Patent Application
20230414404
The present invention relates to a heating plate for the thermal-medical treatment of skin. The present invention further relates to a device for the thermal-medical treatment of skin as well as a method for manufacturing a heating plate.
Skin irritations as can be induced, for example, by insect bites, plants, fish, seaweed, jellyfish or other kinds of cnidarians, can be cured and/or their effects alleviated by a local heat treatment. As soon as possible after the occurrence of the skin irritation or the triggering event, the affected skin area is heated, for example to a temperature between 45° C. and 65° C. The temperature is maintained for a few seconds. The heating stimulates blood circulation and suppresses a skin reaction that can lead to the skin irritation. Pain and itching are relieved.
Due to the fact that the above-mentioned skin irritations often occur in the outdoor area, portable devices for carrying out a corresponding heat treatment have become available in the meantime. For example, WO 2019/020144 A1 discloses a couplable portable device for the thermal-medical treatment of skin. The device comprises a treatment attachment that can be coupled via an interface to a mobile data processing unit, preferably a smartphone or a tablet. In the coupled state, a housing of the treatment attachment overlapping the treatment attachment is provided with a heating element directly underneath the surface facing away from the data processing unit. The heating element is coupled to a temperature sensor. The heating element, with the interposition of a control unit, is connected to an electrically conductive interface or, via a Bluetooth connection, to the data-processing unit in such a way that the heating element is energized via one or more accumulators integrated into the data processing unit so that the heating element can be heated to a temperature predefined via the control unit.
In such devices, regardless of whether they are designed to be coupled to a mobile device or as stand-alone devices with their own control electronics and power supply, so-called heating plates are usually used to transmit heat from a heating element to the skin area to be treated. To heat the heating plate, it is thermally contacted with a heating element. For example, a heating resistor can be used whose heat is directed into the heating plate. For this purpose, the heating plate in particular can be soldered onto a printed circuit board, whereby the heat generated by the heating element is directed into the heating plate via the soldering points. Both the heating element and the heating plate are advantageously arranged in immediate vicinity and are minimally dimensioned so that as much of the heat generated as possible can be applied to the skin surface to be treated. Due to the metallic soldering connection between the various components, the thermal resistance is low.
Based on the foregoing, according to prior art the design is usually such that a heating plate is soldered onto one side of a printed circuit board and a heating element is attached to the other side of the printed circuit board. Thermal contact is then achieved via metallized holes in the area of the contact points of the heating element and the heating plate. Heat can be directed into the heating plate through the metallized holes. Advantageously, these holes are additionally filled with tin or another suitable metal to further reduce thermal resistance.
The heating plate itself is usually made of ceramic, with a metallic material, in particular copper, being applied to one side of the heating plate for contacting purposes. In other words, the heating plate comprises a layer or section for contacting the skin on one side and a section for attaching to a printed circuit board on the other side. In the manufacturing process, this contacting layer or section is often applied to a larger ceramic plate and baked. Only after completion of this connection process is the larger plate then cut into individual small heating plates.
Disadvantages of previous heating plates for this area of application are the high manufacturing costs and the low flexibility of the design when using the heating plate within the device for thermal-medical treatment. In addition, the production is often comparatively complex and cost-intensive. On the other hand, due to the manufacturing processes used and the specifications for the application, only a few degrees of freedom remain with regard to the attachment and processing of the heating plate in the device for thermal-medical treatment of skin.
Based on the foregoing, the problem faced by the present invention is to provide a heating plate that can be efficiently manufactured and allows for flexibility with regard to the attachment in the device for thermal-medical treatment of skin. In particular, a heating plate is to be provided which allows for a simplified and flexible assembly process.
To solve this problem, in a first aspect, the present invention relates to a heating plate for the thermal-medical treatment of skin, comprising:
In another aspect, the present invention relates to a device for the thermal-medical treatment of skin comprising:
In a further aspect, the present invention relates to a method of manufacturing a heating plate as previously described, comprising a step of creating the recess, a further recess and/or an edge section by ablative laser processing of the heating plate.
In a further aspect, the present invention relates to a method of manufacturing a heating plate, in particular a heating plate as previously described, comprising a step of creating the recess, a further recess and/or an edge section by pressing a ceramic powder into a mold.
Preferred embodiments of the invention are described in the dependent claims. It is understood that the above features and those to be explained below can be used not only in the combination indicated in each case, but also in other combinations or on a stand-alone basis, without departing from the scope of the above invention. In particular, the heating plate, the device as well as the methods can be designed according to the embodiments described for the heating plate, the device and the methods in the dependent claims.
