BACKGROUND OF THE INVENTION
1. Field of the Invention
The present disclosure relates to a heat transferring device and a method for manufacturing the same.
2. Description of the Related Art
Currently, the thermal management market growth momentum is adequate, and the heat transferring device is the main product on the market. The heat transferring device includes apparatuses needing to perform or partition heat transfer such as a heat exchanger, a radiator, a condenser, a heater, and a heat insulator.
To provide excellent heat transfer performance, a larger heat transfer surface area is required, so as to increase surface roughness or add fins to achieve improvement of the heat transfer performance. The heat transfer surface area increased by increasing surface roughness is limited, and thus the manner of adding fins is mostly used as a solution. However, adding fins means increase of the equipment volume. Moreover, to achieve the increasingly high demand for thermal management, and to increase the fin area, due to the minimum fin spacing restriction, increase of the volume of the heat transferring device is ultimately required, and the weight thereof also needs to be increased. Another efficient heat transferring device is a heat pipe, and a lot of heat can be taken away by using phase-change latent heat. However, the heat can be transferred to the atmosphere only by adding another heat transferring device. Thus, an innovative heat transferring device is still demanded.
SUMMARY OF THE INVENTION
The present disclosure provides a heat transferring device. The heat transferring device includes: a flexible heat transfer substrate including a first surface, a second surface, at least one solid portion and at least one characteristic hole portion. The second surface is corresponding to the first surface, the at least one solid portion is formed between the first surface and the second surface. The at least one characteristic hole portion includes several characteristic holes penetrating through the first surface and the second surface. The flexible heat transfer substrate further includes: a first end and a second end, and the second end is corresponding to the first end. The flexible heat transfer substrate is rolled from the first end towards the second end to form the heat transferring device with a predetermined shape.
The present disclosure further provides a method for manufacturing a heat transferring device. The method includes: (a) providing a flexible heat transfer substrate including a first surface, a second surface, at least one solid portion and at least one characteristic hole portion, wherein the second surface is corresponding to the first surface, the at least one solid portion is formed between the first surface and the second surface, the at least one characteristic hole portion includes several characteristic holes penetrating through the first surface and the second surface; the flexible heat transfer substrate further including: a first end and a second end, wherein the second end is corresponding to the first end; (b) fixing the first end of the flexible heat transfer substrate onto a rotary shaft of a rolling unit, and fixing the second end of the flexible heat transfer substrate to a moving platform; and (c) rolling the flexible heat transfer substrate to form the heat transferring device with a predetermined shape.
The heat transferring device of the present disclosure can use a porous structure formed by the characteristic holes of the characteristic hole portion to increase the heat transfer surface area, so as to facilitate heat exchange and improve heat transfer efficiency.
The method for manufacturing a heat transferring device according to the present disclosure does not use an adhesive agent and polymer materials to fix the shape of the heat transferring device. The front stage of the process can perform cleaning for the flexible heat transfer substrate, thus reducing energy consumption and having no pollution concerns.
The method for manufacturing a heat transferring device can be proceeded continuously, and does not require the use of special powders and other advanced manufacturing technologies. Therefore, the method of the disclosure can reduce the cost and price of the heat transferring device. The characteristic hole portion can use a sheet for manufacturing, and the process for manufacturing the characteristic hole portion is simple.
The method for manufacturing a heat transferring device can adjust the shape and dimension of the heat transferring device depending upon customization specifications. The heat transferring devices with various specifications can be proceeded by one method, and high performance heat transferring devices can be provided with more competitive prices to enter the thermal management market.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1A is a schematic top view of a flexible heat transfer substrate according to a first embodiment of the present disclosure.
FIG. 1B is a schematic side view of the flexible heat transfer substrate according to the first embodiment of the present disclosure.
FIG. 2 is a schematic view of the heat transferring device according to the first embodiment of the present disclosure.
FIG. 3A is a schematic top view of a flexible heat transfer substrate according to a second embodiment of the present disclosure.
FIG. 3B is a schematic side view of the flexible heat transfer substrate according to the second embodiment of the present disclosure.
FIG. 4 is a schematic sectional view of the heat transferring device according to the second embodiment of the present disclosure.
FIG. 5A is a schematic top view of a flexible heat transfer substrate according to a third embodiment of the present disclosure.
FIG. 5B is a schematic side view of the flexible heat transfer substrate according to the third embodiment of the present disclosure.
