Patent Application
20250164198
The present disclosure relates to a heat transport device.
Conventionally, a heat transporter that transports heat using circulation of a fluid is known. Examples of the heat transporter include a thermosiphon and a wick (capillary structure) type heat pipe.
For example, Patent Document 1 discloses a loop type thermosiphon in which a working fluid is sealed in a sealed container. The thermosetting has an evaporation section and a condensation section. The evaporation section receives heat from a heating element and evaporates the working fluid. The evaporated gas-phase working fluid flows toward the condensation section. The condensation section condenses the gas-phase working fluid into a liquid phase by dissipating heat of the gas-phase working fluid to outside.
In a wick type heat pipe, a working fluid is sealed in a sealed container. The working fluid is evaporated by heat supplied in the evaporation section, flows to the condensation section, and is condensed by heat radiation in the condensation section. Thus, the heat pipe transports heat from the evaporation section to outside of the condensation section. Note that the liquid-phase working fluid condensed in the condensation section returns to the evaporation section by a capillary force of a wick provided on an inner wall surface of the closed container.
However, there is a concern that, when the working fluid is unevenly distributed in the heat transport device, heat transport efficiency of the heat transporter is significantly reduced. For example, when a temperature of the heating element is too high, a large amount of a gas-phase working fluid is generated due to rapid evaporation and an amount of a fluid-phase working fluid is reduced in some cases. In this case, there is also a concern that, when the working fluid becomes difficult to circulate or cannot circulate between the evaporation section and the condensation section, the amount of heat that is transported from a heat source to the evaporation section by the heat transporter is reduced, and heat transportation cannot be performed. Furthermore, when condensing capacity of the condensation section is insufficient with respect to an amount of the gas-phase working fluid, the gas-phase working fluid cannot be sufficiently condensed, and overheating occurs in the heat transporter of the working fluid. This problem can also occur in a thermosiphon, a wick type heat pipe, or the like.
Note that, regarding the heat transport efficiency, in the thermosiphon of Patent Document 1, a multilayer structure having a foam metal layer is provided in the evaporation section, so that efficiency of transferring heat to the working fluid in the evaporation section is increased. In this case, since evaporation of the working fluid in the evaporation section is promoted, when a temperature of the heat source is too high, a large amount of the gas-phase working fluid is generated in the thermosiphon, and therefore, the above-described problem cannot be solved. That is, there is a concern that the working fluid is unevenly distributed and heat transport efficiency of the thermosiphon is significantly reduced.
In view of the above circumstances, it is an object of the present disclosure to provide a heat transport device capable of suppressing or preventing reduction in heat transport efficiency due to uneven distribution of a fluid in a heat transporter.
In order to achieve the above-described object, a heat transport device according to an aspect of the present invention includes a heat exchanger, a fluid supplier, and a supply flow path. The heat exchanger includes a circulation flow path through which a fluid can circulate, and a first cooler that cools the fluid. The circulation flow path includes a heat absorbing flow path that is arranged in a first heat source, and a heat radiation flow path that is arranged in the first cooler. The supply flow path connects the circulation flow path of the heat exchanger and the fluid supplier.
Additional features and advantages of the present invention will become more apparent from the following embodiments.
According to the present invention, it is possible to provide a heat transport device capable of suppressing or preventing reduction in heat transport efficiency due to uneven distribution of a fluid in a heat transporter.
Embodiments of the present invention will be described below with reference to the accompanying drawings.
The heat transport device 100 is arranged in a place in which there is a heat source, such as an exhaust pipe of an incinerator, exhaust heat of a factory, or the like, and transports heat dissipated from the heat source to outside. The heat of the factory that has been transported is used for, for example, thermal power generation. In this embodiment, the heat source in which the heat transport device 100 is arranged is the exhaust duct H1. In the exhaust duct H1, the high-temperature gas flow HG flows in a direction of an arrow pointing from a left side to a right side of
Each component of the heat transport device 100 is controlled by a control device 200. The heat transport device 100 may include the control device 200, or may not include the control device 200. That is, in the latter configuration, the control device 200 is an external device that controls the heat transport device 100.
As illustrated in
The heat exchanger 1 is installed on the exhaust duct H1 and transports heat to outside of the exhaust duct H1 by a fluid F circulating by natural convention without requiring a mechanical device, such as a pump or the like. In this embodiment, the fluid F is water. However, the present invention is not limited to this example, the fluid F may be some other liquid than water, and is preferably a liquid that can be transported by latent heat due to a gas-and-liquid phase change. As the heat exchanger 1, a plurality of heat exchangers 1 are provided and connected to each other via the connection flow path 4. The heat exchangers 1 are thermosiphons that have the same configuration, and perform latent heat transport using a gas-and-liquid phase change. However, the present invention is not limited to this example, and at least one heat exchanger 1 may be some other device than a thermosiphon that is capable of transporting heat. For example, the at least one heat exchanger 1 may be a wick type heat pipe, and may be capable of transporting heat without using a gas-and-liquid phase change. The above-described example does not exclude a configuration including a single heat exchanger 1. Note that a single heat exchanger 1 is provided, the connection flow path 4 is omitted.
