The invention relates to heat transfer profiles.
Besides energy forms corresponding to their actual purpose, electric devices and components in particular produce losses, mainly heat losses. In addition to being wasted energy, this heat may be harmful to the operation of the device or component in question, or that of another device, component or structure arranged in the vicinity thereof. Indeed, excessive heating may for instance shorten the life of devices, components and structures, decrease their efficiency, or even prevent them from operating appropriately. For example in connection with electronics, lighting and buildings, it is thus often necessary to arrange some cooling so as to transfer heat away from an object heating up.
Heat transfer profiles to be used for heat transfer, such as so-called cooling profiles, are structures designed for optimizing heat transfer from a component, structure or the like producing heat. Such optimization of heat transfer may comprise for instance optimizing the direction, velocity or evenness of the transfer of heat. The heat transfer profiles may be used for cooling or heating, on their own or together with other devices, such as cooling devices, or in connection therewith. Typically, heat transfer takes place particularly through convection and radiation, so the surface area plays an important role, which is why the heat transfer profiles often comprise for instance various plates or spikes for increasing the heat-transferring surface area.
However, for instance cooling profiles are often large in relation to the object to be cooled and, when used in combination with for instance various fans or blowers, they may cause additional air resistance and thus even prevent the cooling air from moving.
An object of the invention is thus to provide a novel heat transfer profile. The object is achieved by a heat transfer profile which is characterized by what is stated in the independent claims. Preferred embodiments of the invention are disclosed in the dependent claims.
The solution is based on forming the heat transfer profile from two peripheries which are arranged inside one another such that an outer one of the peripheries is cut at least over a portion of the length of the periphery and which, within the uniform area of the outer periphery, are connected by heat transfer flanges.
An advantage of the heat transfer profile according to the solution is that it is thus possible to form an as small and light as possible heat transfer structure which transfers heat optimally and which enables for instance versatile active cooling devices or elements, light sources and/or other electrically driven devices or components and/or arms or other fastening or support structures to be easily connected thereto.
The invention is now described in closer detail in connection with the preferred embodiments and with reference to the accompanying drawings, in which:
a,
7
b, and 7c schematically show some heat transfer profile arrangements.
In the figures, like reference numerals identify like or similar elements. When the figure comprises several parts or sections of like structure and/or purpose, for the sake of clarity, only one or some of the mutually identical parts or sections is/are usually indicated by reference numerals. It is clear to one skilled in the art that in different embodiments, the features and/or embodiments disclosed in the figures and the description may also be combined in an appropriate manner.
The heat transfer profile 1 may comprise a cylindrical uniform inner periphery 2 inside of which a cylindrical first space 5 is formed. The heat transfer profile 1 may further comprise a cylindrical outer periphery 3 arranged outside the cylindrical inner periphery. The outer periphery 3 is preferably arranged coaxially with the inner periphery 2. Preferably, the outer periphery then forms a box-like frame structure around the heat transfer profile. The cylindrical outer periphery 3 may have been formed to have a shape wherein at least one of its sides is cut, in which case the outer periphery 3 comprises at least one discontinuity point 6a, 6b. In the embodiment of
The heat transfer profile 1 may further comprise a plurality of blade-like heat transfer flanges 4 extending between the inner periphery 2 and the outer periphery 3, only one such flange being indicated by a reference numeral in
An advantage of such a structure is that the cylindrical inner periphery 2 evens out differences in heat transfer between different parts of the heat transfer profile. It also saves the surface area required by the heat transfer profile as compared with a planar bottom plate without decreasing the actual heat transfer or cooling surface area. Further, the inner periphery 2 forms a protective periphery between the object to be cooled and, on the other hand, the environment external thereto, enabling the different parts of the structure to be simply and tightly protected from one another and, on the other hand, for instance against environmental influences, such as air, water and impurities, by employing simple seal and cover solutions, for instance.
A further advantage of such a structure is that the outer periphery 3 connects the heat transfer flanges 4, which makes the structure particularly robust and enhances steady heat transfer. In addition, the structure protects the ends of the heat transfer flanges for instance against damage, forming an open, independent box body. In such a case, the outer periphery 3 also serves as an extension of the heat transfer flanges 4, increasing their surface area and thus enabling a structure as compact as possible with respect to the required cooling power.
In an embodiment, at least one heat transfer flange 4 is arranged substantially at an angle to at least one other heat transfer flange when viewed from a cross direction. The cross direction refers to a cutting direction perpendicular to the direction of a longitudinal axis of the cylindrical inner periphery 2. In an embodiment, the heat transfer flanges 4 may be arranged between the inner periphery 2 and the outer periphery 3 substantially radially.
It is clear that
When the outer periphery 3 comprises at least one discontinuity point 6a, 6b, a second space 7a, 7b is formed which is defined at least by a section of the inner periphery 2 and two heat transfer flanges 4 and which is open at least from the cut side of the outer periphery 3 to the exterior of the outer periphery 3.
