The present disclosure relates to a healing module and a heating glass panel, more particularly to a heating glass panel capable of generating heat from partitioned zones
Glass is prone to having frost or moisture, etc., forming on its surface, due to a temperature difference, etc., between the surface on one side at id the surface on the other side. In such cases, it is possible to remove the frost or moisture, etc., by positioning a heating module for providing heat to the glass.
However, when transferring heat to a target having an increased area, it can be difficult to transfer heat uniformly.
Furthermore, when the target to which heat is to be transferred has to be heated with a constant amount of power, the user may find it difficult to effectively transfer heat to a desired portion.
An objective of the present disclosure is to provide a heating module and a heating glass panel capable of selectively providing heat to a whole or a portion of a glass panel.
A heating glass panel according to an embodiment of the present disclosure can include a first glass substrate, a second glass substrate opposite the first glass substrate, and a heating module positioned between the first glass substrate and the second glass substrate.
The heating module can include a planar heating element, a first busbar superimposed over one side of the planar heating element and electrically connected with the planar heating element, a second busbar superimposed over the other side of the planar heating element and electrically connected with the planar heating element, a third busbar positioned between the first busbar and the second busbar and electrically connected with the planar heating element, a fourth busbar positioned between the first busbar and the second busbar and electrically connected with the planar heating element, a first power supply module electrically connected to a multiple number of busbars from among the first to fourth busbars, a second power supply module electrically connected to a multiple number of busbars from among the first to fourth busbars, and a control circuit configured to control the first power supply module and the second power supply module.
In an embodiment of the present disclosure, the planar heating element can include a multiple number of planar heating sub-elements that are separated from one another by a predetermined distance, and each of the multiple planar heating sub-elements can extend in a direction that intersects the directions in which the first to fourth busbars extend.
In an embodiment of the present disclosure, the first power supply module can be electrically connected to the first busbar, the second busbar, and the third busbar, while the second power supply module can be electrically connected to the second busbar and the fourth busbar.
In an embodiment of the present disclosure, the first power supply module can provide power to two busbars from among the first busbar, she second busbar, and the third busbar according to a first control signal received from the control circuit, while the second power supply module can provide power to the second busbar and the fourth busbar according to a second control signal received from the control circuit.
In an embodiment of the present disclosure, each of the first to fourth busbars can extend along a first direction, the third busbar and the fourth busbar can be positioned adjacent to the first busbar, and the third busbar can be superimposed over the fourth busbar in the first direction.
A heating module according to an embodiment of the present disclosure can further include a fifth busbar, which may be positioned between the second busbar and the third busbar and be electrically connected to the planar heating element, and a sixth busbar, which may be positioned between the second busbar and the fourth busbar and be electrically connected to the planar heating element.
In an embodiment of the present disclosure, the first power supply module can provide power to two busbars from among the first busbar, the second busbar, the third busbar, and the fifth busbar according to a first control signal received from the control circuit, and the second power supply module can provide power to the fourth busbar and the sixth busbar according to a second control signal received from the control circuit.
In an embodiment of the present disclosure, each of the first to sixth busbars can extend along a first direction, the third busbar can be superimposed over the fourth busbar in the first direction, and the fifth busbar can be superimposed over the sixth busbar in the first direction.
In an embodiment of the present disclosure, at least one of the first to fourth busbars can have a mesh shape.
In an embodiment of the present disclosure, the planar heating element can include silver nanowires.
In an embodiment of the present disclosure, the planar-heating element can have a mesh shape.
A heating module according to an embodiment of the present disclosure can include a base member, a planar beating element disposed on the base member, a first busbar electrically connected to the planar heating element, a second busbar positioned separated from the first busbar and electrically connected to the planar heating element, a third busbar positioned between the first busbar and the second busbar and electrically connected to thy planar heating element, a fourth busbar positioned between the first busbar and the second busbar and electrically connected to the planar heating element, and a power supply module configured to selectively provide power to at least two busbars from among the first to fourth busbars.
