1. Field of the Invention
The present disclosure relates to heating circuits, and more particularly to heating circuits for floor panels in aircraft.
2. Description of Related Art
Aircraft entryways and galley areas often need local heating for crew and passenger comfort. Some aircraft entryways and galley areas have floor panels with heating elements incorporated into the floor panel, typically with an etched foil heater element supported within the floor panel below a sheet metal surface of the panel. The etching process to form such resistive heating elements can be relatively involved and entail multiple process operations to arrive at the heating element structure. While generally satisfactory for its intended purpose, the traditional etch process can be time consuming, pose manufacturing challenges and/or operational delays due to over-etch or under etch (making resistance of the resistive heating element either too low or too high), or be susceptible to defects due to the photo-print process. Such defects can lead to failure in the field due to mechanical fatigue and/or thermal cycling of the resistive heating element over time. The heating elements can also be susceptible to fluid intrusion, and mechanical damage during installation and/or operation, and repair can be challenging.
Such conventional methods and systems have generally been considered satisfactory for their intended purpose. However, there is still a need in the art for aircraft floor panels with improved properties, such as manufacturability, mechanical strength, damage resistance, and/or damage tolerance. The present disclosure provides a solution for this need.
An aircraft heated floor panel includes a first face sheet, a second face sheet opposite the first face sheet, and core with an electrically conductive core portion. The electrically conductive core portion supports the first face sheet and the second face sheet, and is electrically insulated from the external environment to receive electrical power, resistively generate heat, and communicate heat to the first face sheet.
In accordance with certain embodiments, the conductive core portion can be connected to one or more leads in a resistive heating circuit. The core can include a honeycomb body or a foam body. The honeycomb body or foam body can be disposed between the first face sheet and the second face sheet. A conductive coating can be conformally disposed a portion of the core to form the conductive core portion. A conductive dopant can be disposed within an interior of the conductive core portion.
In accordance with certain embodiments, the panel can define a longitudinal axis. The longitudinal axis can extend through the core. The first face sheet can be disposed on a side of the longitudinal axis opposite the second face sheet. The conductive core portion can laterally span the width of the core between the first face sheet and the second face sheet. The conductive core portion can be disposed between the longitudinal axis and the first face sheet. The conductive core portion can be disposed between the longitudinal axis and the second face sheet. The longitudinal axis can extend through the conductive core portion.
It is also contemplated that, in accordance with certain embodiments, the core can include an electrically insulating core portion. The insulating core portion can bound the conductive core portion. The insulating core portion can be disposed laterally between the conductive core portion and the first face sheet. The insulating core portion can be disposed laterally between the conductive core portion and the second face sheet. The longitudinal axis can extend through the insulating core portion. The insulating core portion can be disposed between the longitudinal axis and the first face sheet. The insulating core portion can be disposed between the longitudinal axis and the second face sheet. A source lead can be connected to the electrically conductive core portion. A return lead can be connected to the electrically conductive core portion. The electrically conductive core portion can be disposed between the source lead and the return lead. It is contemplated that the lead can include a wire or foil structure. The wire or foil structure can include a copper-containing material.
A method of making a heated floor panel includes depositing conductive ink within a floor panel core, curing the conductive ink to define a conductive core portion within the core, and electrically connecting a lead to the conductive core portion. In certain embodiments, depositing the conductive ink can include dipping the floor panel core in the conductive ink. Depositing the can include coating the floor panel core with the conductive ink. In accordance with certain embodiments, curing the conductive ink includes applying heat and pressure to the floor panel core. It is also contemplated that electrically connecting a lead to the conductive core portion can include depositing conductive ink within the floor panel and adjacent to the conductive core portion and curing the conductive ink to define a lead electrically connected to the conductive core portion of floor panel core.
These and other features of the systems and methods of the subject disclosure will become more readily apparent to those skilled in the art from the following detailed description of the preferred embodiments taken in conjunction with the drawings.