In an embodiment, the outer periphery 3 of the heat transfer profile 1 is cut at least on two sides, i.e. it comprises at least two discontinuity points 6a, 6b. In such a case, inside each cut part, i.e. discontinuity points 6a, 6b, of the outer periphery 3, a second space 7a, 7b, two such second spaces in the embodiment of
In an embodiment, the cut sides, i.e. the discontinuity points 6a, 6b, of the outer periphery are arranged with respect to one another on substantially opposite sides of the outer periphery 3, i.e. opposite to one another on opposite sides of the longitudinal axis of the heat transfer profile 1.
The first space 5 and one or more second spaces 7a, 7b form chamber-like spaces, in the embodiment of
In an embodiment, the heat transfer flanges 4 are arranged in a position substantially perpendicular to a cross direction of the cylindrical inner periphery 2 and outer periphery 3. The cross direction of the inner periphery 2 and the outer periphery 3 refers to a cutting direction perpendicular to the longitudinal direction of the heat transfer profile 1, i.e. perpendicular to the direction of the longitudinal axis of the cylindrical inner periphery 2. In other words, the heat transfer flanges 4 extend in a direction substantially parallel with the longitudinal direction of the cylindrical peripheries formed by the inner periphery 2 and the outer periphery 3. In such a case, the heat transfer flanges 4 join at their first end 4a to the inner periphery 2, and at their second end 4b, which is opposite to the first end, to the outer periphery 3. In different embodiments, the crosswise profiles of the heat transfer flanges 4 may vary in the manners shown in
In an embodiment, the heat transfer profile is formed as a structure open at the ends of the cylindrical inner periphery and outer periphery.
In an embodiment, the heat transfer profile comprises aluminium or aluminium alloy.
An embodiment comprises a heat transfer profile wherein the inner periphery, the outer periphery, and the heat transfer flanges form a uniform, fixed structure.
In an embodiment, the outer periphery 3 comprises at edges of a cut part, i.e. a discontinuity point 6a, 6b, projections 8 which are perpendicular to the cross direction of the cylindrical outer periphery 3 and which extend towards the inner periphery. In other words, the projections 8 continue from the outer periphery 3 at the edge of the discontinuity point 6a, 6b towards the inner periphery 2, as shown in
In an embodiment, the heat transfer profile comprises a base plate 12 arranged in the first space 5 and in contact with the inner periphery. This enables the heat transfer to be further improved by transferring heat efficiently also through the base plate to the inner periphery and, therethrough, to the heat transfer flanges and the outer periphery.
An advantage of the present heat transfer profile is that the cooling properties of the heat transfer profile may be influenced by changing the height of the heat transfer profile. This enables modular solutions suitable for different uses and situations, for instance.
In an embodiment, the heat transfer profile may be a cooling profile used for transferring heat away from a heat-producing device or structure in order to optimize the cooling of the device or structure. In another embodiment, the heat transfer profile may be a heating profile used for transferring heat from a heat-producing device or structure in order to optimize the heating of a surrounding structure, space or the like.
In an embodiment, the device structure comprises a heat transfer profile 1 according to any one of the embodiments disclosed above or a combination thereof. The device structure may further comprise at least one of the following: a light source, a transistor, a diode, a resistor, an IC circuit, a fan, a blower, a fastener, and another electronic component.
In an embodiment, the first space 5 of the heat transfer profile may be provided with a light source. The heat transfer profile may further be provided with fastening structures, such as a fastening plate and/or a fastening arm by employing a fastening method known per se, such as screw fastening. In such a case, a lighting structure thus formed and comprising a heat transfer profile may be arrangeable in a ceiling, a wall or a lighting post, for instance. Since an appropriate heat transfer profile enables the optimal operating temperature and thus efficiency of the light source to be ensured also under challenging conditions and the structure can be easily protected by various cover or shield structures, it is simple to produce a structure suitable for street lighting, industrial or warehouse lighting, cold or humid spaces or other demanding conditions, for instance.
An advantage of the above-disclosed solution is that the outer periphery may serve as a substantial part of the frame of the heat transfer profile and/or the device structure and also form a supporting and/or box-like structure around the heat transfer profile and/or the device structure. In such a case, no separate casing is necessarily required at all.
In addition, in embodiments designed for outdoor usage in particular, the disclosed solution, wherein heat transfer flanges are arranged at an angle to one another, enables fouling of the heat transfer profile and particularly clogging of gaps, which weakens the flow of air on the surface of and inside the heat transfer profile, to be diminished considerably as compared with solutions wherein the heat transfer flanges are arranged side by side, mutually parallelly. This may be further improved by arranging the heat transfer flanges farther away from one another taking, however, the heat transfer surface area optimal for the heat transfer demand into consideration. Such a solution is thus highly suited for use in outdoor lighting, for instance, in which case the light source 13 may be arranged in the first space 5 defined by the inner periphery 2, for instance.
It is apparent to a person skilled in the art that as technology advances, the basic idea of the invention may be implemented in many different ways. The invention and its embodiments are thus not restricted to the examples described above but may vary within the scope of the claims.
Number | Date | Country | Kind |
---|---|---|---|
20135734 | Jul 2013 | FI | national |
Filing Document | Filing Date | Country | Kind |
---|---|---|---|
PCT/FI2014/050548 | 7/2/2014 | WO | 00 |