Patent Application
20240023203
The present invention relates to the technical field of atomization, and more specifically, to a heating mechanism for atomization by heating and an atomization device.
At present, in a heating atomization device, the heating atomization device with a porous ceramic is well received by the market due to its stable structure, good atomization effect, and simple and convenient assembly. Generally, a sheet-shaped heating sheet is embedded on a surface of a porous ceramic body, the liquid is conducted by the porous ceramic body, and the heating sheet generates heat to vaporize and atomize the liquid. Currently, there are two types of assembly structures in the industry. The first type is to print a metal slurry on the surface of the porous ceramic body. The second type is to put a sheet-shaped metal heating element into a ceramic mold, inject a ceramic slurry into the mold, and sinter the heating element and the porous ceramic together, so that the metal heating element can be embedded on the surface of the ceramic. As shown in
A technical problem to be solved by the present invention is, in view of the aforementioned defects in the prior art, to provide a heating mechanism for atomization by heating with a better support strength and a uniform heat distribution.
A further technical problem to be solved by the present invention is to provide an atomization device that is not separated from a ceramic body, has a better support strength of the heating mechanism, and has a uniform heat distribution.
A technical solution adopted by the present invention to solve the technical problem is:
A heating mechanism for atomization by heating, including heating circuits configured for evaporating liquid and electrodes configured for connecting to a power supply unit, wherein at least two heating circuits are provided, and all of the heating circuits are connected in parallel between contacts of the two electrodes, two adjacent heating circuits are connected by a plurality of connections to form a planar integrated unit, and heat dissipation members extending laterally for dispersing heat from the heating circuits are provided in at least the intermediate of the heating circuits located on the outer sides.
Further, in the heating mechanism for atomization, preferably, each of the heating circuits is at least one of a linear unit or a curvilinear unit, or a structure formed by a combination of the linear units and the curvilinear units connected end to end or cross connected.
Further, in the heating mechanism for atomization, preferably, all of the connections are evenly distributed on the heating circuits or arranged symmetrically about the middle of the heating circuits.
Further, in the heating mechanism for atomization, preferably, the connection is rod shaped, strip shaped or plate shaped, and its shape is a straight line, a curve or a combination of at least one of the straight line and the curve.
Further, in the heating mechanism for atomization, preferably, all of the heat dissipation members are evenly distributed on the heating circuits or arranged symmetrically about the middle of the heating circuits.
Further, in the heating mechanism for atomization, preferably, the widths or/and the lengths of the heat dissipation members gradually decrease from the middle to the two ends of each of the heating circuits; or/and the arrangement density of the heat dissipation members on each of the heating circuits gradually decreases from the middle to the two sides.
Further, in the heating mechanism for atomization, preferably, the connections are provided with the heat dissipation members for guiding heat to a ceramic body.
Further, in the heating mechanism for atomization, preferably, the heat dissipation member is rod shaped, strip shaped or plate shaped, and its shape is a straight line, a curve or a combination of at least one of the straight line and the curve.
Further, in the heating mechanism for atomization, preferably, the heat dissipation members extend towards the outer side of the heating circuits and the free ends of the heat dissipation members are folded out of a plane where the heating circuits is located to form first folded portions for fixing the heating circuits.
Further, in the heating mechanism for atomization, preferably, the heating circuits are provided with second folded portions that are folded outward from a plane where the heating circuits is located.
An atomization device, including a porous ceramic body and the aforementioned heating mechanism, wherein the heating mechanism is embedded in and planarly attached to a bottom of the porous ceramic body.
In the present invention, at least two heating circuits are arranged in a parallel or cross manner, and two adjacent heating circuits are connected by the connections, so that the heating circuits form a net shape, and the supporting strength and flatness of the sheet-shaped heating element are improved. Meanwhile, a plurality of heat dissipation members are arranged on the heating circuits to disperse the heat at the higher heat position of the heating circuits, so that the overall heat of the heating mechanism is relatively balanced. In addition, the connections can also achieve the effects of heat dissipation and heat equalization.
Subject matter of the present invention will be described in even greater detail below based on the exemplary figures. In the accompanying drawings:
For better understanding of the technical features, objects and effects of the present invention, the specific embodiments of the present invention will be described in detail with reference to the accompanying drawings.
When one component is described to be “fixed to” or “disposed on” another component, it means that the component may be directly or indirectly located on another component. When one component is described to be “connected to” another component, it means that the component may be directly or indirectly connected to another component.