As illustrated in
The supply flow path 3 is a hollow pipe arranged between the heat exchanger 1 and the fluid supplier 2 and connects the circulation flow path 11 of the heat exchanger 1 and the fluid supplier 2. The fluid F can flow from one of the heat exchangers 1 and the fluid supplier 2 to the other one thereof via the supply flow path 3.
In the heat transport device 100, the fluid supplier 2 is connected to the circulation flow path 11 of the heat exchanger 1 via the supply flow path 3. Therefore, even when the fluid F that transports heat is insufficient in the heat exchanger 1 due to uneven distribution, the fluid F can be supplied from the fluid supplier 2 to the heat exchanger 1. Accordingly, in the heat transport device 100, reduction in heat transport efficiency due to uneven distribution of the fluid F can be suppressed or prevented and overheating in the heat exchanger 1 can be prevented.
Next, a configuration example of the heat exchanger 1 will be described in detail with reference to
The circulation flow path 11 of the heat exchanger 1 further includes an inflow path 113 and an outflow path 114 in addition to the heat absorbing flow path 111 and the heat radiation flow path 112. In other words, the circulation flow path 11 includes the heat absorbing flow path 111, the heat radiation flow path 112, the inflow path 113, and the outflow path 114. The heat absorbing flow path 111 is a vaporization section that vaporizes the fluid F by heat that is received from the high-temperature gas flow HG in the exhaust duct H1 and is also a hollow pipe extending in a meandering manner. An inlet of the heat absorbing flow path 111 is connected to an inlet port Pi of the exhaust duct H1. An outlet of the heat absorbing flow path 111 is connected to an outlet port Po of the exhaust duct H1. The inlet port Pi and the outlet port Po are pipe connection ports arranged on an outer wall surface of the exhaust duct H1 (for example, a duct flange P1 attached to the exhaust duct H1). The fluid F flows into the heat absorbing flow path 111 via the inlet port Pi and flows out from the heat absorbing flow path 111 via the outlet port Po.
The heat radiation flow path 112 is a condensation section in which the vaporized fluid F is cooled by the cooler 12 to be liquefied.
(That is, the fluid F is condensed.) An inlet of the heat radiation flow path 112 is connected to an inlet port 121 of the cooler 12. An outlet of the heat radiation flow path 112 is connected to an outlet port 122 of the cooler 12. Note that the inlet port 121 and the outlet port 122 are pipe connection ports arranged in a housing 120 of the cooler 12. The fluid F flows into the heat radiation flow path 112 via the inlet port 121 and flows out from the heat radiation flow path 112 via the outlet port 122.
The inflow path 113 is a flow path of the fluid F that is arranged between the inlet port Pi of the heat absorbing flow path 111 and the outlet port 122 of the cooler 12 and connects the inlet port Pi and the outlet port 122. For example, one end of the inflow path 113 is connected to the inlet port Pi of the exhaust duct H1. The other end of the inflow path 113 is connected to the outlet port 122 of the cooler 12. The inflow path 113 causes the fluid F that flows out from the heat radiation flow path 112 via the outlet port 122 of the cooler 12 to flow into the heat absorbing flow path 111 via the inlet port Pi of the exhaust duct H1.
The outflow path 114 is a flow path of the fluid F that is arranged between the outlet port Po of the heat absorbing flow path 111 and the inlet port 121 of the cooler 12 and connects the outlet port Po and the inlet port 121. For example, one end of the outflow path 114 is connected to the outlet port Po of the exhaust duct H1. The other end of the outflow path 114 is connected to the inlet port 121 of the cooler 12. The outflow path 114 causes the fluid F that flows out from the heat absorbing flow path 111 via the outlet port Po of the exhaust duct H1 to flow into the heat radiation flow path 112 via the inlet port 121 of the cooler 12.
In each of the heat exchangers 1, the other end of the outflow path 114 (and the inlet port 121 of the cooler 12) is arranged above the one end of the inflow path 113 (and the inlet port Pi of the exhaust duct H1) and the other end of the inflow path 113 (and the outlet port 122 of the cooler 12) in the vertically upward direction Z1. In other words, the inlet and the outlet of the heat radiation flow path 112 are arranged above the inlet of the heat absorbing flow path 111 in the vertically upward direction Z1.
A temperature of the fluid F in the inflow path 113 is lower than a temperature of the fluid in the outflow path 114. Furthermore, in this embodiment, in a normal operation, the fluid F in a liquid phase flows in the inflow path 113, and the fluid F in a gas phase flows in the outflow path 114. Therefore, a density of the fluid F in the inflow path 113 is higher than a density of the fluid F in the outflow path 114. Accordingly, by arranging the inlet and the outlet of the heat radiation flow path 112 above the inlet of the heat absorbing flow path 111 in the vertically upward direction Z1, the fluid F in the circulation flow path 11 can circulate in an order of the heat absorbing flow path 111→the outflow path 114→the heat radiation flow path 112→the inflow path 113→the heat absorbing flow path 111→ . . . due to a difference in density between the fluid F in the inflow path 113 and the fluid F in the outflow path 114. That is, the fluid F in the circulation flow path 11 can naturally circulate without requiring a device that causes the fluid F to circulate.
