The present invention relates to a heater used in e.g. a laser printer to thermally fix toner transferred to recording paper.
Conventionally, various types of heaters have been proposed (see e.g. Patent Document 1).
However, in the conventional structure, the edge of the outer layer 93b made of amorphous glass is held in contact with the upper surface of the substrate 91. Generally, amorphous glass easily form bubbles by reacting with e.g. AlN. Thus, when the substrate is made of AlN in the conventional structure, bubbles may be formed at the edge of the outer layer 93b. The formation of bubbles undesirably reduces the withstand voltage of the protective film 93. Further, moisture in the air is easily absorbed in the inner layer 93a through the portion of the outer layer 93b in which bubbles are formed. The absorption of moisture may cause such a problem as local expansion of the inner layer 93a.
Patent Document 1: JP-A-2002-289328
The present invention has been proposed under the circumstances described above. It is, therefore, an object of the present invention to provide a heater which is capable of preventing a reduction in the withstand voltage of the protective film and moisture absorption in the protective film.
A heater provided according to the present invention includes a substrate, a heating resistor formed on the substrate, and a protective film including a crystallized glass layer covering the heating resistor and an amorphous glass layer covering the crystallized glass layer. The protective film further includes a semi-crystalline glass layer surrounding an edge of the crystallized glass layer and intervening between the substrate and a portion of the amorphous glass layer that projects from the crystallized glass layer.
Preferably, the substrate includes a rectangular upper surface that is elongate in one direction, and the heating resistor includes two main portions extending in parallel to each other in the longitudinal direction of the rectangular upper surface and a connection portion connecting the two main portions to each other.
Preferably, the crystallized glass layer includes a first layer held in direct contact with the heating resistor and a second layer covering the first layer. An additional semi-crystalline glass layer that is elongate in a direction in which the main portions of the heating resistor extend is provided between the first layer and the second layer.
Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.
Preferred embodiments of the present invention will be described below with reference to the accompanying drawings.
The substrate 1 is in the form of an elongated rectangle and made of an insulating material. Examples of the insulating material include AlN and Al2O3.
The heating resistor 2 is formed on the substrate 1 and entirely U-shaped, as shown in
The protective film 3 is provided for protecting the heating resistor 2 and made up of a crystallized glass layer 31, a semi-crystalline glass layer 32 and an amorphous glass layer 33.
The crystallized glass layer 31 is made of crystallized glass such as SiO2—BaO—Al2O3—ZnO-based glass and held in contact with the heating resistor 2. The crystallized glass layer 31 has a thickness of e.g. about 60 μm.
The semi-crystalline glass layer 32 is made of semi-crystalline glass such as BaO—SiO2-based glass and covers the entirety of the crystallized glass layer 31. Thus, the edge 31a of the crystallized glass layer 31 (periphery of the surface held in contact with the substrate 1) is surrounded by the semi-crystalline glass layer 32. The semi-crystalline glass layer 32 has a thickness of e.g. about 20 μm.
The amorphous glass layer 33 is made of amorphous glass such as SiO2—ZnO—MgO-based glass and formed on the semi-crystalline glass layer 32. The amorphous glass layer 33 has a thickness of e.g. about 20 μm. In this embodiment, the amorphous glass layer 33 covers only the upper surface and the nearby portion of the semi-crystalline glass layer 32 and does not cover the side surfaces of the semi-crystalline glass layer 32. Specifically, as shown in
The advantages of the heater A1 will be described below.
With the above-described arrangement, the amorphous glass layer 33 is entirely spaced from the substrate 1 and does not include a portion held in contact with the substrate. As compared with an amorphous glass layer, the semi-crystalline glass layer 32 does not easily form bubbles even when it is in contact with AlN forming the substrate 1. Thus, the formation of bubbles in the protective film 3 is suppressed, so that the withstand voltage of the entire protective film 93 is prevented from reducing.
Moreover, by suppressing the formation of bubbles at the protective film 3, air is substantially prevented from entering the crystallized glass layer 31. As a result, the crystallized glass layer 31 is prevented from locally expanding due to the moisture in the air.
Number | Date | Country | Kind |
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2007-038083 | Feb 2007 | JP | national |
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/JP2008/052433 | 2/14/2008 | WO | 00 | 8/13/2009 |