FIG. 6 is a schematic sectional view of a heat transferring device according to the third embodiment of the present disclosure.
FIG. 7A is a schematic top view of a flexible heat transfer substrate according to a fourth embodiment of the present disclosure.
FIG. 7B is a schematic side view of the flexible heat transfer substrate according to the fourth embodiment of the present disclosure.
FIG. 8 is a schematic sectional view of a heat transferring device according to the fourth embodiment of the present disclosure.
FIG. 9A is a schematic top view of a flexible heat transfer substrate according to a fifth embodiment of the present disclosure.
FIG. 9B is a schematic side view of the flexible heat transfer substrate according to the fifth embodiment of the present disclosure.
FIGS. 10A and 10B are schematic views of implementation aspects of characteristic hole portions of a flexible heat transfer substrate according to the present disclosure.
FIG. 11 is a schematic view of a flow chart of a method for manufacturing a heat transferring device according to the present disclosure.
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1A is a schematic top view of a flexible heat transfer substrate according to a first embodiment of the present disclosure. FIG. 1B is a schematic side view of the flexible heat transfer substrate according to the first embodiment of the present disclosure. According to the first embodiment of the present disclosure, the flexible heat transfer substrate 10 of the present disclosure includes: a first surface 11, a second surface 12, at least one solid portion 13 and at least one characteristic hole portion 14. The second surface 12 is corresponding to the first surface 11. The flexible heat transfer substrate 10 may be a metal, ceramic, composite or polymer material.
The at least one solid portion 13 is formed between the first surface 11 and the second surface 12, the at least one characteristic hole portion 14 includes several characteristic holes 141 and 142 penetrating through the first surface 11 and the second surface 12, and the characteristic holes 141 and 142 are circular. The flexible heat transfer substrate 10 further includes: a first end 15 and a second end 16, the second end 16 is corresponding to the first end 15, where the flexible heat transfer substrate 10 is rolled from the first end 15 towards the second end 16, to form a heat transferring device 20 (referring to FIG. 2) of a predetermined shape.
In this embodiment, the flexible heat transfer substrate 10 includes two solid portions 13 and a characteristic hole portion 14, the characteristic hole portion 14 is disposed between the two solid portions 13. The flexible heat transfer substrate 10 further includes several spacers 17 disposed on the first surface 11. The spacers 17 have a set distance therebetween, and the spacers 17 are disposed in one of the two solid portions 13.
FIG. 2 is a schematic view of the heat transferring device according to the first embodiment of the present disclosure. As stated above, the flexible heat transfer substrate 10 is rolled from the first end 15 towards the second end 16 to form a cylindrical heat transferring device 20. In addition to the solid portion 13 and the characteristic hole portion 14, the heat transferring device 20 has a hollow portion 21 formed by spacing the first surface of the rolled flexible heat transfer substrate 10 from the second surface 12 due to separation of the spacers 17. In this embodiment, the axis of the heat transferring device 20 is made by rolling the solid portion 13, and is a solid structure. The hollow portion 21 surrounds the axis externally and axially penetrates through the heat transferring device 20, so that the heat transferring device 20 forms a tubular structure.
The heat transferring device 20 of the present disclosure can use a porous structure formed by the characteristic holes of the characteristic hole portion 14 to increase the heat transfer surface area, so as to facilitate heat exchange and improve heat transfer efficiency. In addition, a fluid can be added to the hollow portion 21, if the fluid is in a stationary state, heat transfer is mainly performed by means of thermal conduction, and the heat transfer performance is low, and has a heat-insulating function. If the fluid is in a flowing state, the heat transfer can be performed by means of thermal convection, so that the heat transfer performance is good, and has a heat dissipating or heating function. Therefore, the heat transfer performance can be controlled by controlling the flow velocity of the fluid, so that the heat transferring device 20 can achieve various heat transfer demands, such as heat exchange, heating, dissipating, cooling, and heat-insulating.
FIG. 3A is a schematic top view of a flexible heat transfer substrate according to a second embodiment of the present disclosure. FIG. 3B is a schematic side view of the flexible heat transfer substrate according to the second embodiment of the present disclosure. The difference between the flexible heat transfer substrate 30 according to the second embodiment of the present disclosure and the flexible heat transfer substrate 10 according to the first embodiment lies in that, spacers 31 of the flexible heat transfer substrate 30 according to the second embodiment of the present disclosure are disposed on two solid portions 13.