Next, the cooler 12 further includes a refrigerant flow path 123. In this embodiment, the refrigerant flow path 123 is a hollow pipe through which a refrigerant flows in one direction and is arranged in the housing 120. Each of an inlet and an outlet of the refrigerant flow path 123 is arranged on an outer surface of the housing 120 and is connected to a circulation device (such as a pump or the like; not illustrated) that causes the refrigerant to circulate. Note that the refrigerant in a liquid phase or a gas phase sent out from the outlet of the refrigerant flow path 123 is subjected to waste heat utilization and then is sent to the circulation device. When the refrigerant in a liquid phase is sent out, the refrigerant can be used for hot water supply, cooling and heating, or the like. When the refrigerant in a gas phase is sent out, the refrigerant can be used for power generation in a power generator, such as a gas turbine or the like.
Alternatively, the cooler 12 may further include one or more power generation members 124. The power generation member is, for example, a thermoelectric conversion element, such as a Peltier element or the like, is accommodated in the housing 120, and generates power by using heat transported by the heat exchanger 1. For example, in the housing 120, the refrigerant flow path 123 faces the heat radiation flow path 112 with the Peltier element interposed therebetween. In other words, the refrigerant flow path 123 is arranged on one side of the Peltier element. The heat radiation flow path 112 is arranged on the other side of the Peltier element. Electric power generated by the power generation member 124 may be used as a power source of a component (for example, an electromagnetic valve attached to the heat exchanger 1, the fluid supplier 2, the supply flow path 3, or the like) of the heat transport device 100 which requires electric power, and may be transmitted to outside of the heat transport device 100.
In addition, an electromagnetic valve 1231 that controls opening and closing of the refrigerant flow path 123 may be installed in the refrigerant flow path 123. Opening and closing of the electromagnetic valve 1231 is controlled by the control device 200.
The electromagnetic valve 1231 is of a normally-on type, and opens the refrigerant flow path 123 to allow the refrigerant to flow during normal operation. However, this example does not exclude a configuration in which the electromagnetic valve 1231 is not installed in the refrigerant flow path 123.
In this embodiment, as described above, the plurality of heat exchangers 1 are provided, and the heat transport device 100 further includes the connection flow paths 4. Each of the connection flow paths 4 is a harrow pipe through which the fluid F can flow and connects the respective circulation flow paths 11 of the heat exchangers 1. For example, in
The connection flow paths 4 connect the respective circulation flow paths 11 of the heat exchangers 1, so that the plurality of heat exchangers 1 can share the fluid F. That is, the fluid F is distributed between the heat exchangers 1 via the connection flow paths 4. Therefore, a pressure of the fluid F in the heat exchangers 1 is equalized. Since a saturation temperature of the fluid F can be made uniform in the heat exchangers 1 by making the pressure uniform, the fluid F shared by the plurality of heat exchangers 1 is uniformly heated by the exhaust duct H1. Therefore, even when the temperatures of portions of the exhaust duct H1 in which the respective heat absorbing flow paths 111 of the heat exchangers 1 are arranged are not uniform due to fluctuations or the like, the temperature of the fluid F shared by the plurality of heat exchangers 1 can be made uniform.
Note that there is a probability that distribution of the fluid F among the heat exchangers 1 causes uneven distribution of the fluid F and the fluid F is insufficient in some of the heat exchangers 1. In this case, the fluid F is supplied from the fluid supplier 2 to the heat exchangers 1. Therefore, the heat transport device 100 can suppress or prevent reduction in heat transport efficiency due to uneven distribution of the fluid F, and can also prevent overheating in the heat exchangers 1 in which the fluid F is insufficient.
Preferably, at least one connection flow path 4 connects the respective inlet flow paths 113 of the heat exchangers 1. The fluid F that flows into the heat absorbing flow paths 111 flows in the inflow paths 113. Therefore, by connecting the respective inflow paths 113 of the heat exchangers 1 to each other by the connection flow paths 4, the fluid F can be directly supplied to the inflow paths 113 of the heat exchangers 1 in which the fluid F is insufficient due to uneven distribution of the fluid F. Therefore, an insufficiency of the fluid F that flows in the heat absorbing flow paths 111 can be more reliably eliminated, and thus, it is possible to suppress or prevent reduction in heat transport efficiency due to uneven distribution of the fluid F in the heat exchangers 1 in which the fluid F is insufficient. However, this example does not exclude a configuration in which at least one connection flow path 4 connects the respective outflow paths 114 of the heat exchangers 1 to each other, and does not exclude a configuration in which all the connection flow paths 4 connect the inflow paths 113 of some of the heat exchangers 1 to the outflow paths of the other ones of the heat exchangers 1.
Preferably, in at least one connection flow path 4, one end and the other end of the connection flow path 4 are arranged at the same height position in the vertical direction Z. Thus, the pressure of the fluid F at one end of the connection flow path 4 and the pressure of the fluid F at the other end of the connection flow path 4 can be made the same. Therefore, difference in pressure of the fluid F between the one end and the other end of the connection flow path 4 can be eliminated.
Accordingly, the fluid F can smoothly flow between the circulation flow paths of the plurality of heat exchangers 1 without being affected by the pressure difference.
