channel fluid outlets 113 can include any suitable size and/or shape, and can differ from one another in any suitable manner. In this respect, flow can enter the device 100 at the inlet 103, travel into the channels 107 through channel inlets 111, pass through the channels 107, and exit the channels 107 through channel outlets 113 into outlet 105.
The channels 107 can be square wave shaped as shown in
As shown, the plurality of channels 107 can be defined in a series of rows and/or branches. Any other suitable arrangement is contemplated herein. Each channel can be off phase of an adjacent channel by 90 degrees, 180 degrees, or any other suitable off-phase.
The body 101 can include aluminum or any other suitable heat conducting material. The material or combination of materials that form the body 101 can be selected to account for thermal transfer properties to efficiently transfer heat to the fluid in the body 101.
As disclosed herein, the heat transfer device 100 efficiently transfers heat from a heat source by allowing a coolant (e.g., water or any suitable refrigerant) to efficiently pass through the body 101 via the channels 107. The design of the channels 107 allows for a longer path within the body 101 and additional time and impingement locations for heat to transfer to the coolant compared to alternate configurations. Such compact designs allow for much more efficient cooling of small heat generating devices.
In another aspect of this disclosure, a method includes forming a heat transfer device 100 by forming a body 101 that defines a plurality of fluidly isolated channels 107 within the body, each channel 107 connecting to the a fluid inlet 103 and a fluid outlet 105. This can include forming the heat transfer device 101 by additive manufacturing. Any other suitable process for forming the device 100 can be used without departing from the scope of this disclosure.
The methods, devices, and systems of the present disclosure, as described above and shown in the drawings, provide for a heat transfer device with superior properties including increased heat transfer. While the apparatus and methods of the subject disclosure have been shown and described with reference to embodiments, those skilled in the art will readily appreciate that changes and/or modifications may be made thereto without departing from the spirit and scope of the subject disclosure.
