Patent Application
20070045279
1. Field of the Invention
Embodiments of the invention relate to the field of furnaces, and more specifically, to heating element structure in furnaces.
2. Description of Related Art
Furnaces typically use resistance wires as heating elements. Many applications using furnaces require the heaters to be responsive to temperature changes and maintain a uniform temperature over some time period. A resistance wire typically goes through many thermal cycles during its life. Resistance wires expand, grow, or elongate due to exposure to high temperatures over time.
Existing techniques to provide reliable wire heating elements have a number of drawbacks. One technique uses round resistance wire. Different wire diameters are utilized for different temperature ranges. The existing designs and use of round wire have shortcomings, which lead to a shorter heater element life. The most common cause of failure of existing heater elements used in semiconductor equipment is associated with the growth of wire with usage and time. As a heating element cycles between higher and lower temperatures, its linear length increases. Prior art designs do not provide any space for growth of the resistance wire. The other failure mechanism is failure of the heater due to wire deformation resulting in separation of the power terminal and resistance wire. This separation results in disruption of electrical current delivered to the resistance wire, thus prohibiting heater operation.
Embodiments of invention may best be understood by referring to the following description and accompanying drawings that are used to illustrate embodiments of the invention. In the drawings:
An embodiment of the present invention is a heating element structure. A first strip wire shaped in a wave-like configuration is attached to an insulator surface by a plurality of staples placed along the first strip wire. The staples secure the strip wire at a plurality of locations to constrain the movement of the strip wires due to a thermal effect. The staples also guide the strip wires at a plurality of second locations to allow the strip wires to move due to the thermal effect.
In the following description, numerous specific details are set forth. However, it is understood that embodiments of the invention may be practiced without these specific details. In other instances, well-known circuits, structures, and techniques have not been shown to avoid obscuring the understanding of this description.
One embodiment of the invention may be described as a process which is usually depicted as a flowchart, a flow diagram, a structure diagram, or a block diagram. Although a flowchart may describe the operations as a sequential process, many of the operations can be performed in parallel or concurrently. In addition, the order of the operations may be re-arranged. A process is terminated when its operations are completed. A process may correspond to a method, a program, a procedure, a method of manufacturing or fabrication, etc.
An embodiment of the invention is a heating element structure used in a furnace. The furnace may be positioned horizontally or vertically. The furnace includes a heating core. The heating core includes an insulator layer and heating elements. The heating elements are strip wires. The strip wires have resistance selected to generate heat when power is applied. The strip wires have a directional movement under a thermal effect such as when power is applied. The strip wires have wave-like pattern and are attached to an insulator surface by staples at control locations to allow expansion or contraction of the wires locally at spaces at designated locations. By providing the space to allow growth of the heating element, the life of the heating element may be prolonged, avoiding premature failure. In addition, the heating element structures are simple to construct, allowing easy construction of the heating core and reducing assembly costs.
The shield, or shell, 110 provides a housing or enclosure to house or enclose the heating core 130. It may be made of stainless steel. It may include a top ring 112 to shield the top of the heating core 130 and a side shield 114. Typically the shield 110 has a shape of a circular, oval, or elliptic cylinder. The shield 110 may have structures, parts, or elements to provide mechanical and electrical support for power bars and thermocouples.
The insulation layer 120 provides insulation for the heating core 130. The insulation layer 120 includes a top insulation layer 122 and a side insulation layer 124. The insulation layer 120 may be made of any material that is highly resistant to heat, has a low temperature expansion coefficient, has a low heat transfer coefficient, and maintains its properties over time. An example of such material is a mixture of aluminum oxide (Al2O3) and silicon dioxide or silica (SiO2). As is known by one skilled in the art, any other insulating materials having the above desirable characteristics may be used.
The heating core 130 provides heat generation to an object 135 placed inside the core. The object 135 may be any object, structure, element, or component that needs to be heated at some pre-defined temperature range. In one embodiment, the object 135 is a semiconductor wafer. The temperature range may be any suitable range as required, from 25° C. to 1700° C. For example, for semiconductor wafer applications, the temperature range may be between 500° C. to 1200° C. The heating core 130 has power bars to connect to the power source 160. The heating core 130 may provide heat to a number of zones inside the heating core 130. The heating zones may have different temperature ranges according to the requirements and specifications of the furnace. The power bars are allocated to correspond to the heating zones.