More preferably, the one ends and the other ends of all the connection flow paths 4 are arranged at the same height position in the vertical direction Z. Thus, the pressure of the fluid F can be made the same at one ends and the other ends of all the connection flow paths 4. Therefore, the fluid F shared by the plurality of heat exchangers 1 can be more uniformly distributed without being affected by the difference in pressure between the different connection flow paths 4.
However, the above-described example does not exclude a configuration in which one end and the other end of at least one connection flow path 4 are arranged at different height positions in the vertical direction Z, and does not exclude a configuration in which one ends and the other ends of some of the connection flow paths 4 and one ends and the other ends of the other ones of the connection flow paths 4 are arranged at different height positions in the vertical direction Z.
In this embodiment, all the heat exchangers 1 are installed in the same heat source (that is, the exhaust duct H1). However, the present invention is not limited to this example, and some of the heat exchangers 1 may be installed in the exhaust duct H1, while the other heat exchangers 1 may be installed in some other heat source than the exhaust duct H1. Alternatively, the heat exchangers 1 may be arranged in different heat sources.
Next, preferably, at least one heat exchanger 1 further includes a sensor 13 that detects overheating of the fluid F in the circulation flow path 11 of the heat exchanger 1. Note that, in this embodiment, a specific heat exchanger 1a that will be described later includes the sensor 13. However, the present invention is not limited to this example, and some other heat exchanger 1 than the specific heat exchanger 1a may include the sensor 13, and each of all the heat exchangers 1 may include the sensor 13. For example, the sensor 13 is a temperature sensor, is arranged in the circulation flow path 11, and detects a temperature of the outer surface of the circulation flow path 11. A detection result of the sensor 13 is output to the control device 200. The control device 200 detects the temperature of the fluid F flowing in the circulation flow path 11 and a temporal change thereof, based on an output signal of the sensor 13 indicating the detection result.
Next, a configuration example of the fluid supplier 2 will be described in detail with reference to
In this embodiment, the fluid supplier 2 is arranged in a heat source H2. Note that the heat source H2 is an example of a “second heat source” of the present invention. Specifically, at least a portion of the fluid tank 21 is arranged in the heat source H2. For example, in
For example, as illustrated in
Preferably, in
Alternatively, as illustrated in
Preferably, in
The fluid F in the fluid tank 21 is heated by heat received from the heat source H2 and, on the other hand, can be cooled by the cooling member 22, as described above. That is, cooling of the cooling member 22 can be switched between execution and stop. In this embodiment, an electromagnetic valve 221 controlled by the control device 200 is installed in a pipe between an inlet (or outlet) of the cooling member 22 and a device that causes the refrigerant to flow in the cooling member 22. The electromagnetic valve 221 switches between circulation and stop of the refrigerant in the pipe. By switching between execution and stop of cooling of the cooling member 22, a supply state of the fluid F supplied from one of the fluid supplier 2 and the heat exchanger 1 to the other thereof can be adjusted without installing an opening-and-closing device or a device that controls a flow of the fluid F in the supply flow path 3.
For example, in the fluid supplier 2, when cooling of the cooling member 22 is stopped, the pressure of the fluid F in the fluid tank 21 is increased by volume expansion due to a temperature rise. On the other hand, when the fluid F is insufficient in the heat exchangers 1, the pressure of the fluid F is reduced in the heat exchangers 1. Therefore, in this case, in the fluid supplier 2, for example, the electromagnetic valve 221 is switched to a closed state to stop cooling of the cooling member 22 and increase the temperature of the fluid F in the fluid tank 21 as it is. Thus, the heat transport device 100 can supply the fluid F from the fluid supplier 2 to the heat exchangers 1. That is, when the pressure of the fluid F in the heat exchangers 1 becomes lower than the pressure of the fluid F in the fluid tank 21, the fluid F is naturally supplied from the fluid tank 21 to the heat exchangers 1 through the supply flow path 3. Therefore, the heat transport device 100 can eliminate an insufficiency of the fluid F in the heat exchangers 1.
On the other hand, in the fluid supplier 2, when cooling of the cooling member 22 is executed, the pressure of the fluid F in the fluid tank 21 reduces due to volume contraction caused by reduction in temperature. On the other hand, when the fluid F is not insufficient in the heat exchangers 1, the pressure of the fluid F is not reduced in the heat exchangers 1. In this case, in the fluid supplier 2, for example, the electromagnetic valve 221 is switched to an open state to execute cooling of the cooling member 22 and reduce the temperature of the fluid F in the fluid tank 21 by the cooling. Thus, the fluid F in the fluid tank 21 is less likely to be supplied to the heat exchangers 1. That is, when the pressure of the fluid F in the heat exchangers 1 becomes equal to or higher than the pressure of the fluid Fin the fluid tank 21, naturally, the fluid F in the fluid tank 21 is not supplied to the heat exchangers 1. Furthermore, the fluid F in the heat exchangers 1 is sent to the fluid tank 21 of the fluid supplier 2 in accordance with an increase in the pressure of the fluid F in the heat exchangers 1 with respect to the pressure of the fluid F in the fluid tank 21. Thus, the pressure of the fluid F in the heat exchangers 1 can be prevented from being excessively increased.