FIG. 4 is a schematic sectional view of the heat transferring device according to the second embodiment of the present disclosure. Referring to FIGS. 3A, 3B and 4, in this embodiment, a heat transferring device 35 according to the second embodiment is formed by rolling the flexible heat transfer substrate 30. A rotary shaft of a rolling unit used for rolling the flexible heat transfer substrate 30 is large, so that the periphery of the axis of the heat transferring device 35 according to the second embodiment is formed by rolling the solid portions 13 and the spacers 31, and thus the axis of the rolled heat transferring device 35 is a hollow portion 32. From the center to the periphery, the structure of the heat transferring device 35 is the hollow portion 32, the solid portion 13, the characteristic hole portion 14, the solid portion 13, the hollow portion 33 and the solid portion 13. In other words, the heat transferring device 35 is a tubular structure having two hollow portions 32 and 33, and the two hollow portions 32 and 33 are spaced apart by the solid portion 13, the characteristic hole portion 14 and the solid portion 13. Similarly, the heat transferring device 35 according to the second embodiment of the present disclosure has the efficacy of the heat transferring device 20 in the first embodiment.
FIG. 5A is a schematic top view of a flexible heat transfer substrate according to a third embodiment of the present disclosure. FIG. 5B is a schematic side view of the flexible heat transfer substrate according to the third embodiment of the present disclosure. The flexible heat transfer substrate 50 according to the third embodiment of the present disclosure includes: a first surface 51, a second surface 52, three solid portions 531, 532 and 533, a characteristic hole portion 54 and several spacers 57. The characteristic hole portion 54 includes several characteristic holes 541 and 542. The characteristic hole portion 54 extends from the center to a first end 55 to separate the three solid portions 531, 532 and 533. The spacers 57 are disposed in the solid portion 531, and in this embodiment, the spacers 57 are disposed between the characteristic hole portion 54 and an upper edge. The flexible heat transfer substrate 50 according to the third embodiment of the present disclosure further includes a notch portion 58 disposed at a second end 56 and a lower edge.
FIG. 6 is a schematic sectional view of a heat transferring device according to the third embodiment of the present disclosure. Referring to FIGS. 5A, 5B and 6, in this embodiment, the heat transferring device 40 according to the third embodiment is formed by rolling the flexible heat transfer substrate 50. The spacers 57 of the flexible heat transfer substrate 50 are rolled to make the axis of the heat transferring device 40 become a hollow portion 41. The first end 55 of the flexible heat transfer substrate 50 rolled into the hollow portion 41 of the axis further includes the characteristic hole portion 54 and the solid portions 531 and 532, and thus the axis of the heat transferring device 40 is a hollow structure, and a side face at the axis has several characteristic holes 541 and 542. The notch portion 58 of the flexible heat transfer substrate 50 is rolled to make the periphery of the heat transferring device 40 also become the notch portion 58. Similarly, the heat transferring device 40 according to the third embodiment of the present disclosure has the efficacy of the heat transferring device 20 in the first embodiment.
FIG. 7A is a schematic top view of a flexible heat transfer substrate according to a fourth embodiment of the present disclosure. FIG. 7B is a schematic side view of the flexible heat transfer substrate according to the fourth embodiment of the present disclosure. The flexible heat transfer substrate 70 according to the fourth embodiment of the present disclosure includes: a first surface 71, a second surface 72, two solid portions 731 and 732, a characteristic hole portion 74 and a notch portion 77. The characteristic hole portion 74 includes several characteristic holes 741 and 742, and the characteristic hole portion 74 is disposed in the center. The solid portion 731 extends from a first end 75 to below the characteristic hole portion 74. The notch portion 77 is disposed at a second end 76 and a lower edge.
FIG. 8 is a schematic sectional view of a heat transferring device according to the fourth embodiment of the present disclosure. Referring to FIGS. 7A, 7B and 8, in this embodiment, the heat transferring device 60 according to the fourth embodiment is formed by rolling the flexible heat transfer substrate 70, and the solid portion 731 of the flexible heat transfer substrate 70 is rolled to make the axis of the heat transferring device 60 become a hollow structure. Moreover, the notch portion 77 of the flexible heat transfer substrate 70 is rolled to make the periphery of the heat transferring device 60 also become the notch portion 77. Similarly, the heat transferring device 60 according to the fourth embodiment of the present disclosure has the efficacy of the heat transferring device 20 in the first embodiment.
