Patent Application
20210108830
This application claims priority to DE 10 2019 127 324.2, filed Oct. 10, 2019, the entire disclosure of which is hereby incorporated herein by reference.
This disclosure refers to a heating plate of the type generally described in EP 1 566 078 B1. Such heating plates are used in flow heaters in vehicles, as disclosed, for example, in DE 10 2017 121 341 A1.
Heating plates or heating devices containing heating plates are increasingly used in vehicles having pulse-width modulation at high voltages of up to 400 V and more. It is therefore becoming increasingly difficult to meet conventional requirements for electromagnetic compatibility in vehicles.
This disclosure teaches how the electromagnetic compatibility of heating plates or heating devices containing heating plates can be fulfilled more economically.
In a heating plate according to this disclosure, an electrically conductive shielding layer is arranged between the substrate and the heating layer. A first insulation layer thus lies on the substrate, the insulation layer being covered by the shielding layer. The shielding layer bears a second insulation layer on which the heating layer is arranged. Surprisingly, the electromagnetic compatibility of the heating plate or a heating device equipped therewith can be significantly improved.
In a conventional heating plate, the heating layer forms a capacitance to the substrate. An interference current therefore occurs in pulse-width-modulated operation with a high pulse frequency and high voltage, the interference current flowing from the heating layer to the substrate and from there flowing uncontrollably to other system components, for example, a housing.
Problems based on this interference current can be largely eliminated using a heating plate according to this disclosure by placing the shielding layer at a suitable potential, e.g., ground, for example, by means of an electrically conductive connection to a ground connection of a control of a heating device which contains the heating plate. The interference current from the heating layer to the shielding layer can thus be dissipated via a suitable contacting of the shielding layer.
An advantageous refinement of this disclosure provides that the substrate is a metal plate, for example, made of steel. The substrate of a heating plate according to this disclosure can be sheet metal and can therefore be produced inexpensively.
The above-mentioned aspects of exemplary embodiments will become more apparent and will be better understood by reference to the following description of the embodiments taken in conjunction with the accompanying drawings, wherein:
The embodiments described below are not intended to be exhaustive or to limit the invention to the precise forms disclosed in the following description. Rather, the embodiments are chosen and described so that others skilled in the art may appreciate and understand the principles and practices of this disclosure.
The heating plate shown in an exploded view in
The heating layer 5 may comprise one or more tracks. All tracks of the heating layer 5 are arranged on the second insulation layer 4. In the example shown, the substrate is a plate, for example, made of sheet metal. However, a profile can also be used as the substrate, for example.
The insulation layers 2, 4 and the shielding layer 3 may be closed layers, which completely cover the respective underlying surface. The insulation layers 2, 4 and the shielding layer 3 have essentially the same area, that is, the same size. The heating layer 5, on the other hand, may cover only a relatively small part of the surface of the second insulation layer 4 and can, for example, be designed as a plurality of strips arranged at a distance from one another.
The heating plate shown in
The flow heater contains control electronics 18 which, for example, can be arranged on a printed circuit board. The heating plates 16 are connected to an electrical plug connector 19 via the control electronics 18 and can thus be supplied with voltage. Contacts 20 of the control electronics 18 lead to the ends 6 of the heating layer 5, respectively its tracks. In addition, a suitable connection of the control electronics 18, for example, a ground connection, is electrically conductively connected to the shielding layers 3 of the heating plates 16. To ensure that the flow heater can be operated safely with high voltage, its housing is electrically insulated from the circuit through which the heating current flows. The shielding layer 3 is therefore galvanically separated from the substrate 1.
While exemplary embodiments have been disclosed hereinabove, the present invention is not limited to the disclosed embodiments. Instead, this application is intended to cover any variations, uses, or adaptations of this disclosure using its general principles. Further, this application is intended to cover such departures from the present disclosure as come within known or customary practice in the art to which this invention pertains and which fall within the limits of the appended claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 10 2019 127 324.2 | Oct 2019 | DE | national |