In an embodiment of the present disclosure, the planar heating element can include an upper surface, a lower surface opposite the upper surface, and a side surface connecting the upper surface and the lower surface, either one busbar from among the first busbar and second busbar can be positioned at the side surface, and the third busbar and the fourth busbar can be positioned on the upper surface.
In an embodiment of the present disclosure, the one busbar positioned at the side surface from among the first busbar and the second busbar can contain Ag paste or Ag ink.
A heating module according to an embodiment of the present disclosure can include a base member, a planar heating element disposed on the base member, a first busbar superimposed over a portion of one side of She planar heating element and electrically connected with the planar heating element a second busbar superimposed over another portion of the one side of the planar heating element and electrically connected with the planar heating element, a third busbar superimposed over the other side of the planar healing element and electrically connected with she planar heating element a first power supply module electrically connected to the first busbar and the third busbar, a second power supply module electrically connected to the second busbar and the third busbar, and a control circuit configured to control the first power supply module and the second power supply module.
According to an embodiment of the present disclosure, a heating module can be provided that is capable of effectively removing moisture or droplets formed on the surface of a glass panel.
Also, according to an embodiment of the present disclosure, a heating module can be provided that is capable of selectively heating only the portion of a glass panel desired by the user.
Certain embodiments of the present disclosure are described below with reference to the drawings.
In the drawings, the proportions and dimensions of the components have been exaggerated for a more effective depiction of the technical content. A phrase using the term “and/or” encompasses all of the one or more combinations that can be defined with the associated components.
It is to be understood that terms such as “including” or “having,” etc., are intended to indicate the existence of the features, numbers, steps, actions, components, parts, or combinations thereof disclosed in the specification, and are not intended to preclude the possibility that one or more other features, numbers, steps, actions, components, parts, or combinations thereof may exist or may be added.
The heating glass panel 10 can include a first glass substrate 100D, a second glass substrate 100U, a heating module 200, a first attachment member 300D, and a second attachment member 300U.
The heating module 200 can be positioned between the first glass substrate 100D and the second glass substrate 100U.
The first attachment member 300D can be positioned between the first glass substrate 100D and the heating module 200 to join these together.
The second attachment member 300U can be positioned between the second glass substrate 100U and the heating module 200 to join these together.
The first attachment member 300D and the second attachment member 300U can each have a transparent property. For example, each of the first attachment member 300D and second attachment member 300U can include PVB (polyvinyl butyral).
The heating module 200 can generate heat, and the generated heat can be transferred to the first glass substrate 100D and the second glass substrate 100U. When the temperatures of the first glass substrate 100D and second glass substrate 100U are increased as a result, moisture formed on the surface of the heating glass panel 10 can be evaporated.
In another embodiment of the present disclosure, the first glass substrate 100D and the second glass substrate 100U can each be substituted by a transparent plastic such as a polycarbonate (PC), etc., for example. In such cases, the heating glass panel 10 can be understood as being a heating transparent panel.
In an embodiment of the present disclosure, the heating module 200 can include a base member BS, a planar heating element 1000, busbars 2001˜2004, power supply modules 2122, and a control circuit 30.
The base member BS can be a film containing an organic or inorganic substance. However, the invention is not limited thus, and in other embodiments of the present disclosure, the base member BS can be any one of the glass substraies 100D, 100U (see
The planar heating element 1000 can be disposed on the base member BS. The planar heating element 1000 can be understood as a conductor that is electrically connected from one side to the other.
The planar heating element 1000 can include silver nanowires (AgNW). However, the invention is not limited thus, and the planar heating element 1000 can include ITO (indium tin oxide), IZO (indium zinc oxide), CNT (carbon nanotubes), or graphene.
The busbars 2001˜2004 can be electrically connected with the planar heating element 1000. The busbars 2001˜2004 can be formed as wiring or printed circuit boards that include metal.
The busbars 2001˜2004 can be conductors capable of transferring power provided form the power supply modules 21, 22 to the planar heating element 1000. The planar heating element 1000 can generate heat by converting the electrical power transferred from the busbars 2001˜2004 into thermal energy.
