The invention relates to molecule sensors, in particular gas sensors, operating with a heated sensitive layer.
The sensitive layer of this type of sensor generally comprises a semiconductor oxide, the nature and operating temperature of which are chosen according to the molecules to be detected. The resistivity of the sensitive layer varies depending on the concentration of molecules adsorbed by the oxide layer.
The sensor comprises an insulating substrate 10 bearing on its upper surface a sensitive layer 12, based on semiconductor oxide. Two complementary electrodes in the form of conductive tracks E1 and E2, are disposed in electrical contact with the sensitive layer 12. The electrodes E1 and E2 are configured to measure changes in resistivity of the zones of the sensitive layer located between the electrodes. To improve the sensitivity, it is desired to increase the adjacent lengths of the two electrodes. For this purpose, the electrode tracks are often formed as interdigitated combs, as shown.
Each electrode includes a contact terminal placed at the periphery of the sensor, outside the active area of the sensitive layer. The terminal of the electrode E1 is set to a ground voltage (0 V) and the terminal of the electrode E2 is set to a measurement voltage M, of the order of 1 V. The sensor is operated by measuring the current flowing between the terminals of the two electrodes.
For heating the sensitive layer 12, a resistive track 14 is provided, which is electrically isolated from the sensitive layer, and placed for example on the bottom surface of the substrate 10. The track 14 is configured to uniformly heat the active area of the sensitive layer, i.e. the areas between the facing fingers of the electrodes. The track 14 is often in the form of a serpentine, as shown. It is supplied between ground (0 V) and a voltage Vh regulated to achieve the desired temperature.
The structure of a heated sensitive layer sensor and the materials used therein are particularly well suited for manufacturing using integrated circuit technologies. The sensor dimensions are then so small that the sensitive layer can be heated up to 350° C. with a power consumption of only 30 mW. It has nevertheless been noted that the sensitive layers of such sensors age faster than in sensors made in other technologies.
It is thus desired to extend the lifetime of a heated sensitive layer sensor produced using integrated circuit manufacturing technologies.
This need is addressed by a heated sensitive layer sensor, comprising an insulating substrate bearing the sensitive layer; two complementary measurement electrodes in the form of two adjacent conductive tracks configured in electrical contact with the sensitive layer; and a heating element in the form of a resistive track arranged on the substrate for uniformly heating an active area of the sensitive layer. The resistive track comprises at least three power supply points regularly spaced over the length of the resistive track, and each point of odd rank is supplied by a first supply voltage and each point of even rank is supplied by a second supply voltage.
According to an embodiment, the layout of the conductive tracks of the electrodes, projected onto the plane of the resistive track, remains outside a margin defined around the resistive track.
According to an embodiment, the resistive track and the conductive tracks of the electrodes are coplanar.
According to an embodiment, the direction changes of the resistive track and the conductive tracks of the electrodes in the active area of the sensitive layer have a non-zero curvature radius.
According to an embodiment, the resistive track comprises successive U-shaped arcs and the two conductive tracks run parallel to the resistive track, entering each arc with the conductive track remotest from the resistive track ending when exiting the arc, and the conductive track adjacent the resistive track forming, upon exiting the arc, a U-turn around the end of the remotest conductive track to return into the arc.
According to an embodiment, the resistive track is coplanar with the conductive tracks and also in electrical contact with the sensitive layer, the conductive track adjacent the resistive track being set to a ground voltage so that any current flowing in the sensitive layer between the resistive track and the adjacent conductive track does not disturb the current flowing between the conductive tracks.
Other advantages and features will become more clearly apparent from the following description of particular embodiments of the invention provided for exemplary purposes only and represented in the appended drawings, in which:
The inventors have found that the sensitive layer of a small-sized heated sensor, especially when the sensor is produced using integrated circuit manufacturing techniques, deteriorates mainly on the side of the higher voltage (Vh) supplying the resistive track, in a region D shown in
To avoid this deterioration caused by the electric field, the fact of moving the resistive track away from the electrodes does not solve the problem, because the heating efficiency would decrease and would require an increase in the supply voltage of the resistive track.
With the shown configuration, the voltage Vh′ may be divided by four relative to the voltage Vh required with only two power supply terminals, while providing the same heating power. Indeed, each segment of the serpentine has a quarter of the total resistance and sees across its ends a quarter of the conventional supply voltage: the current is unchanged from the conventional configuration, so the power dissipated is the same. The electric field may thus be divided by the number of segments used in the resistive track.
To simplify the manufacture of the sensor it is desired to make the tracks of the electrodes and the resistive track coplanar. This allows forming the tracks with a single mask level. In this case, as shown in
With this configuration, the central section of the resistive track conveys the current for each of the two segments, and thus sees two times more current than each of the segments. If the central section has the same resistivity as the rest of the resistive track, it would dissipate four times more power than the rest. To homogenize the heating power, the central section may be sized to present a quarter of the resistivity of the rest of the track.
Conventional electrode routing configurations, such as shown in
To reduce this effect, as shown in
With this electrode layout technique, a pair of electrode tracks E1, E2 is formed for each arc of the serpentine. The starting point of each track of the pair is connected to a terminal on the edge of the sensor, from which the track may be supplied and connected to peer tracks of the other arcs, if necessary through vias, outside the active zone of the sensor.
At the beginning of the resistive track 14′, as shown, a pair of electrodes E1, E2 starts on the same side as the resistive track and follows the first arc in parallel from the outside until the next arc, where the pattern described above is started. The pattern at the end of the resistive track may be symmetrical.
The configuration of
To prevent this, a local insulator could be deposited between the sensitive layer and the resistive track, or the sensitive layer could be deposited locally on the electrodes. This would adversely affect the heating efficiency of the sensitive layer.
The power supply configuration of the electrodes shown in
In such circumstances, the track structure of
The configuration of
This configuration enables using the whole structure as a single sensor, by connecting the different structures together, or using the different structures separately, thus achieving a “multisensor” configuration providing several different signals (based on the temperature of each serpentine, for example), e.g. an “electronic nose” device.
Number | Date | Country | Kind |
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13 59494 | Oct 2013 | FR | national |
Filing Document | Filing Date | Country | Kind |
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PCT/FR2014/052445 | 9/29/2014 | WO | 00 |
Publishing Document | Publishing Date | Country | Kind |
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WO2015/049445 | 4/9/2015 | WO | A |
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