A heating treatment method of the present invention comprises the steps of: preparing an array of heating chambers, the heating chambers being respectively provided with heaters and connected in series; transporting an object to be heated from an upstream side toward a downstream side of the array to allow the object to pass through the heating chambers; supplying and discharging a warm air flow to and from each heating chamber, and controlling an amount of each supplied warm air flow and an amount of each discharged warm air flow to generate an air flow traveling along a direction in which the object is raised in temperature.
The sum of the amounts of the supplied warm air flows and the sum of the amounts of the discharged warm air flows may be equal to each other and constant.
The heating chamber on the upstream side may be greater than the heating chamber on the downstream side in amount of the supplied air flow, and smaller than the heating chamber on the downstream side in amount of the discharged air flow.
Each warm air flow may be supplied from a warm air supplying source to each of the heating chambers through a first damper, while each warm air flow may be discharged from each of the heating chambers to a discharging device through a second damper, so that each amount of the supplied warm air flow and the discharged warm air flow is controlled by the first and second dampers, respectively.
A heating treatment apparatus of the present invention comprises: an array of heating chambers, the heating chambers being respectively provided with heaters and connected in series; and a transporting unit that transports an object to be heated from an upstream side toward a downstream side of the array to allow the object to pass through the heating chambers; each heating chamber including: an air supplying unit supplying a warm air flow thereto; and an air discharging unit discharging the warm air flow therefrom, wherein an amount of each supplied warm air flow and an amount of each discharged warm air flow are controlled such that an air flow is generated along a direction in which the object is raised in temperature.
The air supplying unit and the air discharging unit may include an air supplying port and an air discharging port, respectively, and the air supplying port may be connected to a warm air supplying source through a first damper, while the air discharging port may be connected to an air discharging device through a second damper, so that an amount of the supplied air and an amount of the discharged air are controlled by the first and second dampers, respectively.
The following description will discuss the present invention by using embodiments shown in the drawings. However, the present invention is not intended to be limited thereby.
A PDP to which the present invention is applied has a structure in which displaying discharge cells are matrix-arranged between two opposing substrates. More specifically, as shown in
In the front substrate assembly 50a, electrodes X and Y that extend in a lateral direction so as to generate a surface discharge along the substrate face are arranged on an inner surface of a glass substrate 11 as a pair of display electrodes S that determine display lines. Each of the electrodes X and Y is constituted by a band-shaped transparent electrode 41 having a wide width, made of an ITO thin film, and a band-shaped bus electrode 42 having a narrow width, made of a metal thin film.
The bus electrode 42 is an auxiliary electrode used for ensuring an appropriate conductive property. A dielectric layer 17 is formed in a manner so as to cover the electrodes X and Y. The surface of the dielectric layer 17 is coated with a protective film 18. Both of the dielectric layer 17 and the protective film 18 have a light-transmitting property.
In the back substrate assembly 50, address electrodes A are arranged in a longitudinal direction orthogonal to the electrodes X and Y on the inner face of a glass substrate 21 on the back side, and a dielectric layer 25 is formed so as to cover address electrodes A. Ribs (partition walls) 29 having a linear shape (or a lattice shape) are placed on the dielectric layer 25 one by one between the respective address electrodes A.
In the back substrate assembly 50, discharging spaces (discharging cells) 30 are defined by these ribs 29 to form sub-pixels (unit light-emitting area) EU, and a gap dimension of the discharging space 30 is consequently determined.
Moreover, phosphor layers 28 having three colors of R, G and B used for color display are formed so as to cover the wall face on the back side including the upper portion of the dielectric layer 25 and the side faces of the ribs 29.
Each of the ribs 29 is made from low-melting point glass, and is opaque to ultraviolet rays. With respect to the forming method of the ribs 29, as will be described later, processes are used in which an etching mask is formed on a low-melting-point glass layer like a solid film through photolithography and this is patterned by using a sand blasting process.
The display electrodes S corresponds to one row in the matrix display, and one address electrode A corresponds to one column. Moreover, three columns correspond to one pixel (pixel element) EG. In other words, one pixel is constituted by three sub-pixels EU of R, G and B, which are aligned in the row direction.