The cap 140 seals the heating core 130 at the top and provides a tight mechanical fit to the top ring 112 to reduce or minimize heat loss. The bottom ring 150 provides mechanical support for the heating core 130.
The power source 160 provides power to the heating core to generate heat when power is applied. The power source 160 is connected to the heating core 130 via the power bars. The power source 160 may have a power controller 165 that controls the amount of current and/or voltage to the heating core 130. By receiving different amounts of current or voltage via the individual power bars, the heating core 130 is able to generate different heat profiles in the corresponding heating zones.
The insulator layer 205 may be the side insulator 124 (
The heating elements 2201 to 220N may be strip wires. Each of the strip wires 2201 to 220N may be shaped in a wave-like configuration and may have a cross-sectional area that is different than the prior art round area. The strip wires 2201 to 220N are attached to the insulator surface 210 by a number of staples 230 that are placed along the strip wires at control locations to control the direction of movement of the strip wires 2201 to 220N when the strip wires 2201 to 220N move (e.g., expand, contract) due to thermal effect. Each of the strip wires 2201 to 220N fits inside the insulator layer 205 such that it forms a ring. Typically, the ring is circular or substantially circular according to the cross section of the insulator layer 205.
The ring strip wire 220 is one of the heating elements 2201 to 220N. It is shaped in a wave-like configuration and forms a ring that fits inside the insulator layer 205 (
The insulator layer 405 is essentially similar to the insulator 205 (
The heating element structure 408k's are arranged and positioned such that they fill up the inner surface of the insulator layer 405. The number P of the heating element structure 408k's may be determined according to the periphery of the inner surface of the insulator layer 405 and the size of each of the heating element structure 408k's. For illustrative purposes,
The heating element structure 408k includes a board 410k and a strip wire 420k. The board 410k has an insulator surface 415k. The insulator surface 415k may be flat or somewhat curved. The strip wire 420k is attached to the insulator surface 415k by a plurality of staples 430k placed along the strip wire 420k at control locations to control the direction of movement of the strip wire 420k when the strip wires 420k moves (e.g., expands, contracts) due to thermal effect. Similarly, the heating element structure 408k+1 includes a board 410k+1 and a strip wire 420k+1. The board 410k+1 has an insulator surface 415k+1. The insulator surface 415k+1 may be flat or somewhat curved. The strip wire 420k+1 is attached to the insulator surface 415k by a plurality of staples 430k+1 placed along the strip wire 420k+1. The heating element structure 408k−1 is similar, having a board 410k−1, a strip wire 420k−1, an insulator surface 415k−1, and staples 430k−1. The strip wire 420k is attached to the strip wire 420k+1 by a bus bar 440k at one end and to the strip wire 420k−1 by a bus bar 440k−1 at the other end.
The heating element structure 408k's are placed vertically, i.e., in the upright direction. In other words, the strip wires 420k's are also placed vertically. The size of the boards 410k's or the strip wires 420k's may be selected so that the heating element structures 408k's fill up completely the inner surface of the insulator layer 405. In one embodiment, the heating element structures 408k's may fill up partially on the inner surface of the insulator layer 405. Typically, the length of each of the boards 410k's fits the length of the insulator layer 405.
The board 410 has the insulator surface 415 and a bottom surface 510. The insulator surface 415 is attached to the strip wire 420. The bottom surface 510 is attached to, or placed on, the inner surface of the insulator layer 405 (
The first locations 620 are located at the peaks on one side of the wave-like configuration or pattern. The secure staples 650 secure the strip wire 220/420k at the first locations 620 to constrain movement of the strip wire 220/420k. The secure staples 650 may firmly or tightly hold the strip wire 220/420k onto the insulator surface 210/415k. At these locations, the strip wire 220/420k may not move much under a thermal effect. The thermal effect may include a temperature increase during heating or a temperature decrease during cooling. Typically, during temperature increase, the strip wire 220/420k expands or elongates; and during temperature decrease, the strip wire 220/420k contracts or shrinks.