The orientation or the position relationship indicated by relative terms such as “top”, “bottom”, “left”, “right”, “front”, “back”, “vertical”, “horizontal”, “top”, “bottom”, “inner”, “outer” and the like are based on the directions or location relationships shown in the accompanying drawings, and are merely used for the convenience of description, and cannot be understood as a limitation on the technical solution. The term “a plurality of” means two or more, unless specifically limited otherwise.
Embodiment 1: As shown in
Compared with the prior art, the present invention changes the existing single heating circuit 100 into at least two heating circuits 100. Due to the arrangement of the plurality of heating circuits 100, the length of each heating circuit 100 can be shortened, and the heat difference between the intermediate area and both ends of the heating circuit 100 caused by the heat conduction effect can be reduced. By additionally arranging the connections 200 and the heat dissipation members 300, the heat at the higher heat position on the heating circuit 100 is dispersed through the heat dissipation members 300 and the connections 200, so that the overall heat of the heating mechanism is relatively balanced. In addition, the plurality of heating circuits 100 are connected to form an integral plane through the connections 200, the mutual connection makes the plane relatively flat and not prone to tilting, thereby avoiding the situation that part of the heating circuit 100 in the prior art is detached from or completely buried in the ceramic body.
The main structure of the heating mechanism of the present invention is the heating circuits 100. Generally, the heating circuits 100 are a linear extension or a turning structure, and two ends of the heating circuits 100 are connected to electrodes. In order to fully atomize the liquid, the heating circuits 100 need to be arranged in a plane. At least two heating circuits 100 are provided in the present invention, and these heating circuits 100 may be the same or different. For uniform atomization, the entire heating circuits 100 of the heating mechanism are regularly arranged. Generally, according to actual needs, the number of the heating circuits 100 may be 2 to 8, and preferably 2 to 5. The various heating circuits 100 may have a same length or different lengths, and may be in a same shape or different shapes. Preferably, the heating circuits 100 have a same length and are in a same shape. The heating circuits 100 are made of metal.
All the heating circuits 100 are connected between the contacts of the two electrodes 700 at the same time, that is, all the heating circuits 100 are connected in parallel between the contacts of the two electrodes 700. But the heating circuits 100 may be arranged in various ways, in order to be fully arranged into a plane, one way is to arrange side by side, that is, the extension directions of the plurality of heating circuits 100 are the same or substantially the same, and the plurality of heating circuits 100 are arranged at intervals, and the spacing between adjacent heating circuits 100 may be the same or different, preferably the same. The second way is to arrange crossed or staggered, that is, the plurality of heating circuits 100 extend in different directions, so that they are intersected at some position or intersected through the connection 200.
Each of the heating circuits 100 is a structure formed by at least one of a linear unit or a curvilinear unit, or a combination of them through an end-to-end connection or a crossed connection. That is, the heating circuit 100 may be in any shape and is not limited, as long as it meets the requirement of uniform heating in the present invention.
Specifically, the first embodiment of the heating circuit 100 is as follows: the heating circuit 100 is composed of one or more linear units, and one linear unit may be linearly arranged from one electrode contact to another electrode contact; a plurality of linear units are connected end to end to form a linear heating circuit 100 or a looped heating circuit 100.
The second embodiment of the heating circuit 100 is as follows: the heating circuit 100 is composed of one or more curvilinear units, and one curvilinear unit may be arranged from one electrode contact to another electrode contact; a plurality of curvilinear units are connected end to end to form the heating circuit 100.
The third embodiment of the heating circuit 100 is as follows: the heating circuit 100 is formed by connecting one or more linear units and curvilinear units end to end, and the linear units and the curvilinear units may be arranged separately or alternately.
The fourth embodiment of the heating circuit 100 is as follows: the heating circuit 100 is formed by a plurality of linear units in a crossed or staggered connection, where the crossed or staggered connection means that the extension directions of the plurality of linear units are various and changeable and the plurality of linear units are crossed or staggered in a certain extension direction. Wherein, the crossed connection means that the plurality of linear units are directly connected together, and the staggered connection means that the plurality of linear units are connected together through the connection 200 or the heat dissipation member 300.
The fifth embodiment of the heating circuit 100 is as follows: the heating circuit 100 is formed by a plurality of curvilinear units in a crossed or staggered connection. Wherein, the crossed connection means that the plurality of curvilinear units are directly connected together, and the staggered connection means that the plurality of curvilinear units are connected together through the connection 200 or the heat dissipation member 300.