In an embodiment of the present disclosure, the busbars 2001˜2004 can be in direct contact with the planar heating element 1000. However, the invention is not limited thus, and a busbar 2001˜2004 can be electrically connected to the planar heating element 1000 by way of an anisotropic conductive film (ACF).
A first busbar 2001 can be positioned on one side of the planar heating element 1000. The first busbar 2001 can extend in a first direction DR1.
A second busbar 2002 can be positioned on the other side of the planar heating element 1000. The second busbar 2002 can extend along the first direction DR1. The second busbar 2002 be positioned separated from the first busbar 2001 in a second direction DR2.
A third busbar 2003 and a fourth busbar 2004 can be positioned between the first busbar 2001 and the second busbar 2002. The third busbar 2003 and the fourth busbar 2004 can each be positioned adjacent to the first busbar 2001. The third busbar 2003 and the fourth busbar 2004 can each extend along the first direction DR1. At least a portion of the third busbar 2003 can be superimposed over the fourth busbar 2004 in the first direction DR1.
A first power supply module 21 can be electrically connected to the first busbar 2001, the second busbar 2002, and the third busbar 2003.
A second power supply module 22 can be electrically connected to the second busbar 2002 and the fourth busbar 2004.
The control circuit 30 can be a circuit for controlling the first power supply module 21 and second power supply module 22. For example, the control circuit 30 can generate a first control signal for controlling the first power supply module 21 and can generate a second control signal for controlling the second power supply module 22.
The control circuit 30 can include a central processing unit (CPU) or a memory (volatile memory or non-volatile memory).
In response to the first control signal received from the control circuit 30, the first power supply module 21 can select two busbars from among the first busbar 2001, second busbar 2002, and third busbar 2003 and provide power to the selected busbars. Here, providing power can be understood as creating a potential difference between a busbar and another busbar to allow a flow of current.
For example, if the first power supply module 21 selects and provides power to the first busbar 2001 and the second busbar 2002, then the overall planar heating element 1000 can receive power and generate heat. That is, an area of about 80% or more of the total area of the planar heating element 1000 can generate heat.
For example, if the first power supply module 21 selects and provides power to the second busbar 2002 and the third busbar 2003, then only the left portion of the planar heating element 1000 can receive power and generate heat. That is, an area of about 79% or less, preferably 50% or less, of the total area of the planar heating element 1000 can generate heat.
In response to the second control signal received from the control circuit 30, the second power supply module 22 can provide power to the second busbar 2002 and die fourth busbar 2004.
For example, if the first power supply module 21 does not provide power and only the second power supply module 22 selects and provides power to the second busbar 2002 and the fourth busbar 2004, then only the right portion of the planar heating element 1000 can receive power and generate heat. That is, an area of about 79% or less, preferably 20% or more and 50% or less, of the total area of the planar heating element 1000 can generate heat.
In this way, the heating module 200 can have a first healing mode in which the planar heating element 1000 generates beat overall (or 80% or more of the total area generates heat) and a second heating mode in which only a portion of the planar heating element 1000 generates heat.
Referring to
Referring to
Referring to
As the busbars 2001˜2004 have mesh shapes, the busbars 2001-2004 can be made less noticeable to the human eye.
However, the shapes of the busbars 2001-2004 are not limited thus, and in other embodiments of the present disclosure, the busbars 2001-2004 can include metal wires or metal films.
The first busbar 2001 can include a multiple number of first lines LN1 and a multiple number of second lines LN2 that intersect with the first lines LN1. For example, the first lines LN1 and second lines LN2 can each have a hue width that is greater than or equal to 1 μm and smaller than or equal to 3 μm, preferably a line width of about 2 μm.
From among the first lines LN1 and second lines LN2, the distance WD between two adjacent lines (hereinafter referred to as ‘separated distance’ ) can be greater than or equal to 20 μm and smaller than or equal to 40 μm. If the separated distance WD is smaller than 20 μm, then visibility may be worsened as the first busbars 2001 become noticeable to the human eye, and if the separated distance WD is greater than 40 μm, then the ability of the first busbar 2001 to transfer heat to another object can be lowered.