Preferably, cooling of the fluid F in the fluid supplier 2 can be switched between execution and stop, based on the detection result of the sensor 13. For example, cooling of the fluid F in the fluid supplier 2 is stopped in response to detection of overheating of the fluid F by the sensor 13. That is, when overheating of the fluid F in the heat exchangers 1 is detected based on the detection result of the sensor 13, the control device 200 closes the electromagnetic valve 221 to stop cooling of the fluid F in the fluid tank 21 by the cooling member 22. Thus, the fluid F is supplied from the fluid tank 21 to the heat exchangers 1 via the supply flow path 3. Note that, when overheating of the fluid F is not detected from the detection result of the sensor 13, cooling of the fluid F in the fluid supplier 2 is executed. Thus, when overheating of the fluid F in the circulation flow path 11 is detected, the fluid F can be supplied from the fluid supplier 2 to the heat exchangers 1. Therefore, an insufficiency of the fluid F in the circulation flow paths 11 of the heat exchangers 1 can be eliminated more reliably and quickly, and the temperature of the excessively heated fluid F can be reduced. However, the present invention is not limited to this example, and cooling of the fluid F in the fluid supplier 2 and stop of the cooling may be manually switched.
Note that, in a supply mechanism for the fluid F as described above, the electromagnetic valve 221 is put in an open state in a normal operation (that is, when the fluid F is not insufficient in the heat exchangers 1), and is put in a closed state when the fluid F is insufficient in the heat exchangers 1. Therefore, preferably, the electromagnetic valve 221 is a normally-on type. Thus, the electromagnetic valve 221 may be switched when the fluid F is insufficient in the heat exchangers 1, and therefore, it is possible to reduce power consumption in the electromagnetic valve 221. However, this example does not exclude a configuration in which the electromagnetic valve 221 is not a normally-on type.
Furthermore, in order to realize the supply mechanism for the fluid F as described above, the fluid tank 21 of the fluid supplier 2 is installed in the heat source H2 and is heated. Therefore, the heat source H2 may be a heating element installed for heating the fluid F in the fluid tank 21. However, the above-described example does not exclude a configuration in which the fluid tank 21 of the fluid supplier 2 is not installed in the heat source H2. Thus, the fluid F in the fluid tank 21 may not be heated. Even in this case, for example, by setting the cooling capacity of the cooling member 22 high, the supply mechanism for the fluid F as described above can be realized by raising and lowering the pressure in accordance with a difference in temperature between when the fluid F in the fluid tank 21 is cooled by the cooling member 22 and when cooling is stopped.
Next, the supply flow path 3 will be described in detail with reference to
The supply flow path 3 connects the fluid tank 21 of the fluid supplier 2 and the circulation flow paths 11 of the heat exchangers 1. For example, the fluid supplier 2 includes a port 23. The port 23 is an example of a “first flow port” of the present invention, is a pipe connection port through which the fluid F can flow into and out from the fluid tank 21, and is arranged in the fluid tank 21. Each of the circulation flow paths 11 of the heat exchangers 1 includes a port 115. The port 115 is an example of a “second flow port” of the present invention, is a pipe connection port through which the fluid F can flow into and out from the circulation flow path 11, and is preferably arranged in the inflow path 113. One end of the supply flow path 3 is connected to the port 23 of the fluid supplier 2. The other end of the supply flow path 3 is connected to the port 115 of the heat exchanger 1.
Preferably, in the vertical direction Z, a height position of the port 23 of the fluid supplier 2 is the same as a height position of the port 115 of the heat exchanger 1. Thus, a pressure of the fluid F at the port 23 (in other words, one end of the supply flow path 3) and a pressure of the fluid F at the port 115 (in other words, the other end of the supply flow path 3) can be made the same. Accordingly, a difference in pressure of the fluid F therebetween can be eliminated. Therefore, the fluid F can smoothly flow between the heat exchanger 1 and the fluid supplier 2 without being affected by the difference in pressure. However, this example does not exclude a configuration in which the height position of the port 23 is different from the height position of the port 115 in the vertical direction Z.
In the vertical direction Z, preferably, height positions of one end and the other end of at least one connection flow path 4 are the same as the height position of the port 115 of the heat exchanger 1. More preferably, the height positions of one ends and the other ends of all the connection flow paths 4 are the same as the height positions of the ports 115 of the heat exchanger 1. Thus, the pressures of the fluid F at the one end and the other end of the supply flow path 3 can be made the same as the pressure of the fluid F at the one end and the other end of each of the connection flow paths 4. Accordingly, a difference in pressure of the fluid F therebetween can be eliminated. Therefore, the fluid F can smoothly flow between the heat exchangers 1 and the fluid supplier 2 and in the connection flow paths 4 without being affected by the difference in pressure. However, this example does not exclude a configuration in which the height position of the port 115 of the heat exchanger 1 is different from the height positions of the one ends and the other ends of all the connection flow paths 4.