Note that the illustration of the control location 610 is applicable for both the ring strip wire 220 and the board strip wire 420k. When the insulator surface is the insulator surface 415k of the board 410k, the end of the strip wire 420k is connected to the end of the adjacent strip wire 420k+1 by a bus bar as explained above. At this end, it is not necessary to secure the strip wire 420k by a secure staple. This is to allow the strip wire 420k to move within the space where the bus bar is connected to the two ends. In other words, the first locations 620 do not include a location at an end of the strip wire 420k where it is connected to the strip wire 420k+1, or 420k−1, by the bus bar.
The second locations 630 are located near or at peaks on opposite side of the wave-like configuration. They may be located within approximately 50% of the segments of the wave-like pattern of the strip wire 220/420k. The guiding staples 660 guide the strip wire 220/420k to allow them to expand or contract in a space 640 due to the thermal effect. At the second locations 630, the strip wire 220/420k freely moves (e.g., expands, contracts) locally within the space 640 guided by the staples. The expansion or contraction of the strip wire 220/420k is therefore distributed locally at the second locations 630. This may reduce the strain or stress on the strip wire 220/420k. The guiding staples 660 at these locations act as a guide to guide the movement of the strip wire 220/420k. The guiding staples 660 hold the strip wire 220/420k loosely. There may be as many guiding staples 660 as necessary to guide the movement of the strip wire 220/420k. The space 640 may have a size of 0.01 inch to 100 inches depending on the size of the strip wire 220/420k and/or their wave-like configuration.
Upon START, the process 900 shapes or bends a first strip wire in a wave-like configuration (Block 910). The wave-like configuration has one of a sinusoidal pattern, a zigzag pattern, a saw-tooth pattern, and a triangular pattern. The first strip wire has a cross sectional shape of one of a rectangle, a square, a triangle, and a polygon.
Next, the process 900 attaches the first strip wire to an insulator surface by a plurality of staples placed along the first strip wire (Block 920). The process 900 is then terminated.
Upon START, the process 920 places the staples at control locations along the first strip wire to control direction of movement of the first strip wire when the first strip wire moves due to thermal effect (Block 1010). The thermal effect may include temperature increase or decrease. Next, the process 920 branches into two paths depending on the particular embodiment. One embodiment uses ring strip wires and another embodiment uses boards.
In the embodiment using ring strip wires, the process 920 attaches the first strip wire to the insulator surface being an inner surface of an insulator layer (Block 1020). The first strip wire is formed into a circular ring fitting the inner surface of the insulator layer. The process 920 is then terminated.
In the embodiment using boards, the process 920 attaches the first strip wire flat to the insulator surface being a surface of a first board (Block 1030). The insulator surface may be flat or slightly curved. The first board has a bottom surface attached to an inner surface of the insulator layer. The bottom surface may be flat or slightly curved to fit the curvature portion of the inner surface on which the board is placed. Next, the process 920 connects a second strip wire attached to a second board to the first strip wire by a bus bar (Block 1040). The process 920 is then terminated.
Upon START, the process 1010 places a first group of staples at a plurality of first locations located at peaks on one side of the wave-like configuration (Block 1110). These staples secure the first strip wire at the first locations to constrain movement of the first strip wire under thermal effect.
Next, the process 1010 places a second group of staples at a plurality of second locations located near or at peaks on opposite side of the wave-like configuration (Block 1120). These staples guide the first strip wire to allow first strip wire to expand or contract in a space due to the thermal effect. The space may have a size of 0.01 inch to 100 inches. The process 1010 is then terminated.
While the invention has been described in terms of several embodiments, those of ordinary skill in the art will recognize that the invention is not limited to the embodiments described, but can be practiced with modification and alteration within the spirit and scope of the appended claims. The description is thus to be regarded as illustrative instead of limiting.
This patent application claims the benefits of U.S. Provisional Application, titled “Heating Element Used In Diffusion Furnaces”, Ser. No. 60/712,597, filing date Aug. 29, 2005.
| Number | Date | Country | |
|---|---|---|---|
| 60712597 | Aug 2005 | US |