The planar heating element 1000 can include multiple planar heating sub-elements 1001˜1009. While
In an embodiment of the present disclosure, each of the planar heating sub-elements 1001˜1009 can base substantially the same sheet resistance value. This is so that, when the planar heating sub-elements 1001˜1009 are supplied with power, heat may be generated uniformly.
Two adjacent planar heating sub-elements 1001˜1009 can be separated by a predetermined distance LL (hereinafter referred to as ‘pattern distance’). The pattern distance LL can be 100 μm or greater. If the pattern distance LL is smaller than 100 μm, visibility may be worsened due to optical properties such as light scattering when light passes through.
In an embodiment of the present disclosure, the heating module 200-1 can include a base member BS, a planar heating element 1000, busbars 2001-1′˜2006-1, power supply modules 21-1, 22-1, and a control circuit 30.
The busbars 2001-1˜2006-1 can be electrically connected with the planar heating element 1000. The busbars 2001-1˜2006-1 can be formed as wiring or printed circuit boards that include metal.
The busbars 2001-1˜2006-1 can be conductors capable of transferring power provided from the power supply modules 21-1, 22-1 to the planar heating element 1000. The planar heating element 1000 can generate heat by converting the electrical power transferred from the busbars 2001-1˜2006-1 into thermal energy.
The first busbar 2001-1 can be positioned at one side of the planar heating element 1000. The first busbar 2001-1 can extend along a first direction DR1.
The second busbar 2002-1 can be positioned at the other side of the planar heating element 1000. The second busbar 2002 can extend along the first direction DR1. The second busbar 2002-1 can be positioned separated from the first busbar 2001-1 in a second direction DR2.
The third to sixth busbars 2003-1˜2006-1 can be positioned between the first busbar 2001-1 and the second busbar 2002-1.
More specifically, the third busbar 2003-1 can be positioned between the first busbar 2001-1 and the fifth busbar 2005-1. The fourth busbar 2004-1 can be positioned between the first busbar 2001-1 and the sixth busbar 2006-1.
The third busbar 2003-1 and the fourth busbar 2004-1 can each extend along the first direction DR1. At least a portion of the third busbar 2003-1 can be superimposed over the fourth busbar 2004-1 in the first direction DR1.
The fifth busbar 2005-1 can be positioned between the second busbar 2002-1 and the third busbar 2003-1. The sixth busbar 2006-1 can be positioned between the second busbar 2002-1 and the fourth busbar 2004-1.
The fifth busbar 2005-1 and the sixth busbar 2006-1 can each extend along the first direction DR1. At least a portion of the fifth busbar 2005-1 can be superimposed over the sixth busbar 2006-1 in the first direction DR1.
A first power supply module 21-1 can be electrically connected to the first busbar 2001-1, second busbar 2002-1, third busbar 2003-1, and fifth busbar 2005-1.
A second power supply module 22-1 can be electrically connected to the fourth busbar 2004-1 and the sixth busbar 2006-1.
In response to a first control signal received from the control circuit 30, the first power supply module 21-1 can select two busbars from among the first busbar 2001-1, second busbar 2002-1, third busbar 2003-1, and fifth busbar 2005-1 and provide power to the selected busbars.
In response to a second control signal received from the control circuit 30, the second power supply module 22-1 can provide power to the fourth busbar 2004-1 and the sixth busbar 2006-1.
The descriptions of the remaining features are substantially the same as the descriptions provided with reference to
In an embodiment of the present disclosure, the heating module 200-2 can include a base member BS, a planar heating element 1000, busbars 2001-2˜2005-2, a power supply module 20, and a control circuit 30.
The busbars 2001-2˜2005-2 can be electrically connected with the planar heating element 1000. The busbars 2001-2˜2005-2 can be formed as wiring or printed circuit boards that include metal.