Furthermore, as illustrated in
For example, the other end of the supply flow path 3 is connected to (the port 115 of) the circulation flow path 11 of the specific heat exchanger 1a. Note that the number of the specific heat exchangers 1a may be one, and may be two or more. In the latter case, a branch flow path 31 is connected to (the port 115 of) each of the respective circulation flow paths 11 of the specific heat exchangers 1a. Note that the branch flow path 31 is a hollow pipe that branches at the other end of the supply flow path 3.
For example, the specific heat exchanger 1a is some of the plurality of heat exchangers 1, and is, for example, the heat exchanger 1 arranged in a portion of the exhaust duct H1 in which the internal temperature is equal to or higher than a predetermined upper limit temperature Tu. The upper limit temperature Tu is set to a temperature at which the fluid F is excessively vaporized in the heat absorbing flow path 111, and is, for example, higher than the lower limit temperature Td described above with respect to the fluid F in the fluid tank 21. Alternatively, the specific heat exchanger 1a (that is, the above-described some of the heat exchangers 1) may be arranged on a more upstream side of the exhaust duct H1 than rest of the heat exchangers 1.
When a spatial temperature distribution in the exhaust duct H1 is less likely to vary, a large amount of the fluid F is likely to be distributed to the heat exchanger 1 in which the heat absorbing flow path 111 is arranged in a portion having a higher temperature than those of other portions. In particular, a larger amount of the fluid F is distributed to the heat exchanger 1a arranged in a portion in which the internal temperature of the exhaust duct H1 is equal to or higher than the upper limit temperature Tu. Therefore, an insufficiency of the fluid F is likely to occur in the heat exchangers 1 other than the specific heat exchanger 1a. Accordingly, the amount of the fluid F distributed to the specific heat exchanger 1a can be reduced by connecting the supply flow path 3 to the circulation flow path 11 of the specific heat exchanger 1a and reliably supplying the fluid F from the fluid supplier 2 to the specific heat exchanger 1a. Therefore, since unevenness of the fluid F distributed to the heat exchangers 1 can be reduced, an insufficiency of the fluid F in the heat exchangers 1 other than the specific heat exchanger 1a can be suppressed or prevented.
Alternatively, as illustrated in
An electromagnetic valve 32 that is controlled by the control device 200 may be arranged in the supply flow path 3. Specifically, the heat transport device 100 may further include the electromagnetic valve 32 that switches opening and closing of the supply flow path 3. The electromagnetic valve 32 may be arranged on one end side (that is, a fluid supplier 2 side) of the supply flow path 3 or may be arranged on the other end side (for example, each of the branch flow paths 31) of the supply flow path 3.
Preferably, the electromagnetic valve 32 switches an open-and-close state of the supply flow path 3 by the control device 200 in accordance with the detection result of the sensor 13. For example, the electromagnetic valve 32 switches the supply flow path 3 to an open state in response to the detection of overheating of the fluid F by the sensor 13. That is, when overheating of the fluid F in the heat exchanger 1 is detected based on the detection result of the sensor 13, the control device 200 closes the electromagnetic valve 32 to allow the fluid F to flow in the supply flow path 3. Thus, when overheating of the fluid F in the circulation flow path 11 is detected, the fluid F can be supplied from the fluid supplier 2 to the heat exchangers 1. However, the present invention is not limited to this example, and the open-and-close state of the electromagnetic valve 32 may be switched by a manual operation.
Note that, in the configuration in which the electromagnetic valve 32 is arranged in the supply flow path 3, the fluid supplier 2 may include the cooling member 22, and may not include the cooling member 22. In particular, in the latter case, supply and stop of supply of the fluid F from the fluid tank 21 to the heat exchanger 1 can be switched by switching the open-and-close state of the electromagnetic valve 32.
However, the above-described example does not exclude a configuration in which the electromagnetic valve 32 is not arranged in the supply flow path 3.
Next, a second embodiment will be described with reference to
In the heat transport device 100 according to the second embodiment, at least one heat exchanger 1 further includes a secondary cooler 14. The secondary cooler 14 is an example of a “second cooler” of the present invention, is arranged between the heat absorbing flow path 111 and the heat radiation flow path 112 of the circulation flow path 11, and cools the fluid F in the circulation flow path 11. The secondary cooler 14 can supplement the cooling capacity of the cooler 12, and can further cool the fluid F in a flow path between the heat absorbing flow path 111 and the heat radiation flow path 112. Accordingly, the heat exchanger 1 can sufficiently cool the fluid F sent out from the heat absorbing flow path 111, and can cause the fluid F having a sufficiently lowered temperature to flow into the heat absorbing flow path 111. Therefore, it is possible to effectively suppress or prevent an excessive temperature rise (in other words, vaporization) of the fluid F in the heat absorbing flow path 111, and to prevent an insufficiency of the fluid F in the circulation flow path 11.
Preferably, the secondary cooler 14 is arranged on the inflow path 113 to cool the fluid F in the inflow path 113. For example, in
The secondary cooler 14 includes a housing 140 and a refrigerant flow path 141. In this embodiment, the refrigerant flow path 141 is a hollow pipe through which the refrigerant flows in one direction, and is arranged in the housing 140. Each of an inlet and an outlet of the refrigerant flow path 141 is arranged on an outer surface of the housing 140, and is connected to a circulation device (a pump or the like; not illustrated) that causes the refrigerant to circulate. Note that the refrigerant in a liquid phase or a gas phase sent out from the outlet of the refrigerant flow path 141 may be sent out to the circulation device after waste heat utilization. For example, the refrigerant in a liquid phase can be used for hot water supply, cooling and heating, or the like. In addition, the refrigerant in a gas phase can be used for power generation in a power generator, such as a gas turbine or the like.