According to the invention, the heating plate is to be provided with a recess on its bottom side. A recess is understood to mean in particular an area of missing material. In particular, the recess creates a cavity or free space between the printed circuit board and the heating plate when the heating plate is attached to the printed circuit board. The connecting section designates the section or layer of the heating plate through which the thermal and mechanical connection with the printed circuit board is established. The acting section is the area of the heating plate that transfers the heat to the skin surface of the person to be treated. The heat generated by the heating element is transferred to the acting section via the connecting section. The acting section can then transfer the heat to the skin of the person to be treated. The cavity or free space created by the recess may be located within the connecting section and/or within the acting section of the heating plate. The top side of the heating plate is applied to the skin. The bottom side of the heating plate is connected to a printed circuit board. A heating plate or a plate is understood to mean in particular a shape or a structure which has a significantly smaller extension in one direction than in the other two directions and is thus flat.
According to the invention, the heating plate and the recess are to be produced by ablative laser processing or by pressing a ceramic powder into a mold. Both ablative laser processing and pressing of a ceramic powder into a mold can enable an efficient production of the recess. Compared to previous approaches, in particular the mechanical generation of a recess, the costs are reduced and the efficiency of the production is significantly improved.
Compared to previous heating plates, which are solid and have no recess on their bottom side, the recess in the heating plate according to the invention allows further degrees of freedom with regard to the attachment to the printed circuit board. For example, light can be introduced into the heating plate through the recess, so that a luminous heating plate is possible. By means of a luminous heating plate, the application can be improved for the user, since the user can identify and treat the skin area to be treated even in the dark. In contrast to the arrangement of a luminous ring around the heating plate, this results in cost and application advantages. In addition, this results in an improved and more comprehensive illumination of the skin area in question with reduced energy consumption. At the same time, the design freedom of the rest of the device can be improved by a luminous heating plate, since no translucent plastic elements have to be installed.
In addition, the recess of the heating plate according to the invention allows for the use of a one-sided assembly process. Since a heating element or other components can be arranged in the recess, for example, one-sided assembly is sufficient, which allows cost advantages to be realized. In previous approaches, two-sided assembly is often required, with the heating element being arranged on the side of the printed circuit board opposite the heating plate.
The manufacturing processes of ablative laser processing or pressing of a ceramic powder according to the invention enable the production of more complex shapes, so that the degrees of freedom in further processing steps are increased. In addition, good surfaces can be produced that enable an efficient heat transmission to the skin area to be treated and avoid skin irritation. Furthermore, the achievable smooth surfaces can facilitate assembly. Particularly advantageous is the use of a flex board onto which the heating plate is soldered, so that control and power supply are not situated in the same plane as the heating plate, but can be arranged in an angled position relative to this plane. This allows for further design flexibility.
In a preferred embodiment, the recess is designed for accommodating a component on the printed circuit board when the heating plate is attached to the printed circuit board. In particular, the recess may be designed to accommodate an LED, preferably a soldered surface-mounted LED. Advantageously, the recess has a size that is sufficient to accommodate a component. In other words, the dimensioning of the recess enables a component to be accommodated on the printed circuit board. On the one hand, this component can be the heating element, so that the heating element can be attached on the same side of the printed circuit board as the heating plate due to the recess. This makes it possible to abstain from two-sided assembly. On the other side, it is possible to arrange an LED in the recess. The LED generates light which can then be passed through the heating plate, resulting in a luminous heating plate and illumination of the skin area to be treated. It is understood that the recess may also be dimensioned to accommodate multiple components. For example, a heating element and one or more LEDs can be arranged in the recess. Compared to previous approaches with solid heating plates, this results in reduced manufacturing costs and further degrees of freedom with regard to structuring and design. Furthermore, the components arranged in the recess are protected from moisture and other environmental influences.
In a preferred embodiment, the recess comprises areas with different depths. In other words, there are at least two areas in the recess which have different depths perpendicular to the plane of the printed circuit board or perpendicular to the heating plate. Different depths allow the recess or the dimension of the recess to be adapted to one or more components arranged within the recess. For example, due to the use of several depths, the recess can be dimensioned in such a way that two components can be accommodated in the recess and at the same time the heating plate is not unnecessarily weakened and thus retains its mechanical stability and good thermal conductivity. It is also possible for a shape of a component to be mimicked by means of different depths of the recess, so that the dimensioning of the recess can be as small as possible in order to enable a minimum dimensioning of the heating plate itself with a sufficient amount of material of the heating plate and sufficient heat absorption capacity.
In a preferred embodiment, the recess extends through the connecting section and into the acting section. In principle, it is possible for the recess to be provided only within the connecting section. Advantageously, however, the design or depth is chosen such that it extends through the connecting section into the acting section. This allows a component to be accommodated in the recess and/or light to be transmitted through the recess and the acting section.