So that those skilled in the art to which the subject disclosure appertains will readily understand how to make and use the devices and methods of the subject disclosure without undue experimentation, embodiments thereof will be described in detail herein below with reference to certain figures, wherein:
Reference will now be made to the drawings wherein like reference numerals identify similar structural features or aspects of the subject disclosure. For purposes of explanation and illustration, and not limitation, a partial view of an exemplary embodiment of an aircraft interior having a heated floor panel in accordance with the disclosure is shown in
Referring now to
In the illustrated exemplary embodiment, heated floor panel 100 is one of a plurality of heated floor panels arrayed within aircraft interior 14 in order to maintain the aircraft cabin at a comfortable temperature. Exemplary heated floor panel 100 includes a first face sheet 106 (shown in
With reference to
First face sheet 106 can include a reinforced prepreg layer. An optional adhesive layer 120 may be interposed between first face sheet 106 and core 110, optional adhesive layer 120 coupling first face sheet 106 to core 110. Second face sheet 108, can be similar to first face sheet 106 with the difference that it is disposed on a side of core 110 opposite first face sheet 106. An optional adhesive layer 122 can couple second face sheet 108 to core 110.
Core 110 includes a honeycomb body 116 or a foam body 118 that extends between a surface of core 110 adjacent to first face sheet 106 and an opposite surface of core 110 adjacent to second face sheet 108. A portion of honeycomb body 116 or foam body 118 of core 110 defining conductive core portion 112 includes a conductive material 128, which may be a conductive layer conformally disposed over honeycomb body 116 or a foam body 118. Alternatively, the conductive material 128 may be a dopant disposed within honeycomb body 116 or foam body 118 of core 110 defining conductive core portion 112. Source lead 102 and return lead 104 each electrically connect to core 110, thereby forming a resistive heating circuit with conductive core portion 112 that structural supports either or both of first face sheet 106 and second face sheet 108.
Heated floor panel 100 defines a longitudinal axis L. Longitudinal axis L extends longitudinally through core 110, and is disposed between first face sheet 106 and second face sheet 108. In the illustrated exemplary embodiment, longitudinal axis L extends through conductive core portion 112, and core 110 further includes a first insulating core portion 124 and a second insulating core portion 126. First insulating core portion 124 is disposed between conductive core portion 112, laterally between longitudinal axis L and first face sheet 106. Second insulating core portion 126 is disposed laterally between longitudinal axis L and second face sheet 108.
With reference to
With reference to
With reference to
With reference to
Depositing the conductive ink can include dipping the floor panel core in the conductive ink, as shown with box 512. Depositing the can include coating the floor panel core with the conductive ink, as shown with box 514. Curing the conductive ink can include applying heat and/or pressure to the core, as shown with boxes 522 and 524.
Electrically connecting a lead to the conductive core portion can include connecting a copper film or wire structure to the conductive core portion. A conductive ink can also be selectively applied to the core that connects to the conductive core portion, as shown with box 532. Thereafter, the conductive ink can be cured to define the lead connected to the conductive core portion of the core, as shown with box 534. The cure can be a second cure involving a second application of heat and pressure, as shown with box 536 and 538. Alternatively, the initial deposition of the conductive ink can define both the conductive core portion and the lead.
Aircraft door and galley areas often require local heating for crew and passenger comfort. Heating elements, such as etched foil heaters bonded below the skin of the floor panel can be susceptible to fluid intrusion and mechanical damage during installation or operation. Localized repair can also be difficult owing to pattern defined within the foil.
In embodiments described herein, a portion of the floor panel core is partially or completely dipped in a conductive ink (e.g., positive temperature or ambient temperature) to define a conductive path on a surface, within a thickness portion, and through the entire thickness of the core. Leads connected to the conductive path, defined either using the conductive ink, copper foil or any other suitable lead structure/material, are in intimate mechanical contact with dipped conductive core material and cured such that electrical connectivity is provided between the leads by the conductive path. This allows for repair of the heated floor panel structure, can reduce the number of layers used to form the heated floor panel, weight, and/or number of structural bond lines within the heated floor panel. It can also allow for positioning the heating circuit, i.e. the conductive core portion, away from the heated floor panel surface where localized damage can occur during installation, maintenance and/or from impacts from foreign objects. Moreover, the heating circuit may be arranged centrally within the heated floor panel, where structural loads are less severe.
The methods and systems of the present disclosure, as described above and shown in the drawings, provide for aircraft heated floor panels with superior properties including uninterrupted core structures with integral heating circuits. While the apparatus and methods of the subject disclosure have been shown and described with reference to preferred embodiments, those skilled in the art will readily appreciate that changes and/or modifications may be made thereto without departing from the scope of the subject disclosure.
This application claims the benefit of priority under 35 U.S.C. §119(e) to U.S. Provisional Application No. 62/294,954, filed Feb. 12, 2016, which is incorporated herein by reference in its entirety.
Number | Date | Country | |
---|---|---|---|
62294954 | Feb 2016 | US |