Moreover, cooling of the secondary cooler 14 can be switched between execution and stop. For example, as illustrated in
Preferably, cooling of the fluid F by the secondary cooler 14 is switched between execution and stop by the control device 200, based on the detection result of the sensor 13. For example, the fluid F in the circulation flow path 11 is further cooled by the secondary cooler 14 in response to detection of overheating of the fluid F by the sensor 13. That is, when overheating of the fluid F in the heat exchanger 1 is detected based on the detection result of the sensor 13, the control device 200 opens the electromagnetic valve 142 of the secondary cooler 14 arranged in the heat exchanger 1 in which overheating has been detected to cause the refrigerant in the refrigerant flow path 141 of the secondary cooler 14 to flow. Thus, when overheating of the fluid F in the circulation flow path 11 is detected, the secondary cooler 14 of the heat exchanger 1 in which overheating has been detected can be operated. Therefore, it is possible to more reliably prevent an excessive temperature rise (in other words, vaporization) of the fluid F and an insufficiency of the fluid F in the circulation flow path 11. However, the present invention is not limited to the above-described example, and the open-and-close state of the electromagnetic valve 142 may be switched by a manual operation in at least one heat exchanger 1.
However, the above-described example does not exclude a configuration in which execution and stop of cooling of the secondary cooler 14 cannot be switched in at least one heat exchanger 1, and does not exclude a configuration in which the electromagnetic valve 142 is not installed in the refrigerant flow path 141 in at least one heat exchanger 1.
Next, a third embodiment will be described with reference to
In the heat transport device 100 according to the third embodiment, some of the heat exchangers 1 are used as the fluid supplier 2, and are connected to rest of the heat exchangers 1 via the supply flow path 3. In other words, the plurality of heat exchangers 1 include a heat exchanger 1b and a heat exchanger 1c. The heat exchanger 1b is an example of a “first heat exchanger” of the present invention. The heat exchanger 1c is an example of a “second heat exchanger” of the present invention.
For example, in the third embodiment, the heat exchanger 1b is the heat exchanger 1 that functions as the fluid supplier 2 that supplies the fluid F to the heat exchanger 1c. The heat exchanger 1b is used in the same way as the fluid supplier 2. The number of the heat exchangers 1b may be one as illustrated in
The heat exchangers 1c are rest of the heat exchangers 1, that is, the heat exchangers 1 other than the heat exchanger 1b, among the plurality of heat exchangers 1. One end of the supply flow path 3 is connected to the circulation flow path 11 of the heat exchanger 1b. The other end of the supply flow path 3 (or the branch flow path 31) is connected to the circulation flow paths 11 of the heat exchangers 1c.
Thus, a device different from the heat exchanger 1 may not be used as the fluid supplier 2. In other words, a device of the same type as the heat exchanger 1 can be used as the fluid supplier 2. Therefore, since the fluid supplier 2 may not be newly prepared, the number of types of components of the heat transport device 100 can be reduced, and manufacturing costs of the heat transport device 100 can be reduced.
Next, a fourth embodiment will be described with reference to
In the heat transport device 100 according to the fourth embodiment, some of the plurality of heat exchangers 1 whose circulation flow paths 11 are connected to each other via the connection flow paths 4, that is, a heat exchanger 1d functions as the fluid supplier 2 that supplies the fluid F to rest of the heat exchangers 1, that is, heat exchangers 1e. For example, in
By connecting the plurality of heat exchangers 1 by the connection flow paths 4, distribution of the fluid F between the plurality of heat exchangers 1 is naturally adjusted. For example, when there is a spatial temperature distribution in the exhaust duct H1, an amount of the fluid F distributed to the heat exchanger 1d arranged in a low-temperature portion (for example, a portion having a temperature equal to or lower than the lower limit temperature Td) of the exhaust duct H1 is reduced. On the other hand, an amount of the fluid F distributed to the heat exchangers 1e arranged in a high-temperature portion (for example, a portion having a temperature higher than the lower limit temperature Td) of the exhaust duct H1 is increased. In addition, since at least some of the connection flow paths 4 function as the supply flow path 3, a member different from the connection flow paths 4 may not be used as the supply flow path 3. Therefore, even when the heat transport device 100 does not include the specific fluid supplier 2 and the supply flow path 3, it is possible to suppress or prevent reduction in heat transport efficiency due to uneven distribution of the fluid F.
Embodiments of the present invention have been described above. It should be understood by those skilled in the art that the above-described embodiments are merely examples, and various modifications can be made to a combination of components and processes thereof and are within the scope of the present invention.
The above-described embodiments will be collectively described below.