The busbars 2001-2˜2005-2 can be conductors capable of transferring power provided from the power supply module 20 to the planar heating element 1000. The planar heating element 1000 can generate heat by converting the electrical power transferred from the busbars 2001-2˜2005-2 into thermal energy.
The busbars 2001-2˜2005-2 can be arranged in a row, superimposed over the planar heating element 1000. Each of the busbars 2001-2˜2005-2 can extend along the first direction DR1.
The power supply module 20 can be electrically connected to the busbars 2001-2˜2005-2.
In response to a control signal received from the control circuit 30, the power supply module 20 can select two busbars from among the busbars 2001-2˜2005-2 and provide power to the selected busbars.
The descriptions of the remaining features are substantially the same as the descriptions provided with reference to
In an embodiment of the present disclosure, the heating module 200-3 can include a planar heating element 1000, busbars 2001-3˜2004-3, power supply modules 21-3, 22-3, and a control circuit 30.
The planar heating element 1000 can include an upper surface, a lower surface opposite the upper surface, and side surfaces connecting the upper surface and lower surface.
A first busbar 2001-3 can be positioned at a side surface of the planar heating element 1000, and a fourth busbar 2004-3 can be positioned at the upper surface of the planar heating element 1000.
Although it is not shown in
In an embodiment of the present disclosure, each of the first busbar 2001-3 and the second busbar 2002-3 can contain Ag paste, Ag ink, high-density AgNW, or metal nanopowder paste.
In an embodiment of the present disclosure, the heating module 200-4 can include a base member BS, a planar heating element 1000, busbars 2001-4˜2003-4. power supply modules 21-4, 22-4, and a control circuit 30.
The busbars 2001-4˜2003-4 can be electrically connected with the planar heating element 1000. The busbars 2001-4˜2003-4 can be formed as wiring or printed circuit boards that include metal.
The busbars 2001-4˜2003-4 can be conductors capable of transferring power provided from the power supply modules 21-4, 22-4 to the planar heating element 1000. The planar heating element 1000 can generate heat by converting the electrical power transferred from the busbars 2001-4˜2003-4 into thermal energy.
The busbars 2001-4˜2003-4 can be arranged in a row, superimposed over the planar heating element 1000. Each of the busbars 2001-4˜2003-4 can extend along the first direction DR1.
A first busbar 2001-4 can be positioned superimposed over a portion of one side of the planar heating element 1000, and a second busbar 2002-4 can be positioned superimposed over another portion one the one side of the planar heating element 1000. A third busbar 2003-4 can be positioned superimposed over the other side of the planar heating element 1000.
A first power supply module 21-4 can provide power to the first busbar 2001-4 and the third busbar 2003-4. A second power supply module 22-4 can provide power to the second busbar 2002-4 and the third busbar 2003-4.
In response to control signals received from the control circuit 30, the power supply modules 21-4, 22-4 can provide power to the busbars 2001-4˜2003-4.
The descriptions of the remaining features are substantially the same as the descriptions provided with reference to
As illustrated in
While
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The heating glass panel 10 illustrated in
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The heating glass panel 10 illustrated in
While the spirit of the invention has been described above with reference to certain embodiments, it is to be appreciated that the person skilled in the art can change or modify the invention in various ways without departing from the scope and spirit of the invention. Moreover, the embodiments disclosed herein are not to limit the spirit of the invention, and all technical concepts within the scope of the claims below as well as the range of equivalency are to be interpreted as being encompassed within the scope of rights of the present invention.
Applying heat uniformly over a glass panel by using a planar heating element can effectively remove frost or moisture, etc., formed on the glass panel and thus increase the utility of the glass panel. Therefore, the present disclosure, which enables a uniform heating of a glass panel by using a planar heating element, has a high potential for industrial applicability.
Number | Date | Country | Kind |
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10-2018-0080615 | Jul 2018 | KR | national |
Filing Document | Filing Date | Country | Kind |
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PCT/KR2019/007071 | 6/12/2019 | WO | 00 |