In a preferred embodiment, the recess in an area within the acting section is open in exactly one spatial direction. In other words, an area of the recess in the acting section corresponds to a cutout that is open on one side. Additionally or alternatively, the recess is designed to be closed off from an environment by the printed circuit board. Additionally or alternatively, the recess has, at least in a partial area, a bone-shaped cross-sectional area with a centrally arranged central area and two exterior areas widened relative to the central area. A recess which is closed off from an environment enables a cavity to be created under the heating plate when the latter is attached to a printed circuit board. In other words, the recess is not designed as a cutout at the edge of the heating plate, but is closed on all sides either by material of the heating plate or by the printed circuit board itself when attached. The use of a bone-shaped cross-sectional area, in particular on the bottom side of the heating plate, enables components to be accommodated with as much as possible amount of material of the heating plate. Preferably, the recess has a bone-shaped cross-sectional area in an area of the recess within the acting section. The cross-sectional area is to be understood as an area parallel to the heating plate or parallel to the printed circuit board in the area where the heating plate is attached to the printed circuit board. At least in a partial area, the recess has a bone-shaped cross-sectional area or bone-shaped cross-section, which enables adaptation to a shape of a component. In addition, the stability of the heating plate is improved. By making the heating plate as solid as possible, the dimensioning of the heating plate can be reduced if sufficient heat capacity is given.
In a preferred embodiment, the acting section is made of a ceramic material. Preferably, the connecting section is formed of a different material that is connected to the ceramic material using a firing process. Ceramic is biocompatible, so that heat can be transferred to the skin without causing skin irritation. In addition, a high thermal conductivity is provided. In particular, a ceramic material with good thermal conductivity can be used. For example, aluminum nitride or aluminum oxide can be used. For the attachment of the ceramic to a printed circuit board, the use of a different material is preferably intended in the connecting section, which can be connected to the ceramic material using a baking process. In particular, a metal layer may be provided as a connecting section, preferably a copper layer.
In a preferred embodiment, the acting section in the area of the recess has a thickness of between 0.2 mm and 0.8 mm, preferably about 0.4 mm. Additionally or alternatively, the heating plate has a maximum thickness between mm and 1.5 mm. Further additionally or alternatively, the acting section has rounded edges. The specified thickness of the acting section or the maximum thickness of the heating plate allows for sufficient mechanical stability combined with sufficient heat absorption capacity. Nevertheless, the thickness is small enough to provide for a sufficiently quick heatability along with a comparatively low energy input, as required for a mobile application of the device for thermal-medical treatment of skin according to the invention. By using rounded edges in the acting section, injuries or additional skin irritations due to scratches can be avoided when treating the skin. In addition, this results in improved mechanical stability, since edging and thus higher force application is avoided.
In a preferred embodiment, the heating plate comprises a further recess on the top side of the heating plate within the acting section. The further recess preferably has a depth which is selected such that a bottom of the further recess is brought into contact with the skin when the acting section is applied to the skin by pressing in the skin. In this respect, the further recess is located opposite the first recess on the top side of the heating plate. For example, a symbol in the form of a recess can be provided on the top side of the heating plate. Thereby, it is preferably intended that nevertheless a substantial part of the acting section or of the top side of the heating plate can be brought into contact with the skin in order to further enable an efficient thermal-medical treatment of the skin through use of heat. In this respect, the recess on the top side of the heating plate is of comparatively small depth. This leads to a higher degree of freedom of design.
In a preferred embodiment, the connecting section comprises a metal layer for soldering the heating plate onto the printed circuit board, in particular a copper layer. Preferably, the metal layer comprises several areas not electrically connected to one another for soldering onto multiple soldering surfaces of the printed circuit board. In particular, the connecting section may correspond to a metal layer. The metal layer may be applied to a ceramic layer forming the acting section, for example by baking. Via the metal layer, a mechanical and thermal connection of the heating plate to the printed circuit board can be established. In this respect, the use of a copper layer is particularly advantageous due to its high electrical and thermal conductivity. By using several areas that are not electrically connected to one another, a direct coupling of a heating element, for example a heating resistor, can be achieved. The multiple soldering surfaces of the printed circuit board to which the heating plate is soldered by means of the connecting section are thermally connected to the soldering surfaces of the printed circuit board to which the heating element or the heating resistor is coupled. In this respect, the heat of the heating element is transferred directly to the heating plate.