For example, a heat transport device 100 disclosed in this specification has a configuration (first configuration) that includes a heat exchanger 1, a fluid supplier 2, and a supply flow path 3, and in which the heat exchanger 1 includes a circulation flow path 11 through which a fluid F can circulate, and a first cooler 12 that cools the fluid F, the circulation flow path 11 includes a heat absorbing flow path 111 that is arranged in a first heat source H1, and a heat radiation flow path 112 that is arranged in the first cooler 12, and the supply flow path 3 connects the circulation flow path 11 and the fluid supplier 2.
The heat transport device 100 of the first configuration may have a configuration (second configuration) that further includes a connection flow path 4 through which the fluid F can flow, and in which, as the heat exchanger 1, a plurality of heat exchangers 1 are provided, and the connection flow path 4 connects the respective circulation flow paths 11 of the heat exchangers 1.
The heat transport device 100 of the second configuration may have a configuration (third configuration) in which the circulation flow path 11 further includes an inflow path 113 that connects an inlet of the heat absorbing flow path 111 and an outlet of the heat radiation flow path 112, and the connection flow path 4 connects the respective inflow paths 113 of the heat exchangers 1.
The heat transport device 100 that has the second or third configuration may have a configuration (fourth configuration) in which the supply flow path 3 is connected to the circulation flow path or paths 11 of one or more heat exchangers 1a of the plurality of heat exchangers 1, and the one or more heat exchangers 1a are arranged on a more upstream side of the first heat source H1 than rest of the heat exchangers 1.
The heat transport device 100 that has any one of the second to fourth configurations may have a configuration (fifth configuration) in which the plurality of heat exchangers 1 include a first heat exchanger 1b that functions as the fluid supplier 2, and second heat exchangers 1c that are rest of the plurality of heat exchangers 1, one end of the supply flow path 3 is connected to the circulation flow path 11 of the first heat exchanger 1b, and the other end of the supply flow path 3 is connected to the circulation flow paths 11 of the second heat exchangers 1c.
The heat transport device 100 that has one of the second to fourth configurations may have a configuration (sixth configuration) in which one or more heat exchangers 1d that are one or more heat exchangers of the plurality of heat exchangers 1 function as the fluid supplier 2 with respect to heat exchangers 1e that are rest of the plurality of heat exchangers, and at least some of the connection flow paths 4 function as the supply flow path 3.
The heat transport device 100 that has one of the first to sixth configurations may have a configuration (seventh configuration) in which the fluid supplier 2 includes a first flow port 23 to which one end of the supply flow path 3 is connected, the circulation flow path 11 further includes a second flow port 115 to which the other end of the supply flow path 3 is connected, and a height position of the first flow port 23 is the same as a height position of the second flow port 115 in a vertical direction.
The heat transport device 100 that has one of the first to seventh configurations may have a configuration (eighth configuration) in which the fluid supplier 2 includes a storage section 21 that stores the fluid F that can be supplied to the heat exchanger 1, and a cooling member 22 that cools the fluid F in the storage section 21, and cooling of the cooling member 22 can be switched between execution and stop.
The heat transport device 100 that has one of the first to eighth configurations may have a configuration (ninth configuration) in which the heat exchanger 1 further includes a sensor 13 used for detecting overheating of the fluid F in the circulation flow path 11, and cooling of the fluid F in the fluid supplier 2 is stopped in accordance with detection of overeating of the fluid F in the sensor 13.
The heat transport device 100 that has one of the first to ninth configurations may have a configuration (tenth configuration) that further includes an electromagnetic valve 32 that switches opening and closing of the supply flow path 3 and in which the heat exchanger 1 further includes a sensor 13 used for detecting overheating of the fluid F in the circulation flow path 11, and the electromagnetic valve 32 switches the supply flow path 3 to an opening state in accordance with detection of overheating of the fluid F in the sensor 13.
The heat transport device 100 that has one of the first to tenth configurations may have a configuration (eleventh configuration) in which the fluid supplier 2 is installed in a second heat source H2 that is different from the first heat source H1.
The heat transport device 100 that has one of the first tenth configurations may have a configuration (twelfth configuration) in which the fluid supplier 2 is installed in a portion (e.g., portion H1b) of the first heat source H1 in which an internal temperature is equal to or lower than a predetermined temperature Td.
The heat transport device 100 that has one of the first to twelfth configurations may have a configuration (thirteenth configuration) in which, in the heat exchanger 1, an inlet and an outlet of the heat radiation flow path 112 are arranged above an inlet of the heat absorbing flow path 111.
The heat transport device that has one of the first to thirteenth configurations may have a configuration (fourteenth configuration) in which the heat exchanger 1 further includes a second cooler 14, and the second cooler 14 is arranged between the heat absorbing flow path 111 and the heat radiation flow path 112 on the circulation flow path 11 to cool the fluid F in the circulation flow path 11.
The heat transport device 100 of the fourteenth configuration may have a configuration (fifteenth configuration) in which the heat exchanger 1 further includes a sensor 13 used for detecting overheating of the fluid F in the circulation flow path 11, cooling of the second cooler 14 can be switched between execution and stop, and the fluid F in the circulation flow path 11 is further cooled by the second cooler 14 in accordance with detection of overheating of the fluid F in the sensor 13.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2023-197804 | Nov 2023 | JP | national |