A wall charge in the dielectric layer 17, used for selecting cells to be displayed, is formed by an opposing discharge (address discharge) between the address electrode A and the electrode Y. Upon alternately applying pulses to the electrodes X and Y, a displaying surface discharge (main discharge) is generated in the sub-pixel EU having the wall charge formed therein by the address discharge.
The phosphor layer 28 is locally excited by ultraviolet rays generated by the surface discharge to emit visible lights having a predetermined color. Among the visible lights, those lights that are transmitted through the glass substrate 11 form display light. Since the arranged pattern of the ribs 29 is a so-called stripe pattern, portions inside the discharging space 30, which correspond to the respective column, are connected to one another in the column direction over the entire lines. The sub-pixels EU inside each column have the same light-emission color.
The following description will discuss forming processes of the partition walls (ribs) 29 in the PDP of this type.
(1) First, as shown in
(2) Next, after a photosensitive resist layer having a sandblast resistant property has been formed on the partition-wall forming material layer 31, active light rays are selectively applied thereto through a photomask, and by developing this, a mask 32 for sandblast, which has an opening pattern corresponding to the partition walls, is formed.
(3) Thereafter, a substrate 33 to be processed on which the partition-wall forming material layer 31 and the mask 32 for sandblast have been formed is subjected to a sandblasting process. By the grinding function of the sandblasting process, the partition-wall forming material layer 31 is removed except for portions below the mask 32.
(4) Next, the mask 32 is removed so that the material layer 31 corresponding to the partition walls is exposed and calcined.
The partition walls (ribs) 29 are formed through the above-mentioned processes (1) to (4).
Next, referring to
As shown in
As shown in
Each of the heating chambers R1 to R6 is provided with a gas-supply port 13 formed at its lower portion and a gas-discharging port 14 formed at its upper portion. Each of the gas-supply ports 13 is connected to a warm air supplying source, not shown, through a damper 15, and each of the gas-discharging port 14 is connected to a gas-discharging device, not shown, through a damper 16.
In each of the heating chambers R1 to R6, there is a capacity in a range from 0.1 to 10 m3, and the heaters 10 include upper and lower infrared-ray heaters having a total output in a range of 50 to 3000 kW.
For example, the object 2 has a structure in which onto a glass substrate 21 having a size of 100 to 3000 mm (width)×100 to 2000 mm (length)×0.3 to 40 mm (thickness) the address electrodes A and the dielectric layer 25 covering the electrodes A have been formed as shown in
In the heating treatment apparatus 1, drying is carried out by evaporating the above-mentioned solvent. Therefore, in the heating treatment apparatus 1, as shown in
Here, the flow rates P1 to P6 and Q1 to Q6 are respectively controlled by the dampers 15 and 16. Conventionally, these are set to P1=P2=P3=P4=P5=P6=A, as well as to Q1=Q2=Q3=Q4=Q5=Q6=A.
Here, for example, A=1 to 10 m3/min.
In the present invention, in the heating chambers on the upstream side of the apparatus 1, the supply flow rate is made greater, while the discharge flow rate is made smaller, and in the heating chambers on the downstream side of the apparatus 1, the supply flow rate is made smaller, while the discharge flow rate is made greater.
For example, the supply flow rates P1 and P2 to the heating chambers R1 and R2 are set to P1=P2=1.2 A, while the supply flow rates P3 to P6 to the heating chambers R3 to R6 are set to P3=P4=P5=P6=0.9 A.
Moreover, the discharge flow rates Q1 and Q2 from the heating chambers R1 and R2 are set to Q1=Q2=0.6 A, while the discharge flow rates Q3 to Q6 from heating chambers R3 to R6 are set to Q3=Q4=Q5=Q6=1.2 A.
Here, P1+P2+P3+P4+P5+P6=Q1+Q2+Q3+Q4+Q5+Q6=6 A, which is a constant value.
With this arrangement, as shown in
As shown in
Moreover, the solvent contained in the partition-wall forming paste of the object 2 is evaporated in a temperature range of 100 to 140° C. Therefore, the temperature profile of
Number | Date | Country | Kind |
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2006-191717 | Jul 2006 | JP | national |