The sixth embodiment of the heating circuit 100 is as follows: the heating circuit 100 is formed by at least one linear unit and at least one curvilinear unit in a crossed or staggered connection. This method is a technical solution formed by combining the fourth and fifth embodiments.
In order to maintain the flatness and supporting performance of the whole heating mechanism, a connection 200 is provided between the adjacent heating circuits 100. The connection 200 may be connected to any position of the heating circuit 100, and may be rod shaped, strip shaped or plate shaped, and the shape of which is a straight line, a curve, or a combination of at least one of them. The rod shape, strip shape or plate shape refers to that, in the transverse width of the connection 200, the structure of the connection 200 may be a rod shape with a relatively narrow width, a strip shape with a certain width, or a plate shape with a relatively wide width, and from the whole or in the length direction, the shape of the connection 200 may be a straight line, a curve or a combination of at least one of them. Herein, the combination of at least one of them means that, the connection 200 may have a plurality of straight line parts connected end to end or cross-connected into a whole; the connection 200 may have a plurality of straight line parts connected end to end or cross-connected into a whole; the connection 200 may have a plurality of straight line parts and curve parts connected end to end or cross-connected into a whole, or the connection 200 may also include a combined shape formed by a curve part and a straight line part on different sides. The connections 200 on a single heating circuit 100 may be arranged in parallel or not, which is determined according to actual needs.
In order to maintain the flatness and uniform heat conduction, preferably all the connections 200 are evenly distributed on the heating circuit 100 or symmetrically arranged with respect to the center of the heating circuit 100. The connection 200 may be transversely connected, axially connected or obliquely connected with respect to the heating circuit 100. Adjacent connections 200 may be arranged at intervals, may be adjacently arranged in parallel, or may be arranged crosswise.
The function of the heat dissipation member 300 is to dissipate the heat in the heating circuit 100 from the heat dissipation member 300, and since connections 200 are provided between the heating circuits 100, the heat dissipation members are generally arranged on the outer side of the outermost heating circuit 100, that is, arranged the outer side of all the heating circuits 100. The heat dissipation member 300 extends outward, and the extension direction may be perpendicular to the central axis of the entire heating mechanism, or may be arranged obliquely. The heat dissipation members 300 on a single heating circuit 100 may be parallel or non-parallel, and may be determined according to actual needs.
In terms of the arrangement position, the heat dissipation members 300 provided in the present invention are used to evenly dissipate the heat on the heating circuit 100, especially in the high heat position. That is, the heat dissipation member 300 are arranged at least in the intermediate area of the heating circuit 100, and may also be arranged in the two end areas and the intermediate area of the heating circuit 100. Preferably, all the heat dissipation members 300 are evenly distributed on the heating circuits 100 or symmetrically arranged about the center of the heating circuits 100.
In terms of the structure of the heat dissipation member 300 itself, since the heat in the intermediate area of the heating circuit 100 is higher than the heat in the two end areas of the heating circuit 100, the selected structure of the heat dissipation member 300 is different at different positions. The widths or/and the lengths of the heat dissipation members 300 may be selected to be gradually reduced from the middle of each heating circuit 100 to the two ends of the heating circuit 100, that is, the areas of the heat dissipation members 300 are gradually reduced from the middle of the heating circuit 100 to the two ends of the heating circuit 100. Alternatively, the arrangement density of the heat dissipation members 300 on each heating circuit 100 may be selected to gradually decrease from the middle to the two ends. Alternatively, the shape, size and density of the heat dissipation member 300 are all gradually reduced from the middle to the two ends. This structure and arrangement can dissipate high heat as much as possible, reduce the temperature difference, and maintain the heating uniformity of the heating circuit 100.
The heat dissipation member 300 is rod shaped, strip shaped or plate shaped, and its shape is a straight line, a curve, or a combination of at least one of them. The rod shape, strip shape or plate shape refers to that, in the transverse width of the connection 200, the structure of the heat dissipation member 300 may be a rod shape with a relatively narrow width, a strip shape with a certain width, or a plate shape with a relatively wide width, and from the whole or in the length direction, the shape of the heat dissipation member 300 may be a straight line, a curve or a combination of at least one of them. Herein, the combination of at least one of them means that, the heat dissipation member 300 may have a plurality of straight line parts connected end to end or cross-connected into a whole; the heat dissipation member 300 may have a plurality of straight line parts connected end to end or cross-connected into a whole; the heat dissipation member 300 may have a plurality of straight line parts and curve parts connected end to end or cross-connected into a whole.