FIG. 9A is a schematic top view of a flexible heat transfer substrate according to a fifth embodiment of the present disclosure. FIG. 9B is a schematic side view of the flexible heat transfer substrate according to the fifth embodiment of the present disclosure. The flexible heat transfer substrate 80 is substantially identical with the third embodiment, and includes: a first surface 81, a second surface 82, three solid portions 831, 832 and 833, a characteristic hole portion 84 and several spacers 87. The difference lies in that the spacers 87 are disposed in the characteristic hole portion 84, and close to a first end 85. The spacers 87 are materials extruding the characteristic hole portion 84 when the characteristic hole 841 is formed, and the spacers 87 are formed by protruding the material of the characteristic hole portion 84 beyond the first surface 81. The schematic section view of the heat transferring device according to the fifth embodiment of the present disclosure is the same as that of the heat transferring device according to the third embodiment, which is as shown in FIG. 6, and is not repeated herein.
FIGS. 10A and 10B are schematic views of implementation aspects of characteristic hole portions of a flexible heat transfer substrate according to the present disclosure. In FIG. 10A, the characteristic hole portion 100 includes several characteristic holes 101 and 102, and the characteristic holes 101 and 102 are hexagonal. In FIG. 10B, the characteristic hole portion 110 includes several characteristic holes 111 and 112, and the characteristic holes 111 and 112 are rhombic. However, in other embodiments, the characteristic holes of the characteristic hole portion may be polygonal.
FIG. 11 is a schematic view of a flow chart of a method for manufacturing a heat transferring device according to the present disclosure. Referring to step S91, a flexible heat transfer substrate is provided. The flexible heat transfer substrate can refer to the above embodiments, and is not repeated herein. Referring to step S92, the flexible heat transfer substrate is processed; preferably, the step of treating the flexible heat transfer substrate includes: shock-washing 5 minutes with ultra-pure water, shock-washing 5 minutes with acetone, shock-washing 5 minutes with ultra-pure water and shock-washing with 5 minutes with alcohol, for removing residual oil in the processing of the flexible heat transfer substrate as well as solid impurities on the surface.
Referring to step S93, the first end of the flexible heat transfer substrate is fixed onto a rotary shaft of a rolling unit, and the second end of the flexible heat transfer substrate is fixed to a moving platform. A clamp can be used to clamp and fix the second end of the flexible heat transfer substrate to the moving platform. Referring to step S94, the flexible heat transfer substrate is rolled at a predetermined rotation speed to perform continuous rolling. The rolling process may include a shape setting step, as shown in step S95, a shape setting device is used, during the rolling process, to get close to the flexible heat transfer substrate so as to form a heat transferring device with the predetermined shape. Alternatively, the rotary shaft of the rolling unit having various shapes can be used to form the heat transferring device with various predetermined shapes.
In addition, the rolling process may include a tension controlling step, as shown in step S96, a tensometer is used to control tension in the rolling process, to control the tension acted upon the flexible heat transfer substrate.
In order to fix the shape of the heat transferring device, a connecting step may be included in the rolling process or after the rolling, as shown in step S97, the flexible heat transfer substrate is connected in the rolling process or after the rolling with a high-temperature furnace melting, spark plasma, resistance welding or laser welding method, to form the heat transferring device with the predetermined shape, as shown in step S98.
The method for manufacturing a heat transferring device according to the present disclosure does not use an adhesive agent and polymer materials to fix the shape of the heat transferring device. The front stage of the process can perform cleaning for the flexible heat transfer substrate, thus reducing energy consumption and having no pollution concerns.
The method for manufacturing a heat transferring device can be proceeded continuously, and does not require the use of special powders and other advanced manufacturing technologies. Therefore, the method of the disclosure can reduce the cost and price of the heat transferring device. The characteristic hole portion can use a sheet for manufacturing, and the process for manufacturing the characteristic hole portion is simple.
The method for manufacturing a heat transferring device can adjust the shape and dimension of the heat transferring device depending upon customization specifications. The heat transferring devices with various specifications can be proceeded by one method, and high performance heat transferring devices can be provided with more competitive prices to enter the thermal management market.
While several embodiments of the present disclosure have been illustrated and described, various modifications and improvements can be made by those skilled in the art. The embodiments of the present disclosure are therefore described in an illustrative but not in a restrictive sense. It is intended that the present disclosure should not be limited to the particular forms as illustrated and that all modifications which maintain the spirit and scope of the present disclosure are within the scope defined in the appended claims.
Patent Application
20140166251