In a preferred embodiment, the heating plate comprises an edge section which is set back relative to the acting section on the top side of the heating plate. The edge section preferably circulates the acting section step-like. Additionally or alternatively, the edge section is made of the same material as the acting section. The edge section is thus preferably made of the material of the acting section or the material of the connecting section. In this respect, an edge section is understood to be an area in which the heating plate has a smaller thickness or, when attached to the printed circuit board, a smaller height than in a central area. In other words, it can be provided, for example, that a step circulates around the heating plate. This allows for a high degree of stability when attaching the heating plate to the printed circuit board, as well as a reduction of the mechanical susceptibility of the heating plate or the device during use.
In a preferred embodiment, the device comprises a component attached to the printed circuit board in the recess of the heating plate. In particular, the component may be an LED.
In a preferred embodiment of the method according to the invention, parallel processing of multiple heating plates takes place in one panel. Parallel processing leads to cost savings and enables an efficient production.
In this context, a heating plate or a plate is understood to be a plate-like structure which has a larger dimension in one plane than in a height perpendicular to this plane. An acting section or also a connecting section are in particular layers which are connected to one another. A recess corresponds to an area of missing material and may also be referred to as a cavity or cutout. The heating plate has a top side and a bottom side, with the top side obviously denoting the side opposite the bottom side. The thickness between the top and bottom sides is substantially less than the dimension in the other two spatial directions. A printed circuit board is understood in this context to mean in particular a circuit board on which electronic components can be arranged. A printed circuit board can in particular be a flexible board or flex board or flexible printed circuit board. A metal surface or a contacting metal surface or a soldering surface of the printed circuit board is understood to mean a soldering pad or a metallized area for the attachment of electronic components. A surface of a printed circuit board may be both a top side and a bottom side.
The invention is described and explained in more detail below with reference to some selected embodiments in connection with the accompanying drawings. They show:
In the illustrated embodiment, the heating plate 14 and the heating element 16 are attached on different sides of the printed circuit board 12, which is designed as a flexible printed circuit board. In this case, the heating plate 14 serves to contact the skin (not shown) and to transfer heat to the skin. The heating element 16 can be designed, for example, as a heating resistor or a heating transistor and serves for heat generation. The heat is directed through the printed circuit board 12 into the heating element 16. On its top side 20 the heating plate 14 comprises an acting section to be placed on the skin. On a bottom side 28, the heating plate 14 comprises a connecting section for attaching the heating plate 14 to the printed circuit board 12, for example by soldering.
In
In the embodiment shown in
In comparison of
The invention provides that the heating plate 14 is manufactured by ablative laser processing and/or by pressing a ceramic powder into a mold. By means of these manufacturing processes, it is possible for the heating plate 14 to obtain a 3D shaping. In particular, by applying such manufacturing processes to a ceramic material, a variety of different shapes can be realized. By using a 3D manufacturing process, such as ablative laser processing, a recess 32 can be created.
The recess 32 can accommodate, for example, a component that is attached to the printed circuit board. The heating plate 14 is arranged in the manner of a lid, so to speak, above a component on the printed circuit board. The component is then located in the recess 32. For example, the recess 32 can thereby be dimensioned such that an LED can be arranged therein. In this case, it is possible for light to be generated by this LED, with, for example, a ceramic material being translucent, so that, due to the generation of light in the recess 32, illumination of the heating plate 14 through the acting section 24 and thus illumination of a skin area to be treated is possible.
In the illustrated embodiment, the recess 32 is open in an area within the acting section in exactly one spatial direction, in direction of the bottom side 28. In this respect, the design of the recess provides, in particular, that it is closed off from an environment when the heating plate 14 is fixed to the printed circuit board at its bottom side 28.
The acting section 24 does not comprise any part of the recess 32. Due to the comparatively thick metal layer 34 or the comparatively thick connecting section 26 it is possible for a component to be arranged within the recess 32. The recess 32 is large enough, so to speak, to accommodate a component on the printed circuit board when the heating plate 14 is attached to the printed circuit board.
In this respect,
In
The invention has been comprehensively described and explained with reference to the drawings and the description. The description and explanation are to be understood as an example and not restrictive. The invention is not limited to the disclosed embodiments. Other embodiments or variations will be apparent to those skilled in the art upon use of the present invention and upon close analysis of the drawings, the disclosure and the following claims.
In the claims, the word “comprising” does not exclude other elements or steps, and the indefinite article “a” or “an” does not exclude a plurality. A single element or single unit may fulfill the functions of several items recited in the claims. An element, a unit, a device and a system may partially or completely be implemented by corresponding hardware and/or software. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage. Reference signs in the claims are not to be understood restrictively. Identical reference signs in the figures denote the same elements in each case.
| Number | Date | Country | Kind |
|---|---|---|---|
| 10 2022 116 008.4 | Jun 2022 | DE | national |