In order to further enhance the heat dissipation efficiency, preferably, the connection 200 is also provided with the heat dissipation member 300 for guiding the heat to the ceramic body. The structure of the heat dissipation member 300 here may be the same as or different from the heat dissipation member 300 in the heating circuit 100. Generally, the length of the connection 200 is relatively short, and the heat dissipation member 300 here is mainly plate shaped or sheet shaped.
Since the heating circuit 100 needs to be embedded in but cannot be buried in the ceramic body, the heating circuit 100 and the ceramic body are prone to being separated. In order to enhance the fixation of the heating circuit 100 and the ceramic body, preferably, the heat dissipation member 300 extends towards the outer side of the heating circuit 100, and the free end of the heat dissipation member 300 is folded out of the plane where the heating circuit 100 is located to form a first folded portion 500 for fixing the heating circuit 100. The first folded portion 500 is located on one side of the plane of the heating circuit 100, and may be buried in the ceramic body during manufacture to strengthen the fixation between the heating circuit 100 and the ceramic body.
In order to further strengthen the supporting force, preferably, the heating circuits 100 are provided with second folded portions 600 that are folded outward from the plane where the heating circuits 100 are located. The second folded portions 600 are preferably disposed at two ends of the heating circuits 100 to maintain the firmness of the fixation between the heating mechanism and the ceramic body from two ends. The second folded portion 600 is also buried in the ceramic body. One or both of the first folded portion 500 and the second folded portion 600 may be provided.
In order to further illustrate the present invention, several specific embodiments are listed below for detailed description.
Embodiment 1-1: As shown in
Embodiment 1-2: As shown in
Embodiment 1-3: As shown in
Embodiment 1-4: As shown in
Embodiment 1-5: As shown in
Embodiment 1-6: As shown in
Embodiment 1-7: As shown in
Embodiment 1-8: As shown in
Embodiment 1-9: As shown in
Embodiment 1-10: As shown in
Embodiment 1-11: As shown in
On the basis of the above-mentioned embodiments, the linear unit may be changed to a folded line composed of linear units or a turning-arc line composed of curvilinear units, etc., so that more detours are achieved, the contact area of the heating circuit and the heating element is larger, and the resistance value of the detour circuit can be larger.
Embodiment 1-12: As shown in
Embodiment 1-13: As shown in
Embodiment 2: As shown in
The porous ceramic body 1 has a square groove structure, and the heating mechanism 2 is embedded in the bottom of the porous ceramic body 1. The first folded portions 500 and the second folded portions 600 of the heating mechanism 2 are embedded in the porous ceramic body 1 during manufacture, and the least two heating circuits 100 are attached to the bottom of the porous ceramic body 1.
The specific structure of the heating mechanism 1 is the same as that of the Embodiment 1, and will not be repeated herein.
Comparative tests: Using the single circuit in the prior art, the present invention selects three embodiments for testing.
Test method: Different heating mechanisms are selected, where the heating mechanisms are all made of nickel-chromium alloy, and have the resistance value of 1.0±0.05Ω. The power supply is 1.5 V (three stages of heating, and each 0.5 V for 10 seconds), and an infrared thermal imaging thermometer (with an accuracy of ±0.1° C.) is used to observe the temperature differences between the point at the middle of the heating mechanism and the points on two sides of the heating mechanism. The test points are at three positions, where A is at the middle of the ceramic, B and C are at the positions (by capturing the highest temperature value) on the two sides of the ceramic. The temperature values are divided into different intervals, and the temperature difference value is obtained according to the temperatures of the various positions (mainly test the data between 70 degrees Celsius and 350 degrees Celsius).
It can be seen from the above data that the temperature difference in the prior art gradually increases as the temperature increases, and the maximum temperature difference is 58.4° C. While in the embodiments of the present invention, by arranging the heat dissipation members and the connections, the temperature of the heating mechanism can be distributed to the porous ceramic, so as to minimize the temperature difference between the middle and the two sides caused by heat conduction and heat radiation; it can be seen that the maximum temperature difference is reduced to 15-25° C. from the data of the above embodiments, which makes the temperature of the heating surface at the bottom of the entire atomization heating mechanism more balanced, and the heat distribution more uniform. The above data show that the structure of the present invention makes the heat distribution more uniform, and the structure of the heating mechanism can well solve the problem of uneven temperature distribution caused by heat radiation, making the temperature difference smaller or even approaching to uniform temperature.
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/CN2021/077057 | 2/20/2021 | WO |
